Toshiba SG5 User Manual
Displayed below is the user manual for SG5 by Toshiba which is a product in the Internal Solid State Drives category. This manual has pages.
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1 / 20
Copyright © 2016 Toshiba Corporation. All Rights Reserved.
Client SSD SG5 Series Brochure Rev.1.00
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
SSD
SPECIFICATIONS
Refer to the notes on the next page
Standar d Models 2.5-inch M.2 2280-S2
(Single-sided)
M.2 2280-D2
(Double-Sided)
Memory
TOS HIBA TLC NAND F lash M emory
Interface
SATA revision 3.2
Maximum Speed
6 Gbit/s, 3 Gbit/s, 1.5 Gbit/s
Connector Type
Standard SATA
M.2 B-M
Formatted Cap ac ity
1)
128/256/ 512/ 1024 GB
128/256/ 512 GB
1024 GB
Command
ACS-3
Performance
1),2)
Sequent ial
Read
up to 545 MB/s {520 MiB/s}
Sequent ial
Write
up to 387 MB/s {370 MiB/s}
Sector Siz e
Advanced Format: 4K physical sectors with 512 by te emulation (512e)
Supply Vo ltage
5.0 V ±5 %
3.3 V ±5 %
Power Consumption
Active: 5.6 W typ.
Idle: 70 mW typ.
Active: 4.0 W typ.
Idle: 65 mW typ.
Active: 5.5 W typ.
Idle: 65 mW typ.
Temperature
Operatin g: 0 ° C - 70 °C
(case te mper ature)
Non-operating: -40 °C - 85 °C
Operatin g: 0 ° C - 80 °C
(component s t emperature)
Non-operating: -40 °C - 85 °C
Reliability3)
Mean Time to Failure (MT TF) : 1, 500, 000 hours
Product Li fe: Ap pr oximate ly 5 years
Size
100.0 mm x 69.85 mm
x 7.0 mm
80.0 mm x 22. 0 m m
x 2.23 mm
80.0 mm x 22.0 mm
x 3.58 mm
Weight
48
–
51 g ty p.
7 g typ.
8.7 g ty p.
More Feat ur es
Toshiba's propriet ary error-correct ion technology, QSBC support.
Read only mod e supporte d for emergency .
Compliance
UL/cUL, TÜV, KC, FCC, BSMI, CE, RCM, ISED, VCCI
SG5 SERIES
CLIENT SSD
SG5 series are Client SSDs using Toshiba TLC NAND flash memory.
Delivering a storage capacity up to 1,024GB and a 6.0 Gbit/s SATA interface, the SG5 SSDs
are engineered for desktop and notebook PCs.
Further features of the series include QSBC ECC technology from Toshiba for error
correction and reliability.
The versatile SG5 SSD family is also available in thin, space saving M.2 2280 form factor
and standard 2.5-inch type case.
Product image may represent a design model
APPLICATIONS
• Desktop PCs
• Notebook PCs
KEY FEATURES
• Capacities up to 1024GB
• 3-bit-per-cell NAND Flash Memory
• SATA 6.0 Gbit/s interface
• 2.5-inch and M.2 2280 form factor options
• Toshiba Proprietary Quadruple Swing-By Code
(QSBC) ECC
2 / 20
Copyright © 2016 Toshiba Corporation. All Rights Reserved.
Client SSD SG5 Series Brochure Rev.1.00
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
1) Definiti on of capacit y: Toshiba defines a megabyte (MB) as 1, 000,000 by t es, a gigabyte ( G B) as 1, 000, 000,000
bytes and a t er abyte (TB) as 1,000,000,000,000 byt es. A co mputer operating syst em, how ever, repor t s
storage ca pacity using p owers of 2 for the definiti on of 1GB = 230 = 1, 073, 741,824 by t es and t her efore
shows less storage capacity . Available storage capacity (including examples of various media files) wi ll vary
based on file size, form at t ing, s et t ings, software and operating system, such as M icrosoft Operating System
and/or pre-installed software applications, or m edia content . Actual for m atted capacity may vary.
2) A kibibyt e ( Ki B) means 210, or 1, 024 bytes, a mebibyt e ( M iB) means 220, or 1,048,576 byt es, and a gibibyte
(GiB) means 230, or 1,073,471,824 byt es.
3) MTTF (M ean Time to Failur e) is not a guarantee or es t i mate of product li f e; it is a statistic al v alue rela t ed t o
mean failure rates for a large numb er of products which may not accurately reflect actual operat ion. Actual
operating l i fe o f t he pr oduct may be different from the MTT F.
* Product im age may r epr esent a design mod el.
* Read and writ e speed may vary depending on the host device, rea d and w r ite conditio ns , and file size.
3 / 20
Copyright © 2016 Toshiba Corporation. All Rights Reserved.
Client SSD SG5 Series Brochure Rev.1.00
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
ORDE RING IN FORMATION
THN
SX
X
XXXX
X
X
X
1
2
3
4
5
6
7
1. Model Name THN: T osh ib a NAND drive
2. Model Ty pe SN: No n-SED
3. Contro ller Type K: Type K
4. Capacity 128G / 256G / 512G / 1T02
128G is 128 GB, 256G is 256 G B, 512G is 512 G B and 1T02 is 1024 GB
(1 GB = 1,000, 000, 000 byt es)
5. Form Fac t or C: 2.5-inch (7.0 m m he igh t)
V: M.2 2280-S2 Mod ule type (Single Side)
D: M.2 2280-D2 Module type (Double Side)
6. Host I/F Type S: Standard SATA, N: M.2 B-M S ATA type
7. NAND Typ e 8: TLC
4 / 20
Copyright © 2016 Toshiba Corporation. All Rights Reserved.
Client SSD SG5 Series Brochure Rev.1.00
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
PRODUCT LINE UP
CAPACITY
PERFORMANCE
1) Single S ide, 2) Double Si de
Note: 1 GB (Gigabyte) = 1, 000, 000,000 by t es , Bytes per sect or : 512 bytes
1) Under the condition o f measurement with 128 KiB unit seque nt ial access (1 KiB = 1024 by t es)
Model Number Formatted
Capacity Interface
Function
Note
THNSNK128GCS8
128 GB
2.5-inch
Specificat ion Revisi on
Non-SED
THNSNK256GCS8
256 GB
THNSNK512GCS8
512 GB
THNSNK1T02CS8
1024GB
THNSNK128GVN8
128 GB
M.2 Type 2280-S21)-B-M module
THNSNK256GVN8
256 GB
THNSNK512GVN8
512 GB
THNSNK1T02DN8
1024GB
M.2 Type 2280-D2
2)
-B-M module
Capacity Total N umber of User Addres sable S e ctors i n LBA Mod e
128 GB 250,069,680
256 GB 500,118,192
512 GB 1,000,215,216
1024 GB 2,000,409,264
THNSNK128GCS8
THNSNK128GVN8
THNSNK256GCS8
THNSNK256GVN8
THNSNK512GVN8
THNSNK512GCS8
THNSNK1T02CS8
THNSNK1T02DN8
Interfac e Spe ed 6 Gbit/s max.
Sequent ial Read1) up to 545 MB/s {520 MiB/s}
Sequent ial Write1) up to 136 MB/s
{130 MiB/s} up to 262 MB/s
{250 MiB/s} up to 387 MB/s
{370 MiB/s}
5 / 20
Copyright © 2016 Toshiba Corporation. All Rights Reserved.
Client SSD SG5 Series Brochure Rev.1.00
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
SUPPLY VOLT AGE
POWER CONSUMPTION
2.5-inch M.2 2280 Mod ule
Allowable v olt age 5.0 V ±5 % 3.3 V ±5 %
Allowable n oi s e/ r ip ple 100 mV p-p or less
Allowable s upply rise ti me 2 –100 ms
Note: These drives have over current pr ot ection circuit . ( Rated current: 3.15A)
Operation
(Ta 1)=25°C) 2.5-inch
THNSNK128GCS8 THNSNK256GCS8 THNSNK512GCS8 THNSNK1T02CS8
Read2) 2.5 W typ. 2.5 W typ. 2.6 W typ. 2.7 W typ.
Write2) 2.8 W typ. 4.3 W typ. 5.5 W typ. 5.6 W typ.
Idle3) 4) 65 m W typ. 65 mW typ. 65 mW typ. 70 mW typ.
Standby3) 4) 60 mW typ. 60 mW typ. 65 mW typ. 70 mW typ.
Sleep3) 60 mW typ. 60 mW typ. 65 mW ty p. 70 mW typ.
DevSleep 6 mW max. 6 mW max. 6 mW max. 6 mW max.
1) Ambient Temperature
2) The values ar e s pecifie d at t he condition caus ing maximum power consumption.
3) The values are based o n using SATA power management feat ur es . The Slum ber mode is used for the
power con sumption meas ure ments.
4) The driv e may int ernally write t o NAND flash memory, while the dr ive is in idle or standby. Therefore,
drive power consumpt ion may te mpora lly change up t o w r ite power.
Operation
(Ta 1)=25°C) M.2 2280 Module
THNSNK128GVN8 THNSNK256GVN8 THNSNK512GVN8 THNSNK1T02DN8
Read2) 2.3 W typ. 2.4 W typ. 2.5 W typ. 2.5 W typ.
Write2) 2.7 W typ. 3.8 W typ. 4.0 W typ. 5.5 W typ.
Idle3) 4) 65 m W typ. 65 mW typ. 65 mW typ. 65 mW typ.
Standby3) 4) 60 mW typ. 60 mW typ. 60 mW typ. 60 mW typ.
Sleep3) 60 mW ty p. 60 mW ty p. 60 mW typ. 60 mW typ.
DevSleep 5 mW max. 5 m W max. 5 mW max. 5 m W max.
6 / 20
Copyright © 2016 Toshiba Corporation. All Rights Reserved.
Client SSD SG5 Series Brochure Rev.1.00
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
TEMPERATURE
HUMIDITY
SHOCK
VIBRATION
ENVIRONMENTAL CONDITIONS
Condition Range Gradient
2.5-inch M.2 2280 Mod ule
Operating 1) 0 °C (Tc) – 70 °C (Tc) 0°C (Tc) – 80°C (Tc) 30 °C (T a) / h maximum
Non-operating -40 °C – 85 °C 30 °C / h maximum
Under Ship m ent 2) -40 °C – 85 °C 30 °C / h maximum
1) Ta: Ambient Temperat ure, Tc: Case or Compon ents Temperature
2) Package d in T oshiba’s or iginal shipp in g package
Condition Range
Operating 8 % – 90 % R.H. (N o c ondensation)
Non-operating 8 % – 95 % R.H. ( N o c ondensation)
Under Ship m ent
1)
5 % – 95 % R.H.
1) Package d in T oshiba’s or iginal sh ipp ing package
Condition Range
Operating 14.709 km/s2 {1500 G} , 0.5 ms, ha lf sine wav e
Non-operating
Under Ship m ent 1) 100 cm free drop
1) Apply shocks in each direction o f t he drive’s three mutual ly per pendicular axes, one axis at a t ime.
Packaged in Toshiba’ s or iginal ship pin g package.
Condition Range
Operating 196 m/s2 {20 G} Peak, 10 - 2,000 Hz
(20 minutes per axis) x 3 axis
Non-operating
7 / 20
Copyright © 2016 Toshiba Corporation. All Rights Reserved.
Client SSD SG5 Series Brochure Rev.1.00
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
SAFETY / EMI STANDARDS
RELIABILITY
COMPLIANCE
Parameter Value
Mean Time to Failure 1,500,000 hours
Product Li fe Approxim ately 5 year s
Title Description Region
UL
(Underwriters Laboratories)
UL 60950-1 USA
cUL
(Underwr it er s Laboratories of Cana da)
CSA-C22.2 No.60950 -1 Canada
TÜV
(Techn ischer Überw achungs Verein)
EN 60950-1 EURO
KC
KN22, KN24
Korea
FCC
FCC part 15 Subpart B
USA
BSMI
(Bureau of Standards, Metrology and Inspection)
CNS13438( CI SPR Pub. 22) Taiwan
CE
EN 55022, EN 55024
EURO
RCM AS/NZS CISPR Pub . 22
Australia,
New Zealand
ISED
ICES-003
Canada
VCCI
Class B
Japan
8 / 20
Copyright © 2016 Toshiba Corporation. All Rights Reserved.
Client SSD SG5 Series Brochure Rev.1.00
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
2.5-INCH
MECHANICA L SPECIFICATIONS
Figure 1: 2.5-inch Drive Dimension
Model Weight Width Height Length
7.0 mm
THNSNK128GCS8 48 g typ.
69.85 mm 7.0 m m 100. 0 mm
THNSNK256GCS8 50 g typ.
THNSNK512GCS8 51 g typ.
THNSNK1T02CS8
9 / 20
Copyright © 2016 Toshiba Corporation. All Rights Reserved.
Client SSD SG5 Series Brochure Rev.1.00
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
2.5-INCH DIMENSIONS
Dimension
SFF-8200 Rev3.2 1)
SFF-8201 Rev3.3
SFF-8223 Rev2.5
Toshiba SG5 SSD
(Differences only)
Millimeters
Inches
Millimeters
Inches
A1
7.00
0.276
A2
0.20
0.008
A3
0.50
0.020
A4
69.85
2.750
A5
0.25
0.010
A6 2)
100.45 *
3.955 *
100.00 ± 0.41
3.937 ± 0.016
A7
3.5
0.138
A8
9.40
0.370
9.40 ± 0.51
0.370 ± 0.020
A10 3)
-
-
30.125 ± 0.28
1.186 ± 0.011
A12
0.38
0.015
A23
3.00
0.118
3.00 ± 0.20
0.118 ± 0.007
A26
M3
N/A
A28
4.07
0.160
4.07 + 0.295/ -0.305
0.060 +0.011/-0.012
A29
61.72
2.430
61.72 ± 0.25
2.430 ± 0.010
A32
M3
N/A
A38
3 #
3 #
A41
2.5 #
2.5 #
A50 2) 14.00 0.551 14.00 ± 0.25 0.551 ± 0. 010
A51
2)
90.60
3.567
90.60 ± 0.30
3.567 ± 0.012
A52 2)
14.00
0.551
14.00 ± 0.25
0.551 ± 0.010
A53 2)
90.60
3.567
90.60 ± 0.30
3.567 ± 0.012
* = maximum
# = minimum number of th r eads
1) SFF-8200: Small Form Factor Standar d
2) PCB, Connector not included
3) Connector c enter de fined is the sam e as SFF-8223
10 / 20
Copyright © 2016 Toshiba Corporation. All Rights Reserved.
Client SSD SG5 Series Brochure Rev.1.00
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
M.2 2280 MODULE
Figure 2: M.2 2280-S2 M odul e Dime nsio n
Unit:mm
Model Weight Width Height Length
THNSNK128GVN8
7.0 g ty p. 22.0 m m 2.23 mm 80.0 mm
THNSNK256GVN8
THNSNK512GVN8
THNSNK1T02DN8 8.7 g typ. 3.58 mm
11 / 20
Copyright © 2016 Toshiba Corporation. All Rights Reserved.
Client SSD SG5 Series Brochure Rev.1.00
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
Figure 3: M.2 2280-D2 Module Dimension
Unit:mm
12 / 20
Copyright © 2016 Toshiba Corporation. All Rights Reserved.
Client SSD SG5 Series Brochure Rev.1.00
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
2.5-inch Case Serial ATA Interface Connector
INT ERFACE CONNECTO R
Figur e 4 : 2.5-inch Case Ser i al ATA Interface C on nector
Unit:mm
13 / 20
Copyright © 2016 Toshiba Corporation. All Rights Reserved.
Client SSD SG5 Series Brochure Rev.1.00
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
2.5-INCH DRIVE CONNECTER PIN ASSIGNM ENT1)
Segment Pin
Position Name Description
Signal
Segment
S1
GND
2nd Mate
S2
A+
Diffe r ent ial Sig nal P air A ( De vic e Rx ), 3rd Mate
S3
A-
S4
GND
2nd Mate
S5
B-
Diffe r ent ial Sig nal P air B ( De vic e T x ), 3rd Mate
S6
B+
S7
GND
2nd Mate
Signal seg m ent “ L”
Central co nnect or polariz er
Power segment “L”
Power
Segment
P1
Retired
2)
P2
Retired 2)
P3
DEVSLP 2)
Enter/Ex it DevSleep
P4
GND
1st Mate
P5
GND
2nd Mate
P6
GND
2
nd
Mate
P7
V5
5 V power, pre-charge 3), 2nd Mate
P8
V5
5 V power, 3rd Mate
P9
V5
5 V power, 3rd Mate
P10
GND
2nd Mate
P11
DAS/DSS
Driv e Ac tivity Sig n al / Disable Stagg er ed Spin-up, 3rd Mate
P12
GND
1st Mate
P13
V12
12 V power, pre-charg e, 2nd Mate (Unused)
P14
V12
12 V power ( Unu sed) , 3rd Mate
P15
V12
12 V power ( Unu sed) , 3rd Mate
Power segment key
1) The Mate orders are for backplane usage. Hot-Plug and OS-Aware Hot Removal are supported when using
with a backplane conne ct or .
2) Previous ly, 3.3 V was assigned to p ins P1, P2 an d P3 by Serial AT A I nt er national Or ganizatio n.
3) Direct connect to non pre-charge pin s.
U1
N.C.
Not connected
U2
TX
For test use, Not connect ed
U3
UX
For test use, Not connect ed
U4
GND
14 / 20
Copyright © 2016 Toshiba Corporation. All Rights Reserved.
Client SSD SG5 Series Brochure Rev.1.00
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
M.2 2280 MODULE INTERFACE CONNECTOR
Figure 5: M.2 2280 Mod ule Inter face Connect or
Unit:mm
15 / 20
Copyright © 2016 Toshiba Corporation. All Rights Reserved.
Client SSD SG5 Series Brochure Rev.1.00
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
PIN ASSIGNMENT ON M.2 2280 MODULE CONNEC TO R
Pin
# Name Description Pin
# Name Description
1 CONFIG_3 Defines module type(GND) 2 +3.3V 3.3 V So ur ce
3 GND GND 4 +3.3V 3.3 V Source
5 Reserved NC 6 Reserved NC
7 Reserved NC 8 Reserved NC
9 Reserved NC 10 DAS/DSS Drive Activity Sig n al /
Disable St aggered Spi n-up
11
Reserved
NC
Notch
Notch
20
Reserved
NC
21
CONFIG_0
Defines modu le type(GND)
22
Reserved
NC
23
Reserved
NC
24
Reserved
NC
25
Reserved
NC
26
Reserved
NC
27
GND
GND
28
Reserved
NC
29
Reserved
NC
30
Reserved
NC
31
Reserved
NC
32
Reserved
NC
33 GND GND 34 Reserved NC
35 Reserved NC 36 Reserved NC
37 Reserved NC 38 DEVSLP DEVSLP signal
39 GND GND 40 Reserved NC
41 B+ Host Receiv er Different ial
Signal Pair 42 Reserved NC
43
B-
44
Reserved
NC
45 GND GND 46 Reserved NC
47 A- Host Transmitter
Differential Signal Pair 48 Reserved NC
49
A+
50
Reserved
NC
51 GND GND 52 Reserved NC
53 Reserved NC 54 Reserved NC
55 Reserved NC 56 MFG1 Manufacturing pin. Must be a
no-connect on t he host boar d.
57
GND
GND
58
MFG2
Notch Notch
67
Reserved
NC
68
Reserved
NC
69 CONGIG_1 Defines modu le type(GND) 70 +3.3V 3.3 V Source
71 GND GND 72 +3.3V 3.3 V Sour ce
73 GND GND 74 +3.3V 3.3 V Sour ce
75 CONGIG_2 Defines modu le type(GND)
16 / 20
Copyright © 2016 Toshiba Corporation. All Rights Reserved.
Client SSD SG5 Series Brochure Rev.1.00
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
COMM AND TABLE
ADMIN Com m and set
Op-Code Command Name
00h
NOP
06h
DATA SET MA NAGEMENT
10h
RECALIBRATE
20h
READ SECTOR(S)
21h
REA D SECTOR(S) without ret ries
24h
READ SECTOR(S) EXT
25h
REA D DMA EXT
27h
READ NATIVE MAX ADDRESS EXT
29h
READ MULTIPLE EXT
2Fh
READ LOG EXT
30h
WRITE SECTOR(S)
31h
WRITE SECTOR( S) w it hout retr ies
34h
WRITE SECTOR(S) EXT
35h
WRIT E DMA EX T
37h
SET MAX ADDRESS EXT
39h
WRIT E MUL TIPLE EXT
3Dh
WRIT E DMA FU A EXT
3Fh
WRITE LOG EXT
40h
READ VERIFY SECTOR(S)
41h
READ VERIFY SECTOR(S) without retries
42h
READ VERIFY SECTOR(S) EXT
45h
WRITE UNCORRECTABLE EXT
45h
55h
Create a pseudo-uncor r ectable error w ith logging
45h
AAh
Create a flagged err or w ithout loggi ng
47h
REA D L OG DMA EXT
57h
WRIT E L O G DMA EXT
5Bh
TRUSTED NON-DATA
5Ch
TRUSTED RECEIVE
5Dh
TRUST E D RE CEI VE DM A
5Eh
TRUSTED SEND
5Fh
TRU ST ED SE ND DMA
60h
READ FPDMA QUEUED
61h
WRITE FPDMA QUEUED
17 / 20
Copyright © 2016 Toshiba Corporation. All Rights Reserved.
Client SSD SG5 Series Brochure Rev.1.00
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
Op-Code Feature Name
70h
SEEK
90h
EXE CUTE DE VICE DIAG NO STIC
91h
INITI ALI ZE DE VI CE PA R AME T ER S
92h
DOWNLO AD MICROCODE
92h
03h
Download with offsets and sav e micr oc ode for im me diate and future use
92h
07h
Download and save micr ocode for im m edi ate and fut ur e use
92h
0Eb
Download with offset s and save microcode f or futur e use
92h
0Fb
Activate down loaded m icrocod e
93h
DO WNLO A D MI CRO CO DE DMA
93h
03h
Download with offsets and sav e micr oc ode for im me diate and future use
93h
07h
Download and save micr ocode for im m edi ate and fut ur e use
93h
0Eb
Download with offsets and sav e micr oc ode for future use
93h
0Fb
Activate down loaded m icrocod e
B0h
SMART
B0h
D0h
SMART READ DATA
B0h
D1h
SMART READ ATTRIBUTE THRESHOLDS
B0h
D2h
SMART ENABLE/DISABLE ATTRIBUTE AUTOSAVE
B0h
D3h
SMART SAVE ATTRIBUTE VALUES
B0h
D4h
SMART EXECUTE OFF-LINE IMMEDIATE
B0h
D4h
00h
Execute SMART off-line routin e in off-line mode
B0h
D4h
01h
Execute SMART Short self-test r out in e in off-line mode
B0h
D4h
02h
Execute SMART Extended sel f-t est routine in o f f-line mode
B0h
D4h
04h
Execute SMART Selective self-test rout in e in off-line mode
B0h
D4h
7Fh
Abort off-line mode self-test routine
B0h
D4h
81h
Execute SMART Short self-test r out in e in captive mode
B0h
D4h
82h
Execute SMART Extended sel f-t est routine in c aptive mode
B0h
D4h
84h
Execute SMART Selective self-test rout in e in captive mode
B0h
D5h
SMART READ LOG
B0h
D6h
SMAR T WRITE LOG
B0h
D8h
SMART ENABLE OPERATIONS
B0h
D9h
SMART DISABLE OPER ATIO NS
B0h
DAh
SMART RETURN STATUS
B0h
DBh
SMART ENABLE/DISABLE AUTOMATIC OFF-LINE
B1h
DEVICE CONFIGURATION OVERLAY
B1h
C0h
DEVI CE CO N FI GU R ATION RE STO RE
B1h
C1h
DEVICE CONFI GUR AT IO N FREEZE LOCK
B1h
C2h
DEVICE CONFIGURATION IDENTIFY
18 / 20
Copyright © 2016 Toshiba Corporation. All Rights Reserved.
Client SSD SG5 Series Brochure Rev.1.00
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
Op-Code Feature Name
B1h
C3h
DEVICE CONFIGURATION SET
B1h
C4h
DEVICE CONFIGURATION IDENTIFY DMA
B1h
C5h
DEVI CE CO N FI GU R ATION SET DM A
B4h
SANITIZE DEVICE
B4h
00h
SANITIZE STATU S EXT
B4h
11h
CRYPTO SC RAMBL E EX T
B4h
12h
BLO CK ERA SE EX T
B4h
20h
SANITIZE FREEZ E L OCK EX T
C4h
READ MULTILE
C5h
WRITE MULTIPLE
C6h
SET MULTIPLE MODE
C8h
REA D DMA
C9h
REA D DMA w ithou t ret ries
CAh
WRITE DMA
CBh
WRITE DMA w it hout retr i es
CEh
WRIT E MUL TIPLE FUA E XT
E0h
STANDBY IMMEDIATE
E1h
IDLE IM MEDIATE
E2h
STANDBY
E3h
IDLE
E4h
READ BUFFER
E5h
CHECK POWER MODE
E6h
SLEEP
E7h
FLUS H CA CHE
E8h
WRITE BUFFER
E9h
READ BUFFER DMA
EAh
FLUS H CA CHE EX T
EBh
WRITE BUFFER DMA
ECh
IDENT IFY DEVICE
EFh
SET FEATURES
EFh
02h
Enable volatile write cache
EFh
03h
Set transfer m ode
EFh
05h
Enable the APM feature set
EFh
10h
Enable use of SATA feature set
EFh
10h
02h
Enable DM A Set up FIS A ut o-Activate optimization
EFh
10h
03h
Enable Device-initiat ed i nt er face power stat e ( DIPM) t r ansitions
EFh
10h
06h
Enable So ftwar e Settings Preser v ation(SSP)
19 / 20
Copyright © 2016 Toshiba Corporation. All Rights Reserved.
Client SSD SG5 Series Brochure Rev.1.00
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
Op-Code Feature Name
EFh
10h
07h
Enable Device Auto m at ic Partial to S lumber transit i ons
EFh
10h
09h
Enable Device Sleep
EFh
55h
Disable read look-ahead
EFh
66h
Disable rev er t ing t o power-on defaults
EFh
82h
Disable volatile write c ache
EFh
85h
Disable the APM featur e set
EFh
90h
Disable use of SATA feat ur e s et
EFh
90h
02h
Disable DMA Setup FIS Auto-Activate optimizatio n
EFh
90h
03h
Disable Device-init iated inter face pow er s t at e ( DIPM) t r ansitions
EFh
90h
06h
Disable Software Sett ings Preservation(SSP)
EFh
90h
07h
Disable Device Automatic Par t ia l t o Slumber t rans iti ons
EFh
90h
09h
Disable Device Sleep
EFh
AAh
Enable read l ook-ahead
EFh
CCh
Enable reverting to pow er-on de fau lts
F1h
SECURITY SET PASSWORD
F2h
SECURITY UNLOCK
F3h
SECURITY ERASE PREPARE
F4h
SECURITY ERASE UNIT
F5h
SECURITY FREEZE LOCK
F6h
SECURITY DISABLE PASSWORD
F8h
READ NATIVE MAX ADDRESS
F9h
SET MAX ADDRESS
F9h
01h
SET MAX SET PASSWO RD
F9h
02h
SET MAX LOCK
F9h
03h
SET MAX UNLOCK
F9h
04h
SET MAX FR E EZE LO CK
F9h
05h
SET MAX SET PASSWO RD DMA
F9h
06h
SET MAX UNLOCK DMA
20 / 20
Copyright © 2016 Toshiba Corporation. All Rights Reserved.
Client SSD SG5 Series Brochure Rev.1.00
Products and specifications discussed herein are for reference purposes
only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind.
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
RESTRICTIO NS ON PRODUCT USE
• Tosh iba Corporat i on, and its subsidi ar ie s and af f iliates (collectively "TOSHIBA"), reser ve the right t o ma ke
changes to t he in formatio n in this document , and r elated hardware, so ftw ar e and systems (collectively
"Product ") without notic e.
• This doc ument and any in formation her ein may not be r epr oduced wit hout prior w r itten permissio n from
TO SHIBA. Even wit h TOSHIB A's w r itt en permission, r epr oduction is permissible only if reproduction is without
alteration/omission.
• Though TOSHIBA works continually to impr ove Product 's quality and r eli abi l it y, Product ca n malfuncti on or fail.
Customers ar e responsib le for comply in g with safety standar ds and for provid ing adequate designs an d
safeguards f or t heir hardware, soft w ar e and syst em s which mini m ize risk and a void situations in which a
malfunct io n or failure of Pr oduc t could caus e los s of human life, bo di ly injury or damage t o pr operty, including
data loss or cor r uption. Before customers use t he Product, create designs includi ng the Product, or
incorporate the Produ ct into their ow n applications , custo mers must also r ef er t o and comply w it h (a) the latest
versions o f all relevant TOSHIBA information, inc lu ding without limitation, this document , the specific at io ns , t he
data sheet s and applicat io n notes for Prod uct and the prec autions and conditions s et fort h i n the "T O SHIBA
Semiconductor Re liability Handbook" and (b) the instruct ions for the appl ication wit h w hich t he Product w ill be
used with or for. Customer s ar e solely respo nsible for all as pect s of their own p r oduct design or applications,
including but not limited to (a) deter m in ing t he appropriat eness of the use of this Pro duct in such des ign or
applications; (b) evaluating and det ermining t he applic ability of any inf ormation contained in this document , or
in charts, d iagrams, programs, alg or it hms, sampl e applicat ion circuits, or any other referenced doc uments;
and (c) valid at ing all operat ing p ar ameters for such designs a nd applicat ions. T OSHIBA ASSU ME S NO
LIABILITY FO R CUSTOMER S' PRODUCT DESIGN OR APPLICATIO NS .
• PRO DUCT IS NEIT HER INT ENDED NO R WARRA NTED FOR USE IN EQUIPMEN TS OR SYSTEMS THAT
REQUIRE EXTRAORDINA RILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A
MALFUNCTIO N OR FAILU RE OF WHICH MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY,
SERI OUS P ROPERTY D AMA GE AND/O R S ERIO US PUBLIC IMPACT ( "UNINTENDED USE"). Except for
specific a ppl ications as expressly stated in this document, Un intended Use includes, wit hout limitation,
equipment used in nuclear facilities, equi pment use d in t he aerospace i ndustry, medical equipment, equipment
used for automobiles, trains, ships and ot her transportation, t r affic s ignaling equipment, equipment use d t o
control combustions or explosions, safety devices, elevators and escalator s , devices rel at ed t o electric power,
and equipment used in finance-related fiel ds. IF YOU USE PRODUCT FOR UNINTENDED USE, TOSHIBA
ASSUMES NO LIABILITY FOR PRODUCT. For details, p lea se c ontact y our T OSHIBA sales repr esent at iv e.
• Do not disa s semble, analyze, r everse-engineer, alter, modify, t r anslate or copy Product , whether in whole or in
part.
• Product shall not be used for or in c or porated int o any product s or systems wh ose manufactur e, us e, or sale is
prohibite d under any appl icable laws or regulatio ns.
• The information contained her ein is presented o nly as guidance f or Pr oduct use. No respons ib il ity is assu med
by T OSHIBA for any infrin gement of pate nt s or any other intellectua l property rights of third part ies t hat may
result from the use of Product. No license to any intellectual propert y right is granted by this document,
whether express or im pl ied, by est oppel or ot her wise.
• ABSENT A WRITTEN SIG NED AGREEMEN T, EXCEP T AS PROVIDED I N THE RELEVANT T ERMS AND
CONDITIONS OF SALE FOR PROD UCT, AND TO THE MA XIMUM E X TENT ALLOWABL E BY LAW,
TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT,
CONSEQUENTIA L, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT
LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS
OF DATA, AND (2) DISC LAIMS ANY AND ALL EXPR ESS OR I MPLIED WARRANTIES AND CONDITI ONS
RELATED TO SALE, USE OF PRODUCT, OR INFOR MATION, INCLU DING WARRANTIES OR
CONDITIONS OF MER CHANTABIL ITY, FITNE SS FOR A PA RT ICULAR PURP OS E, ACCURACY OF
INFORMATION, OR NONINFRINGEMENT.
• Do not use or ot her w ise make available Product or related softw ar e or t ec hnology for any military purposes,
including without li mit at ion, for the design, develop m ent , use, stockpil ing or manufactur ing of nucle ar,
chemica l, or bio logical we apons or missil e t echnolo gy products (m ass destruction weapons). Product and
related softw ar e and tech nol ogy may be controlled under t he applicable expor t laws and regulations including,
without limitation, the Japanese Foreign Exc hange and F or eign Trade Law and t he U.S. Export Admin istration
Regulatio ns . Export and re-export of Product or r elated software or t echnolog y are strictly prohibited except in
compliance w it h all applicable export l aw s and r egulations.
• Please contact your TOSHIBA sales representat ive for details a s t o environmental matters such as the RoHS
compatibi l it y of Product. Pleas e use Product in compliance with all appl ica ble laws and regulations that
regulate t he in clusion or u se of controlle d substance s, incl uding with out limitation, the EU RoH S D irective.
TOSHIBA A SSUMES NO LIA BILITY FOR DAMAGES O R LOSSES O CCUR RING AS A RESULT OF
NONCO MPLI ANCE WIT H A PPLICA BLE LAWS AN D REGULATIONS.