Working on your computer
Removing and installing components
Technology and components
System specifications
- Technical specifications
  - Display specifications in detail
- Hot key combinations
System setup
Software
Troubleshooting
- Dell Enhanced Pre-Boot System Assessment — ePSA diagnostic 3.0
- Real Time Clock reset
Contacting Dell

DELL 7490 User Manual

Displayed below is the user manual for 7490 by DELL which is a product in the Notebooks category. This manual has pages.

Related Manuals

DELL 7490 Manual

Latitude 7490

Owner's Manual

Regulatory Model: P73G

Regulatory Type: P73G002

Notes, cautions, and warnings

NOTE: A NOTE indicates important information that helps you make better use of your product.

CAUTION: A CAUTION indicates either potential damage to hardware or loss of data and tells you how to avoid the problem.

WARNING: A WARNING indicates a potential for property damage, personal injury, or death.

trademarks may be trademarks of their respective owners.

2018 - 01

Rev. A00

Working on your computer

Topics:

• Safety precautions

• Before working inside your computer

• After working inside your computer

Safety precautions

The safety precautions chapter details the primary steps to be taken before performing any disassembly instructions.

Observe the following safety precautions before you perform any installation or break/x procedures involving disassembly or reassembly:

• Turn o the system and all attached peripherals.

• Disconnect the system and all attached peripherals from AC power.

• Disconnect all network cables, telephone, and telecommunications lines from the system.

• Use an ESD eld service kit when working inside any notebook to avoid electrostatic discharge (ESD) damage.

• After removing any system component, carefully place the removed component on an anti-static mat.

• Wear shoes with non-conductive rubber soles to reduce the chance of getting electrocuted.

Standby power

Dell products with standby power must be unplugged before you open the case. Systems that incorporate standby power are essentially

powered while turned o. The internal power enables the system to be remotely turned on (wake on LAN) and suspended into a sleep

mode and has other advanced power management features.

Unplugging, pressing and holding the power button for 15 seconds should discharge residual power in the system board, notebooks

Bonding

Bonding is a method for connecting two or more grounding conductors to the same electrical potential. This is done through the use of a

eld service electrostatic discharge (ESD) kit. When connecting a bonding wire, ensure that it is connected to bare metal and never to a

painted or non-metal surface. The wrist strap should be secure and in full contact with your skin, and ensure that you remove all jewelry

such as watches, bracelets, or rings prior to bonding yourself and the equipment.

Electrostatic discharge — ESD protection

ESD is a major concern when you handle electronic components, especially sensitive components such as expansion cards, processors,

memory DIMMs, and system boards. Very slight charges can damage circuits in ways that may not be obvious, such as intermittent

problems or a shortened product life span. As the industry pushes for lower power requirements and increased density, ESD protection is an

increasing concern.

Due to the increased density of semiconductors used in recent Dell products, the sensitivity to static damage is now higher than in previous

Dell products. For this reason, some previously approved methods of handling parts are no longer applicable.

Two recognized types of ESD damage are catastrophic and intermittent failures.

Working on your computer 3

•Catastrophic – Catastrophic failures represent approximately 20 percent of ESD-related failures. The damage causes an immediate and

complete loss of device functionality. An example of catastrophic failure is a memory DIMM that has received a static shock and

immediately generates a "No POST/No Video" symptom with a beep code emitted for missing or nonfunctional memory.

•Intermittent – Intermittent failures represent approximately 80 percent of ESD-related failures. The high rate of intermittent failures

means that most of the time when damage occurs, it is not immediately recognizable. The DIMM receives a static shock, but the

tracing is merely weakened and does not immediately produce outward symptoms related to the damage. The weakened trace may

take weeks or months to melt, and in the meantime may cause degradation of memory integrity, intermittent memory errors, etc.

The more dicult type of damage to recognize and troubleshoot is the intermittent (also called latent or "walking wounded") failure.

Perform the following steps to prevent ESD damage:

• Use a wired ESD wrist strap that is properly grounded. The use of wireless anti-static straps is no longer allowed; they do not provide

adequate protection. Touching the chassis before handling parts does not ensure adequate ESD protection on parts with increased

sensitivity to ESD damage.

• Handle all static-sensitive components in a static-safe area. If possible, use anti-static oor pads and workbench pads.

• When unpacking a static-sensitive component from its shipping carton, do not remove the component from the anti-static packing

material until you are ready to install the component. Before unwrapping the anti-static packaging, ensure that you discharge static

electricity from your body.

• Before transporting a static-sensitive component, place it in an anti-static container or packaging.

ESD eld service kit

The unmonitored Field Service kit is the most commonly used service kit. Each Field Service kit includes three main components: anti-static

mat, wrist strap, and bonding wire.

Components of an ESD eld service kit

The components of an ESD eld service kit are:

•Anti-Static Mat – The anti-static mat is dissipative and parts can be placed on it during service procedures. When using an anti-static

mat, your wrist strap should be snug and the bonding wire should be connected to the mat and to any bare metal on the system being

worked on. Once deployed properly, service parts can be removed from the ESD bag and placed directly on the mat. ESD-sensitive

items are safe in your hand, on the ESD mat, in the system, or inside a bag.

•Wrist Strap and Bonding Wire – The wrist strap and bonding wire can be either directly connected between your wrist and bare metal

on the hardware if the ESD mat is not required, or connected to the anti-static mat to protect hardware that is temporarily placed on

the mat. The physical connection of the wrist strap and bonding wire between your skin, the ESD mat, and the hardware is known as

bonding. Use only Field Service kits with a wrist strap, mat, and bonding wire. Never use wireless wrist straps. Always be aware that the

internal wires of a wrist strap are prone to damage from normal wear and tear, and must be checked regularly with a wrist strap tester

in order to avoid accidental ESD hardware damage. It is recommended to test the wrist strap and bonding wire at least once per week.

•ESD Wrist Strap Tester – The wires inside of an ESD strap are prone to damage over time. When using an unmonitored kit, it is a best

practice to regularly test the strap prior to each service call, and at a minimum, test once per week. A wrist strap tester is the best

method for doing this test. If you do not have your own wrist strap tester, check with your regional oce to nd out if they have one.

To perform the test, plug the wrist-strap's bonding-wire into the tester while it is strapped to your wrist and push the button to test. A

green LED is lit if the test is successful; a red LED is lit and an alarm sounds if the test fails.

•Insulator Elements – It is critical to keep ESD sensitive devices, such as plastic heat sink casings, away from internal parts that are

insulators and often highly charged.

•Working Environment – Before deploying the ESD Field Service kit, assess the situation at the customer location. For example,

deploying the kit for a server environment is dierent than for a desktop or portable environment. Servers are typically installed in a rack

within a data center; desktops or portables are typically placed on oce desks or cubicles. Always look for a large open at work area

that is free of clutter and large enough to deploy the ESD kit with additional space to accommodate the type of system that is being

repaired. The workspace should also be free of insulators that can cause an ESD event. On the work area, insulators such as Styrofoam

and other plastics should always be moved at least 12 inches or 30 centimeters away from sensitive parts before physically handling any

hardware components

•ESD Packaging – All ESD-sensitive devices must be shipped and received in static-safe packaging. Metal, static-shielded bags are

preferred. However, you should always return the damaged part using the same ESD bag and packaging that the new part arrived in.

The ESD bag should be folded over and taped shut and all the same foam packing material should be used in the original box that the

new part arrived in. ESD-sensitive devices should be removed from packaging only at an ESD-protected work surface, and parts should

never be placed on top of the ESD bag because only the inside of the bag is shielded. Always place parts in your hand, on the ESD mat,

in the system, or inside an anti-static bag.

4Working on your computer

•Transporting Sensitive Components – When transporting ESD sensitive components such as replacement parts or parts to be

returned to Dell, it is critical to place these parts in anti-static bags for safe transport.

ESD protection summary

It is recommended that all eld service technicians use the traditional wired ESD grounding wrist strap and protective anti-static mat at all

times when servicing Dell products. In addition, it is critical that technicians keep sensitive parts separate from all insulator parts while

performing service and that they use anti-static bags for transporting sensitive components.

Transporting sensitive components

When transporting ESD sensitive components such as replacement parts or parts to be returned to Dell, it is critical to place these parts in

anti-static bags for safe transport.

Before working inside your computer

1 Ensure that your work surface is at and clean to prevent the computer cover from being scratched.

2 Turn o your computer.

3 If the computer is connected to a docking device (docked), undock it.

4 Disconnect all network cables from the computer (if available).

CAUTION: If your computer has an RJ45 port, disconnect the network cable by rst unplugging the cable from your

computer.

5 Disconnect your computer and all attached devices from their electrical outlets.

6 Open the display.

7 Press and hold the power button for few seconds, to ground the system board.

CAUTION: To guard against electrical shock unplug your computer from the electrical outlet before performing Step # 8.

CAUTION: To avoid electrostatic discharge, ground yourself by using a wrist grounding strap or by periodically touching an

unpainted metal surface at the same time as touching a connector on the back of the computer.

8 Remove any installed ExpressCards or Smart Cards from the appropriate slots.

After working inside your computer

After you complete any replacement procedure, ensure that you connect external devices, cards, and cables before turning on your

computer.

CAUTION: To avoid damage to the computer, use only the battery designed for this particular Dell computer. Do not use batteries

designed for other Dell computers.

1 Connect any external devices, such as a port replicator or media base, and replace any cards, such as an ExpressCard.

2 Connect any telephone or network cables to your computer.

CAUTION: To connect a network cable, rst plug the cable into the network device and then plug it into the

computer.

3 Connect your computer and all attached devices to their electrical outlets.

4 Turn on your computer.

Working on your computer 5

Removing and installing components

Topics:

• Recommended tools

• Screw size list

• Subscriber identication module card

• Base cover

• Battery

• PCIe solid state drive

• Speaker

• Coin cell battery

• WWAN card

• WLAN card

• Memory modules

• Heat sink

• LED board

• Smart card module

• Touchpad buttons board

• Power connector port

• Display Assembly

• Display Bezel

• Display hinge

• Display panel

• Camera

• System board

• Keyboard

• Palm rest

Recommended tools

The procedures in this document require the following tools:

• Phillips #0 screwdriver

• Phillips #1 screwdriver

• Plastic scribe

NOTE: The #0 screw driver is for screws 0-1 and the #1 screw driver is for screws 2-4

6 Removing and installing components

Screw size list

Table 1. Latitude 7490 - Screw size list

Component M2.5x 6.0 M2.5x5.0 M2.0 x 5.0 M2.5 x 4.0 M2.0x3.0 M2.0 x 2.5 M2.0 x 2.0

Back cover 8 (captive screw)

Battery (3-cell) 1

Battery (4-cell) 2

SSD module 1

Heat sink module 4

System fan 2

WWAN card 1

WLAN card 1

Power connector port 1

ESD bracket 2

EDP bracket 1

Touchpad buttons 2

Fingerprint reader 1

LED board 1

Smart card reader cage 2

Display hinge 6

Display panel 4

Keyboard support plate 18

Keyboard 5

System board 3

USB Type C bracket 2

Thermal module 4

DC In bracket 1

K-Lock bracket 1

Subscriber identication module card

Removing SIM card or SIM card tray

NOTE: SIM card or SIM card tray removal is only available on systems that are shipped with WWAN module. Hence, removing

procedure is only applicable for systems that are shipped with WWAN module.

CAUTION: Removing the SIM card with the system is turned On, may cause data loss or damage to the card. Ensure that your

system is turned o or the network connections are disabled.

1 Insert a paperclip or a SIM card removal tool into the pinhole on the SIM card tray.

2 Use a scribe to pull the SIM card tray.

Removing and installing components 7

3 If a SIM card is available, remove the SIM card from the SIM card tray.

Replacing SIM card

1 Insert a paperclip or a SIM card removal tool into the pinhole on the SIM card tray.

2 Use a scribe to pull the SIM card tray

3 Place on the SIM card on the tray.

4 Insert the SIM card tray into the slot.

Removing dummy SIM card tray

For models shipped with a WWAN card, the SIM card tray must rst be removed from the system before removing the system board. To

remove the SIM card tray from the system follow the steps outlined in the disassembly section.

NOTE: For models shipped with a wireless card only, a dummy SIM card tray must rst be removed from the system before

removing the system board. The following are the steps for removing the dummy SIM card tray:

1 Push the release latch located on the SIM card slot inwards.

8Removing and installing components

2 Slide the dummy SIM card tray out of the system.

Base cover

Removing base cover

1 Follow the procedure in Before working inside your computer.

2 To release the base cover:

a Loosen the eight (M2.5 x 6.0) captive screws that secure the base cover to the system [1].

Remember: Exercise caution when loosening the screws. Angle the screw driver to match the head of the screw to

avoid a possible stripped screw head.

b Use a plastic scribe to release the base cover from the edge [2].

Removing and installing components 9

3 Lift the base cover from the system.

10 Removing and installing components

Installing base cover

1 Align the base cover tabs to the slots on the edges of the system.

2 Press the edges of the cover until it clicks into place.

3 To secure the base cover to the system, tighten the eight (M2.5 x 6.0) captive screws .

Remember: Exercise caution when tightening the screws. Angle the screw driver to match the head of the screw to avoid a

possible stripped screw head.

4 Follow the procedure in After working inside your computer.

Battery

Lithium-ion battery precautions

CAUTION:

• Exercise caution when handling Lithium-ion batteries.

• Discharge the battery as much as possible before removing it from the system. This can be done by disconnecting the AC adapter

from the system to allow the battery to drain.

• Do not crush, drop, mutilate, or penetrate the battery with foreign objects.

• Do not expose the battery to high temperatures, or disassemble battery packs and cells.

• Do not apply pressure to the surface of the battery.

• Do not bend the battery.

• Do not use tools of any kind to pry on or against the battery.

• If a battery gets stuck in a device as a result of swelling, do not try to free it as puncturing, bending, or crushing a Lithium-ion

battery can be dangerous. In such an instance, the entire system should be replaced. Contact https://www.dell.com/support for

assistance and further instructions.

• Always purchase genuine batteries from https://www.dell.com or authorized Dell partners and re-sellers.

Removing battery

1 Follow the procedure in Before working inside your computer.

2 Remove the base cover.

3 To remove the battery:

a Disconnect the battery cable from the connector on the system board [1].

b Remove the two (M2.0 x 5.0) screws that secure the battery to the computer [2].

NOTE: A 3-cell battery has a single screw, and a 4-cell battery has two screws. Hence, the image displayed below is a

4-cell battery.

c Lift the battery from the system [3].

Removing and installing components 11

Installing battery

1 Insert the battery into the slot on the system.

2 Route the battery cable through the routing clip and connect the battery cable to the connector on the system board.

NOTE: Route the battery cable, if the cable at the base of the battery is un routed.

3 Tighten the two (M2.0 x 5.0) screws to secure the battery to the system.

NOTE: A small battery (3-cell) has a single screw, a larger battery (4-cell) has two screws.

4 Install the base cover

5 Follow the procedure in After working inside your computer.

PCIe solid state drive

Removing PCIe SSD

1 Follow the procedure in Before working inside your computer.

2 Remove the following components:

abase cover

bbattery

3 To remove the PCIe solid state drive (SSD):

a Loosen the two (M2.0 x 3.0) captive screws that secure the SSD bracket [1].

b Remove the SSD bracket (optional) [2].

c Remove the PCIe SSD from the system [3].

12 Removing and installing components

Installing PCIe SSD

1 Insert the PCIe SSD card into the connector.

2 Install the SSD bracket over the PCIe SSD card.

NOTE: When installing the SSD bracket, ensure that the tab on the bracket is held securely with the tab on the palm rest.

3 Tighten the two (M2.0 x 3.0) screws to secure the PCIe SSD card to the SSD bracket.

4 Install the following components:

•battery

•base cover

5 Follow the procedure in After working inside your computer.

Speaker

Removing speaker module

1 Follow the procedure in Before working inside your computer.

2 Remove the:

abase cover

bbattery

Removing and installing components 13

3 To release the speaker module:

a Disconnect the speaker cable from the connector on the system board [1].

NOTE: Use a plastic scribe to release the cable from the connector. Do not pull the cable as it may result in breakage

b Un-route the speaker cable from the routing clips [2].

c Remove the tape that secures the speaker cables to the touchpad board [3].

4 Lift the speaker module from the computer.

14 Removing and installing components

Installing speaker module

1 Place the speaker module into the slots on the system.

2 Route the speaker cable through the retention clips on the system.

3 Connect the speaker cable to the connector on the system board.

4 Install the:

abattery

bbase cover

5 Follow the procedure in After working inside your computer.

Coin cell battery

Removing the coin cell battery

1 Follow the procedure in Before working inside your computer.

2 Remove the:

abase cover

bbattery

3 To remove the coin cell battery:

a Disconnect the coin cell battery cable from the connector on the system board [1].

NOTE: You must un-route the coin cell battery cable from the routing channel.

b Lift the coin cell battery to release it from the adhesive [2].

Removing and installing components 15

Installing coin cell battery

1 Ax the coin cell battery on the slot inside the computer.

2 Route the coin cell battery cable through the routing channel before connecting the cable.

3 Connect the coin cell battery cable to the connector on the system board.

4 Install the:

abattery

bbase cover

5 Follow the procedure in After working inside your computer.

WWAN card

Removing WWAN card

1 Follow the procedure in Before working inside your computer.

2 Remove the following components:

abase cover

bbattery

3 To remove the WWAN card:

a Remove the M2.0 x 3.0 screw that secures the WWAN bracket to the WWAN card.

b Lift the WWAN bracket that secures the WWAN card.

c Disconnect the WWAN cables from the connectors on the WWAN card .

16 Removing and installing components

Installing WWAN card

1 Insert the WWAN card into the connector on the system board.

2 Connect the WWAN cables to the connectors on the WWAN card.

3 Place the metal bracket and tighten the M2.0 x 3.0 screw to secure it to the computer.

4 Install the:

abattery

bbase cover

5 Follow the procedure in After working inside your computer.

NOTE: The IMEI number can also be found on the WWAN card.

WLAN card

Removing WLAN card

1 Follow the procedure in Before working inside your computer.

2 Remove the

abase cover

bbattery

3 To remove the WLAN card:

a Remove the M2.0 x 3.0 screw that secures the metal bracket to the WLAN card [1].

b Lift the metal bracket [2].

c Disconnect the WLAN cables from the connectors on the WLAN card [3].

d Remove the WLAN card from the system [4].

Removing and installing components 17

Installing WLAN card

1 Insert the WLAN card into the connector on the system board.

2 Connect the WLAN cables to the connectors on the WLAN card.

3 Place the metal bracket and tighten the M2.0 x 3.0 screw to secure it to the WLAN card.

4 Install the following:

abattery

bbase cover

5 Follow the procedure in After working inside your computer.

Memory modules

Removing memory module

1 Follow the procedure in Before working inside your computer.

2 Remove the following:

abase cover

bbattery

3 To remove the memory module:

a Pull the clips securing the memory module until the module snaps-out [1].

b Remove the memory module from the connector on the system board [2].

18 Removing and installing components

Installing memory module

1 Insert the memory module into the connector until snaps in.

2 Install the following:

abattery

bbase cover

3 Follow the procedures in After working inside your computer.

Heat sink

Removing heat sink assembly

Heat sink assembly comprises of heat sink and the system fan.

1 Follow the procedure in Before working inside your computer.

2 Remove the following:

abase cover

bbattery

3 To remove the heat sink assembly:

NOTE: To identify the number of screws, see the screw list.

a Disconnect the fan cable from the system board [1].

Removing and installing components 19

b Remove the M2.0 x 5.0 screws that secure the heat sink assembly to the system board [2].

NOTE: Remove the screws in the order of the callout numbers [1, 2, 3, 4] as indicated on the heat sink.

c Lift the heat sink assembly from the system board [3].

Installing heat sink assembly

Heat sink assembly comprises of heat sink and the system fan.

1 Align the heat sink assembly with screw holders on the system board.

2 Replace the M2.0 x 3.0 screws to secure the heat sink assembly to the system board.

NOTE: Replace the screws in the order of the callout numbers [1, 2, 3, 4] as indicated on the heat sink.

3 Connect the fan cable to the connector on the system board.

4 Install the following:

abattery

bbase cover

5 Follow the procedure in After working inside your computer.

LED board

Removing LED board

1 Follow the procedure in Before working inside your computer.

2 Remove the following:

abase cover

bbattery

20 Removing and installing components

3 To remove the LED board:

a Disconnect the LED cable from the LED board [1].

CAUTION: Avoid pulling the cable as it would result in breaking the cable connector. Instead, use a scribe to push the

edges of the cable connector to release the LED cable.

b Remove the M2.0 x 3.0 screw that secures the LED board to the system [2].

c Lift the LED board from the system [3].

Installing LED board

1 Insert the LED board into the slot on the computer.

2 Replace the M2.0 x 3.0 screw to secure the LED board.

3 Connect the LED cable to the LED board.

4 Install the following:

abattery

bbase cover

5 Follow the procedure in After working inside your computer.

Removing and installing components 21

Smart card module

Removing smart card cage

1 Follow the procedure in Before working inside your computer.

2 Remove the following:

abase cover

bbattery

cPCIe SSD card

3 To disconnect the smart card cable:

a Disconnect the smart card cable [1].

b Lift the smart card cable that is axed to the touchpad module [2].

4 To remove the smart card cage:

NOTE: To identify the number of screws, see screw list

a Remove the two (M2.0 x 3.0) screws that secure the smart card cage to the system [1].

b Slide and lift the smart card cage from the system [2].

22 Removing and installing components

Installing smart card cage

1 Slide the smart card cage into the slot to align with the tabs on the system.

2 Replace the two (M2.0 x 3.0) screws to secure the smart card cage to the system.

3 Ax the smart card cable and connect it to the connector on the system .

4 Install the following:

aPCIe SSD card

bbattery

cbase cover

5 Follow the procedure in After working inside your computer.

Touchpad buttons board

Removing touchpad buttons board

1 Follow the procedure in Before working inside your computer.

2 Remove the:

abase cover

bbattery

cspeaker

Removing and installing components 23

3 To disconnect the smart card cable:

a Disconnect the smart card cable [1].

b Lift the smart card cable that is axed to the system [2] to reveal the touchpad buttons board cable.

4 To remove the touchpad buttons board:

a Disconnect the touchpad buttons board cable from the touchpad board [1].

NOTE: The touchpad buttons board cable is below the smart card cable.

b Remove the two (M2.0 x 3.0) screws that secure the touchpad buttons board [2].

NOTE: To identify the screws, see screw list.

c Lift the touchpad buttons board from the system [3].

24 Removing and installing components

Installing touchpad buttons board

1 Insert the touchpad buttons board into the slot to align the tabs with the grooves on the system.

2 Replace the two (M2.0 x 3.0) screws to secure the touchpad buttons board to the system.

3 Connect the touchpad buttons board cable to the connector on the touchpad board.

4 Install the:

asmart card module

bspeaker

cbattery

dbase cover

5 Follow the procedure in After working inside your computer.

Power connector port

Removing power connector port

1 Follow the procedure in Before working inside your computer.

2 Remove the following:

abase cover

bbattery

3 To remove the power connector port:

a Disconnect the power connector port cable from the system board [1].

Removing and installing components 25

NOTE: Use a plastic scribe to release the cable from the connector. Do not pull the cable as it may result in breakage

b Remove the M2.0 x 3.0 screw to release the metal bracket on the power connector port [2].

c Lift the metal bracket from the system [3].

d Remove the power connector port from the computer [4].

Installing power connector port

1 Install the power connector port into the slot on the system.

2 Place the metal bracket on the power connector port.

3 Replace the M2.0 x 3.0 screw to secure the power connector port to the system.

4 Connect the power connector port cable to the connector on the system board.

5 Install the following:

abattery

bbase cover

6 Follow the procedure in After working inside your computer.

Display Assembly

Removing display assembly with touch

1 Follow the procedure in Before working inside your computer.

2 Remove the:

26 Removing and installing components

abase cover

bbattery

cWLAN card

dWWAN card

NOTE: To identify the number of screws, see screw list

3 To remove the display assembly:

a Disconnect the IR camera cable from the system board [1].

b Un route the WLAN and WWAN cables from the routing channels [2].

c Remove the M2.0x3.0 screw that secures the eDP bracket [3].

d Lift the eDP bracket from the eDP cable [4].

e Lift the eDP cable to disconnect it from the connector on the system board [5].

f Un route the eDP cable from the routing channel [6].

4 To remove the display assembly:

a Open the display of the computer and lay it on a at surface at 180 degree angle

b Remove the six (M2.5 x 4.0) screws that secure the display hinge to the display assembly [1].

c Lift the display assembly from the system.

Removing and installing components 27

Installing display assembly with touch

1 Place the base of the computer on a plane surface of a table and position it closer to the edge of the table.

2 Install the display assembly to align it with the display hinge holders on the system.

3 Holding the display assembly, replace the six (M2.5 x 4.0) screws to secure the display hinges on the system display assembly with the

system unit.

4 Route the eDP cable from the routing channel.

5 Ax the tapes to secure the eDP cable (display cable) to the system board.

6 Connect the eDP cable to the connector on the system board.

7 Install the eDP metal bracket on the eDP cable and tighten the M2.0 x 3.0 screws.

8 Connect the IR camera cable to the system board.

9 Route the WLAN and WWAN cables through the routing channels.

10 Install the:

aWLAN card

bWWAN card

cbattery

dbase cover

11 Follow the procedure in After working inside your computer.

Display Bezel

28 Removing and installing components

Removing display bezel

NOTE: The display bezel removal procedure is applicable only for non-touch systems.

1 Follow the procedure in Before working inside your computer.

2 Remove the:

abase cover

bbattery

cWLAN card

dWWAN card

edisplay assembly

3 To remove the display bezel:

a Use a plastic scribe, nd recess to loosen the bottom edge of the display bezel [1].

b Loosen the tabs on the edges of the display [2,3,4].

NOTE: Adhesive is used to secure the display bezel to the display panel.

4 Remove the display bezel from the display assembly.

Installing display bezel

NOTE: The display bezel installation procedure is applicable only for non-touch systems.

1 Place the display bezel on the display assembly.

2 Press the edges of the display bezel until it clicks onto the display assembly.

Removing and installing components 29

NOTE: Adhesive is used to secure the display bezel to the display panel.

3 Install the:

adisplay assembly

bWLAN card

cWWAN card

dbattery

ebase cover

4 Follow the procedure in After working inside your computer.

Display hinge

Removing the display hinge cap

1 Follow the procedure in Before working inside your computer.

2 Remove the following components:

abase cover

bbattery

cWLAN card

dWWAN card

edisplay assembly

3 Slide and remove the display hinge cap from the display panel.

Installing the display hinge cap

1 Place the display hinge cap on the slot and slide it back to t on the display assembly.

2 Install the:

30 Removing and installing components

adisplay assembly

bWLAN card

cWWAN card

dbattery

ebase cover

3 Follow the procedure in After working inside your computer.

Display panel

Removing the display panel

1 Follow the procedure in Before working inside your computer.

2 Remove the following components:

abase cover

bbattery

cWLAN card

dWWAN card

edisplay assembly

3 To remove the display panel:

a Remove the two (M2.0 x 3.0) screws on the panel [1].

b Lift up the bottom edge of the display panel [2].

c Slide the display panel away from the system from the bottom [1], and ip the display panel over [2].

Removing and installing components 31

d Peel o the display connector adhesive strip from the display panel [1]

e Peel o the mylar tape securing the display cable on the back of the display panel [2].

f Lift the metal tab and disconnect the display cable from the back of the display panel [3,4].

g Remove the display panel.

32 Removing and installing components

Installing the display panel

1 Connect the display cable on the back of the display panel.

2 Ax the mylar tape securing the display cable on the back of the display panel.

3 Ax display connector adhesive strip to the display panel.

4 Flip the display panel over and slide the display panel towards the system.

5 Replace the two (M2.0 x 3.0) screws on the panel

6 Install the:

adisplay assembly

bWLAN card

cWWAN card

dbattery

ebase cover

7 Follow the procedure in After working inside your computer.

Camera

Removing camera

The removal procedure of the camera is only for a touch display.

1 Follow the procedure in Before working inside your computer.

2 Remove the following:

abase cover

bbattery

cWLAN card

dWWAN card

edisplay assembly

3 To remove the camera module:

a Lift the plastic bracket to disconnect the FPC from the camera module [1].

b Using a plastic scribe, pry up the camera module from the top side of the compartment on the display back cover [2].

c Remove the camera module.

Removing and installing components 33

4 To remove the camera module:

a Peel o the two pieces of conductive tape covering the camera module [1].

NOTE: The conductive tape is a separate part from the camera module that must be removed and then re-attached

when replacing the camera module.

b Flip the camera module [2].

c Disconnect the camera FPC from the camera module [3].

d Lift and remove the camera module [4].

34 Removing and installing components

Installing camera

The installation procedure is applicable only for systems shipping with touch display assembly.

1 Insert the camera module into the slot on the display assembly.

2 Connect the camera cable.

3 Install the following:

adisplay bezel

bdisplay assembly

cWLAN card

dWWAN card

ebattery

fbase cover

4 Follow the procedure in After working inside your computer.

System board

Removing system board

1 Follow the procedure in Before working inside your computer.

Removing and installing components 35

NOTE: If your computer is shipped with a WWAN card, then the removal of a blank SIM card tray is a requirement.

2 Remove the:

aSIM card

bdummy SIM card tray

cbase cover

dbattery

ememory module

fPCIe SSD

gWLAN card

hWWAN card

iheat sink assembly

1 To identify the screws, seescrew list

3 To remove the memory module bracket:

a Remove the two (M2.0 x 3.0) screws that secure memory module bracket to the system board [1].

b Lift the memory module bracket from the system board [2].

4 To disconnect the eDP cable:display assembly

5 To disconnect the cables:

NOTE: To disconnect the speaker, LED board, coin cell battery and the power connector port cables, use a plastic scribe to

release the cables from the connectors. Do not pull the cable as it may result in breakage

a speaker cable [1]

b LED board cable [2]

c coin cell battery cable [3]

d touchpad cable and USH board cable [4]

e power connector port [5]

36 Removing and installing components

6 To remove the system board:

a Remove the USB type-C bracket.

Image does not display the USB type-C bracket removal.

b Remove the three (M2.0 x 5.0) screws that secure the system board [1].

c Lift the system board away from the computer [2].

Removing and installing components 37

7 Remove the two (M2.0x5.0) screws that secure the USB Type-C bracket.

8 Flip the system board, peel o the tapes securing the bracket and remove the USB Type-C port from the system board.

38 Removing and installing components

NOTE: When removing or reinstalling the USB Type-C bracket to the system board, technicians must place the system

board on an ESD mat to avoid damage.

Installing system board

1 Align the system board with the screw holders on the system.

2 Replace the M2.0 x 5.0 screws to secure the system board to the system.

3 Connect the speaker, LED board, coin cell battery, touchpad, and USH cables, and power connector, cables to the connectors on the

system board.

4 Connect the eDP cable to the connector on the system board.

5 Place the metal bracket over the eDP cable and replace the M2.0 x 5.0 screws to secure it.

6 Place the metal bracket over the memory module connectors and replace the M2.0 x 3.0 screws to secure it to the system.

NOTE: If your computer has a WWAN card, then SIM card tray installation is a requirement.

7 Install the following:

aheat sink

bWLAN card

cWWAN card

dPCIe SSD card

ememory module

fbattery

gbase cover

hdummy SIM card tray

iSIM card

8 Follow the procedure in After working inside your computer.

Removing and installing components 39

Keyboard

Removing keyboard assembly

NOTE: The keyboard and the keyboard tray together are called the keyboard assembly.

1 Follow the procedure in Before working inside your computer.

2 Remove:

abase cover

bbattery

cmemory module

dPCIe SSD

eWLAN card

fWWAN card

gheat sink assembly

hsystem board

3 Disconnect the cables from the palmrest end:

a keyboard cable [1]

b keyboard backlight cable [2]

c Touchpad and USH board cables [3,4]

4 To remove the keyboard assembly:

NOTE: To identify the screws, see screw list

40 Removing and installing components

a Remove the 18 (M2.0 x 2.5) screws that secure the keyboard [1].

b Lift the keyboard assembly from the chassis [2].

Removing keyboard from keyboard tray

1 Follow the procedure in Before working inside your computer.

2 Remove the keyboard assembly

3 Remove the M2.0 x 2.0 screws that secure the keyboard to the keyboard assembly.

4 Lift the keyboard away from the keyboard tray.

Installing keyboard to keyboard tray

1 Align the keyboard with the screw holders on the keyboard tray.

2 Tighten the M2.0 x 2.0 screws to secure the keyboard to the keyboard tray.

3 Install the keyboard assembly.

Installing keyboard assembly

NOTE: The keyboard and the keyboard tray together are called the keyboard assembly.

1 Align the keyboard assembly with the screw holders on the computer.

2 Tighten the M2.0 x 2.5 screws that secure the keyboard to the chassis.

Removing and installing components 41

3 Connect the keyboard cable, keyboard backlight cable, and touchpad cable cable to the connectors on the touchpad buttons board.

4 Install the:

asystem board

bheat sink

cWLAN card

dWWAN card

ePCIe SSD card

fmemory module

gbattery

hbase cover

5 Follow the procedure in After working inside your computer.

Palm rest

Replacing palm rest

1 Follow the procedure in Before working inside your computer.

2 Remove the:

abase cover

bbattery

cmemory module

dPCIe SSD

eWLAN card

fWWAN card

gheat sink assembly

hsystem board

ipower connector port

jcoin cell battery

kspeaker

42 Removing and installing components

The component you are left with is the palm rest.

3 Replace the palm rest.

4 Install the:

aspeaker

bcoin cell battery

cpower connector port

dsystem board

eheat sink

fWLAN card

gWWAN card

hPCIe SSD card

imemory module

jbattery

kbase cover

5 Follow the procedure in After working inside your computer.

Removing and installing components 43

Technology and components

This chapter details the technology and components available in the system.

Topics:

• DDR4

• HDMI 1.4

• USB features

• USB Type-C

• Thunderbolt over USB Type-C

DDR4

DDR4 (double data rate fourth generation) memory is a higher-speed successor to the DDR2 and DDR3 technologies and allows up to 512

GB in capacity, compared to the DDR3's maximum of 128 GB per DIMM. DDR4 synchronous dynamic random-access memory is keyed

dierently from both SDRAM and DDR to prevent the user from installing the wrong type of memory into the system.

DDR4 needs 20 percent less or just 1.2 volts, compared to DDR3 which requires 1.5 volts of electrical power to operate. DDR4 also supports

a new, deep power-down mode that allows the host device to go into standby without needing to refresh its memory. Deep power-down

mode is expected to reduce standby power consumption by 40 to 50 percent.

DDR4 Details

There are subtle dierences between DDR3 and DDR4 memory modules, as listed below.

Key notch dierence

The key notch on a DDR4 module is in a dierent location from the key notch on a DDR3 module. Both notches are on the insertion edge

but the notch location on the DDR4 is slightly dierent, to prevent the module from being installed into an incompatible board or platform.

Figure 1. Notch dierence

Increased thickness

DDR4 modules are slightly thicker than DDR3, to accommodate more signal layers.

44 Technology and components

Figure 2. Thickness dierence

Curved edge

DDR4 modules feature a curved edge to help with insertion and alleviate stress on the PCB during memory installation.

Figure 3. Curved edge

Memory Errors

Memory errors on the system display the new ON-FLASH-FLASH or ON-FLASH-ON failure code. If all memory fails, the LCD does not

turn on. Troubleshoot for possible memory failure by trying known good memory modules in the memory connectors on the bottom of the

system or under the keyboard, as in some portable systems.

HDMI 1.4

This topic explains the HDMI 1.4 and its features along with the advantages.

HDMI (High-Denition Multimedia Interface) is an industry-supported, uncompressed, all-digital audio/video interface. HDMI provides an

interface between any compatible digital audio/video source, such as a DVD player, or A/V receiver and a compatible digital audio and/or

video monitor, such as a digital TV (DTV). The intended applications for HDMI TVs, and DVD players. The primary advantage is cable

reduction and content protection provisions. HDMI supports standard, enhanced, or high-denition video, plus multichannel digital audio on

a single cable.

NOTE: The HDMI 1.4 will provide 5.1 channel audio support.

HDMI 1.4 Features

•HDMI Ethernet Channel - Adds high-speed networking to an HDMI link, allowing users to take full advantage of their IP-enabled

devices without a separate Ethernet cable

•Audio Return Channel - Allows an HDMI-connected TV with a built-in tuner to send audio data "upstream" to a surround audio system,

eliminating the need for a separate audio cable

•3D - Denes input/output protocols for major 3D video formats, paving the way for true 3D gaming and 3D home theater applications

•Content Type - Real-time signaling of content types between display and source devices, enabling a TV to optimize picture settings

based on content type

•Additional Color Spaces - Adds support for additional color models used in digital photography and computer graphics

Technology and components 45

•4K Support - Enables video resolutions far beyond 1080p, supporting next-generation displays that will rival the Digital Cinema systems

used in many commercial movie theaters

•HDMI Micro Connector - A new, smaller connector for phones and other portable devices, supporting video resolutions up to 1080p

•Automotive Connection System - New cables and connectors for automotive video systems, designed to meet the unique demands of

the motoring environment while delivering true HD quality

Advantages of HDMI

• Quality HDMI transfers uncompressed digital audio and video for the highest, crispest image quality.

• Low -cost HDMI provides the quality and functionality of a digital interface while also supporting uncompressed video formats in a

simple, cost-eective manner

• Audio HDMI supports multiple audio formats from standard stereo to multichannel surround sound

• HDMI combines video and multichannel audio into a single cable, eliminating the cost, complexity, and confusion of multiple cables

currently used in A/V systems

• HDMI supports communication between the video source (such as a DVD player) and the DTV, enabling new functionality

USB features

Universal Serial Bus, or USB, was introduced in 1996. It dramatically simplied the connection between host computers and peripheral

devices like mice, keyboards, external drivers, and printers.

Let's take a quick look on the USB evolution referencing to the table below.

Table 2. USB evolution

Type Data Transfer Rate Category Introduction Year

USB 3.0/USB 3.1 Gen 1 5 Gbps Super Speed 2010

USB 2.0 480 Mbps High Speed 2000

USB 3.0/USB 3.1 Gen 1 (SuperSpeed USB)

For years, the USB 2.0 has been rmly entrenched as the de facto interface standard in the PC world with about 6 billion devices sold, and

yet the need for more speed grows by ever faster computing hardware and ever greater bandwidth demands. The USB 3.0/USB 3.1 Gen 1

nally has the answer to the consumers' demands with a theoretically 10 times faster than its predecessor. In a nutshell, USB 3.1 Gen 1

features are as follows:

• Higher transfer rates (up to 5 Gbps)

• Increased maximum bus power and increased device current draw to better accommodate power-hungry devices

• New power management features

• Full-duplex data transfers and support for new transfer types

• Backward USB 2.0 compatibility

• New connectors and cable

The topics below cover some of the most commonly asked questions regarding USB 3.0/USB 3.1 Gen 1.

46 Technology and components

Speed

Currently, there are 3 speed modes dened by the latest USB 3.0/USB 3.1 Gen 1 specication. They are Super-Speed, Hi-Speed and Full-

Speed. The new SuperSpeed mode has a transfer rate of 4.8Gbps. While the specication retains Hi-Speed, and Full-Speed USB mode,

commonly known as USB 2.0 and 1.1 respectively, the slower modes still operate at 480Mbps and 12Mbps respectively and are kept to

maintain backward compatibility.

USB 3.0/USB 3.1 Gen 1 achieves the much higher performance by the technical changes below:

• An additional physical bus that is added in parallel with the existing USB 2.0 bus (refer to the picture below).

• USB 2.0 previously had four wires (power, ground, and a pair for dierential data); USB 3.0/USB 3.1 Gen 1 adds four more for two pairs

of dierential signals (receive and transmit) for a combined total of eight connections in the connectors and cabling.

• USB 3.0/USB 3.1 Gen 1 utilizes the bidirectional data interface, rather than USB 2.0's half-duplex arrangement. This gives a 10-fold

increase in theoretical bandwidth.

With today's ever increasing demands placed on data transfers with high-denition video content, terabyte storage devices, high megapixel

count digital cameras etc., USB 2.0 may not be fast enough. Furthermore, no USB 2.0 connection could ever come close to the 480Mbps

theoretical maximum throughput, making data transfer at around 320Mbps (40MB/s) — the actual real-world maximum. Similarly, USB

3.0/USB 3.1 Gen 1 connections will never achieve 4.8Gbps. We will likely see a real-world maximum rate of 400MB/s with overheads. At this

speed, USB 3.0/USB 3.1 Gen 1 is a 10x improvement over USB 2.0.

Applications

USB 3.0/USB 3.1 Gen 1 opens up the laneways and provides more headroom for devices to deliver a better overall experience. Where USB

video was barely tolerable previously (both from a maximum resolution, latency, and video compression perspective), it's easy to imagine

that with 5-10 times the bandwidth available, USB video solutions should work that much better. Single-link DVI requires almost 2Gbps

throughput. Where 480Mbps was limiting, 5Gbps is more than promising. With its promised 4.8Gbps speed, the standard will nd its way

into some products that previously weren't USB territory, like external RAID storage systems.

Listed below are some of the available SuperSpeed USB 3.0/USB 3.1 Gen 1 products:

• External Desktop USB 3.0/USB 3.1 Gen 1 Hard Drives

• Portable USB 3.0/USB 3.1 Gen 1 Hard Drives

• USB 3.0/USB 3.1 Gen 1 Drive Docks & Adapters

• USB 3.0/USB 3.1 Gen 1 Flash Drives & Readers

• USB 3.0/USB 3.1 Gen 1 Solid-state Drives

Technology and components 47

• USB 3.0/USB 3.1 Gen 1 RAIDs

• Optical Media Drives

• Multimedia Devices

• Networking

• USB 3.0/USB 3.1 Gen 1 Adapter Cards & Hubs

Compatibility

The good news is that USB 3.0/USB 3.1 Gen 1 has been carefully planned from the start to peacefully co-exist with USB 2.0. First of all,

while USB 3.0/USB 3.1 Gen 1 species new physical connections and thus new cables to take advantage of the higher speed capability of

the new protocol, the connector itself remains the same rectangular shape with the four USB 2.0 contacts in the exact same location as

before. Five new connections to carry receive and transmitted data independently are present on USB 3.0/USB 3.1 Gen 1 cables and only

come into contact when connected to a proper SuperSpeed USB connection.

Windows 8/10 will be bringing native support for USB 3.1 Gen 1 controllers. This is in contrast to previous versions of Windows, which

continue to require separate drivers for USB 3.0/USB 3.1 Gen 1 controllers.

Microsoft announced that Windows 7 would have USB 3.1 Gen 1 support, perhaps not on its immediate release, but in a subsequent Service

Pack or update. It is not out of the question to think that following a successful release of USB 3.0/USB 3.1 Gen 1 support in Windows 7,

SuperSpeed support would trickle down to Vista. Microsoft has conrmed this by stating that most of their partners share the opinion that

Vista should also support USB 3.0/USB 3.1 Gen 1.

Super-Speed support for Windows XP is unknown at this point. Given that XP is a seven-year-old operating system, the likelihood of this

happening is remote.

USB Type-C

USB Type-C is a new, tiny physical connector. The connector itself can support various exciting new USB standard like USB 3.1 and USB

power delivery (USB PD).

Alternate Mode

USB Type-C is a new connector standard that's very small. It's about a third the size of an old USB Type-A plug. This is a single connector

standard that every device should be able to use. USB Type-C ports can support a variety of dierent protocols using “alternate modes,”

which allows you to have adapters that can output HDMI, VGA, DisplayPort, or other types of connections from that single USB port

USB Power Delivery

The USB PD specication is also closely intertwined with USB Type-C. Currently, smartphones, tablets, and other mobile devices often use

a USB connection to charge. A USB 2.0 connection provides up to 2.5 watts of power — that'll charge your phone, but that's about it. A

laptop might require up to 60 watts, for example. The USB Power Delivery specication ups this power delivery to 100 watts. It's bi-

directional, so a device can either send or receive power. And this power can be transferred at the same time the device is transmitting

data across the connection.

This could spell the end of all those proprietary laptop charging cables, with everything charging via a standard USB connection. You could

charge your laptop from one of those portable battery packs you charge your smartphones and other portable devices from today. You

could plug your laptop into an external display connected to a power cable, and that external display would charge your laptop as you used

it as an external display — all via the one little USB Type-C connection. To use this, the device and the cable have to support USB Power

Delivery. Just having a USB Type-C connection doesn't necessarily mean they do.

48 Technology and components

USB Type-C and USB 3.1

USB 3.1 is a new USB standard. USB 3's theoretical bandwidth is 5 Gbps, while USB 3.1 Gen2 is10Gbps . That's double the bandwidth, as

fast as a rst-generation Thunderbolt connector. USB Type-C isn't the same thing as USB 3.1. USB Type-C is just a connector shape, and

the underlying technology could just be USB 2 or USB 3.0. In fact, Nokia's N1 Android tablet uses a USB Type-C connector, but underneath

it's all USB 2.0 — not even USB 3.0. However, these technologies are closely related.

Thunderbolt over USB Type-C

Thunderbolt is a hardware interface that combines data, video, audio, and power in a single connection. Thunderbolt combines PCI Express

(PCIe) and DisplayPort (DP) into one serial signal, and additionally provides DC power, all in one cable. Thunderbolt 1 and Thunderbolt 2 use

the same connector [1] as miniDP (DisplayPort) to connect to peripherals, while Thunderbolt 3 uses a USB Type-C connector [2].

Figure 4. Thunderbolt 1 and Thunderbolt 3

1 Thunderbolt 1 and Thunderbolt 2 (using a miniDP connector)

2 Thunderbolt 3 (using a USB Type-C connector)

Thunderbolt 3 over USB Type-C

Thunderbolt 3 brings Thunderbolt to USB Type-C at speeds up to 40 Gbps, creating one compact port that does it all - delivering the

fastest, most versatile connection to any dock, display or data device like an external hard drive. Thunderbolt 3 uses a USB Type-C

connector/port to connect to supported peripherals.

1 Thunderbolt 3 uses USB Type-C connector and cables - It is compact and reversible

2 Thunderbolt 3 supports speed up to 40 Gbps

3 DisplayPort 1.2 – compatible with existing DisplayPort monitors, devices and cables

4 USB Power Delivery - Up to 130W on supported computers

Key Features of Thunderbolt 3 over USB Type-C

1 Thunderbolt, USB, DisplayPort and power on USB Type-C on a single cable (features vary between dierent products)

2 USB Type-C connector and cables which are compact and reversible

3 Supports Thunderbolt Networking (*varies between dierent products)

4 Supports up to 4K displays

5 Up to 40 Gbps

NOTE: Data transfer speed may vary between dierent devices.

Technology and components 49

System specications

Topics:

• Technical specications

• Hot key combinations

Technical specications

NOTE: Oerings may vary by region. The following specications are only those required by law to ship with your computer. For

more information about the conguration of your computer, go to Help and Support in your Windows operating system and

select the option to view information about your computer.

Table 3. Specications

Type Feature

Processor family Intel Core i5-8250U (Quad Core, 3.4GHz, 6M Cache, 15W )

Intel Core i5-8350U (Quad Core, 3.6GHz, 6M Cache, 15W ) vPro

Intel Core i7-8650U (Quad Core, 3.9 GHz, 8M Cache, 15W ) vPro

Intel Core i3-7130U (Dual Core, 2.7 GHz, 3M cache, 15W )

Intel Core i5-7300U (Dual Core, 3.5 GHz, 3M Cache, 15W) vPro

System • Chipset: Intel Kaby Lake -U/R—Integrated in the processor

• DRAM bus width: 64 - Bit

• Flash EPROM: SPI 128 Mbits

• PCIe bus: 100 MHz

• External Bus Frequency: DMI 3.0-8GT/s

Operating System • Microsoft Windows 10 Home

• Microsoft Windows 10 Pro 64 bit

• Ubuntu 16.04 LTS

Memory • DDR4 2400 SDRAM operates at 2133 with Intel 7th Gen

• DDR4 2400 SDRAM operates at 2400 with Intel 8th Gen

• 2 DIMM slots supporting up to 32GB

Video • Intel HD Graphics 620 (7th Gen Intel Core

• Intel UHD Graphics 620 (8th Gen Intel Core)

Audio • Types: Four-channel high-denition audio

• Controller: Realtek ALC3246

• Stereo conversion: 24-bit-analog-to-digital and digital-to-analog

• Internal interface: High-denition audio

50 System specications

• External interface: Microphone-in, stereo headphones, and headset combo

connector

• Speakers: Two

• Internal speaker amplier: 2 W (RMS) per channel

• Volume controls: Hot keys

Display • 14.0 inch HD (1366 x 768) Anti-Glare, HD CAM/Mic, WLAN capable, Mag

Alloy back, Non Touch

• 14.0 inch HD (1366 x 768) Anti-Glare, HD CAM/Mic, WLAN/WWAN, Mag

Alloy back, Non Touch

• 14.0 inch FHD (1920 x 1080) Anti-Glare, HD CAM/Mic, WLAN capable, Mag

Alloy back, Non Touch

• 14.0 inch FHD (1920 x 1080) Anti-Glare, HD CAM/Mic, WWAN/WLAN,

Mag Alloy back, Non Touch

• 14.0 inch FHD (1920 x 1080) Anti-Glare, Mic only, WLAN capable, Mag Alloy

back, Non Touch

• 14.0 inch FHD (1920 x 1080) Anti-Glare, Super Low Power Panel (SLP), HD

CAM/Mic, WLAN w/ASA, Narrow Border Mag Alloy back, Non Touch

• 14.0 inch FHD (1920 x 1080) Anti-Glare, Super Low Power Panel (SLP), IR

CAM/Mic, WLAN w/ASA, Narrow Border Mag Alloy back, Non Touch

• 14.0 inch FHD (1920 x 1080), Anti-Glare, HD CAM/Mic, WLAN/WWAN,

Mag Alloy back, On-cell Touch

• 14.0 inch FHD (1920 x 1080), Anti-Glare, HD CAM/Mic, WLAN w/ASA,

Narrow Border Carbon Fiber back, On-cell Touch

• 14.0 inch FHD (1920 x 1080), Anti-Glare, IR CAM/Mic, WLAN w/ASA,

Narrow Border Carbon Fiber back, On-cell Touch

Storage options Primary Storage:

• 128 GB M.2 2280 SATA 2280 SSD

• 256 GB M.2 2280 SATA 2280 SSD

• 512 GB M.2 2280 SATA 2280 SSD

• 512 GB M.2 2280 SATA SED 2280 SSD

• 128 GB M.2 2280 PCIe SSD

• 256 GB M.2 2280 PCIe SSD

• 512 GB M.2 2280 PCIe SSD

• 1 TB M.2 2280 PCIe SSD

• 256 GB M.2 2280 PCIe SED SSD

• 512 GB M.2 2280 PCIe SED SSD

Security TPM 2.0 FIPS 140-2 Certied, TCG Certied (February 2018)

Optional Hardware Authentication Bundle 1: FIPS 201 Contacted Smart Card

with Control Vault 2.0 Advanced Authentication with FIPS 140-2 Level 3

Certication

Optional Hardware Authentication Bundle 2: Touch Fingerprint Reader, FIPS 201

Contacted Smart Card, Contactless Smart Card, NFC, Control Vault 2.0

Advanced Authentication with FIPS 140-2 Level 3 Certication

Docking options • Dell Business Dock WD15 (optional)

• Dell Business Thunderbolt Dock - TB16(optional for Thunderbolt 3 equipped

systems only)

Multimedia • Integrated High-Quality Speakers

• Headset and mic combo jack

• Noise reducing array microphones

System specications 51

• Optional HD or IR Cam or No webcam

Optical Drive Options External Options Only

Battery options • 42 Whr Prismatic, ExpressCharge Capable

• 60 Whr Polymer, ExpressCharge Capable

• 60 Whr Long Life Cycle (polymer)

42 WHr (3-cell):

• Length: 95.9 mm ( 3.78 inch )

• Width: 5.70 mm ( 0.22 inch )

• Height: 18.50 mm (0.71 inch )

• Weight: 185.00 g (0.41lb)

• Battery Capacity : 3.68 mAhr

60 WHr (4-cell):

• Length: 95.9mm ( 3.78 inch)

• Width: 5.70mm ( 0.22 inch)

• Height: 18.50 mm (0.71 inch )

• Weight: 270.00 g (0.6lb)

• Battery Capacity: 7.89 mAhr

60 WHr Long Life Cycle battery (polymer):

• Length: 95.9mm ( 3.78 inch)

• Width: 5.70mm ( 0.22 inch)

• Height: 18.50 mm (0.71 inch )

• Weight: 270.00 g (0.6lb)

• Battery Capacity: 7.89 mAhr

Maximum Runtime Cong • 7490 xed hardware conguration that allows user to get signicant hours

of additional runtime

• It features a new Super-Low-Power (SLP) panel that enables the majority

of the power savings. Backlight power draw is signicantly lower than

standard FHD panel

NOTE:

Up to 20 hrs. battery run time (~18% improvement over standard FHD

panel) with this conguration using FHD SLP panel with 60Whr battery

Power adapter • Type: E5 65 W or E5 90 W

• Input voltage: 100 V AC to 240 V AC

• Input current-maximum:1.7 A

• Input frequency: 50 Hz to 60 Hz

• Output current: 3.34 A and 4.62 A

• Rated output voltage: 19.5 V DC

• Weight: 230 g (65 W) and 320 g (90 W)

• Dimensions: 22 x 66 x 106 mm (65 W) and 22 x 66 x 130 (90 W)

• Temperature range-Operating: 0°C to 40°C (32°F to 104°F)

• Temperature range-Non-Operating: -40°C to 70°C (-40°F to 158°F)

Communications Network adapter: Intel i219LM Gigabit Ethernet Controller,10/100/1000 Mb/s

Ethernet (RJ-45)

52 System specications

Wireless and Modem:

• Qualcomm QCA61x4A 802.11ac Dual Band (2x2) Wireless Adapter +

Bluetooth 4.1 Wireless Card

• Intel Dual-Band Wireless-AC 8265 Wi-Fi Wireless Card (No BT) (2x2)

• Intel Dual-Band Wireless-AC 8265 Wi-Fi + BT 4.2 Wireless Card (2x2)

• Intel Tri-Band Wireless-AC 18265 WiGig + Wi-Fi + BT4.2 Wireless Card

• Qualcomm Snapdragon™ X7 LTE-A (DW5811e)

• Qualcomm Snapdragon™ X7 HSPA+ (DW5811e)

• Qualcomm Snapdragon™ X7 LTE-A (DW5816e)

Ports, Slots, and Chassis • HDMI 1.4(1)

• Universal Jack

• MultiMedia card reader (SD 4.0)

• uSIM (external)

• 3x USB 3.1 Gen1 (one with PowerShare)

• DisplayPort over USB Type-C(optional Thunderbolt 3(1)

• RJ45

• Optional Smartcard

• Noble lock wedge slot

• DC-in

Camera • Type: HD xed focus

• Sensor type: CMOS sensor technology

• Imaging rate: Up to 30 frames per second

• Video Resolution: 1280 x 720 pixels (0.92 MP)

Touchpad Active area

• X-axis—99.50 mm

• Y-axis—53.0 mm

• X/Y position resolution— X: 1048cpi; Y:984cpi

•Multi-touch—Congurable single nger and multi-nger gestures

Internal Keyboards • 14.1 inches Single Pointing, non backlit

• 14.1 inches Dual Pointing, backlit

Physical specications • Front height to Back ( Non Touch) : 0.69 to 0.70 inches; 7.47 to 17.9

• Width: 13.03 inch; 331.0 mm

• Depth: 8.70 inch; 220.9 mm

• Starting weight: 1.4 kg; 3.11 lbs

Environmental specications Temperature Specications

• Operating: 0°C to 35°C (32°F to 95°F)

• Storage : –40°C to 65°C (–40°F to 149°F)

Relative humidity—maximum Specications

• Operating: 10% to 90% (non-condensing)

• Storage: 5% to 95% (non-condensing)

Altitude—maximum Specications

• Operating: 0 to 3048 m (0 to 10,000 ft)

• Non-operating: 5% to 95% (non-condensing)

System specications 53

• Airborne contaminant level: G2 or lower as dened by ISA S71.04–1985

Display specications in detail

Table 4. 14.0 inches (16:9) AG HD (1366 x 768) WLED 200 nits ( typ ) eDP 1.2 ,HD CAM/Mic, WLAN capable, Mag Alloy back, Non

Touch

Feature Specication

Type HD Anti-Glare

Luminance (typical) 200 nits

Dimensions (Active Area) • Height: 173.95 mm(maximum )

• Width: 309.4 mm(maximum )

• Diagonal: 14.0 inch

Native Resolution 1366 x 768

Megapixels 1.05

Pixels per Inch (PPI) 112

Contrast Ratio (min) 300:1

Response Time (max) 25 msec rise/fall

Refresh Rate 60 Hz

Horizontal View Angle (min) +/- 40 degrees

Vertical View Angle (min) +10/-30 degrees

Pixel Pitch 0.2265 mm

Power Consumption (maximum) 2.8 W

Table 5. 14.0 inches (16:9) AG HD (1366 x 768) WLED 200 nits ( typ ) eDP 1.2 ,HHD CAM/Mic, WLAN/WWAN, Mag Alloy back, Non

Touch

Feature Specication

Type HD Anti-Glare

Luminance (typical) 200 nits

Dimensions (Active Area) • Height: 173.95 mm(maximum )

• Width: 309.4 mm(maximum )

• Diagonal: 14.0 inch

Native Resolution 1366 x 768

Megapixels 1.05

Pixels per Inch (PPI) 112

Contrast Ratio (min) 300:1

Response Time (max) 25 msec rise/fall

54 System specications

Refresh Rate 60 Hz

Horizontal View Angle (min) +/- 40 degrees

Vertical View Angle (min) +10/-30 degrees

Pixel Pitch 0.2265 mm

Power Consumption (maximum) 2.8 W

Table 6. 14.0 inches (16:9) AG FHD (1920 x 1080) 300 nits, eDP 1.3 w/PSR, IPS, HD CAM/Mic, WLAN capable, Mag Alloy back, Non

Touch

Feature Specication

Type FHD Anti-Glare

Luminance (typical) 300 nits

Dimensions (Active Area) • Height: 173.95 mm(maximum )

• Width: 309.4 mm(maximum )

• Diagonal: 14.0 inch

Native Resolution 1920 x 1080

Megapixels 2.07

Pixels per Inch (PPI) 157

Contrast Ratio (min) 600:1

Response Time (max) 35 msec black to white

Refresh Rate 60 Hz

Horizontal View Angle (min) +/- 80 degrees

Vertical View Angle (min) +/- 80 degrees

Pixel Pitch 0.161 x 0.161 mm

Power Consumption (maximum) 3.8 W

Table 7. 14.0 inches (16:9) AG FHD (1920 x 1080) 300 nits, eDP 1.3 w/PSR, IPS, HD CAM/Mic, WWAN/WLAN, Mag Alloy back, Non

Touch

Feature Specication

Type FHD Anti-Glare

Luminance (typical) 300 nits

Dimensions (Active Area) • Height: 173.95 mm (maximum) without metal tabs mm

• Width: 309.4 mm(maximum )

• Diagonal: 14.0 inch

Native Resolution 1920 x 1080

Megapixels 2.07

Pixels per Inch (PPI) 157

Contrast Ratio (min) 1000:1

System specications 55

Response Time (max) 35 msec black to white

Refresh Rate 60 Hz

Horizontal View Angle (min) +/- 80 degrees

Vertical View Angle (min) +/- 80 degrees

Pixel Pitch 0.161 x 0.161 mm

Power Consumption (maximum) 3.8 W

Table 8. 14.0 inches (16:9) AG FHD (1920 x 1080) 300 nits, eDP 1.3 w/PSR, IPS, Mic only, WLAN capable, Mag Alloy back, Non Touch

Feature Specication

Type FHD Anti-Glare

Luminance (typical) 300 nits

Dimensions (Active Area) • Height: 173.95 mm(maximum )

• Width: 309.4 mm(maximum )

• Diagonal: 14.0 inch

Native Resolution 1920 x 1080

Megapixels 2.07

Pixels per Inch (PPI) 157

Contrast Ratio (min) 600:1

Response Time (max) 35 msec black to white

Refresh Rate 60 Hz

Horizontal View Angle (min) +/- 80 degrees

Vertical View Angle (min) +/- 80 degrees

Pixel Pitch 0.161 x 0.161 mm

Power Consumption (maximum) 3.8 W

Table 9. 14.0 inches (16:9) AG FHD (1920 x 1080) 300 nits, eDP 1.3 w/PSR, IPS, Super Low Power Panel (SLP), HD CAM/Mic,

WLAN w/ASA, Narrow Border Mag Alloy back, Non Touch

Feature Specication

Type FHD Anti-Glare

Luminance (typical) 300 nits

Dimensions (Active Area) • Height: 173.95 mm(maximum) without metal tabs

• Width: 309.4 mm(maximum )

• Diagonal: 14.0 inch

Native Resolution 1920 x 1080

Megapixels 2.07

Pixels per Inch (PPI) 157

56 System specications

Contrast Ratio (min) 1000:1

Response Time (max) 35 msec black to white

Refresh Rate 60 Hz

Horizontal View Angle (min) +/- 80 degrees

Vertical View Angle (min) +/- 80 degrees

Pixel Pitch 0.161 x 0.161 mm

Power Consumption (maximum) 1.99 W

Table 10. 14.0 inches (16:9) AG FHD (1920 x 1080) 300 nits, eDP 1.3 w/PSR, IPS, Super Low Power Panel (SLP), IR CAM/Mic, WLAN

w/ASA, Narrow Border Mag Alloy back, Non Touch

Feature Specication

Type FHD Anti-Glare

Luminance (typical) 300 nits

Dimensions (Active Area) • Height: 173.95 mm(maximum) without metal tabs

• Width: 309.4 mm(maximum )

• Diagonal: 14.0 inch

Native Resolution 1920 x 1080

Megapixels 2.07

Pixels per Inch (PPI) 157

Contrast Ratio (min) 1000:1

Response Time (max) 35 msec black to white

Refresh Rate 60 Hz

Horizontal View Angle (min) +/- 80 degrees

Vertical View Angle (min) +/- 80 degrees

Pixel Pitch 0.161 x 0.161 mm

Power Consumption (maximum) 1.99 W

Table 11. 14.0 inches (16:9) AG FHD (1920 x 1080) 300 nits, eDP 1.3 w/PSR, IPS, HD CAM/Mic, WLAN/WWAN, Mag Alloy back, On-

cell Touch

Feature Specication

Type FHD Anti-Glare

Luminance (typical) 300 nits

Dimensions (Active Area) • Height: 173.95 mm(maximum )

• Width: 309.4 mm(maximum )

• Diagonal: 14.0 inch

Native Resolution 1920 x 1080

Megapixels 2.07

System specications 57

Pixels per Inch (PPI) 157

Contrast Ratio (min) 600:1

Response Time (max) 35 msec black to white

Refresh Rate 60 Hz

Horizontal View Angle (min) +/- 80 degrees

Vertical View Angle (min) +/- 80 degrees

Pixel Pitch 0.161 x 0.161 mm

Power Consumption (maximum) 4.1 W

Table 12. 14.0 inches (16:9) AG FHD (1920 x 1080) 300 nits, eDP 1.3 w/PSR, IPS, HD CAM/Mic, WLAN w/ASA, Narrow Border

Carbon Fiber back, On-cell Touch

Feature Specication

Type FHD Anti-Glare

Luminance (typical) 300 nits

Dimensions (Active Area) • Height: 173.95 mm(maximum )

• Width: 309.4 mm(maximum )

• Diagonal: 14.0 inch

Native Resolution 1920 x 1080

Megapixels 2.07

Pixels per Inch (PPI) 157

Contrast Ratio (min) 600:1

Response Time (max) 35 msec black to white

Refresh Rate 60 Hz

Horizontal View Angle (min) +/- 80 degrees

Vertical View Angle (min) +/- 80 degrees

Pixel Pitch 0.161 x 0.161 mm

Power Consumption (maximum) 4.1 W

Table 13. 14.0 inches (16:9) AG FHD (1920 x 1080) 300 nits, eDP 1.3 w/PSR, IPS, IR CAM/Mic, WLAN w/ASA, Narrow Border Carbon

Fiber back, On-cell Touch

Feature Specication

Type FHD Anti-Glare

Luminance (typical) 300 nits

Dimensions (Active Area) • Height: 173.95 mm(maximum )

• Width: 309.4 mm(maximum )

• Diagonal: 14.0 inch

Native Resolution 1920 x 1080

58 System specications

Megapixels 2.07

Pixels per Inch (PPI) 157

Contrast Ratio (min) 600:1

Response Time (max) 35 msec black to white

Refresh Rate 60 Hz

Horizontal View Angle (min) +/- 80 degrees

Vertical View Angle (min) +/- 80 degrees

Pixel Pitch 0.161 x 0.161 mm

Power Consumption (maximum) 4.1 W

Hot key combinations

Table 14. Hot key combinations

Function key combination Latitude 7490

Fn+ESC Fn Toggle

Fn+ F1 Speaker Mute

Fn+ F2 Volume Down

Fn+ F3 Volume Up

Fn+ F4 Mic Mute

Fn+ F5 Num Lock

Fn+ F6 Scroll Lock

Fn+ F8 Display Toggle (Win + P)

Fn+ F9 Search

Fn+ F10 Increase keyboard back light brightness

Fn+ F11 Decrease display brightness

Fn+ F12 Increase display brightness

Fn + Prt Scr WLAN on/o

Fn + Insert Sleep

Fn + Left Cursor Home

Fn + Right Cursor End

System specications 59

System setup

System setup enables you to manage your notebook hardware and specify BIOS level options. From the System setup, you can:

• Change the NVRAM settings after you add or remove hardware

• View the system hardware conguration

• Enable or disable integrated devices

• Set performance and power management thresholds

• Manage your computer security

Topics:

• Boot menu

• Navigation keys

• System setup options

• General screen options

• System Conguration screen options

• Video screen options

• Security screen options

• Secure Boot screen options

• Intel software guard extensions screen options

• Performance screen options

• Power management screen options

• POST behavior screen options

• Manageability

• Virtualization support screen options

• Wireless screen options

• Maintenance screen options

• System logs screen options

• System and setup password

• Updating the BIOS in Windows

Boot menu

Press <F12> when the Dell™ logo appears to initiate a one-time boot menu with a list of the valid boot devices for the system. Diagnostics

and BIOS Setup options are also included in this menu. The devices listed on the boot menu depend on the bootable devices in the system.

This menu is useful when you are attempting to boot to a particular device or to bring up the diagnostics for the system. Using the boot

menu does not make any changes to the boot order stored in the BIOS.

The options are:

• Legacy Boot:

– Internal HDD

– Onboard NIC

• UEFI Boot:

– Windows Boot Manager

60 System setup

• Other Options:

– BIOS Setup

– BIOS Flash Update

– Diagnostics

– Change Boot Mode Settings

Navigation keys

NOTE: For most of the System Setup options, changes that you make are recorded but do not take eect until you restart the

system.

Keys Navigation

Up arrow Moves to the previous eld.

Down arrow Moves to the next eld.

Enter Selects a value in the selected eld (if applicable) or follow the link in the eld.

Spacebar Expands or collapses a drop‐down list, if applicable.

Tab Moves to the next focus area.

NOTE: For the standard graphics browser only.

Esc Moves to the previous page until you view the main screen. Pressing Esc in the main screen displays a message

that prompts you to save any unsaved changes and restarts the system.

System setup options

NOTE: Depending on the notebook and its installed devices, the items listed in this section may or may not appear.

General screen options

This section lists the primary hardware features of your computer.

Option Description

System Information This section lists the primary hardware features of your computer.

• System Information: Displays BIOS Version, Service Tag, Asset Tag, Ownership Tag, Ownership Date,

Manufacture Date, Express Service Code, the Signed Firmware update—enabled by default

• Memory Information: Displays Memory Installed, Memory Available, Memory Speed, Memory Channels Mode,

Memory Technology, DIMM ASize, DIMM B Size,

• Processor Information: Displays Processor Type, Core Count, Processor ID, Current Clock Speed, Minimum

Clock Speed, Maximum Clock Speed, Processor L2 Cache, Processor L3 Cache, HT Capable, and 64-Bit

Technology

• Device Information: Displays M.2 SATA, M.2 PCIe SSD-0, LOM MAC Address, Passthrough MAC address,

Video Controller, Video BIOS Version, Video Memory, Panel Type, Native Resolution, Audio Controller, Wi-Fi

Device, WiGig Device, Cellular Device, Bluetooth Device

Battery Information Displays the battery status health and whether the AC adapter is installed.

Boot Sequence Allows you to change the order in which the computer attempts to nd an operating system.

• Diskette Drive

• Internal HDD

• USB Storage Device

• CD/DVD/CD-RW Drive

System setup 61

Option Description

• Onboard NIC

Boot sequence

options • Windows Boot Manager

Boot list options • Legacy

• UEFI—selected by default

Advanced Boot

Options

This option allows you the legacy option ROMs to load. By default, the Enable Legacy Option ROMs is disabled.

Enable Attempt Legacy Boot is disabled by default.

UEFI boot path

security • Always, except internal HDD

• Always

• Never

Date/Time Allows you to change the date and time.

System Conguration screen options

Option Description

Integrated NIC Allows you to congure the integrated network controller. The options are:

• Disabled

• Enabled

• Enable UEFI network stack: This option is enabled by default.

• Enabled w/PXE

SATA Operation Allows you to congure the internal SATA hard-drive controller. The options are:

• Disabled

• AHCI

• RAID On: This option is enabled by default.

Drives Allows you to congure the SATA drives on board. All drives are enabled by default. The options are:

• SATA-2

• M.2 PCI-e SSD-0

SMART Reporting This eld controls whether hard drive errors for integrated drives are reported during system startup. This

technology is part of the SMART (Self-Monitoring Analysis and Reporting Technology) specication. This option is

disabled by default.

• Enable SMART Reporting

USB Conguration This is an optional feature.

This eld congures the integrated USB controller. If Boot Support is enabled, the system is allowed to boot any

type of USB Mass Storage Devices—HDD, memory key, oppy.

If USB port is enabled, device attached to this port is enabled and available for OS.

If USB port is disabled, the OS cannot see any device attached to this port.

62 System setup

Option Description

The options are:

• Enable USB Boot Support—enabled by default

• Enable External USB Port—enabled by default

NOTE: USB keyboard and mouse always work in the BIOS setup irrespective of these settings.

Dell Type-C Dock

Conguration

Always Allow Dell Docs.This option is enabled by default.

Thunderbolt Adaptor

Conguration •Enable Thunderbolt Technology Support.This option is enabled by default.

•Enable Thunderbolt Adaptor Boot Support

•Enable Thunderbolt Adaptor Pre-boot Modules

•Security level—No Security

•Security level—User Authorization.This option is enabled by default.

•Security level—Secure Connect

•Security level—Display Port Only

USB PowerShare This eld congures the USB PowerShare feature behavior. This option allows you to charge external devices using

the stored system battery power through the USB PowerShare port. This option is disabled by default

Audio This eld enables or disables the integrated audio controller. By default, the Enable Audio option is selected. The

options are:

• Enable Microphone—by default enable

• Enable Internal Speaker—by default enable

Keyboard

Illumination

This eld lets you choose the operating mode of the keyboard illumination feature. The keyboard brightness level

can be set from 0% to 100%. The options are:

• Disabled

• Dim

• Bright—enabled by default

Keyboard Backlight

with AC

The Keyboard Backlight with AC option does not aect the main keyboard illumination feature. Keyboard

Illumination will continue to support the various illumination levels. This eld has an eect when the backlight is

enabled. This option is enabled by default.

Keyboard Backlight

Timeout on AC

The Keyboard Backlight Timeout dims out with AC option. The main keyboard illumination feature is not aected.

Keyboard Illumination will continue to support the various illumination levels. This eld has an eect when the

backlight is enabled. The options are:

• 5 sec

• 10 sec—enabled by default

• 15 sec

• 30 sec

• 1 min

• 5 min

• 15 min

• Never

Keyboard Backlight

Timeout on Battery

The Keyboard Backlight Timeout dims out with the Battery option. The main keyboard illumination feature is not

aected. Keyboard Illumination will continue to support the various illumination levels. This eld has an eect when

the backlight is enabled. The options are:

System setup 63

Option Description

• 5 sec

• 10 sec—enabled by default

• 15 sec

• 30 sec

• 1 min

• 5 min

• 15 min

• Never

Unobtrusive Mode This option, when enabled, pressing Fn+F7 turns o all light and sound emissions in the system. To resume normal

operation, press Fn+F7 again. This option is disabled by default.

Miscellaneous

Devices

Allows you to enable or disable the following devices:

• Enable Camera—enabled by default

• Secure Digital (SD) card—enabled by default

• Secure Digital (SD) card boot

• Secure Digital (SD) card read-only-mode

Video screen options

Option Description

LCD Brightness Allows you to set the display brightness depending up on the power source—On Battery and On AC. The LCD

brightness is independent for battery and AC adapter. It can be set using the slider.

NOTE: The video setting is visible only when a video card is installed into the system.

Security screen options

Option Description

Admin Password Allows you to set, change, or delete the administrator (admin) password.

NOTE: You must set the admin password before you set the system or hard drive password. Deleting the

admin password automatically deletes the system password and the hard drive password.

NOTE: Successful password changes take eect immediately.

Default setting: Not set

System Password Allows you to set, change, or delete the system password.

NOTE: Successful password changes take eect immediately.

Default setting: Not set

Strong Password Allows you to enforce the option to always set strong passwords.

Default Setting: Enable Strong Password is not selected.

NOTE: If Strong Password is enabled, the Admin and System passwords must contain at least one

uppercase character, one lowercase character and be at least 8 characters long.

64 System setup

Option Description

Password

Conguration

Allows you to specify the minimum and max password lengths of the Administrator and System passwords.

• min-4—by default, if you want to change you can increase the number

• max-32—you can decrease the number

Password Bypass Allows you to enable or disable the permission to bypass the System and the Internal HDD password, when they

are set. The options are:

• Disabled

• Reboot bypass

Default setting: Disabled

Password Change Allows you to enable the disable permission to the System and Hard Drive passwords when the admin password is

set.

Default setting: Allow Non-Admin Password Changes is selected.

Non-Admin Setup

Changes

Allows you to determine whether changes to the setup options are allowed when an Administrator Password is set.

If disabled the setup options are locked by the admin password.

Option "allow wireless switch changes" is not selected by default.

UEFI Capsule

Firmware Updates

This option controls if the system allows BIOS updates through UEFI capsule packages.

•Enable UEFI Capsule Firmware Updates. This option is enabled by default.

TPM 2.0 Security Allows you to enable the Trusted Platform Module (TPM) during POST. The options are:

• UEFI capsule Firmware updates—enabled by default

• TPM On—enabled by default

• Clear

• PPI Bypass for Enable Commands

• PPI Bypass for Disabled Commands

• Attestation enable—enabled by default

• Key storage enable—enabled by default

• SHA-256—enabled by default

• Disabled

• Enabled—enabled by default

NOTE: To upgrade or downgrade TPM 2.0, download the TPM wrapper tool—software.

Computrace Allows you to activate or disable the optional Computrace software The options are:

• Deactivate

• Disable

• Activate—enabled by default

NOTE: The Activate and Disable options will permanently activate or disable the feature and no further

changes are allowed

CPU XD Support Allows you to enable the Execute Disable mode of the processor.

Enable CPU XD Support—enabled by default

System setup 65

Option Description

OROM Keyboard

Access

Allows you to set an option to enter the Option ROM Conguration screens using hotkeys during boot. The options

are:

• Enabled

• One Time Enable

• Disable

Default setting: Enable

Admin Setup

Lockout

Allows you to prevent users from entering Setup when an Administrator password is set.

Default Setting: This option is enabled

Master password

lockout

This option is not enabled by default

SMM Security

Mitigation

This option enables or disables additional UEFI SMM Security Mitigation protections.

•SMM Security Mitigation

Secure Boot screen options

Option Description

Secure Boot Enable This option enables or disables the Secure Boot feature.

• Disabled

• Enabled

Default setting: Disabled

Expert Key

Management

Allows you to manipulate the security key databases only if the system is in Custom Mode. The Enable Custom

Mode option is disabled by default. The options are:

• PK—enabled by default

• KEK

• db

• dbx

If you enable the Custom Mode, the relevant options for PK, KEK, db, and dbx appear. The options are:

•Save to File—Saves the key to a user-selected le

•Replace from File—Replaces the current key with a key from a user-selected le

•Append from File—Adds a key to the current database from a user-selected le

•Delete—Deletes the selected key

•Reset All Keys—Resets to default setting

•Delete All Keys—Deletes all the keys

NOTE: If you disable the Custom Mode, all the changes made are erased and the keys restore to default

settings.

66 System setup

Intel software guard extensions screen options

Option Description

Intel SGX Enable This eld species you to provide a secured environment for running code/storing sensitive information in the

context of the main OS. The options are:

• Disabled

• Enabled

• Software Controlled

Default setting: Software Controlled

Enclave Memory

Size

This option sets SGX Enclave Reserve Memory Size. The options are:

• 32 MB

• 64 MB

• 128 MB—enabled by default

Performance screen options

Option Description

Multi-Core Support This eld species whether the process has one or all cores enabled. The performance of some applications

improves with the additional cores. This option is enabled by default. Allows you to enable or disable multi-core

support for the processor. The installed processor supports two cores. If you enable Multi-Core Support, two cores

are enabled. If you disable Multi-Core Support, one core is enabled.

• Enable Multi-Core Support

Default setting: The option is enabled.

Intel SpeedStep Allows you to enable or disable the Intel SpeedStep feature.

• Enable Intel SpeedStep

Default setting: The option is enabled.

C-States Control Allows you to enable or disable the additional processor sleep states.

• C states

Default setting: The option is enabled.

Intel TurboBoost Allows you to enable or disable the Intel TurboBoost mode of the processor.

• Enable Intel TurboBoost

Default setting: The option is enabled.

HyperThread

Control

Allows you to enable or disable the Hyper-Threading in the processor.

• Disabled

• Enabled

System setup 67

Option Description

Default setting: Enabled is selected.

Power management screen options

Option Description

AC Behavior Allows you to enable or disable the computer from turning on automatically when an AC adapter is connected.

Default setting: Wake on AC is not selected.

Enable Intel Speed

Shift Technology

This option is used to enable or disable Intel speed shift technoloy.

Default setting: Enable Intel Speed Shift Technology is enabled.

Auto On Time Allows you to set the time at which the computer must turn on automatically. The options are:

• Disabled

• Every Day

• Weekdays

• Select Days

Default setting: Disabled

USB Wake Support Allows you to enable USB devices to wake the system from Standby.

NOTE: This feature is only functional when the AC power adapter is connected. If the AC power adapter

is removed during Standby, the system setup removes power from all the USB ports to conserve battery

power.

• Enable USB Wake Support

• Wake on Dell USB-C dock

Default setting: The option is disabled.

Wireless Radio

Control

Allows you to enable or disable the feature that automatically switches from wired or wireless networks without

depending on the physical connection.

• Control WLAN Radio

• Control WWAN Radio

Default setting: The options are disabled.

Wake on WLAN Allows you to enable or disable the feature that powers on the computer from the O state when triggered by a

LAN signal.

• Disabled

• LAN Only

• WLAN Only

• LAN or WLAN

• Disabled

• WLAN

Default setting: Disabled

68 System setup

Option Description

Block Sleep This option lets you block entering to sleep (S3 state) in operating system environment.

Block Sleep (S3 state)

Default setting: This option is disabled

Peak Shift This option enables you to minimize the AC power consumption during the peak power times of day. After you

enable this option, your system runs only in battery even if the AC is attached.

• Enable peak shift

• Set battery threshold (15% to 100%) - 15 % (enabled by default)

• Enable peak shift—is disabled

• Set battery threshold (15% to 100%) - 15 % (enabled by default)

Advanced Battery

Charge

Conguration

This option enables you to maximize the battery health. By enabling this option, your system uses the standard

charging algorithm and other techniques, during the nonwork hours to improve the battery health.

Disabled

Default setting: Disabled

Primary Battery

Charge

Conguration

Allows you to select the charging mode for the battery. The options are:

• Adaptive—enabled by default

• Standard—Fully charges your battery at a standard rate.

• ExpressCharge—The battery charges over a shorter time using Dell’s fast charging technology This option is

enabled by default.

• Primarily AC use

• Custom

If Custom Charge is selected, you can also congure Custom Charge Start and Custom Charge Stop.

NOTE: All charging mode may not be available for all the batteries. To enable this option, disable the

Advanced Battery Charge Conguration option.

Sleep mode

• OS Automatic selection—enabled by default

Force S3

Type-C connector

power • 7.5 Watts

• 15 Watts—enabled by default

POST behavior screen options

Option Description

Adapter Warnings Allows you to enable or disable the system setup (BIOS) warning messages when you use certain power adapters.

Default setting: Enable Adapter Warnings

Keypad

(Embedded)

Allows you to choose one of two methods to enable the keypad that is embedded in the internal keyboard.

• Fn Key Only—default.

System setup 69

Option Description

• By Numlock

NOTE: When setup is running, this option has no eect. Setup works in Fn Key Only mode.

Numlock Enable Allows you to enable the Numlock option when the computer boots.

Enable Network. This option is enabled by default.

Fn Key Emulation Allows you to set the option where the Scroll Lock key is used to simulate the Fn key feature.

Enable Fn Key Emulation (default)

Fn Lock Options Allows you to let hot key combinations Fn + Esc toggle the primary behavior of F1–F12, between their standard

and secondary functions. If you disable this option, you cannot toggle dynamically the primary behavior of these

keys. The available options are:

• Fn Lock—enabled by default

• Lock Mode Disable/Standard—enabled by default

• Lock Mode Enable/Secondary

Fastboot Allows you to speed up the boot process by bypassing some of the compatibility steps. The options are:

• Minimal—enabled by default

• Thorough

• Auto

Extended BIOS

POST Time

Allows you to create an extra preboot delay. The options are:

• 0 seconds—enabled by default.

• 5 seconds

• 10 seconds

Full Screen Log • Enable Full Screen Logo—not enabled

Warnings and errors • Prompt on warnings and errors—enabled by default

• Continue on warnings

• Continue on warnings and errors

Manageability

Option Description

USB provision Enable USB provision is not selected by default

MEBX Hotkey —

enabled by default

Allows you to specify whether the MEBx Hotkey function should enable, during the system boot.

• Disabled

• Enabled

Default setting: Enabled

70 System setup

Virtualization support screen options

Option Description

Virtualization This eld species whether a virtual Machine Monitor (VMM) can utilize the conditional hardware capabilities

provided by Intel Virtualization Technology.

Enable Intel Virtualization Technology—enabled by default.

VT for Direct I/O Enables or disables the Virtual Machine Monitor (VMM) from utilizing the additional hardware capabilities provided

by Intel® Virtualization technology for direct I/O.

Enable VT for Direct I/O - enabled by default.

Trusted Execution This option species whether a Measured Virtual Machine Monitor (MVMM) can utilize the additional hardware

capabilities provided by Intel Trusted Execution Technology. The TPM Virtualization Technology, and the

Virtualization technology for direct I/O must be enabled to use this feature.

Trusted Execution - disabled by default.

Wireless screen options

Option Description

Wireless Switch Allows to set the wireless devices that can be controlled by the wireless switch. The options are:

• WWAN

• GPS (on WWAN Module)

• WLAN

• Bluetooth

All the options are enabled by default.

NOTE: For WLAN enable or disable controls are tied together and they cannot be enabled or disabled

independently.

Wireless Device

Enable

Allows you to enable or disable the internal wireless devices.

• WWAN/GPS

• WLAN

• Bluetooth

All the options are enabled by default.

NOTE: IMEI number for WWAN can be found ont the outer box or the WWAN card.

Maintenance screen options

Option Description

Service Tag Displays the Service Tag of your computer.

Asset Tag Allows you to create a system asset tag if an asset tag is not already set. This option is not set by default.

BIOS Downgrade This controls ashing of the system rmware to previous revisions. Option 'Allow BIOS downgrade' is enabled by

default.

System setup 71

Option Description

Data Wipe This eld allows users to erase the data securely from all internal storage devices. Option 'Wipe on Next boot' is not

enabled by default. The following is list of devices aected:

• Internal SATA HDD/SSD

• Internal M.2 SATA SDD

• Internal M.2 PCIe SSD

• Internal eMMC

BIOS Recovery This eld allows you to recover from certain corrupted BIOS conditions from a recover le on the user primary hard

drive or an external USB key.

• BIOS Recovery from Hard Drive—enabled by default

• Always perform integrity check—disabled by default

System logs screen options

Option Description

BIOS Events Allows you to view and clear the System Setup (BIOS) POST events.

Thermal Events Allows you to view and clear the System Setup (Thermal) events.

Power Events Allows you to view and clear the System Setup (Power) events.

System and setup password

You can create a system password and a setup password to secure your computer.

Password type Description

System password Password that you must enter to log on to your system.

Setup password Password that you must enter to access and make changes to the BIOS settings of your computer.

CAUTION: The password features provide a basic level of security for the data on your computer.

CAUTION: Anyone can access the data stored on your computer if it is not locked and left unattended.

NOTE: System and setup password feature is disabled.

Assigning a system password and setup password

You can assign a new System Password only when the status is in Not Set.

To enter the system setup, press F2 immediately after a power-on or re-boot.

1 In the System BIOS or System Setup screen, select Security and press Enter.

The Security screen is displayed.

2 Select System Password and create a password in the Enter the new password eld.

Use the following guidelines to assign the system password:

• A password can have up to 32 characters.

• The password can contain the numbers 0 through 9.

• Only lower case letters are valid, upper case letters are not allowed.

72 System setup

• Only the following special characters are allowed: space, (”), (+), (,), (-), (.), (/), (;), ([), (\), (]), (`).

3 Type the system password that you entered earlier in the Conrm new password eld and click OK.

4 Press Esc and a message prompts you to save the changes.

5 Press Y to save the changes.

The computer reboots.

Deleting or changing an existing system and or setup password

Ensure that the Password Status is Unlocked (in the System Setup) before attempting to delete or change the existing System and/or

Setup password. You cannot delete or change an existing System or Setup password, if the Password Status is Locked.

To enter the System Setup, press F2 immediately after a power-on or reboot.

1 In the System BIOS or System Setup screen, select System Security and press Enter.

The System Security screen is displayed.

2 In the System Security screen, verify that Password Status is Unlocked.

3 Select System Password, alter or delete the existing system password and press Enter or Tab.

4 Select Setup Password, alter or delete the existing setup password and press Enter or Tab.

NOTE: If you change the System and/or Setup password, re-enter the new password when promoted. If you delete the

System and/or Setup password, conrm the deletion when promoted.

5 Press Esc and a message prompts you to save the changes.

6 Press Y to save the changes and exit from System Setup.

The computer reboots.

Updating the BIOS in Windows

It is recommended to update your BIOS (System Setup), when you replace the system board or if an update is available. For laptops, ensure

that your computer battery is fully charged and connected to a power outlet

NOTE: If BitLocker is enabled, it must be suspended prior to updating the system BIOS, and then re-enabled after the BIOS

update is completed.

1 Restart the computer.

2 Go to Dell.com/support.

• Enter the Service Tag or Express Service Code and click Submit.

• Click Detect Product and follow the instructions on screen.

3 If you are unable to detect or nd the Service Tag, click Choose from all products.

4 Choose the Products category from the list.

NOTE: Choose the appropriate category to reach the product page

5 Select your computer model and the Product Support page of your computer appears.

6 Click Get drivers and click Drivers and Downloads.

The Drivers and Downloads section opens.

7 Click Find it myself.

8 Click BIOS to view the BIOS versions.

9 Identify the latest BIOS le and click Download.

10 Select your preferred download method in the Please select your download method below window, click Download File.

The File Download window appears.

11 Click Save to save the le on your computer.

12 Click Run to install the updated BIOS settings on your computer.

Follow the instructions on the screen.

System setup 73

NOTE: It is recommended not to update the BIOS version for more than three revisions. For example: If you want to update the

BIOS from 1.0 to 7.0, then install version 4.0 rst and then install version 7.0.

Updating BIOS on systems with bitlocker enabled

CAUTION: If BitLocker is not suspended before updating the BIOS, the next time you reboot the system it will not recognize the

BitLocker key. You will then be prompted to enter the recovery key to progress and the system will ask for this on each reboot. If

the recovery key is not known this can result in data loss or an unnecessary operating system re-install. For more information on

this subject, see Knowledge Article: http://www.dell.com/support/article/us/en/19/SLN153694/updating-bios-on-systems-

with-bitlocker-enabled

Updating your system BIOS using a USB ash drive

If the system cannot load into Windows but there is still a need to update the BIOS, download the BIOS le using another system and save

it to a bootable USB Flash Drive.

NOTE: You will need to use a bootable USB Flash drive. Please refer to the following article for further details: http://

www.dell.com/support/article/us/en/19/SLN143196/how-to-create-a-bootable-usb-ash-drive-using-dell-diagnostic-

deployment-package--dddp-

1 Download the BIOS update .EXE le to another system.

2 Copy the le e.g. O9010A12.EXE onto the bootable USB Flash drive.

3 Insert the USB Flash drive into the system that requires the BIOS update.

4 Restart the system and press F12 when the Dell Splash logo appears to display the One Time Boot Menu.

5 Using arrow keys, select USB Storage Device and click Return.

6 The system will boot to a Diag C:\> prompt.

7 Run the le by typing the full lename e.g. O9010A12.exe and press Return.

8 The BIOS Update Utility will load, follow the instructions on screen.

Figure 5. DOS BIOS Update Screen

74 System setup

Updating the Dell BIOS in Linux and Ubuntu environments

If you want to update the system BIOS in a Linux environment such as Ubuntu, see http://www.dell.com/support/article/us/en/19/

SLN171755/updating-the-dell-bios-in-linux-and-ubuntu-environments.

Flashing the BIOS from the F12 One-Time boot menu

Updating your system BIOS using a BIOS update .exe le copied to a FAT32 USB key and booting from the F12 one time boot menu.

BIOS Update

You can run the BIOS update le from Windows using a bootable USB key or you can also update the BIOS from the F12 One-Time boot

menu on the system.

Most Dell systems built after 2012 have this capability and you can conrm by booting your system to the F12 One-Time Boot Menu to see

if BIOS FLASH UPDATE is listed as a boot option for your system. If the option is listed, then the BIOS supports this BIOS update option.

NOTE: Only systems with BIOS Flash Update option in the F12 One-Time Boot Menu can use this function.

Updating from the One-Time Boot Menu

To update your BIOS from the F12 One-Time boot menu, you will need:

• USB key formatted to the FAT32 le system (key does not have to be bootable)

• BIOS executable le that you downloaded from the Dell Support website and copied to the root of the USB key

• AC power adapter connected to the system

• Functional system battery to ash the BIOS

Perform the following steps to execute the BIOS update ash process from the F12 menu:

CAUTION: Do not power o the system during the BIOS update process. Powering o the system could make the system fail to

boot.

1 From a power o state, insert the USB key where you copied the ash into a USB port of the system .

2 Power on the system and press the F12 key to access the One-Time Boot Menu, Highlight BIOS Flash Update using the arrow keys

then press Enter.

System setup 75

3 The Bios ash menu will open then click the browse button.

4 The E5450A14.exe le is shown as an example in the following screenshot. The actual le name may vary.

5 Once the le is selected, it will show in the le selection box and you can click the OK button to continue.

76 System setup

6 Click the Begin Flash Update button.

7 A warning box is displayed asking you if you want to proceed. Click the Yes button to begin the ash.

System setup 77

8 At this point the BIOS ash will execute, the system will reboot and then the BIOS ash will start and a progress bar will show the

progress of the ash. Depending on the changes included in the update, the progress bar may go from zero to 100 multiple times and

the ash process could take as long as 10 minutes. Generally this process takes two to three minutes.

9 Once complete, the system will reboot and the BIOS update process is completed.

78 System setup

Software

This chapter details the supported operating systems along with instructions on how to install the drivers.

Topics:

• Supported operating systems

• Downloading drivers

• Chipset driver

• Video driver

• Audio driver

• Network driver

• USB driver

• Storage driver

• Other drivers

Supported operating systems

The topic lists the operating systems supported for Latitude 7480.

Table 15. Supported operating systems

Supported operating systems Description

Windows 10 • Microsoft Windows 10 Pro 64-bit

• Microsoft Windows 10 Home 64-bit

Other • Ubuntu 16.04 LTS SP1 64-bit

• NeoKylin v6.0 64-bit

Downloading drivers

1 Turn on the notebook.

2 Go to Dell.com/support.

3 Click Product Support, enter the Service Tag of your notebook, and then click Submit.

NOTE: If you do not have the Service Tag, use the auto detect feature or manually browse for your notebook model.

4 Click Drivers and Downloads.

5 Select the operating system installed on your notebook.

6 Scroll down the page and select the driver to install.

7 Click Download File to download the driver for your notebook.

8 After the download is complete, navigate to the folder where you saved the driver le.

9 Double-click the driver le icon and follow the instructions on the screen.

Chipset driver

Verify if the Intel chipset and Intel Management Engine Interface drivers are already installed in the system.

Software 79

80 Software

Video driver

Verify if the video driver is already installed in the system.

Audio driver

Verify if audio drivers is already installed in the system.

Network driver

This system comes with both LAN and WiFi drivers and is able to detect the LAN and WiFi without going through the drivers installation.

USB driver

Verify if the USB drivers are already installed in the system.

Storage driver

Verify if the storage controller drivers are installed in the system.

Software 81

Other drivers

This section lists driver details for all the other components in the Device Manager.

Security device driver

Verify if the security device driver is installed in the system.

HID

Verify if the HID driver is installed in the system.

Control Vault Device

Verify if the control vault device driver is installed in the system.

Proximity device

Verify if the proximity device driver is installed in the system.

82 Software

Smart card reader

Verify if the smart card reader drivers are installed in the system.

Biometric device

Verify if the Biometric device driver is installed in the system

Image device driver

Verify if the image device driver is installed in the system.

Software 83

Troubleshooting

Dell Enhanced Pre-Boot System Assessment — ePSA

diagnostic 3.0

You can invoke the ePSA diagnostics by performing either of the following steps:

• Press the F12 key when the system boots and choosing Diagnostics option.

• Press Fn+PWR when the system boots.

For more details, see Dell EPSA Diagnostic 3.0.

Real Time Clock reset

The Real Time Clock (RTC) reset function allows you or the service technician to recover the recently launched model Dell Latitude and

Precision systems from select No POST/No Boot/No Power situations. You can initiate the RTC reset on the system from a power o

state only if it is connected to AC power. Press and hold the power button for 25 seconds. The system RTC reset occurs after you release

the power button.

NOTE: If AC power is disconnected from the system during the process or the power button is held longer than 40 seconds, the

RTC reset process is aborted.

The RTC reset will reset the BIOS to Defaults, un-provision Intel vPro and reset the system date and time. The following items are

unaected by the RTC reset:

• Service Tag

• Asset Tag

• Ownership Tag

• Admin Password

• System Password

• HDD Password

• Key Databases

• System Logs

The following items may or may not reset based on your custom BIOS setting selections:

• The Boot List

• Enable Legacy OROMs

• Secure Boot Enable

• Allow BIOS Downgrade

84 Troubleshooting

Contacting Dell

NOTE: If you do not have an active Internet connection, you can nd contact information on your purchase invoice, packing slip,

bill, or Dell product catalog.

Dell provides several online and telephone-based support and service options. Availability varies by country and product, and some services

may not be available in your area. To contact Dell for sales, technical support, or customer service issues:

1 Go to Dell.com/support.

2 Select your support category.

3 Verify your country or region in the Choose a Country/Region drop-down list at the bottom of the page.

4 Select the appropriate service or support link based on your need.

Contacting Dell 85

Table of Contents

DELL 7490 User Manual

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