Table of Contents
Gigabyte B660M DS3H AX DDR4 User Manual
Displayed below is the user manual for B660M DS3H AX DDR4 by Gigabyte which is a product in the Motherboards category. This manual has pages.
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B660M DS3H AX DDR4
B660M DS3H DDR4
User's Manual
Rev. 1101
B660M DS3H AX DDR4 B660M DS3H DDR4
Copyright
© 2021 GIGA-BYTE TECHNOLOGY CO., LTD. All rights reserved.
The trademarks mentioned in this manual are legally registered to their respective owners.
Disclaimer
Information in this manual is protected by copyright laws and is the property of GIGABYTE.
Changes to the specications and features in this manual may be made by GIGABYTE without
prior notice. No part of this manual may be reproduced, copied, translated, transmitted, or
published in any form or by any means without GIGABYTE's prior written permission.
In order to assist in the use of this product, carefully read the User's Manual.
For product-related information, check on our website at: https://www.gigabyte.com
Identifying Your Motherboard Revision
The revision number on your motherboard looks like this: "REV: X.X." For example, "REV: 1.0"
means the revision of the motherboard is 1.0. Check your motherboard revision before
updating motherboard BIOS, drivers, or when looking for technical information.
Example:
- 3 -
Table of Contents
Chapter 1 Product Introduction .......................................................................................4
1-1 Motherboard Layout ......................................................................................... 4
1-2 Box Contents .................................................................................................... 5
Chapter 2 Hardware Installation .....................................................................................6
2-1 Installation Precautions .................................................................................... 6
2-2 Product Specications ...................................................................................... 7
2-3 Installing the CPU and CPU Cooler ............................................................... 11
2-4 Installing the Memory ..................................................................................... 14
2-5 Installing an Expansion Card ......................................................................... 15
2-6 Back Panel Connectors .................................................................................. 16
2-7 Internal Connectors ........................................................................................ 18
Chapter 3 BIOS Setup ..................................................................................................30
Chapter 4 Installing the Operating System and Drivers ................................................ 32
4-1 Operating System Installation ........................................................................ 32
4-2 Drivers Installation .......................................................................................... 33
Chapter 5 Appendix ......................................................................................................34
5-1 Conguring a RAID Set .................................................................................. 34
Regulatory Notices .................................................................................................... 35
Contact Us ................................................................................................................ 38
- 4 -
1-1 Motherboard Layout
Chapter 1 Product Introduction
KB_MS_USB
CPU_FAN
SYS_FAN1 ATX
B660M DS3H AX DDR4
B660M DS3H DDR4
F_AUDIO
SPDIF_O
AUDIO
BAT
ATX_12V_2X4
CODEC
CLR_CMOS
RST
U32_LAN
PCIEX16
PCIEX1_1
iTE®
Super I/O
Realtek®
2.5GbE LAN
LED_C F_USB2 SYS_FAN3
SPI_TPM F_PANEL
SATA3 5 4
SATA3 7
6
VGA k
HDMI
80
60
60
80
M_BIOS
LPT k
QFLASH_PLUS
RST_SW
F_U32
U32G2C
U32G2
M2P_SB
M2A_CPU
DDR4_A2
DDR4_A1
DDR4_B1
DDR4_B2
D_LED
M2_WIFIj
SYS_FAN2
F_USB1
QFLED
PCIEX1_2
DUAL_DP
COM k
USB 2.0 Hub
LGA1700
Intel®
B660
Temperature sensor
jOnly for B660M DS3H AX DDR4.
kOnly for B660M DS3H DDR4.
- 5 -
1-2 Box Contents
5B660M DS3H AX DDR4 or B660M DS3H DDR4 motherboard
5User's Manual
5I/O Shield
5Two SATA cables
5One antennaj
5M.2 screws
* The box contents above are for reference only and the actual items shall depend on the product package you obtain.
The box contents are subject to change without notice.
jOnly for B660M DS3H AX DDR4.
- 6 -
2-1 Installation Precautions
The motherboard contains numerous delicate electronic circuits and components which can become
damaged as a result of electrostatic discharge (ESD). Prior to installation, carefully read the user's
manual and follow these procedures:
•Prior to installation, make sure the chassis is suitable for the motherboard.
•Prior to installation, do not remove or break motherboard S/N (Serial Number) sticker or
warranty sticker provided by your dealer. These stickers are required for warranty validation.
•Always remove the AC power by unplugging the power cord from the power outlet before
installing or removing the motherboard or other hardware components.
•When connecting hardware components to the internal connectors on the motherboard, make
sure they are connected tightly and securely.
•When handling the motherboard, avoid touching any metal leads or connectors.
•It is best to wear an electrostatic discharge (ESD) wrist strap when handling electronic
components such as a motherboard, CPU or memory. If you do not have an ESD wrist strap,
keep your hands dry and rst touch a metal object to eliminate static electricity.
•Prior to installing the motherboard, please have it on top of an antistatic pad or within an
electrostatic shielding container.
•Before connecting or unplugging the power supply cable from the motherboard, make sure
the power supply has been turned off.
•Before turning on the power, make sure the power supply voltage has been set according to
the local voltage standard.
•Before using the product, please verify that all cables and power connectors of your hardware
components are connected.
•To prevent damage to the motherboard, do not allow screws to come in contact with the
motherboard circuit or its components.
•Make sure there are no leftover screws or metal components placed on the motherboard or
within the computer casing.
•Do not place the computer system on an uneven surface.
•Do not place the computer system in a high-temperature or wet environment.
•Turning on the computer power during the installation process can lead to damage to system
components as well as physical harm to the user.
•If you are uncertain about any installation steps or have a problem related to the use of the
product, please consult a certied computer technician.
•If you use an adapter, extension power cable, or power strip, ensure to consult with its installation
and/or grounding instructions.
Chapter 2 Hardware Installation
- 7 -
2-2 ProductSpecications
CPU LGA1700 socket: Support for 12th Generation Intel® Core™, Pentium® Gold and
Celeron® Processors
(Go to GIGABYTE's website for the latest CPU support list.)
L3 cache varies with CPU
Chipset Intel® B660 Express Chipset
Memory Support for DDR4 3200/3000/2933/2666/2400/2133 MHz memory modules
4 x DDR4 DIMM sockets supporting up to 128 GB (32 GB single DIMM capacity)
of system memory
Dual channel memory architecture
Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in
non-ECC mode)
Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules
Support for Extreme Memory Prole (XMP) memory modules
(Go to GIGABYTE's website for the latest supported memory speeds and memory
modules.)
Onboard
Graphics
Integrated Graphics Processor-Intel® HD Graphics support:
- 1 x D-Sub port, supporting a maximum resolution of 1920x1200@60 Hz k
- 1 x HDMI port, supporting a maximum resolution of 4096x2160@60 Hz
* Support for HDMI 2.0 version and HDCP 2.3.
- 1 x DisplayPort, supporting a maximum resolution of 4096x2304@60 Hz
* Support for DisplayPort 1.2 version and HDCP 2.3
- 1 x DisplayPort, supporting a maximum resolution of 4096x2304@60 Hz
* Support for DisplayPort 1.2 version.
(Graphics specications may vary depending on CPU support.)
Support for up to 3 displays at the same time j
Support for up to 4 displays at the same time k
Audio Realtek® Audio CODEC
High Denition Audio
2/4/5.1/7.1-channel
* To congure 7.1-channel audio, you need to open the audio software and select
Device advanced settings > Playback Device to change the default setting rst.
LAN Realtek® 2.5GbE LAN chip (2.5 Gbps/1 Gbps/100 Mbps)
Wireless
Communication
Modulej
Intel® Wi-Fi 6 AX201 (For PCB rev. 1.0)
- WIFI a, b, g, n, ac, ax, supporting 2.4/5 GHz Dual-Band
- BLUETOOTH 5.2
- Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate
Intel® Wi-Fi 6 AX200 (For PCB rev. 1.1)
- WIFI a, b, g, n, ac, ax, supporting 2.4/5 GHz Dual-Band
- BLUETOOTH 5.2
- Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate
Intel® Wi-Fi 6E AX211 (For PCB rev. 1.2)
- WIFI a, b, g, n, ac, ax, supporting 2.4/5/6 GHz carrier frequency bands
- BLUETOOTH 5.2
- Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate
(Actual data rate may vary depending on environment and equipment.)
jOnly for B660M DS3H AX DDR4.
kOnly for B660M DS3H DDR4.
- 8 -
Expansion Slots 1 x PCI Express x16 slot, running at x16
(The PCIEX16 slot conforms to PCI Express 4.0 standard.)
2 x PCI Express x1 slots
(The PCIEX1 slots conform to PCI Express 3.0 standard.)
Storage Interface CPU:
- 1 x M.2 connector (Socket 3, M key, type 2260/2280 PCIe 4.0 x4/x2 SSD
support) (M2A_CPU)
Chipset:
- 1 x M.2 connector (Socket 3, M key, type 2260/2280 PCIe 4.0 x4/x2 SSD
support) (M2P_SB)
- 4 x SATA 6Gb/s connectors
Support for SATA RAID 0, RAID 1, RAID 5, and RAID 10
Intel® Optane™ Memory Ready
* System acceleration with Intel® Optane™ Memory can only be enabled on the M.2
connector supported by the Chipset.
USB Chipset:
- 1 x USB Type-C® port on the back panel, with USB 3.2 Gen 2 support
- 5 x USB 3.2 Gen 1 ports (3 ports on the back panel, 2 ports available through
the internal USB header)
- 2 x USB 2.0/1.1 ports on the back panel
Chipset+USB 2.0 Hub:
- 4 x USB 2.0/1.1 ports available through the internal USB headers
Internal
Connectors
1 x 24-pin ATX main power connector
1 x 8-pin ATX 12V power connector
1 x CPU fan header
3 x system fan headers
1 x addressable LED strip header
1 x RGB LED strip header
2 x M.2 Socket 3 connectors
4 x SATA 6Gb/s connectors
1 x front panel header
1 x front panel audio header
1 x USB 3.2 Gen 1 header
2 x USB 2.0/1.1 headers
1 x Trusted Platform Module header (For the GC-TPM2.0 SPI/GC-TPM2.0 SPI
2.0 module only)
1 x serial port header k
1 x parallel port header k
1 x S/PDIF Out header
1 x Q-Flash Plus button
1 x reset button
1 x reset jumper
1 x Clear CMOS jumper
jOnly for B660M DS3H AX DDR4.
kOnly for B660M DS3H DDR4.
- 9 -
Back Panel
Connectors
2 x USB 2.0/1.1 ports
1 x PS/2 keyboard/mouse port
2 x SMA antenna connectors (2T2R) j
1 x D-Sub port k
1 x HDMI 2.0 port
2 x DisplayPorts
3 x USB 3.2 Gen 1 ports
1 x USB Type-C® port, with USB 3.2 Gen 2 support
1 x RJ-45 port
3 x audio jacks
I/O Controller iTE® I/O Controller Chip
Hardware
Monitor
Voltage detection
Temperature detection
Fan speed detection
Fan fail warning
Fan speed control
* Whether the fan speed control function is supported will depend on the cooler you
install.
BIOS 1 x 256 Mbit ash
Use of licensed AMI UEFI BIOS
PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0
Unique Features Support for APP Center
* Available applications in APP Center may vary by motherboard model. Supported
functions of each application may also vary depending on motherboard specications.
- @BIOS
- EasyTune
- Fast Boot
- Game Boost
- ON/OFF Charge
- RGB Fusion
- Smart Backup
- System Information Viewer
Support for Q-Flash Plus
Support for Q-Flash
Support for Xpress Install
jOnly for B660M DS3H AX DDR4.
kOnly for B660M DS3H DDR4.
- 10 -
Bundled
Software
Norton® Internet Security (OEM version)
LAN bandwidth management software
Operating
System
Support for Windows 11 64-bit
Support for Windows 10 64-bit
Form Factor Micro ATX Form Factor; 24.4cm x 24.4cm
* GIGABYTE reserves the right to make any changes to the product specications and product-related information without
prior notice.
Please visit GIGABYTE's website for support lists of CPU, memory modules,
SSDs, and M.2 devices.
Please visit the Support\Utility List page on GIGABYTE's website to download the latest
version of apps.
B660M DS3H AX DDR4 B660M DS3H DDR4
- 11 -
2-3 Installing the CPU and CPU Cooler
Read the following guidelines before you begin to install the CPU:
•Make sure that the motherboard supports the CPU.
(Go to GIGABYTE's website for the latest CPU support list.)
•Always turn off the computer and unplug the power cord from the power outlet before installing the
CPU to prevent hardware damage.
•Locate the pin one of the CPU. The CPU cannot be inserted if oriented incorrectly. (Or you may
locate the notches on both sides of the CPU and alignment keys on the CPU socket.)
•Apply an even and thin layer of thermal grease on the surface of the CPU.
•Do not turn on the computer if the CPU cooler is not installed, otherwise overheating and damage
of the CPU may occur.
•Set the CPU host frequency in accordance with the CPU specications. It is not recommended
that the system bus frequency be set beyond hardware specications since it does not meet the
standard requirements for the peripherals. If you wish to set the frequency beyond the standard
specications, please do so according to your hardware specications including the CPU, graphics
card, memory, hard drive, etc.
A. Note the CPU Orientation
Note the alignment keys on the motherboard CPU socket and the notches on the CPU.
Please visit GIGABYTE's website for details on hardware installation.
Do not remove the CPU socket cover before inserting the CPU. It may pop off from the load
plate automatically after you insert the CPU and close the load plate.
Alignment Key
Alignment Key
LGA1700 CPU Socket
Triangle Pin One Marking
of the CPU Socket
Notch
Notch
LGA1700 CPU
Triangle Pin One
Marking on the CPU
- 12 -
B. Installing the CPU
Follow the steps below to correctly install the CPU into the motherboard CPU socket.
w
u
Do not force to engage the CPU socket locking lever when the CPU is not installed correctly
as this would damage the CPU and CPU socket.
v
jGently press the CPU socket lever handle
down and away from the socket.
kCompletely lift up the CPU socket locking
lever.
lUse the finger tab on the side of the
metal load plate to lift open the metal
load plate with the plastic protective cover
attached to it.
Hold the CPU with your ngers by the edges.
Align the CPU pin one marking (triangle) with
the pin one corner of the CPU socket (or you
may align the CPU notches with the socket
alignment keys) and gently insert the CPU
into position.
Make sure the CPU is properly installed and
then close the load plate. The plastic protec-
tive cover will pop off, just remove it. Secure
the lever under its retention tab to complete
the installation of the CPU.
* Always replace the plastic protective cover
when the CPU is not installed to protect the
CPU socket.
j
k
l
Finger Tab
Pin One
j
k
l
- 13 -
C. Installing the CPU Cooler
Be sure to install the CPU cooler after installing the CPU. (Actual installation process may differ depending the
CPU cooler to be used. Refer to the user's manual for your CPU cooler.)
u
v
Apply an even and thin layer of thermal
grease on the surface of the installed CPU.
Place the cooler atop the CPU, aligning the
four push pins through the pin holes on the
motherboard. Push down on the push pins
diagonally.
j
j
kk
w
Finally, attach the power connector of
the CPU cooler to the CPU fan header
(CPU_FAN) on the motherboard.
CPU_FAN
- 14 -
2-4 Installing the Memory
Read the following guidelines before you begin to install the memory:
•Make sure that the motherboard supports the memory. It is recommended that memory of the same
capacity, brand, speed, and chips be used. (Go to GIGABYTE's website for the latest supported
memory speeds and memory modules.)
•Always turn off the computer and unplug the power cord from the power outlet before installing the
memory to prevent hardware damage.
•Memory modules have a foolproof design. A memory module can be installed in only one direction.
If you are unable to insert the memory, switch the direction.
DualChannelMemoryConguration
This motherboard provides four memory sockets and supports Dual Channel Technology. After the memory
is installed, the BIOS will automatically detect the specications and capacity of the memory. Enabling Dual
Channel memory mode will double the original memory bandwidth.
The four memory sockets are divided into two channels and each channel has two memory sockets as following:
Channel A: DDR4_A1, DDR4_A2
Channel B: DDR4_B1, DDR4_B2
* Recommended Dual Channel Memory Conguration:
DDR4_A1 DDR4_A2 DDR4_B1 DDR4_B2
2 Modules - - DS/SS - - DS/SS
4 Modules DS/SS DS/SS DS/SS DS/SS
(SS=Single-Sided, DS=Double-Sided, "- -"=No Memory)
Due to CPU limitations, read the following guidelines before installing the memory in Dual Channel mode.
1. Dual Channel mode cannot be enabled if only one memory module is installed.
2. When enabling Dual Channel mode with two or four memory modules, it is recommended that memory of
the same capacity, brand, speed, and chips be used.
When installing a single memory module, we recommend that you install it in the DDR4_A2
or DDR4_B2 socket.
DDR4_A1
DDR4_A2
DDR4_B1
DDR4_B2
- 15 -
2-5 Installing an Expansion Card
Read the following guidelines before you begin to install an expansion card:
•Make sure the motherboard supports the expansion card. Carefully read the manual that came
with your expansion card.
•Always turn off the computer and unplug the power cord from the power outlet before installing an
expansion card to prevent hardware damage.
Follow the steps below to correctly install your expansion card in the expansion slot.
1. Locate an expansion slot that supports your card. Remove the metal slot cover from the chassis back panel.
2. Align the card with the slot, and press down on the card until it is fully seated in the slot.
3. Make sure the metal contacts on the card are completely inserted into the slot.
4. Secure the card's metal bracket to the chassis back panel with a screw.
5. After installing all expansion cards, replace the chassis cover(s).
6. Turn on your computer. If necessary, go to BIOS Setup to make any required BIOS changes for your
expansion card(s).
7. Install the driver provided with the expansion card in your operating system.
PCIEX16 Slot
- 16 -
2-6 Back Panel Connectors
USB 2.0/1.1 Port (Q-Flash Plus Port)
The USB port supports the USB 2.0/1.1 specication. Use this port for USB devices. Before using Q-Flash
Plus (Note), make sure to insert the USB ash drive into this port rst.
USB 2.0/1.1 Port
The USB port supports the USB 2.0/1.1 specication. Use this port for USB devices.
PS/2 Keyboard/Mouse Port
Use this port to connect a PS/2 mouse or keyboard.
SMA Antenna Connectors (2T2R) j
Use this connector to connect an antenna.
D-Sub Port k
The D-Sub port supports a 15-pin D-Sub connector and supports a maximum resolution of 1920x1200@60 Hz
(the actual resolutions supported depend on the monitor being used). Connect a monitor that supports
D-Sub connection to this port.
HDMI 2.0 Port
The HDMI port supports HDCP 2.3 and Dolby TrueHD and DTS HD Master
Audio formats. It also supports up to 192KHz/24bit 7.1-channel LPCM audio
output. You can use this port to connect your HDMI-supported monitor. The maximum supported resolution
is 4096x2160@60 Hz, but the actual resolutions supported are dependent on the monitor being used.
DisplayPort
DisplayPort delivers high quality digital imaging and audio, supporting bi-directional audio transmission.
DisplayPort can support HDCP 2.3 content protection mechanisms. You can use this port to connect your
DisplayPort-supported monitor. Note: The DisplayPort Technology can support a maximum resolution of
4096x2304@60 Hz but the actual resolutions supported depend on the monitor being used.
DisplayPort
DisplayPort delivers high quality digital imaging and audio, supporting bi-directional audio transmission.
You can use this port to connect your DisplayPort-supported monitor. Note: The DisplayPort Technology
can support a maximum resolution of 4096x2304@60 Hz but the actual resolutions supported depend
on the monitor being used.
•To set up a quad-display k/triple-display j conguration, you must install motherboard drivers
in the operating system rst.
•After installing the HDMI/DisplayPort device, make sure to set the default sound playback
device to HDMI/DisplayPort. (The item name may differ depending on your operating system.)
(Note) To enable the Q-Flash Plus function, please navigate to the "Unique Features" page of GIGABYTE's
website for more information.
Tighten the antennas to the antenna connectors and then aim the antennas correctly for better
signal reception.
jOnly for B660M DS3H AX DDR4.
kOnly for B660M DS3H DDR4.
- 17 -
USB 3.2 Gen 1 Port
The USB 3.2 Gen 1 port supports the USB 3.2 Gen 1 specication and is compatible to the USB 2.0
specication. Use this port for USB devices.
USB Type-C® Port, with USB 3.2 Gen 2 Support
The reversible USB port supports the USB 3.2 Gen 2 specication and is compatible to the USB 3.2 Gen 1
and USB 2.0 specication. Use this port for USB devices.
RJ-45 LAN Port
The Gigabit Ethernet LAN port provides Internet connection at up to 2.5 Gbps data rate. The following
describes the states of the LAN port LEDs.
Please visit GIGABYTE's website for details on conguring the audio software.
•When removing the cable connected to a back panel connector, rst remove the cable from your
device and then remove it from the motherboard.
•When removing the cable, pull it straight out from the connector. Do not rock it side to side to
prevent an electrical short inside the cable connector.
Activity LED
Speed LED
LAN Port
Speed LED:
State Description
Orange 2.5 Gbps data rate
Green 1 Gbps data rate
Off 100 Mbps data rate
Activity LED:
State Description
Blinking Data transmission or receiving is occurring
Off No data transmission or receiving is occurring
Line In/Rear Speaker Out (Blue)
The line in jack. Use this audio jack for line in devices such as an optical drive, walkman, etc.
Line Out/Front Speaker Out (Green)
The line out jack.
Mic In/Center/Subwoofer Speaker Out (Pink)
The Mic in jack.
Audio Jack Congurations:
Jack Headphone/
2-channel 4-channel 5.1-channel 7.1-channel
Line In/Rear Speaker Out a a a
Line Out/Front Speaker Out a a a a
Mic In/Center/Subwoofer Speaker Out a a
Front Panel Line Out/Side Speaker Out a
•You can change the functionality of an audio jack using the audio software.
•To congure 7.1-channel audio, you need to open the audio software and select Device
advanced settings > Playback Device to change the default setting rst.
- 18 -
2-7 Internal Connectors
Read the following guidelines before connecting external devices:
•First make sure your devices are compliant with the connectors you wish to connect.
•Before installing the devices, be sure to turn off the devices and your computer. Unplug the power
cord from the power outlet to prevent damage to the devices.
•After installing the device and before turning on the computer, make sure the device cable has
been securely attached to the connector on the motherboard.
919
11
2
4
5
1210 18 2019 6 7
14
14 15
17
3
8
8
16
413
5
1) ATX_12V_2X4
2) ATX
3) CPU_FAN
4) SYS_FAN1/2/3
5) SATA3 4/5/6/7
6) D_LED
7) LED_C
8) M2A_CPU/M2P_SB
9) F_PANEL
10) F_AUDIO
11) F_U32
12) F_USB1/F_USB2
13) SPI_TPM
14) COM k
15) LPT k
16) BAT
17) CLR_CMOS
18) SPDIF_O
19) RST_SW/RST
20) QFLASH_PLUS
kOnly for B660M DS3H DDR4.
- 19 -
1/2) ATX_12V_2X4/ATX (2x4 12V Power Connector and 2x12 Main Power Connector)
With the use of the power connector, the power supply can supply enough stable power to all the components
on the motherboard. Before connecting the power connector, rst make sure the power supply is turned
off and all devices are properly installed. The power connector possesses a foolproof design. Connect the
power supply cable to the power connector in the correct orientation.
The 12V power connector mainly supplies power to the CPU. If the 12V power connector is not connected,
the computer will not start.
To meet expansion requirements, it is recommended that a power supply that can withstand high
power consumption be used (500W or greater). If a power supply is used that does not provide the
required power, the result can lead to an unstable or unbootable system.
ATX_12V_2X4
ATX:
Pin No. Denition Pin No. Denition
1 3.3V 13 3.3V
2 3.3V 14 -12V
3 GND 15 GND
4 +5V 16 PS_ON (soft On/Off)
5 GND 17 GND
6 +5V 18 GND
7 GND 19 GND
8 Power Good 20 NC
9 5VSB (stand by +5V) 21 +5V
10 +12V 22 +5V
11 +12V (Only for 2x12-pin ATX) 23 +5V (Only for 2x12-pin ATX)
12 3.3V (Only for 2x12-pin ATX) 24 GND (Only for 2x12-pin ATX)
DEBUG
PORT
G.QBOFM
41
85
DEBUG
PORT
G.QBOFM
131
2412
ATX
ATX_12V_2X4:
Pin No. Denition Pin No. Denition
1GND (Only for 2x4-pin 12V) 5+12V (Only for 2x4-pin 12V)
2GND (Only for 2x4-pin 12V) 6+12V (Only for 2x4-pin 12V)
3 GND 7 +12V
4 GND 8 +12V
- 20 -
•Be sure to connect fan cables to the fan headers to prevent your CPU and system from
overheating. Overheating may result in damage to the CPU or the system may hang.
•These fan headers are not conguration jumper blocks. Do not place a jumper cap on the headers.
3/4) CPU_FAN/SYS_FAN1/2/3 (Fan Headers)
All fan headers on this motherboard are 4-pin. Most fan headers possess a foolproof insertion design.
When connecting a fan cable, be sure to connect it in the correct orientation (the black connector wire is
the ground wire). The speed control function requires the use of a fan with fan speed control design. For
optimum heat dissipation, it is recommended that a system fan be installed inside the chassis.
CPU_FAN
DEBUG
PORT
G.QBOFM
1
DEBUG
PORT
G.QBOFM
DEBUG
PORT
G.QBOFM
1
1
SYS_FAN3SYS_FAN1/
SYS_FAN2
Pin No. Denition
1 GND
2 Voltage Speed Control
3 Sense
4 PWM Speed Control
Connector CPU_FAN SYS_FAN1~3
Maximum Current 2A 2A
Maximum Power 24W 24W
5) SATA3 4/5/6/7 (SATA 6Gb/s Connectors)
The SATA connectors conform to SATA 6Gb/s standard and are compatible with SATA 3Gb/s and SATA
1.5Gb/s standard. Each SATA connector supports a single SATA device. The Intel® Chipset supports RAID 0,
RAID 1, RAID 5, and RAID 10. Please navigate to the "Conguring a RAID Set" page of GIGABYTE's
website for instructions on conguring a RAID array.
Pin No. Denition
1 GND
2 TXP
3 TXN
4 GND
5 RXN
6 RXP
7 GND
SATA3
SATA3
7
6
4
5
To enable hot-plugging for the SATA ports, please navigate to the "BIOS Setup" page of GIGABYTE's
website and search for "SATA Conguration" for more information.
1
1
7
7
DEBUG
PORT
G.QBOFM
1
DEBUG
PORT
G.QBOFM
7
DEBUG
PORT
G.QBOFM
- 21 -
6) D_LED (Addressable LED Strip Header)
This header can be used to connect a standard 5050 addressable LED strip, with maximum power rating
of 5A (5V) and maximum number of 1000 LEDs.
1
Pin No. Denition
1 V (5V)
2 Data
3 No Pin
4 GND
Connect your addressable LED strip to the header. The power pin (marked
with a triangle on the plug) of the LED strip must be connected to Pin 1 of
the addressable LED strip header. Incorrect connection may lead to the
damage of the LED strip.
Addressable LED
Strip
1
F_USB30 F_U
B_
F_ F_
_
B
BS_
B
SB_
B
_S
S_
_
B
_U
_
B
S
123
123
123
123
1
1
1
1
BSS
S
_S
SSU
1 2 3
S3 BSSS
U
__ 3
F_USB3F
S _
S _
S _
SF
B_
B_
F
_0
S
S
_0F
_F
_
_
__B
U
S _S
_ SF_
B
USB0_B
B_
B_
F_USB3
F_USB303
_
_3U
S_
_S
SS_F
_
_ F
7) LED_C (RGB LED Strip Header)
This header can be used to connect a standard 5050 RGB LED strip (12V/G/R/B), with maximum power
rating of 2A (12V) and maximum length of 2m.
Connect your RGB LED strip to the header. The power pin (marked with a
triangle on the plug) of the LED strip must be connected to Pin 1 (12V) of
this header. Incorrect connection may lead to the damage of the LED strip.
Pin No. Denition
1 12V
2 G
3 R
4 B
1
DEBUG
PORT
G.QBOFM
Before installing the devices, be sure to turn off the devices and your computer. Unplug the power
cord from the power outlet to prevent damage to the devices.
For how to turn on/off the lights of the LED strip, please navigate to the "Unique Features" page
of GIGABYTE's website.
12V
RGB LED Strip
1
- 22 -
8) M2A_CPU/M2P_SB (M.2 Socket 3 Connectors)
The M.2 connectors on the motherboard support only M.2 PCIe SSDs.
Follow the steps below to correctly install an M.2 SSD in the M.2 connector.
Step 1:
Locate the M.2 connector where you will install the M.2 SSD, use a screwdriver to unfasten the screw on
the heatsink and then remove the heatsink. (Only the M2A_CPU connector has the heatsink)
Step 2:
Locate the proper mounting hole based on the length of your M.2 SSD drive. If needed, move the standoff
to the desired mounting hole. Insert the M.2 SSD into the M.2 connector at an angle.
Step 3:
Press the M.2 SSD down and then use the included screw to secure it in the connector. Remove the
protective lm from the bottom of the heatsink. Then replace the heatsink and secure it to the original hole.
* Types of M.2 SSDs supported by each M.2 connector:
M.2 PCIe x4 SSD M.2 PCIe x2 SSD M.2 SATA SSD
M2A_CPU a a r
M2P_SB a a r
F_USB30 F_U
B_
F_ F_
_
B
BS_
B
SB_
B
_S
S_
_
B
_U
_
B
S
123
123
123
123
1
1
1
1
BSS
S
_S
SSU
1 2 3
S3 BSSS
U
__ 3
F_USB3F
S _
S _
S _
SF
B_
B_
F
_0
S
S
_0F
_F
_
_
__B
U
S _S
_ SF_
B
USB0_B
B_
B_
F_USB3
F_USB303
_
_3U
S_
_S
SS_F
_
_ F
80 60
M2A_CPU
M2P_SB
60 80
F_USB30 F_U
B_
F_ F_
_
B
BS_
B
SB_
B
_S
S_
_
B
_U
_
B
S
123
123
123
123
1
1
1
1
BSS
S
_S
SSU
1 2 3
S3 BSSS
U
__ 3
F_USB3F
S _
S _
S _
SF
B_
B_
F
_0
S
S
_0F
_F
_
_
__B
U
S _S
_ SF_
B
USB0_B
B_
B_
F_USB3
F_USB303
_
_3U
S_
_S
SS_F
_
_ F
- 23 -
The front panel design may differ by chassis. A front panel module mainly consists of power switch,
reset switch, power LED, hard drive activity LED, speaker and etc. When connecting your chassis
front panel module to this header, make sure the wire assignments and the pin assignments are
matched correctly.
9) F_PANEL (Front Panel Header)
Connect the power switch, reset switch, speaker, chassis intrusion switch/sensor and system status indicator
on the chassis to this header according to the pin assignments below. Note the positive and negative pins
before connecting the cables.
•PW (Power Switch):
Connects to the power switch on the chassis front panel. You may congure the way to turn off your
system using the power switch (please navigate to the "BIOS Setup" page of GIGABYTE's website and
search for "Soft-Off by PWR-BTTN" for more information).
•SPEAK (Speaker):
Connects to the speaker on the chassis front panel. The system reports system startup status by issuing
a beep code. One single short beep will be heard if no problem is detected at system startup.
•HD (Hard Drive Activity LED):
Connects to the hard drive activity LED on the chassis front panel. The LED is on when the hard drive
is reading or writing data.
•RES (Reset Switch):
Connects to the reset switch on the chassis front panel. Press the reset switch to restart the computer
if the computer freezes and fails to perform a normal restart.
•CI (Chassis Intrusion Header):
Connects to the chassis intrusion switch/sensor on the chassis that can detect if the chassis cover has
been removed. This function requires a chassis with a chassis intrusion switch/sensor.
•NC: No connection.
•PLED/PWR_LED (Power LED):
Connects to the power status indicator on the chassis front panel. The LED
is on when the system is operating. The LED is off when the system is in S3/
S4 sleep state or powered off (S5).
System Status LED
S0 On
S3/S4/S5 Off
SPEAK+
SPEAK-
Speaker
NC
NC
Hard Drive
Activity LED
1
2
19
20
CI-
CI+
PLED-
PW-
PLED+
PW+
HD-
RES+
HD+
RES-
Reset
Switch Chassis Intrusion
Header
Power Switch
F_USB30 F_U
B_
F_ F_
_
B
BS_
B
SB_
B
_S
S_
_
B
_U
_
B
S
123
123
123
123
1
1
1
1
BSS
S
_S
SSU
1 2 3
S3 BSSS
U
__ 3
F_USB3F
S _
S _
S _
SF
B_
B_
F
_0
S
S
_0F
_F
_
_
__B
U
S _S
_ SF_
B
USB0_B
B_
B_
F_USB3
F_USB303
_
_3U
S_
_S
SS_F
_
_ F
Power LED
Power LED
PWR_LED-
PWR_LED+
PWR_LED-
- 24 -
10) F_AUDIO (Front Panel Audio Header)
The front panel audio header supports High Denition audio (HD). You may connect your chassis front
panel audio module to this header. Make sure the wire assignments of the module connector match the
pin assignments of the motherboard header. Incorrect connection between the module connector and the
motherboard header will make the device unable to work or even damage it.
Pin No. Denition
1 MIC L
2 GND
3 MIC R
4 NC
5 Head Phone R
6 MIC Detection
7 SENSE_SEND
8 No Pin
9 Head Phone L
10 Head Phone
Detection
Some chassis provide a front panel audio module that has separated connectors on each wire
instead of a single plug. For information about connecting the front panel audio module that has
different wire assignments, please contact the chassis manufacturer.
1
2
9
10
11) F_U32 (USB 3.2 Gen 1 Header)
The header conforms to USB 3.2 Gen 1 and USB 2.0 specication and can provide two USB ports. For
purchasing the optional 3.5" front panel that provides two USB 3.2 Gen 1 ports, please contact the local
dealer.
Pin No. Denition Pin No. Denition
1 VBUS 11 D2+
2 SSRX1- 12 D2-
3 SSRX1+ 13 GND
4 GND 14 SSTX2+
5 SSTX1- 15 SSTX2-
6 SSTX1+ 16 GND
7 GND 17 SSRX2+
8 D1- 18 SSRX2-
9 D1+ 19 VBUS
10 NC 20 No Pin
F_USB30 F_U
B_
F_ F_
_
B
BS_
B
SB_
B
_S
S_
_
B
_U
_
B
S
123
123
123
123
1
1
1
1
BSS
S
_S
SSU
1 2 3
S3 BSSS
U
__ 3
F_USB3F
S _
S _
S _
SF
B_
B_
F
_0
S
S
_0F
_F
_
_
__B
U
S _S
_ SF_
B
USB0_B
B_
B_
F_USB3
F_USB303
_
_3U
S_
_S
SS_F
_
_ F
20 1
1011
- 25 -
12) F_USB1/F_USB2 (USB 2.0/1.1 Headers)
The headers conform to USB 2.0/1.1 specication. Each USB header can provide two USB ports via an
optional USB bracket. For purchasing the optional USB bracket, please contact the local dealer.
Pin No. Denition
1 Power (5V)
2 Power (5V)
3 USB DX-
4 USB DY-
5 USB DX+
6 USB DY+
7 GND
8 GND
9 No Pin
10 NC
•Do not plug the IEEE 1394 bracket (2x5-pin) cable into the USB 2.0/1.1 header.
•Prior to installing the USB bracket, be sure to turn off your computer and unplug the power cord
from the power outlet to prevent damage to the USB bracket.
10
9 1
2
12
11
2
1
F_USB30 F_U
B_
F_ F_
_
B
BS_
B
SB_
B
_S
S_
_
B
_U
_
B
S
123
123
123
123
1
1
1
1
BSS
S
_S
SSU
1 2 3
S3 BSSS
U
__ 3
F_USB3F
S _
S _
S _
SF
B_
B_
F
_0
S
S
_0F
_F
_
_
__B
U
S _S
_ SF_
B
USB0_B
B_
B_
F_USB3
F_USB303
_
_3U
S_
_S
SS_F
_
_ F
Pin No. Denition
1Data Output
2Power (3.3V)
3No Pin
4NC
5Data Input
6CLK
7Chip Select
8GND
9IRQ
10 NC
11 NC
12 RST
13) SPI_TPM (Trusted Platform Module Header)
You may connect an SPI TPM (Trusted Platform Module) to this header.
- 26 -
14) COM (Serial Port Header) k
The COM header can provide one serial port via an optional COM port cable. For purchasing the
optional COM port cable, please contact the local dealer.
10
9
2
1
15) LPT (Parallel Port Header) k
The LPT header can provide one parallel port via an optional LPT port cable. For purchasing the optional
LPT port cable, please contact the local dealer.
Pin No. Denition Pin No. Denition
1STB- 14 GND
2AFD- 15 PD6
3PD0 16 GND
4ERR- 17 PD7
5PD1 18 GND
6INIT- 19 ACK-
7PD2 20 GND
8SLIN- 21 BUSY
9PD3 22 GND
10 GND 23 PE
11 PD4 24 No Pin
12 GND 25 SLCT
13 PD5 26 GND
DEBUG
PORT
G.QBOFM
1
226
25
kOnly for B660M DS3H DDR4.
Pin No. Denition
1 NDCD-
2 NSIN
3 NSOUT
4 NDTR-
5 GND
6 NDSR-
7 NRTS-
8 NCTS-
9 NRI-
10 No Pin
- 27 -
17) CLR_CMOS (Clear CMOS Jumper)
Use this jumper to clear the BIOS conguration and reset the CMOS values to factory defaults. To clear
the CMOS values, use a metal object like a screwdriver to touch the two pins for a few seconds.
•Always turn off your computer and unplug the power cord from the power outlet before clearing
the CMOS values.
•After system restart, go to BIOS Setup to load factory defaults (select Load Optimized Defaults) or
manually congure the BIOS settings (please navigate to the "BIOS Setup" page of GIGABYTE's
website for more information).
Open: Normal
Short: Clear CMOS Values
16) BAT (Battery)
The battery provides power to keep the values (such as BIOS congurations, date, and time information)
in the CMOS when the computer is turned off. Replace the battery when the battery voltage drops to a low
level, or the CMOS values may not be accurate or may be lost.
You may clear the CMOS values by removing the battery:
1. Turn off your computer and unplug the power cord.
2. Gently remove the battery from the battery holder and wait for
one minute. (Or use a metal object like a screwdriver to touch the
positive and negative terminals of the battery holder, making them
short for 5 seconds.)
3. Replace the battery.
4. Plug in the power cord and restart your computer.
•Always turn off your computer and unplug the power cord before replacing the battery.
•Replace the battery with an equivalent one. Damage to your devices may occur if the battery is
replaced with an incorrect model.
•Contact the place of purchase or local dealer if you are not able to replace the battery by yourself
or uncertain about the battery model.
•When installing the battery, note the orientation of the positive side (+) and the negative side (-)
of the battery (the positive side should face up).
•Used batteries must be handled in accordance with local environmental regulations.
- 28 -
19) RST_SW/RST (Reset Button/Reset Jumper)
The reset button (RST_SW) allows users to quickly turn on/off the computer in an open-case environment
when they want to change hardware components or conduct hardware testing. The reset jumper (RST)
can connect to the reset switch on the chassis front panel. Press the reset switch to restart the computer
if the computer freezes and fails to perform a normal restart.
Pin No. Denition
1 Reset
2 GND
The reset button (RST_SW)/rest jumper (RST) provides you with several functions to use. To remap
the button to perform different tasks, please navigate to the "BIOS Setup" page of GIGABYTE's
website and search for "RST_SW (MULTIKEY)" for more information.
RST
RST_SW
18) SPDIF_O (S/PDIF Out Header)
This header supports S/PDIF digital output, which allows you to connect a S/PDIF digital audio cable to
output digital audio from your motherboard to the supported audio devices. For information about connecting
the digital audio cable, carefully read the manual for your audio devices.
Pin No. Denition
1 5VDUAL
2 No Pin
3 SPDIFO
4 GND
1
F_USB30 F_U
B_
F_ F_
_
B
BS_
B
SB_
B
_S
S_
_
B
_U
_
B
S
123
123
123
123
1
1
1
1
BSS
S
_S
SSU
1 2 3
S3 BSSS
U
__ 3
F_USB3F
S _
S _
S _
SF
B_
B_
F
_0
S
S
_0F
_F
_
_
__B
U
S _S
_ SF_
B
USB0_B
B_
B_
F_USB3
F_USB303
_
_3U
S_
_S
SS_F
_
_ F
1
RSTRST_SW
- 29 -
20) QFLASH_PLUS (Q-Flash Plus Button)
Q-Flash Plus allows you to update the BIOS when your system is off (S5 shutdown state). Save the latest
BIOS on a USB thumb drive and plug it into the dedicated port, and then you can now ash the BIOS
automatically by simply pressing the Q-Flash Plus button. The QFLED will ash when the BIOS matching
and ashing activities start and will stop ashing when the main BIOS ashing is complete.
To enable the Q-Flash Plus function, please navigate to the "Unique Features" page of GIGABYTE's
website for more information.
QFLASH_PLUS
QFLED
- 30 -
BIOS (Basic Input and Output System) records hardware parameters of the system in the CMOS on the
motherboard. Its major functions include conducting the Power-On Self-Test (POST) during system startup,
saving system parameters and loading operating system, etc. BIOS includes a BIOS Setup program that allows
the user to modify basic system conguration settings or to activate certain system features.
When the power is turned off, the battery on the motherboard supplies the necessary power to the CMOS to
keep the conguration values in the CMOS.
To access the BIOS Setup program, press the <Delete> key during the POST when the power is turned on.
To upgrade the BIOS, use either the GIGABYTE Q-Flash or @BIOS utility.
•Q-Flash allows the user to quickly and easily upgrade or back up BIOS without entering the operating system.
•@BIOS is a Windows-based utility that searches and downloads the latest version of BIOS from the Internet
and updates the BIOS.
For instructions on using the Q-Flash and @BIOS utilities, please navigate to the "Unique Features" page of
GIGABYTE's website and search for "BIOS Update Utilities."
Chapter 3 BIOS Setup
•Because BIOS ashing is potentially risky, if you do not encounter problems using the current
version of BIOS, it is recommended that you not ash the BIOS. To ash the BIOS, do it with
caution. Inadequate BIOS ashing may result in system malfunction.
•It is recommended that you not alter the default settings (unless you need to) to prevent system
instability or other unexpected results. Inadequately altering the settings may result in system's
failure to boot. If this occurs, try to clear the CMOS values and reset the board to default values.
•Refer to the introductions of the battery/clear CMOS jumper in Chapter 2 or navigate to the "BIOS
Setup" page of GIGABYTE's website and search for "Load Optimized Defaults" for how to clear
the CMOS values.
Please visit GIGABYTE's website for details on conguring BIOS Setup.
- 31 -
Startup Screen:
Function Keys:
<DEL>: BIOS SETUP\Q-FLASH
Press the <Delete> key to enter BIOS Setup or to access the Q-Flash utility in BIOS Setup.
<F12>: BOOT MENU
Boot Menu allows you to set the rst boot device without entering BIOS Setup. In Boot Menu, use the up
arrow key <h> or the down arrow key <i> to select the rst boot device, then press <Enter> to accept.
The system will boot from the device immediately.
Note: The setting in Boot Menu is effective for one time only. After system restart, the device boot order
will still be based on BIOS Setup settings.
<END>: Q-FLASH
Press the <End> key to access the Q-Flash utility directly without having to enter BIOS Setup rst.
Function Keys
The following startup Logo screen will appear when the computer boots.
- 32 -
Chapter 4 Installing the Operating System and Drivers
4-1 Operating System Installation
With the correct BIOS settings, you are ready to install the operating system.
If you want to install an operating system on a RAID volume, you need to install the Intel® RST VMD Controller
driver rst during the OS installation process. Refer to the steps below:
Step 1:
Go to GIGABYTE's website, browse to the motherboard model's web page, download the Intel SATA Preinstall
driver le on the Support\Download\SATA RAID/AHCI page, unzip the le and copy the les to your USB thumb
drive.
Step 2:
Boot from the Windows setup disc and perform standard OS installation steps. When the screen requesting you
to load the driver appears, select Browse.
Step 3:
Insert the USB thumb drive and then browse to the location of the driver. When a screen as shown below
appears, select Intel RST VMD Controller 467F and click Next to load the driver and continue the OS installation.
- 33 -
4-2 Drivers Installation
After you install the operating system, a dialog box will appear on the bottom-right corner of the desktop asking
if you want to download and install the drivers and GIGABYTE applications via APP Center. Click Install to
proceed with the installation. (In BIOS Setup, make sure Settings\IO Ports\APP Center Download & Install
Conguration\APPCenterDownload&Install is set to Enabled.)
Please visit GIGABYTE's website for
more software information.
Please visit GIGABYTE's website for
more troubleshooting information.
Before the installation, make sure the system is connected to the Internet.
When the End User License Agreement dialog box appears, press <Accept> to install APP Center. On the APP
Center screen, select the drivers and applications you want to install and click Install.
- 34 -
Chapter 5 Appendix
5-1 ConguringaRAIDSet
RAID Levels
RAID 0 RAID 1 RAID 5 RAID 10
Minimum
Number of Hard
Drives
≥2 2≥3 4
Array Capacity
Number of hard
drives * Size of the
smallest drive
Size of the smallest
drive
(Number of hard
drives -1) * Size of
the smallest drive
(Number of hard
drives/2) * Size of the
smallest drive
Fault Tolerance No Yes Yes Yes
Before you begin, please prepare the following items:
This motherboard supports SATA RAID 0, RAID 1, RAID 5, and RAID 10. Prepare the correct number of hard
drives as indicated in the table above before conguring a RAID array.
•SATA hard drives or SSDs. To ensure optimal performance, it is recommended that you use two hard drives
with identical model and capacity.
•Windows setup disc.
•An Internet connected computer.
•A USB thumb drive.
Please visit GIGABYTE's website for details on conguring a RAID array.
- 35 -
Supplier's Declaration of Conformity
47 CFR § 2.1077 Compliance Information
Product Name: Motherboard
Trade Name: GIGABYTE
Model Number: B660M DS3H AX DDR4/B660M DS3H DDR4
Responsible Party – U.S. Contact Information: G.B.T. Inc.
Address: 17358 Railroad street, City Of Industry, CA91748
Tel.: 1-626-854-9338
Internet contact information: https://www.gigabyte.com
FCC Compliance Statement:
This device complies with Part 15 of the FCC Rules, Subpart B, Unintentional Radiators.
Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this
device must accept any interference received, including interference that may cause undesired operation.
Regulatory Notices
United States of America, Federal Communications Commission Statement
Antenna use:
In order to comply with FCC RF exposure limits, low gain integrated
antennas should be located at a minimum distance of 7.9 inches (20 cm)
or more from the body of all persons.
Explosive Device Proximity Warning
Warning: Do not operate a portable transmitter (such as a wireless network
device) near unshielded blasting caps or in an explosive environment
unless the device has been modied to be qualied for such use.
Antenna Warning
The wireless adapter is not designed for use with high-gain antennas.
Use On Aircraft Caution
Caution: Regulations of the FCC and FAA prohibit airborne operation of
radio-frequency wireless devices because their signals could interfere with
critical aircraft instruments.
Other Wireless Devices
Safety Notices for Other Devices in the Wireless Network: Refer to the
documentation supplied with wireless Ethernet adapters or other devices
in the wireless network.
Canada, Canada-Industry Notice:
This device complies with Industry Canada license-exempt RSS
standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and
(2) this device must accept any interference, including interference that
may cause undesired operation of the device.
Cet appareil est conforme aux normes Canada d’Industrie de RSS
permis-exempt. L’utilisation est assujetti aux deux conditions suivantes:
(1) le dispositif ne doit pas produire de brouillage préjudiciable, et
(2) ce dispositif doit accepter tout brouillage reçu, y compris un brouillage
susceptible de provoquer un fonctionnement indésirable.
Caution: When using IEEE 802.11a wireless LAN, this product is restricted
to indoor use due to its operation in the 5.15-to 5.25-GHz frequency
range. Industry Canada requires this product to be used indoors for the
frequency range of 5.15 GHz to 5.25 GHz to reduce the potential for
harmful interference to co-channel mobile satellite systems. High power
radar is allocated as the primary user of the 5.25-to 5.35-GHz and 5.65 to
5.85-GHz bands. These radar stations can cause interference with and/or
damage to this device. The maximum allowed antenna gain for use with
this device is 6dBi in order tocomply with the E.I.R.P limit for the 5.25-to
5.35 and 5.725 to 5.85 GHz frequency range in point-to-point operation. To
comply with RF exposure requirements all antennas should be located at a
minimum distance of 20cm, or the minimum separation distance allowed
by the module approval, from the body of all persons.
Attention: l’utilisation d’un réseau sans l IEEE802.11a est restreinte à
une utilisation en intérieur à cause du fonctionnement dansla bande de
fréquence 5.15-5.25 GHz. Industry Canada requiert que ce produit soit
utilisé à l’intérieur des bâtiments pour la bande de fréquence 5.15-5.25
GHz an de réduire les possibilités d’interférences nuisibles aux canaux
co-existants des systèmes de transmission satellites. Les radars de
puissances ont fait l’objet d’une allocation primaire de fréquences dans
les bandes 5.25-5.35 GHz et 5.65-5.85 GHz. Ces stations radar peuvent
créer des interférences avec ce produit et/ou lui être nuisible. Le gain
d’antenne maximum permissible pour une utilisation avec ce produit est de
6 dBi an d’être conforme aux limites de puissance isotropique rayonnée
équivalente (P.I.R.E.) applicable.
dans les bandes 5.25-5.35 GHz et 5.725-5.85 GHz en fonctionnement
point-à-point. Pour se conformer aux conditions d’exposition de RF toutes
les antennes devraient être localisées à une distance minimum de 20
cm, ou la distance de séparation minimum permise par l’approbation du
module, du corps de toutes les personnes.
Under Industry Canada regulations, this radio transmitter may only operate
using an antenna of a type and maximum (or lesser) gain approved for
the transmitter by Industry Canada. To reduce potential radio interference
to other users, the antenna type and its gain should be chosen so that
the equivalent isotropically radiated power (e.i.r.p.) is not more than that
necessary for successful communication.
The FCC with its action in ET Docket 96-8 has adopted a safety standard for human exposure to radio frequency (RF) electromagnetic energy emitted
by FCC certied equipment. The Intel PRO/Wireless 5000 LAN products meet the Human Exposure limits found in OET Bulletin 65, 2001, and ANSI/
IEEE C95.1, 1992. Proper operation of this radio according to the instructions found in this manual will result in exposure substantially below the FCC’s
recommended limits.
The following safety precautions should be observed:
•Do not touch or move antenna while the unit is transmitting or receiving.
•Do not hold any component containing the radio such that the antenna is very close or touching any exposed parts of the body, especially the face
or eyes, while transmitting.
•Do not operate the radio or attempt to transmit data unless the antenna is connected; if not, the radio may be damaged.
•Use in specic environments:
- The use of wireless devices in hazardous locations is limited by the constraints posed by the safety directors of such environments.
- The use of wireless devices on airplanes is governed by the Federal Aviation Administration (FAA).
- The use of wireless devices in hospitals is restricted to the limits set forth by each hospital.
- 36 -
European Union (EU) CE Declaration of Conformity
This device complies with the following directives: Electromagnetic
Compatibility Directive 2014/30/EU, Low-voltage Directive 2014/35/EU,
Radio Equipment Directive 2014/53/EU, ErP Directive 2009/125/EC, RoHS
directive (recast) 2011/65/EU & the 2015/863 Statement.
This product has been tested and found to comply with all essential
requirements of the Directives.
European Union (EU) RoHS (recast) Directive 2011/65/EU & the
European Commission Delegated Directive (EU) 2015/863 Statement
GIGABYTE products have not intended to add and safe from hazardous
substances (Cd, Pb, Hg, Cr+6, PBDE, PBB, DEHP, BBP, DBP and DIBP).
The parts and components have been carefully selected to meet RoHS
requirement. Moreover, we at GIGABYTE are continuing our efforts to
develop products that do not use internationally banned toxic chemicals.
European Union (EU) Community Waste Electrical & Electronic
Equipment (WEEE) Directive Statement
GIGABYTE will fulll the national laws as interpreted from the 2012/19/
EU WEEE (Waste Electrical and Electronic Equipment) (recast) directive.
The WEEE Directive species the treatment, collection, recycling and
disposal of electric and electronic devices and their components. Under
the Directive, used equipment must be marked, collected separately, and
disposed of properly.
WEEE Symbol Statement
The symbol shown below is on the product or on its
packaging, which indicates that this product must not be
disposed of with other waste. Instead, the device should be
taken to the waste collection centers for activation of the
treatment, collection, recycling and disposal procedure.
For more information about where you can drop off your waste equipment
for recycling, please contact your local government ofce, your household
waste disposal service or where you purchased the product for details of
environmentally safe recycling.
End of Life Directives-Recycling
The symbol shown below is on the product or on its packaging,
which indicates that this product must not be disposed of with
other waste. Instead, the device should be taken to the waste
collection centers for activation of the treatment, collection,
recycling and disposal procedure.
Déclaration de Conformité aux Directives de l’Union européenne (UE)
Cet appareil portant la marque CE est conforme aux directives de l’UE
suivantes: directive Compatibilité Electromagnétique 2014/30/UE, directive
Basse Tension 2014/35/UE, directive équipements radioélectriques
2014/53/UE, la directive RoHS II 2011/65/UE & la déclaration 2015/863.
La conformité à ces directives est évaluée sur la base des normes
européennes harmonisées applicables.
European Union (EU) CE-Konformitätserklärung
Dieses Produkte mit CE-Kennzeichnung erfüllen folgenden EU-Richtlinien:
EMV-Richtlinie 2014/30/EU, Niederspannungsrichtlinie 2014/35/EU,
Funkanlagen Richtlinie 2014/53/EU, RoHS-Richtlinie 2011/65/EU erfüllt
und die 2015/863 Erklärung.
Die Konformität mit diesen Richtlinien wird unter Verwendung der
entsprechenden Standards zurEuropäischen Normierung beurteilt.
CE declaração de conformidade
Este produto com a marcação CE estão em conformidade com das
seguintes Diretivas UE: Diretiva Baixa Tensão 2014/35/EU; Diretiva
CEM 2014/30/EU; Diretiva RSP 2011/65/UE e a declaração 2015/863.
A conformidade com estas diretivas é vericada utilizando as normas
europeias harmonizadas.
CE Declaración de conformidad
Este producto que llevan la marca CE cumplen con las siguientes
Directivas de la Unión Europea: Directiva EMC 2014/30/EU, Directiva de
bajo voltaje 2014/35/EU, Directiva de equipamentos de rádio 2014/53/EU,
Directiva RoHS 2011/65/EU y la Declaración 2015/863.
El cumplimiento de estas directivas se evalúa mediante las normas
europeas armonizadas.
CE Dichiarazione di conformità
I prodotti con il marchio CE sono conformi con una o più delle seguenti
Direttive UE, come applicabile: Direttiva EMC 2014/30/UE, Direttiva sulla
bassa tensione 2014/35/UE, Direttiva di apparecchiature radio 2014/53/
UE, Direttiva RoHS 2011/65/EU e Dichiarazione 2015/863.
La conformità con tali direttive viene valutata utilizzando gli Standard
europei armonizzati applicabili.
DeklaracjazgodnościUEUniiEuropejskiej
Urządzenie jest zgodne z następującymi dyrektywami: Dyrektywa
kompatybilności elektromagnetycznej 2014/30/UE, Dyrektywa
niskonapięciowej 2014/35/UE, Dyrektywa urządzeń radiowych 2014/53/
UE, Dyrektywa RoHS 2011/65/UE i dyrektywa2015/863.
Niniejsze urządzenie zostało poddane testom i stwierdzono jego zgodność
z wymaganiami dyrektywy.
ESProhlášeníoshodě
Toto zařízení splňuje požadavky Směrnice o Elektromagnetické
kompatibilitě 2014/30/EU, Směrnice o Nízkém napětí 2014/35/EU,
Směrnice o rádiových zařízeních 2014/53/EU, Směrnice RoHS 2011/65/
EU a 2015/863.
Tento produkt byl testován a bylo shledáno, že splňuje všechny základní
požadavky směrnic.
EKmegfelelőséginyilatkozata
A termék megfelelnek az alábbi irányelvek és szabványok
követelményeinek, azok a kiállításidőpontjában érvényes, aktuális
változatában: EMC irányelv 2014/30/EU, Kisfeszültségű villamos
berendezésekre vonatkozó irányelv 2014/35/EU, rádióberendezések
irányelv 2014/53/EU, RoHS irányelv 2011/65/EU és 2015/863.
ΔήλωσησυμμόρφωσηςΕΕ
Είναι σε συμμόρφωση με τις διατάξεις των παρακάτω Οδηγιών
της Ευρωπαϊκής Κοινότητας: Οδηγία 2014/30/ΕΕ σχετικά με την
ηλεκτρομαγνητική συμβατότητα, Οοδηγία χαμηλή τάση 2014/35/EU,
Οδηγία 2014/53/ΕΕ σε ραδιοεξοπλισμό, Οδηγία RoHS 2011/65/ΕΕ
και 2015/863.
Η συμμόρφωση με αυτές τις οδηγίες αξιολογείται χρησιμοποιώντας τα
ισχύοντα εναρμονισμένα ευρωπαϊκά πρότυπα.
Conformément à la réglementation d'Industrie Canada, le présent émetteur
radio peut fonctionner avec une antenne d'un type et d'un gain maximal
(ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le
but de réduire les risques de brouillage radio électrique à l'intention des
autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte
que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas
l'intensité nécessaire à l'établissement d'une communication satisfaisante.
European Community Radio Equipment Directive Compliance Statement:
This equipment complies with all the requirements and other relevant provisions of Radio Equipment Directive 2014/53/EU.
This equipment is suitable for home and ofce use in all the European Community Member States and EFTA Member States.
The low band 5.15 -5.35 GHz is for indoor use only.
AT BE BG CH CY CZ DE
DK EE EL ES FI FR HR
HU IE IS IT LI LT LU
LV MT NL PL PT RO SE
SI SK TR UK
- 37 -
Taiwan NCC Wireless Statements / 無線設備警告聲明：
低功率電波輻射性電機管理辦法
(1) 取得審驗證明之低功率射頻器材，非經核准，公司、商號或使用者均不得擅自變更頻率、加大功率或變更原設計之特
性及功能。低功率射頻器材之使用不得影響飛航安全及干擾合法通信；經發現有干擾現象時，應立即停用，並改善至
無干擾時方得繼續使用。前述合法通信，指依電信管理法規定作業之無線電通信。低功率射頻器材須忍受合法通信或
工業、科學及醫療用電波輻射性電機設備之干擾。
(2) 應避免影響附近雷達系統之操作。
Korea KCC NCC Wireless Statement:
5,25GHz - 5,35 GHz 대역을 사용하는 무선 장치는 실내에서만 사용하도록 제한됩니다.
Japan Wireless Statement:
5.15 GHz 帯 ~ 5.35 GHz 帯: 屋内のみの使用。
Country approvals for wireless module AX201NGW:
Country approvals for wireless module AX200NGW:
Australia:
Country approvals for wireless module AX211NGW:
Wireless module country approvals:
To identify your Motherboard version or revision number, look for “REV: X.X” printed on the PCB on the top left corner of the Motherboard. For
example, "REV:1.0" means the revision of the motherboard is 1.0. .
Motherboard revision no.: Wireless module manufacturer, model name:
B660M DS3H AX DDR4 rev. 1.0 Intel® Corporation AX201NGW
B660M DS3H AX DDR4 rev. 1.1 Intel® Corporation AX200NGW
B660M DS3H AX DDR4 rev. 1.2 Intel® Corporation AX211NGW
- 38 -
•GIGABYTE eSupport
To submit a technical or non-technical (Sales/Marketing) question, please link to:
https://esupport.gigabyte.com
Contact Us
GIGA-BYTE TECHNOLOGY CO., LTD.
Address: No.6, Baoqiang Rd., Xindian Dist., New Taipei City 231, Taiwan
TEL: +886-2-8912-4000, FAX: +886-2-8912-4005
Tech. and Non-Tech. Support (Sales/Marketing) : https://esupport.gigabyte.com
WEB address (English): https://www.gigabyte.com
WEB address (Chinese): https://www.gigabyte.com/tw