Toshiba KXG50ZNV256G User Manual
Displayed below is the user manual for KXG50ZNV256G by Toshiba which is a product in the Internal Solid State Drives category. This manual has pages.
Related Manuals
1 / 13
Copyright © 2017 Toshiba Memory Corporation. All rights reserved.
Client SSD XG5 Series Brochure Rev.1.00
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
SSD
* Availability of the SED model line-up may vary by region.
Standard Models
M.2 2280-S2
(Single-sided)
Model Number
KXG50ZNV256G
KXG5AZNV256G
KXG50ZNV512G
KXG5AZNV512G
KXG50ZNV1T02
KXG5AZNV1T02
Memory
TOSHIBA BiCS FLASHTM
Interface
PCI Express® Base Specification Revision 3.1 (PCIe®)
Maximum Speed
32 GT/s (PCIe® Gen3×4 Lane)
Command
NVM ExpressTM Revision 1.2.1 (NVMeTM)
Connector Type
M.2 M
Formatted Capacity1)
256 GB
512 GB
1,024 GB
Performance2)
(Up to)
Sequential
Read
2,700 MB/s {2,580 MiB/s}
3,000 MB/s {2,900 MiB/s}
Sequential
Write
1,050 MB/s {1,000 MiB/s}
2,100 MB/s {2,000 MiB/s}
Supply Voltage
3.3 V ±5 %
Power
Consumption
Active
4.0 W typ.
4.3 W typ.
4.5 W typ.
L1.2 mode
3 mW typ.
Size
80.0 mm x 22.0 mm x 2.23 mm
Weight
7.0 g typ.
7.3 g typ.
KEY FEATURES
Toshiba 64-Layer BiCS FLASHTM
PCIeⓇ Gen3*4L NVMeTM
Capacities up to 1024GB
M.2 2280 Single-sided
TCG OPAL 2.01 Optional for SED
APPLICATIONS
Thin performance Notebook
Enthusiast Desktop/Laptop
Mainstream PC Computing
Server/Storage Boot
XG5 SERIES
CLIENT SSD
XG5 series SSDs feature Toshiba’s latest 64-layer, 3D TLC (3-bit-per-cell) flash memory BiCS
FLASH™. This new line of NVMe™ based client SSDs deliver high performance up to 3000
MB/s of sequential read and 2100 MB/s of sequential write with a maximum interface
bandwidth of 32 GT/s. XG5 series SSDs also feature an SLC cache to accelerate burst type
workloads, as well as improved power consumption comparing to prior generation XG3,
making these SSDs an efficient option for high performance mobile computing.
XG5 Series SSDs are available in 256GB, 512GB and 1024GB capacities in compact single-
sided M.2 2280 form factors.
Self-encrypting drive (SED) models supporting TCG Opal Version 2.01 are also offered,
making the new series highly suited to address data security needs for commercial PCs or
other business applications.
Product image may represent a design model
SPECIFICATIONS
2 / 13
Copyright © 2017 Toshiba Memory Corporation. All rights reserved.
Client SSD XG5 Series Brochure Rev.1.00
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
Note: 1) Definition of capacity: Toshiba defines a megabyte (MB) as 1,000,000 bytes, a gigabyte (GB) as 1,000,000,000 bytes
and a terabyte (TB) as 1,000,000,000,000 bytes. A computer operating system, however, reports storage capacity using
powers of 2 for the definition of 1GB = 230 = 1,073,741,824 bytes and therefore shows less storage capacity. Available
storage capacity (including examples of various media files) will vary based on file size, formatting, settings, software
and operating system, such as Microsoft Operating System and/or pre-installed software applications, or media
content. Actual formatted capacity may vary.
2) 1 MiB (mebibyte) = 220 bytes = 1,048,576 bytes, and 1 MB (megabyte) = 1,000,000 bytes.
3) MTTF (Mean Time to Failure) is not a guarantee or estimate of product life; it is a statistical value related to mean
failure rates for a large number of products which may not accurately reflect actual operation. Actual operating life of the
product may be different from the MTTF.
* PCIe® and PCI Express® are registered trademarks of PCI-SIG
* NVMeTM and NVM ExpressTM are trademarks of NVM Express, Inc.
* Product image may represent a design model.
* Read and write speed may vary depending on the host device, read and write conditions, and file size.
Standard Models
M.2 2280-S2
(Single-sided)
Temperature
Operating
0 to 95 °C (Controller Temperature)
0 to 85 °C (Other Components Temperature)
Non-
operating
-40 to 85 °C
Reliability3)
Mean Time to Failure (MTTF): 1,500,000 hours
Product Life: Approximately 5 years
More Features
• Device Self-test is supported.
• Host Controlled Thermal Management (HCTM) is supported.
• Strong & highly-efficient ECC named QSBCTM is supported.
• TCG Pyrite Version 1.00 is supported.
• Storage Interface Interactions Specification(SIIS) Version 1.06 is supported.
Compliance
UL, cUL, TÜV, KC, FCC, BSMI, CE, RCM, IC, VCCI
3 / 13
Copyright © 2017 Toshiba Memory Corporation. All rights reserved.
Client SSD XG5 Series Brochure Rev.1.00
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
ORDERING INFORMATION
/
K
XX
X
X
X
X
X
XXXX
1
2
3
4
5
6
7
8
1. Product Name K: SSD product
2. Prodct Category XG: XG Series
3. Development Generation 5: Generation 5
4. Option Code 1 0: Non-SED
A: SED
5. Option Code 2 Z: No-option
6. Connector Type N: M.2 M (PCI Express® I/F)
7. Form Factor V: M.2 2280 Single Sided/M.2 M type
8. Capacity 128G / 256G / 512G /1T02
128G is 128 GB, 256G is 256 GB, 512G is 512 GB and 1T02 is 1024 GB
(1 GB = 1,000,000,000 bytes)
4 / 13
Copyright © 2017 Toshiba Memory Corporation. All rights reserved.
Client SSD XG5 Series Brochure Rev.1.00
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
Note: 1) Single Sided
2) Availability of the SED model line-up may vary by region.
Note: 1 GB (Gigabyte) = 1,000,000,000 bytes
Model Number
Formatted
Capacity
Form Factor/Connect Type
Function
Note
KXG50ZNV256G
256 GB
M.2 2280-S2 1)-M module
Non- SED
KXG50ZNV512G
512 GB
KXG50ZNV1T02
1,024 GB
KXG5AZNV256G
256 GB
SED2)
KXG5AZNV512G
512 GB
KXG5AZNV1T02
1,024 GB
Capacity
Total Number of User Addressable Sectors in LBA Mode
512 bytes sector
4,096 bytes sector
256 GB
500,118,192
62,514,774
512 GB
1,000,215,216
125,026,902
1,024 GB
2,000,409,264
250,051,158
PRODUCT LINE UP
CAPACITY
5 / 13
Copyright © 2017 Toshiba Memory Corporation. All rights reserved.
Client SSD XG5 Series Brochure Rev.1.00
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
Note: 1) Under the condition of measurement with 128 KiB unit sequential access (1 KiB = 1024 bytes) and queue depth is 64.
2) Under the condition of measurement with 128 KiB unit sequential access with 4KiB (1 KiB = 1024 bytes) align and
queue depth is 64.
3) SLC cache is effective.
4) After unexpected power down, it may increase up to 10 s.
Standard Models
M.2 2280 Module
Allowable voltage
3.3 V ±5 %
Allowable noise/ripple
100 mV p-p or less, 0-10 MHz
Allowable supply rise time
2 –100 ms
Note: The drive has over current protection circuit. (Rated current: 3.15A)
Note: 1) Ambient Temperature
2) The values are specified at the condition causing maximum power consumption and Power State 0.
3) PCIe Link state is L1.2. Power consumption during the Admin command processing is excluded.
Standard Models
KXG50ZNV256G
KXG5AZNV256G
KXG50ZNV512G
KXG5AZNV512G
KXG50ZNV1T02
KXG5AZNV1T02
Interface Speed
32 GT/s (Gen3x4 Lane), 20 GT/s (Gen2x4 Lane),
16 GT/s (Gen3x2 Lane), 10 GT/s (Gen2x2 Lane)
@32GT/s
Sequential Read1)
(Up to)
2,700 MB/s
{2,580 MiB/s}
3,000 MB/s
{2,900 MiB/s}
3,000 MB/s
{2,900 MiB/s}
Sequential Write2)3)
(Up to)
1,050 MB/s
{1,000 MiB/s}
1,050 MB/s
{1,000 MiB/s}
2,100 MB/s
{2,000 MiB/s}
Time from Power-on to
process the Admin
Commands4)
100 ms typ.
Time from Power-on to
process the I/O
Commnads4)
100 ms typ.
Operation
(Ta 1)=25°C)
M.2 2280 Module
KXG50ZNV256G
KXG5AZNV256G
KXG50ZNV512G
KXG5AZNV512G
KXG50ZNV1T02
KXG5AZNV1T02
Read2)
4.0 W typ.
4.3 W typ.
4.5 W typ.
Write2)
2.6 W typ.
2.6 W typ.
3.4 W typ.
Power State 33)
50.0 mW typ.
50.0 mW typ.
50.0 mW typ.
Power State 43)
5.0 mW typ.
5.0 mW typ.
5.0 mW typ.
Power State 53)
3.0 mW typ.
3.0 mW typ.
3.0 mW typ.
PERFORMANCE
SUPPLY VOLTAGE
POWER CONSUMPTION
6 / 13
Copyright © 2017 Toshiba Memory Corporation. All rights reserved.
Client SSD XG5 Series Brochure Rev.1.00
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
ENVIRONMENTAL CONDITIONS
Note: 1) Ta: Ambient Temperature, Tc: Components Temperature
2) Packaged in Toshiba’s original shipping package
Note: 1) Packaged in Toshiba’s original shipping package
Condition
Range
Operating
14.709 km/s2 {1,500 G}, 0.5 ms half sine wave
Non-operating
Condition
Range
Gradient
Operating1)
0°C (Tc) – 95°C (Tc) (Controller Temperature)
0°C (Tc) – 95°C (Tc) (Other Components Temperature)
30 °C (Ta) / h maximum
Non-operating
-40 °C – 85 °C
30 °C / h maximum
Under Shipment2)
-40 °C – 85 °C
30 °C / h maximum
Condition
Range
Operating
8 % – 90 % R.H. (No condensation)
Non-operating
8 % – 95 % R.H. (No condensation)
Under Shipment1)
5 % – 95 % R.H.
Max. wet bulb
32.5 °C (Operating)
40.0 °C (Non-operating / Shipping)
Condition
Range
Operating
196 m/s2 {20 G} Peak, 10 - 2,000 Hz
(20 minutes per axis) x 3 axis
Non-operating
TEMPERATURE
HUMIDITY
SHOCK
STANDARDS
VIBRATION
STANDARDS
7 / 13
Copyright © 2017 Toshiba Memory Corporation. All rights reserved.
Client SSD XG5 Series Brochure Rev.1.00
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
COMPLIANCE
Note: 1) UL certification is basically on a voluntary basis.
Title
Description
Region
UL
(Underwriters Laboratories)
UL 60950-1
USA1)
cUL
(Underwriters Laboratories of Canada)
CSA-C22.2 No.60950-1-07
Canada
TÜV
(Technischer Überwachungs Verein)
EN 60950-1
EURO
KC
KN32, KN35
Korea
FCC
FCC part 15 Subpart B
USA
BSMI
(Bureau of Standards, Metrology and Inspection)
CNS13438 (CISPR Pub. 22)
Taiwan
CE
EN 55032, EN 55024
EURO
RCM
AS/NZS CISPR 32
Australia, New Zealand
ISED
ICES-003
Canada
VCCI
VCCI-CISPR32
Japan
Parameter
Value
Mean Time to Failure
1,500,000 hours
Product Life
Approximately 5 years
SAFETY / EMI STANDARDS
RELIABILITY
8 / 13
Copyright © 2017 Toshiba Memory Corporation. All rights reserved.
Client SSD XG5 Series Brochure Rev.1.00
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
MECHANICAL SPECIFICATIONS
Unit:mm
Figure 1: Dimension of KXG5xZNVxxxx (M.2 2280-S2 Module)
Model Number
Weight
Width
Height
Length
KXG50ZNV256G
KXG5AZNV256G
7.0 g typ.
22.00 mm
2.23 mm
80.00 mm
KXG50ZNV512G
KXG5AZNV512G
7.3 g typ.
KXG50ZNV1T02
KXG5AZNV1T02
7.3 g typ.
M.2 2280 MODULE
9 / 13
Copyright © 2017 Toshiba Memory Corporation. All rights reserved.
Client SSD XG5 Series Brochure Rev.1.00
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
M.2 2280 MODULE INTERFACE CONNECTOR
INTERFACE CONNECTOR
Unit:mm
Figure 2: Interface Dimensions of KXG5xZNVxxxx (M.2 2280 Module)
10 / 13
Copyright © 2017 Toshiba Memory Corporation. All rights reserved.
Client SSD XG5 Series Brochure Rev.1.00
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
PIN ASSIGNMENT ON M.2 2280 MODULE CONNECTOR
Pin #
Name
Description
Pin #
Name
Description
1
GND
GND
2
+3.3V
3.3 V Source
3
GND
GND
4
+3.3V
3.3 V Source
5
PETn3
PCIe Lane 3
Device Transmitter
6
Reserved
NC
7
PETp3
8
Reserved
NC
9
GND
GND
10
LED1#
Device Activity
11
PERn3
PCIe Lane 3
Device Receiver
12
+3.3V
3.3 V Source
13
PERp3
14
+3.3V
3.3 V Source
15
GND
GND
16
+3.3V
3.3 V Source
17
PETn2
PCIe Lane 2
Device Transmitter
18
+3.3V
3.3 V Source
19
PETp2
20
Reserved
NC
21
GND
GND
22
Reserved
NC
23
PERn2
PCIe Lane 2
Device Receiver
24
Reserved
NC
25
PERp2
26
Reserved
NC
27
GND
GND
28
Reserved
NC
29
PETn1
PCIe Lane 1
Device Transmitter
30
Reserved
NC
31
PETp1
32
Reserved
NC
33
GND
GND
34
Reserved
NC
35
PERn1
PCIe Lane 1
Device Receiver
36
Reserved
NC
37
PERp1
38
Reserved
NC
39
GND
GND
40
Reserved
NC
41
PETn0
PCIe Lane 0
Device Transmitter
42
Reserved
NC
43
PETp0
44
Reserved
NC
45
GND
GND
46
Reserved
NC
47
PERn0
PCIe Lane 0
Device Receiver
48
Reserved
NC
49
PERp0
50
PERST# 1)
PE-Reset
51
GND
GND
52
CLKREQ#
Clock Request
53
REFCLKn
PCIe Reference Clock
54
PEWAKE#
NC
55
REFCLKp
PCIe Reference Clock
56
MFG1
Manufacturing pin. Must be no-
connect on the host board.
57
GND
GND
58
MFG2
Notch
Notch
67
Reserved
NC
68
SUSCLK
NC
69
PEDET
NC-PCIe
70
+3.3V
3.3 V Source
71
GND
GND
72
+3.3V
3.3 V Source
73
GND
GND
74
+3.3V
3.3 V Source
75
GND
GND
Note: 1) The drive can’t detect PERST# in L1.2.
11 / 13
Copyright © 2017 Toshiba Memory Corporation. All rights reserved.
Client SSD XG5 Series Brochure Rev.1.00
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
COMMAND TABLE
ADMIN Command set
Op-Code
Command Name
00h
Delete I/O Submission Queue
01h
Create I/O Submission Queue
02h
Get Log Page
04h
Delete I/O Completion Queue
05h
Create I/O Completion Queue
06h
Identify
08h
Abort
09h
Set Features
0Ah
Get Features
0Ch
Asynchronous Event Request
10h
Firmware Commit
11h
Firmware Image Download
14h
Device Self-Test (DST)
80h
Format NVM
81h
Security Send
82h
Security Receive
Set Features / Get Features Set
Op-Code
Feature Name
01h
Arbitration
02h
Power Management
03h
LBA Range Type
04h
Temperature Threshold
05h
Error Recovery
06h
Volatile Write Cache
07h
Number of Queues
08h
Interrupt Coalescing
09h
Interrupt Vector Configuration
0Ah
Write Atomicity Normal
0Bh
Asynchronous Event Configuration
0Ch
Autonomous Power State Transition
0Eh
Time Stamp
10h
Host Controlled Thermal Management (HCTM)
80h
Software Progress Marker
12 / 13
Copyright © 2017 Toshiba Memory Corporation. All rights reserved.
Client SSD XG5 Series Brochure Rev.1.00
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
NVM Command Set
Op-Code
Command Name
00h
Flush
01h
Write
02h
Read
04h
Write Uncorrectable
05h
Compare
08h
Write Zeroes
09h
Dataset Management
13 / 13
Copyright © 2017 Toshiba Memory Corporation. All rights reserved.
Client SSD XG5 Series Brochure Rev.1.00
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
RESTRICTIONS ON PRODUCT USE
Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in this
document, and related hardware, software and systems (collectively "Product") without notice.
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written
permission, reproduction is permissible only if reproduction is without alteration/omission.
Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for
complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize
risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including
data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own
applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without
limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the
"TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for.
Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the
appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information
contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c)
validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT
DESIGN OR APPLICATIONS.
PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE EXTRAORDINARILY
HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY CAUSE LOSS OF HUMAN
LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT ("UNINTENDED USE"). Except for specific
applications as expressly stated in this document, Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment
used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling
equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and
equipment used in finance-related fields. IF YOU USE PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR
PRODUCT. For details, please contact your TOSHIBA sales representative.
Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable
laws or regulations.
The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement
of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property
right is granted by this document, whether express or implied, by estoppel or otherwise.
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR
PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING
WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT
LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS
ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION,
INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF
INFORMATION, OR NONINFRINGEMENT.
Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the
design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass
destruction weapons). Product and related software and technology may be controlled under the applicable export laws and regulations
including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and
re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please
use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without
limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF
NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.