Toshiba KSG60ZSE1T02 User Manual
Displayed below is the user manual for KSG60ZSE1T02 by Toshiba which is a product in the Internal Solid State Drives category. This manual has pages.
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Copyright © 2017 Toshiba Memory Corporation. All rights reserved.
Client SSD SG6 Series Brochure Rev.1.00
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
SSD
Standard Models
2.5-type
(7.0 mm height)
M.2 2280-S2
Single-sided
M.2 2280-D2
Double-sided
Model
Number
(Non-SED)
KSG60ZSE256G
KSG60ZSE512G
KSG60ZSE1T02
KSG60ZMV256G
KSG60ZMV512G
KSG60ZM81T02
(SED)
KSG6AZSE256G
KSG6AZSE512G
KSG6AZSE1T02
KSG6AZMV256G
KSG6AZMV512G
KSG6AZM81T02
Memory
TLC (BiCS FLASHTM)
Interface
SATA Rev. 3.3
Maximum Speed
6.0 Gbit/s
Command
ACS-4
Connector Type
Standard SATA
M.2 B-M
Formatted Capacity1)
256 GB
512 GB
1024 GB
256 GB
512 GB
1024 GB
Perfor-
mance2)
(Up to)
Sequential
Read
550 MB/s {524 MiB/s}
550 MB/s {524 MiB/s}
Sequential
Write
340 MB/s
{324 MiB/s}
535 MB/s
{510 MiB/s}
340 MB/s
{324 MiB/s}
535 MB/s
{510 MiB/s}
Supply Voltage
5.0 V ±5 %
3.3 V ±5 %
Power
Consump-
tion
Active
2.3 W typ.
3.1 W typ.
3.5 W typ.
2.3 W typ.
3.1 W typ.
3.5 W typ.
Idle
60 mW typ.
65 mW typ.
70 mW typ.
55 mW typ.
60 mW typ.
65 mW typ.
DevSleep
6 mW max.
5 mW max.
Size
100.0 mm x
69.85 mm x
7.0 mm
80.0 mm x
22.0 mm x
2.23 mm
80.0 mm x
22.0 mm x
3.58 mm
Weight
41 g typ.
42 g typ.
43 g typ.
6.9 g typ.
8.3 g typ.
KEY FEATURES
64-layer, 3-bit-per-cell (TLC) BiCS FLASH™
Capacities up to 1024GB
SATA Revision 3.3, 6.0 Gbit/s interface
2.5-type and M.2 2280 form factor options
TCG Opal Version 2.01 (SED model)
APPLICATIONS
Desktop PCs
Notebook PCs
SG6 SERIES
CLIENT SSD
SG6 Series is a Client SATA SSD lineup using 64-layer, 3-bit-per-cell (TLC) BiCS
FLASHTM.
The SG6 series SSDs with up to 1024GB capacity, delivers performance of up to
550MB/s sequential read and 535MB/s sequential write. Furthermore, active power
consumption was decreased by up to 40% compared to previous SG5 series,
enabling increased battery life for mobile computing.
Offered in both traditional 2.5-type (7mm height) and compact M.2 2280 form factors,
SG6 series is engineered for mainstream desktop PCs and notebook PCs, consumer
upgrades, as well as applications needing data security with an option of self-
encrypting drive (SED) models.
Product image may represent a design model
SPECIFICATIONS
2 / 21
Copyright © 2017 Toshiba Memory Corporation. All rights reserved.
Client SSD SG6 Series Brochure Rev.1.00
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
Note: 1) Definition of capacity: Toshiba Memory Corporation defines a megabyte (MB) as 1,000,000 bytes, a gigabyte (GB) as
1,000,000,000 bytes and a terabyte (TB) as 1,000,000,000,000 bytes. A computer operating system, however, reports
storage capacity using powers of 2 for the definition of 1GB = 230 = 1,073,741,824 bytes and therefore shows less
storage capacity. Available storage capacity (including examples of various media files) will vary based on file size,
formatting, settings, software and operating system, such as Microsoft Operating System and/or pre-installed software
applications, or media content. Actual formatted capacity may vary.
2) 1 MiB (mebibyte) = 220 bytes = 1,048,576 bytes, and 1 MB (megabyte) = 1,000,000 bytes.
3) MTTF (Mean Time to Failure) is not a guarantee or estimate of product life; it is a statistical value related to mean
failure rates for a large number of products which may not accurately reflect actual operation. Actual operating life of the
product may be different from the MTTF.
* Product image may represent a design model.
* Read and write speed may vary depending on the host device, read and write conditions, and file size.
* Company names, product names, and service names mentioned herein may be trademarks of their respective companies.
Standard Models
2.5-type
(7.0 mm Height)
M.2 2280-S2
Single-sided
M.2 2280-D2
Double-sided
Tempera-
ture
Operating
0 to 70 °C
(Case Temperature)
0 to 80 °C
(Components Temperature)
Non-
operating
-40 to 85 °C
Reliability3)
Mean Time to Failure (MTTF): 1,500,000 hours
Product Life: Approximately 5 years
More Features
Strong & highly-efficient ECC named QSBCTM is supported.
Firmware security feature (only digitally signed firmware can be installed) is supported.
Compliance
UL, cUL, TÜV, KC, FCC, BSMI, CE, RCM, ISED, VCCI, Moroccan conformity mark
3 / 21
Copyright © 2017 Toshiba Memory Corporation. All rights reserved.
Client SSD SG6 Series Brochure Rev.1.00
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
ORDERING INFORMATION
K
XX
X
X
X
X
X
XXXX
1
2
3
4
5
6
7
8
1. Product Name K: SSD product
2. Prodct Category SG: SG Series
3. Development Generation 6: Generation 6
4. Option Code 1 0: Non-SED
A: SED
5. Option Code 2 Z: No-option
6. Connector Type S: Standard SATA
M: M.2 B-M
7. Form Factor E: 2.5-type 7 mm H
V: M.2 2280 Single Sided
8: M.2 2280 Double Sided
8. Capacity 256G / 512G /1T02
256G is 256 GB, 512G is 512 GB and 1T02 is 1024 GB
(1 GB = 1,000,000,000 bytes)
4 / 21
Copyright © 2017 Toshiba Memory Corporation. All rights reserved.
Client SSD SG6 Series Brochure Rev.1.00
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
Note: 1) 7mm Height
2) Single Sided
3) Double Sided
Note: 1 GB (Gigabyte) = 1,000,000,000 bytes
Note: 1) Under the condition of measurement with 128 KiB unit sequential access and 4KiB align and queue depth is 32.
(1KiB=1024 bytes.)
Model Number
Formatted
Capacity
Form Factor/Connect Type
Function
Note
KSG60ZSE256G
256 GB
2.5-type1) Standard SATA
Non-SED
KSG60ZSE512G
512 GB
KSG60ZSE1T02
1,024 GB
KSG6AZSE256G
256 GB
SED
KSG6AZSE512G
512 GB
KSG6AZSE1T02
1,024 GB
KSG60ZMV256G
256 GB
M.2 2280-S22) -B-M
Non-SED
KSG60ZMV512G
512 GB
KSG60ZM81T02
1,024 GB
M.2 2280-D23) -B-M
KSG6AZMV256G
256 GB
M.2 2280-S22) -B-M
SED
KSG6AZMV512G
512 GB
KSG6AZM81T02
1,024 GB
M.2 2280-D23) -B-M
Capacity
Total Number of User Addressable Sectors in LBA Mode
512 bytes sector
256 GB
500,118,192
512 GB
1,000,215,216
1,024 GB
2,000,409,264
Standard Models
KSG60ZSE256G
KSG6AZSE256G
KSG60ZMV256G
KSG6AZMV256G
KSG60ZSE512G
KSG6AZSE512G
KSG60ZMV512G
KSG6AZMV512G
KSG60ZSE1T02
KSG6AZSE1T02
KSG60ZM81T02
KSG6AZM81T02
Interface Speed
6.0 Gbit/s max.
Sequential Read1)
(Up to)
550 MB/s
{524 MiB/s}
Sequential Write1)
(Up to)
340 MB/s
{324 MiB/s}
535 MB/s
{510 MiB/s}
535 MB/s
{510 MiB/s}
PRODUCT LINE UP
CAPACITY
PERFORMANCE
5 / 21
Copyright © 2017 Toshiba Memory Corporation. All rights reserved.
Client SSD SG6 Series Brochure Rev.1.00
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
Standard Models
2.5-type
M.2 2280 Module
Allowable voltage
5.0 V ±5 %
3.3 V ±5 %
Allowable noise/ripple
100 mV p-p or less
Allowable supply rise time
2 –100 ms
Note: The drive has over current protection circuit. (Rated current: 3.15A)
Note: 1) Ambient Temperature
2) The values are specified at the condition causing maximum power consumption, i.e., maximum workload, default
maximum parallel number of flash memory operation and no thermal control effect.
3) The values are based on using SATA power management features. The Slumber mode is used for the power
consumption measurements.
4) The drive may internally write to flash memory. Therefore, drive power consumption may temporally change up to
write power.
Operation
(Ta1)=25°C)
2.5-type
KSG60ZSE256G
KSG6AZSE256G
KSG60ZSE512G
KSG6AZSE512G
KSG60ZSE1T02
KSG6AZSE1T02
Read2)
2.0 W typ.
2.1 W typ.
2.1 W typ.
2.2 W typ.
2.2 W typ.
2.3 W typ.
Write2)
2.3 W typ.
3.1 W typ.
3.5 W typ.
Idle 33)4)
60 mW typ.
65 mW typ.
70 mW typ.
Standby3)4)
60 mW typ.
65 mW typ.
70 mW typ.
Sleep3)
60 mW typ.
65 mW typ.
70 mW typ.
DevSleep
6 mW max.
Operation
(Ta 1)=25°C)
M.2 2280 Module
KSG60ZMV256G
KSG6AZMV256G
KSG60ZMV512G
KSG6AZMV512G
KSG60ZM81T02
KSG6AZM81T02
Read2)
2.0 W typ.
2.1 W typ.
2.1 W typ.
2.2 W typ.
2.2 W typ.
2.3 W typ.
Write2)
2.3 W typ.
3.1 W typ.
3.5 W typ.
Idle 33)4)
55 mW typ.
60 mW typ.
65 mW typ.
Standby3)4)
55 mW typ.
60 mW typ.
65 mW typ.
Sleep3)
55 mW typ.
60 mW typ.
65 mW typ.
DevSleep
5 mW max.
SUPPLY VOLTAGE
POWER CONSUMPTION
6 / 21
Copyright © 2017 Toshiba Memory Corporation. All rights reserved.
Client SSD SG6 Series Brochure Rev.1.00
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
ENVIRONMENTAL CONDITIONS
Note: 1) Ta: Ambient Temperature, Tc: Case or Components Temperature
2) Packaged in Toshiba Memory Corporation’s original shipping package
Note: 1) Packaged in Toshiba Memory Corporation’s original shipping package
Note: 1) Apply shocks in each direction of the drive’s three mutually perpendicular axes, one axis at a time.
Packaged in Toshiba Memory Corporation’s original shipping package
Condition
Range
Gradient
2.5-type
M.2 2280 Module
Operating1)
0 °C (Tc) – 70 °C (Tc)
(Case Temperature)
0 °C (Tc) – 80 °C (Tc)
(Components Temperature)
30 °C (Ta) / h maximum
Non-operating
-40 °C – 85 °C
30 °C / h maximum
Under Shipment2)
-40 °C – 85 °C
30 °C / h maximum
Condition
Range
Operating
8 % – 90 % R.H. (No condensation)
Non-operating
8 % – 95 % R.H. (No condensation)
Under Shipment1)
5 % – 95 % R.H.
Max. wet bulb
32.5 °C (Operating)
40.0 °C (Non-operating / Shipping)
Condition
Range
Operating
14.709 km/s2 {1,500 G}, 0.5 ms half sine wave
Non-operating
Under Shipment1)
100 cm free drop
Condition
Range
Operating
196 m/s2 {20 G} Peak, 10 - 2,000 Hz
(20 minutes per axis) x 3 axis
Non-operating
TEMPERATURE
HUMIDITY
SHOCK
STANDARDS
VIBRATION
STANDARDS
7 / 21
Copyright © 2017 Toshiba Memory Corporation. All rights reserved.
Client SSD SG6 Series Brochure Rev.1.00
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
COMPLIANCE
Note: 1) UL certification is basically on a voluntary basis.
Title
Description
Region
UL
(Underwriters Laboratories)
UL 60950-1
USA1)
cUL
(Underwriters Laboratories of Canada)
CSA-C22.2 No.60950-1-07
Canada
TÜV
(Technischer Überwachungs Verein)
EN 60950-1
EURO
KC
KN32, KN35
Korea
FCC
FCC part 15 Subpart B
USA
BSMI
(Bureau of Standards, Metrology and Inspection)
CNS13438 (CISPR Pub. 22)
Taiwan
CE
EN 55032, EN 55024
EURO
RCM
AS/NZS CISPR 32
Australia, New Zealand
ISED
ICES-003
Canada
VCCI
Class B
Japan
Moroccan conformity mark
NM E55024
Morocco
Parameter
Value
Mean Time to Failure
1,500,000 hours
Product Life
Approximately 5 years
SAFETY / EMI STANDARDS
RELIABILITY
8 / 21
Copyright © 2017 Toshiba Memory Corporation. All rights reserved.
Client SSD SG6 Series Brochure Rev.1.00
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
MECHANICAL SPECIFICATIONS
Figure 1: Dimensions of KSG6xZSExxxx (2.5-type)
Model Number
Weight
Width
Height
Length
KSG60ZSE256G
KSG6AZSE256G
41 g typ.
69.85 mm
7.0 mm
100.0 mm
KSG60ZSE512G
KSG6AZSE512G
42 g typ.
KSG60ZSE1T02
KSG6AZSE1T02
43 g typ.
2.5 TYPE
9 / 21
Copyright © 2017 Toshiba Memory Corporation. All rights reserved.
Client SSD SG6 Series Brochure Rev.1.00
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
Dimension
SFF-8200 Rev3.21)
SFF-8201 Rev3.3
SFF-8223 Rev2.5
SG6 Series SSD
(Differences only)
Millimeters
Inches
Millimeters
Inches
A1
7.00
0.276
A2
0.20
0.008
0.00
0.000
A3
0.50
0.020
A4
69.85
2.750
A5
0.25
0.010
A62)
100.45*
3.955*
100.00 ± 0.41
3.937 ± 0.016
A7
3.5
0.138
A8
9.40
0.370
9.40 ± 0.51
0.370 ± 0.020
A103)
-
-
30.125 ± 0.28
1.186 ± 0.011
A12
0.38
0.015
A23
3.00
0.118
3.00 ± 0.20
0.118 ± 0.007
A26
M3
N/A
A28
4.07
0.160
4.07 + 0.295/-0.305
0.060 +0.011/-0.012
A29
61.72
2.430
61.72 ± 0.25
2.430 ± 0.010
A32
M3
N/A
A38
3#
3#
A41
2.5#
2.5#
A502)
14.00
0.551
14.00 ± 0.25
0.551 ± 0.010
A512)
90.60
3.567
90.60 ± 0.30
3.567 ± 0.012
A522)
14.00
0.551
14.00 ± 0.25
0.551 ± 0.010
A532)
90.60
3.567
90.60 ± 0.30
3.567 ± 0.012
* = maximum
# = minimum number of threads
Note: 1) SFF-8200: Small Form Factor Standard
2) PCA, Connector not included
3) Connector center defined the same as SFF-8223 All
DIMENSIONS OF KSG6xZSExxxx
10 / 21
Copyright © 2017 Toshiba Memory Corporation. All rights reserved.
Client SSD SG6 Series Brochure Rev.1.00
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
Unit:mm
Figure 2: Dimensions of KSG6xZMVxxxx (M.2 2280-S2 Module)
Model Number
Weight
Width
Height
Length
KSG60ZMV256G
KSG6AZMV256G
6.9 g typ.
22.00 mm
2.23 mm
80.00 mm
KSG60ZMV512G
KSG6AZMV512G
6.9 g typ.
KSG60ZM81T02
KSG6AZM81T02
8.3 g typ.
3.58 mm
M.2 2280 MODULE
11 / 21
Copyright © 2017 Toshiba Memory Corporation. All rights reserved.
Client SSD SG6 Series Brochure Rev.1.00
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
Unit:mm
Figure 3: Dimensions of KSG6xZM81T02 (M.2 2280-D2 Module)
12 / 21
Copyright © 2017 Toshiba Memory Corporation. All rights reserved.
Client SSD SG6 Series Brochure Rev.1.00
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
2.5 TYPE
INTERFACE CONNECTOR
Unit:mm
Figure 4: 2.5-type Serial ATA Interface Connector Dimension
13 / 21
Copyright © 2017 Toshiba Memory Corporation. All rights reserved.
Client SSD SG6 Series Brochure Rev.1.00
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
2.5 TYPE DRIVE CONNECTER PIN ASSIGNMENT1)
Note: 1) The Mate orders are for backplane usage. Hot-Plug and OS-Aware Hot Removal are supported when using with a
backplane connector.
2) Previously, 3.3 V was assigned to pins P1, P2 and P3 by Serial ATA International Organization.
3) Direct connect to non pre-charge pins.
Segment
Pin
Position
Name
Description
Signal
Segment
S1
GND
2nd Mate
S2
A+
Differential Signal Pair A (Device Rx), 3rd Mate
S3
A-
S4
GND
2nd Mate
S5
B-
Differential Signal Pair B (Device Tx), 3rd Mate
S6
B+
S7
GND
2nd Mate
Signal segment “L”
Central connector polarizer
Power segment “L”
Power
Segment
P1
Retired2)
P2
Retired2)
P3
DEVSLP2)
Enter/Exit DevSleep
P4
GND
1st Mate
P5
GND
2nd Mate
P6
GND
2nd Mate
P7
V5
5 V power, pre-charge3), 2nd Mate
P8
V5
5 V power, 3rd Mate
P9
V5
5 V power, 3rd Mate
P10
GND
2nd Mate
P11
DAS/DSS
Drive Activity Signal / Disable Staggered Spin-up, 3rd Mate
P12
GND
1st Mate
P13
V12
12 V power, pre-charge, 2nd Mate (Unused)
P14
V12
12 V power (Unused), 3rd Mate
P15
V12
12 V power (Unused), 3rd Mate
Power segment key
14 / 21
Copyright © 2017 Toshiba Memory Corporation. All rights reserved.
Client SSD SG6 Series Brochure Rev.1.00
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
M.2 2280 MODULE
Unit:mm
Figure 5: Interface Dimensions of KSG6xZMVxxxx (M.2 2280-S2 Module)
15 / 21
Copyright © 2017 Toshiba Memory Corporation. All rights reserved.
Client SSD SG6 Series Brochure Rev.1.00
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
Unit:mm
Figure 6: Interface Dimensions of KSG6xZM81T02 (M.2 2280-D2 Module)
16 / 21
Copyright © 2017 Toshiba Memory Corporation. All rights reserved.
Client SSD SG6 Series Brochure Rev.1.00
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
M.2 2280 MODULE CONNECTOR PIN ASSIGNMENT
Pin
#
Name
Description
Pin
#
Name
Description
1
CONFIG_3
Defines module type(GND)
2
+3.3V
3.3 V Source
3
GND
GND
4
+3.3V
3.3 V Source
5
Reserved
NC
6
Reserved
NC
7
Reserved
NC
8
Reserved
NC
9
Reserved
NC
10
DAS/DSS
Drive Activity Signal /
Disable Staggered Spin-up
11
Reserved
NC
Notch
Notch
20
Reserved
NC
21
CONFIG_0
Defines module type(GND)
22
Reserved
NC
23
Reserved
NC
24
Reserved
NC
25
Reserved
NC
26
Reserved
NC
27
GND
GND
28
Reserved
NC
29
Reserved
NC
30
Reserved
NC
31
Reserved
NC
32
Reserved
NC
33
GND
GND
34
Reserved
NC
35
Reserved
NC
36
Reserved
NC
37
Reserved
NC
38
DEVSLP
DEVSLP signal
39
GND
GND
40
Reserved
NC
41
B+
Host Receiver Differential
Signal Pair
42
Reserved
NC
43
B-
44
Reserved
NC
45
GND
GND
46
Reserved
NC
47
A-
Host Transmitter
Differential Signal Pair
48
Reserved
NC
49
A+
50
Reserved
NC
51
GND
GND
52
Reserved
NC
53
Reserved
NC
54
Reserved
NC
55
Reserved
NC
56
MFG1
Manufacturing pin. Must be a
no-connect on the host board.
57
GND
GND
58
MFG2
Notch
Notch
67
Reserved
NC
68
Reserved
NC
69
CONFIG_1
Defines module type(GND)
70
+3.3V
3.3 V Source
71
GND
GND
72
+3.3V
3.3 V Source
73
GND
GND
74
+3.3V
3.3 V Source
75
CONFIG_2
Defines module type(GND)
17 / 21
Copyright © 2017 Toshiba Memory Corporation. All rights reserved.
Client SSD SG6 Series Brochure Rev.1.00
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
COMMAND TABLE
Op-Code
Command Name
00h
NOP
06h
DATA SET MANAGEMENT
10h
RECALIBRATE
20h
READ SECTOR(S)
21h
READ SECTOR(S) without retries
24h
READ SECTOR(S) EXT
25h
READ DMA EXT
27h
READ NATIVE MAX ADDRESS EXT
29h
READ MULTIPLE EXT
2Fh
READ LOG EXT
30h
WRITE SECTOR(S)
31h
WRITE SECTOR(S) without retries
34h
WRITE SECTOR(S) EXT
35h
WRITE DMA EXT
37h
SET MAX ADDRESS EXT
39h
WRITE MULTIPLE EXT
3Dh
WRITE DMA FUA EXT
3Fh
WRITE LOG EXT
40h
READ VERIFY SECTOR(S)
41h
READ VERIFY SECTOR(S) without retries
42h
READ VERIFY SECTOR(S) EXT
45h
WRITE UNCORRECTABLE EXT
45h
55h
Create a pseudo-uncorrectable error with logging
45h
AAh
Create a flagged error without logging
47h
READ LOG DMA EXT
57h
WRITE LOG DMA EXT
5Bh
TRUSTED NON-DATA
5Ch
TRUSTED RECEIVE
5Dh
TRUSTED RECEIVE DMA
5Eh
TRUSTED SEND
5Fh
TRUSTED SEND DMA
60h
READ FPDMA QUEUED
61h
WRITE FPDMA QUEUED
70h
SEEK
90h
EXECUTE DEVICE DIAGNOSTIC
91h
INITIALIZE DEVICE PARAMETERS
18 / 21
Copyright © 2017 Toshiba Memory Corporation. All rights reserved.
Client SSD SG6 Series Brochure Rev.1.00
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
Op-Code
Feature Name
92h
DOWNLOAD MICROCODE
92h
03h
Download with offsets and save microcode for immediate and future use
92h
07h
Download and save microcode for immediate and future use
92h
0Eb
Download with offsets and save microcode for future use
92h
0Fb
Activate downloaded microcode
93h
DOWNLOAD MICROCODE DMA
93h
03h
Download with offsets and save microcode for immediate and future use
93h
07h
Download and save microcode for immediate and future use
93h
0Eb
Download with offsets and save microcode for future use
93h
0Fb
Activate downloaded microcode
B0h
SMART
B0h
D0h
SMART READ DATA
B0h
D1h
SMART READ ATTRIBUTE THRESHOLDS
B0h
D2h
SMART ENABLE/DISABLE ATTRIBUTE AUTOSAVE
B0h
D3h
SMART SAVE ATTRIBUTE VALUES
B0h
D4h
SMART EXECUTE OFF-LINE IMMEDIATE
B0h
D5h
SMART READ LOG
B0h
D6h
SMART WRITE LOG
B0h
D8h
SMART ENABLE OPERATIONS
B0h
D9h
SMART DISABLE OPERATIONS
B0h
DAh
SMART RETURN STATUS
B0h
DBh
SMART ENABLE/DISABLE AUTOMATIC OFF-LINE
B1h
DEVICE CONFIGURATION OVERLAY
B1h
C0h
DEVICE CONFIGURATION RESTORE
B1h
C1h
DEVICE CONFIGURATION FREEZE LOCK
B1h
C2h
DEVICE CONFIGURATION IDENTIFY
B1h
C3h
DEVICE CONFIGURATION SET
B1h
C4h
DEVICE CONFIGURATION IDENTIFY DMA
B1h
C5h
DEVICE CONFIGURATION SET DMA
B4h
SANITIZE DEVICE
B4h
00h
SANITIZE STATUS EXT
B4h
11h
CRYPTO SCRAMBLE EXT
B4h
12h
BLOCK ERASE EXT
B4h
20h
SANITIZE FREEZE LOCK EXT
19 / 21
Copyright © 2017 Toshiba Memory Corporation. All rights reserved.
Client SSD SG6 Series Brochure Rev.1.00
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
Op-Code
Feature Name
C4h
READ MULTIPLE
C5h
WRITE MULTIPLE
C6h
SET MULTIPLE MODE
C8h
READ DMA
C9h
READ DMA without retries
CAh
WRITE DMA
CBh
WRITE DMA without retries
CEh
WRITE MULTIPLE FUA EXT
E0h
STANDBY IMMEDIATE
E1h
IDLE IMMEDIATE
E2h
STANDBY
E3h
IDLE
E4h
READ BUFFER
E5h
CHECK POWER MODE
E6h
SLEEP
E7h
FLUSH CACHE
E8h
WRITE BUFFER
E9h
READ BUFFER DMA
EAh
FLUSH CACHE EXT
EBh
WRITE BUFFER DMA
ECh
IDENTIFY DEVICE
EFh
SET FEATURES
EFh
02h
Enable volatile write cache
EFh
03h
Set transfer mode
EFh
05h
Enable the APM feature set
EFh
10h
Enable use of SATA feature set
EFh
55h
Disable read look-ahead
EFh
66h
Disable reverting to power-on defaults
EFh
82h
Disable volatile write cache
EFh
85h
Disable the APM feature set
EFh
90h
Disable use of SATA feature set
EFh
AAh
Enable read look-ahead
EFh
CCh
Enable reverting to power-on defaults
20 / 21
Copyright © 2017 Toshiba Memory Corporation. All rights reserved.
Client SSD SG6 Series Brochure Rev.1.00
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
Op-Code
Feature Name
F1h
SECURITY SET PASSWORD
F2h
SECURITY UNLOCK
F3h
SECURITY ERASE PREPARE
F4h
SECURITY ERASE UNIT
F5h
SECURITY FREEZE LOCK
F6h
SECURITY DISABLE PASSWORD
F8h
READ NATIVE MAX ADDRESS
F9h
SET MAX ADDRESS
F9h
01h
SET MAX SET PASSWORD
F9h
02h
SET MAX LOCK
F9h
03h
SET MAX UNLOCK
F9h
04h
SET MAX FREEZE LOCK
F9h
05h
SET MAX SET PASSWORD DMA
F9h
06h
SET MAX UNLOCK DMA
21 / 21
Copyright © 2017 Toshiba Memory Corporation. All rights reserved.
Client SSD SG6 Series Brochure Rev.1.00
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
RESTRICTIONS ON PRODUCT USE
Toshiba Corporation and its subsidiaries and affiliates are collectively referred to as “TOSHIBA”.
Hardware, software and systems described in this document are collectively referred to as “Product”.
TOSHIBA reserves the right to make changes to the information in this document and related Product without notice.
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written
permission, reproduction is permissible only if reproduction is without alteration/omission.
Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for
complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize
risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including
data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own
applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without
limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the
"TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for.
Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the
appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information
contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c)
validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT
DESIGN OR APPLICATIONS.
PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE EXTRAORDINARILY
HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY CAUSE LOSS OF HUMAN
LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT ("UNINTENDED USE"). Except for specific
applications as expressly stated in this document, Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment
used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling
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Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable
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The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement
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ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR
PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING
WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT
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INFORMATION, OR NONINFRINGEMENT.
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NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.