Table of Contents
- Dell OptiPlex 7070 Micro Service Manual
- Working on your computer
- Technology and components
- Removing and installing components
- Troubleshooting
- Getting help
DELL n004o7070micro-d1515cn User Manual
Displayed below is the user manual for n004o7070micro-d1515cn by DELL which is a product in the PCs/Workstations category. This manual has pages.
Related Manuals
Dell OptiPlex 7070 Micro
Service Manual
Regulatory Model: D10U
Regulatory Type: D10U003
Notes, cautions, and warnings
NOTE: A NOTE indicates important information that helps you make better use of your product.
CAUTION: A CAUTION indicates either potential damage to hardware or loss of data and tells you how to avoid the
problem.
WARNING: A WARNING indicates a potential for property damage, personal injury, or death.
© 2018 - 2019 Dell Inc. or its subsidiaries. All rights reserved. Dell, EMC, and other trademarks are trademarks of Dell Inc. or its
subsidiaries. Other trademarks may be trademarks of their respective owners.
2019 - 06
Rev. A00
1 Working on your computer............................................................................................................ 5
Safety instructions................................................................................................................................................................ 5
Before working inside your computer........................................................................................................................... 5
Safety precautions...........................................................................................................................................................6
Electrostatic discharge—ESD protection.................................................................................................................... 6
ESD field service kit ........................................................................................................................................................ 7
Transporting sensitive components...............................................................................................................................7
After working inside your computer.............................................................................................................................. 8
2 Technology and components......................................................................................................... 9
DDR4....................................................................................................................................................................................... 9
USB features........................................................................................................................................................................ 10
USB Type-C..........................................................................................................................................................................12
Advantages of DisplayPort over USB Type-C..................................................................................................................12
HDMI 2.0............................................................................................................................................................................... 12
Intel Optane memory........................................................................................................................................................... 13
Enabling Intel Optane memory......................................................................................................................................13
Disabling Intel Optane memory.....................................................................................................................................13
3 Removing and installing components............................................................................................ 15
Side cover............................................................................................................................................................................. 15
Removing side cover......................................................................................................................................................15
Installing side cover........................................................................................................................................................ 16
2.5-inch hard drive assembly..............................................................................................................................................18
Removing 2.5–inch hard drive assembly.....................................................................................................................18
Installing 2.5–inch drive assembly................................................................................................................................18
Hard drive..............................................................................................................................................................................19
Removing the 2.5–inch drive from the drive bracket............................................................................................... 19
Installing the 2.5 inch hard drive into the drive bracket........................................................................................... 20
Heat sink blower.................................................................................................................................................................. 20
Removing heat sink blower.......................................................................................................................................... 20
Installing heat sink blower..............................................................................................................................................21
Speaker................................................................................................................................................................................. 22
Removing speaker......................................................................................................................................................... 22
Installing speaker............................................................................................................................................................23
Memory modules................................................................................................................................................................. 24
Removing memory module...........................................................................................................................................24
Installing memory module............................................................................................................................................. 25
Heat sink ..............................................................................................................................................................................26
Removing heatsink........................................................................................................................................................ 26
Installing heatsink...........................................................................................................................................................27
Processor..............................................................................................................................................................................28
Removing processor......................................................................................................................................................28
Installing processor........................................................................................................................................................29
Contents
Contents 3
WLAN card...........................................................................................................................................................................30
Removing the WLAN card............................................................................................................................................30
Installing the WLAN card.............................................................................................................................................. 32
M.2 PCIe SSD...................................................................................................................................................................... 34
Removing the M.2 PCIe SSD ......................................................................................................................................34
Installing the M.2 PCIe SSD ........................................................................................................................................ 35
Coin-cell battery.................................................................................................................................................................. 36
Removing coin cell battery........................................................................................................................................... 36
Installing coin cell battery..............................................................................................................................................37
Optional module...................................................................................................................................................................38
Removing optional module........................................................................................................................................... 38
Installing optional module..............................................................................................................................................40
System board........................................................................................................................................................................41
Removing system board................................................................................................................................................ 41
Installing system board..................................................................................................................................................43
4 Troubleshooting......................................................................................................................... 46
Enhanced Pre-Boot System Assessment — ePSA diagnostics................................................................................... 46
Running the ePSA Diagnostics.................................................................................................................................... 46
Diagnostics........................................................................................................................................................................... 46
Diagnostic error messages................................................................................................................................................. 48
System error messages.......................................................................................................................................................51
5 Getting help...............................................................................................................................52
Contacting Dell.................................................................................................................................................................... 52
4Contents
Working on your computer
Safety instructions
Use the following safety guidelines to protect your computer from potential damage and to ensure your personal safety. Unless otherwise
noted, each procedure included in this document assumes that the following conditions exist:
• You have read the safety information that shipped with your computer.
• A component can be replaced or, if purchased separately, installed by performing the removal procedure in reverse order.
NOTE: Disconnect all power sources before opening the computer cover or panels. After you finish working inside the
computer, replace all covers, panels, and screws before connecting to the power source.
WARNING: Before working inside your computer, read the safety information that shipped with your computer. For
additional safety best practices information, see the Regulatory Compliance Homepage
CAUTION: Many repairs may only be done by a certified service technician. You should only perform troubleshooting and
simple repairs as authorized in your product documentation, or as directed by the online or telephone service and
support team. Damage due to servicing that is not authorized by Dell is not covered by your warranty. Read and follow
the safety instructions that came with the product.
CAUTION: To avoid electrostatic discharge, ground yourself by using a wrist grounding strap or by periodically touching
an unpainted metal surface at the same time as touching a connector on the back of the computer.
CAUTION: Handle components and cards with care. Do not touch the components or contacts on a card. Hold a card by
its edges or by its metal mounting bracket. Hold a component such as a processor by its edges, not by its pins.
CAUTION: When you disconnect a cable, pull on its connector or on its pull-tab, not on the cable itself. Some cables
have connectors with locking tabs; if you are disconnecting this type of cable, press in on the locking tabs before you
disconnect the cable. As you pull connectors apart, keep them evenly aligned to avoid bending any connector pins. Also,
before you connect a cable, ensure that both connectors are correctly oriented and aligned.
NOTE: The color of your computer and certain components may appear differently than shown in this document.
Before working inside your computer
To avoid damaging your computer, perform the following steps before you begin working inside the computer.
1. Ensure that you follow the Safety Instruction.
2. Ensure that your work surface is flat and clean to prevent the computer cover from being scratched.
3. Turn off your computer.
4. Disconnect all network cables from the computer.
CAUTION: To disconnect a network cable, first unplug the cable from your computer and then unplug the cable from
the network device.
5. Disconnect your computer and all attached devices from their electrical outlets.
6. Press and hold the power button while the computer is unplugged to ground the system board.
NOTE: To avoid electrostatic discharge, ground yourself by using a wrist grounding strap or by periodically touching
an unpainted metal surface at the same time as touching a connector on the back of the computer.
1
Working on your computer 5
Safety precautions
The safety precautions chapter details the primary steps to be taken before performing any disassembly instructions.
Observe the following safety precautions before you perform any installation or break/fix procedures involving disassembly or reassembly:
• Turn off the system and all attached peripherals.
• Disconnect the system and all attached peripherals from AC power.
• Disconnect all network cables, telephone, and telecommunications lines from the system.
• Use an ESD field service kit when working inside any desktop to avoid electrostatic discharge (ESD) damage.
• After removing any system component, carefully place the removed component on an anti-static mat.
• Wear shoes with non-conductive rubber soles to reduce the chance of getting electrocuted.
Standby power
Dell products with standby power must be unplugged before you open the case. Systems that incorporate standby power are essentially
powered while turned off. The internal power enables the system to be remotely turned on (wake on LAN) and suspended into a sleep
mode and has other advanced power management features.
Unplugging, pressing and holding the power button for 15 seconds should discharge residual power in the system board.
Bonding
Bonding is a method for connecting two or more grounding conductors to the same electrical potential. This is done through the use of a
field service electrostatic discharge (ESD) kit. When connecting a bonding wire, ensure that it is connected to bare metal and never to a
painted or non-metal surface. The wrist strap should be secure and in full contact with your skin, and ensure that you remove all jewelry
such as watches, bracelets, or rings prior to bonding yourself and the equipment.
Electrostatic discharge—ESD protection
ESD is a major concern when you handle electronic components, especially sensitive components such as expansion cards, processors,
memory DIMMs, and system boards. Very slight charges can damage circuits in ways that may not be obvious, such as intermittent
problems or a shortened product life span. As the industry pushes for lower power requirements and increased density, ESD protection is
an increasing concern.
Due to the increased density of semiconductors used in recent Dell products, the sensitivity to static damage is now higher than in
previous Dell products. For this reason, some previously approved methods of handling parts are no longer applicable.
Two recognized types of ESD damage are catastrophic and intermittent failures.
•Catastrophic – Catastrophic failures represent approximately 20 percent of ESD-related failures. The damage causes an immediate
and complete loss of device functionality. An example of catastrophic failure is a memory DIMM that has received a static shock and
immediately generates a "No POST/No Video" symptom with a beep code emitted for missing or nonfunctional memory.
•Intermittent – Intermittent failures represent approximately 80 percent of ESD-related failures. The high rate of intermittent failures
means that most of the time when damage occurs, it is not immediately recognizable. The DIMM receives a static shock, but the
tracing is merely weakened and does not immediately produce outward symptoms related to the damage. The weakened trace may
take weeks or months to melt, and in the meantime may cause degradation of memory integrity, intermittent memory errors, etc.
The more difficult type of damage to recognize and troubleshoot is the intermittent (also called latent or "walking wounded") failure.
Perform the following steps to prevent ESD damage:
• Use a wired ESD wrist strap that is properly grounded. The use of wireless anti-static straps is no longer allowed; they do not provide
adequate protection. Touching the chassis before handling parts does not ensure adequate ESD protection on parts with increased
sensitivity to ESD damage.
• Handle all static-sensitive components in a static-safe area. If possible, use anti-static floor pads and workbench pads.
• When unpacking a static-sensitive component from its shipping carton, do not remove the component from the anti-static packing
material until you are ready to install the component. Before unwrapping the anti-static packaging, ensure that you discharge static
electricity from your body.
• Before transporting a static-sensitive component, place it in an anti-static container or packaging.
6Working on your computer
ESD field service kit
The unmonitored Field Service kit is the most commonly used service kit. Each Field Service kit includes three main components: anti-
static mat, wrist strap, and bonding wire.
Components of an ESD field service kit
The components of an ESD field service kit are:
•Anti-Static Mat – The anti-static mat is dissipative and parts can be placed on it during service procedures. When using an anti-
static mat, your wrist strap should be snug and the bonding wire should be connected to the mat and to any bare metal on the system
being worked on. Once deployed properly, service parts can be removed from the ESD bag and placed directly on the mat. ESD-
sensitive items are safe in your hand, on the ESD mat, in the system, or inside a bag.
•Wrist Strap and Bonding Wire – The wrist strap and bonding wire can be either directly connected between your wrist and bare
metal on the hardware if the ESD mat is not required, or connected to the anti-static mat to protect hardware that is temporarily
placed on the mat. The physical connection of the wrist strap and bonding wire between your skin, the ESD mat, and the hardware is
known as bonding. Use only Field Service kits with a wrist strap, mat, and bonding wire. Never use wireless wrist straps. Always be
aware that the internal wires of a wrist strap are prone to damage from normal wear and tear, and must be checked regularly with a
wrist strap tester in order to avoid accidental ESD hardware damage. It is recommended to test the wrist strap and bonding wire at
least once per week.
•ESD Wrist Strap Tester – The wires inside of an ESD strap are prone to damage over time. When using an unmonitored kit, it is a
best practice to regularly test the strap prior to each service call, and at a minimum, test once per week. A wrist strap tester is the
best method for doing this test. If you do not have your own wrist strap tester, check with your regional office to find out if they have
one. To perform the test, plug the wrist-strap's bonding-wire into the tester while it is strapped to your wrist and push the button to
test. A green LED is lit if the test is successful; a red LED is lit and an alarm sounds if the test fails.
•Insulator Elements – It is critical to keep ESD sensitive devices, such as plastic heat sink casings, away from internal parts that are
insulators and often highly charged.
•Working Environment – Before deploying the ESD Field Service kit, assess the situation at the customer location. For example,
deploying the kit for a server environment is different than for a desktop or portable environment. Servers are typically installed in a
rack within a data center; desktops or portables are typically placed on office desks or cubicles. Always look for a large open flat work
area that is free of clutter and large enough to deploy the ESD kit with additional space to accommodate the type of system that is
being repaired. The workspace should also be free of insulators that can cause an ESD event. On the work area, insulators such as
Styrofoam and other plastics should always be moved at least 12 inches or 30 centimeters away from sensitive parts before physically
handling any hardware components
•ESD Packaging – All ESD-sensitive devices must be shipped and received in static-safe packaging. Metal, static-shielded bags are
preferred. However, you should always return the damaged part using the same ESD bag and packaging that the new part arrived in.
The ESD bag should be folded over and taped shut and all the same foam packing material should be used in the original box that the
new part arrived in. ESD-sensitive devices should be removed from packaging only at an ESD-protected work surface, and parts
should never be placed on top of the ESD bag because only the inside of the bag is shielded. Always place parts in your hand, on the
ESD mat, in the system, or inside an anti-static bag.
•Transporting Sensitive Components – When transporting ESD sensitive components such as replacement parts or parts to be
returned to Dell, it is critical to place these parts in anti-static bags for safe transport.
ESD protection summary
It is recommended that all field service technicians use the traditional wired ESD grounding wrist strap and protective anti-static mat at all
times when servicing Dell products. In addition, it is critical that technicians keep sensitive parts separate from all insulator parts while
performing service and that they use anti-static bags for transporting sensitive components.
Transporting sensitive components
When transporting ESD sensitive components such as replacement parts or parts to be returned to Dell, it is critical to place these parts in
anti-static bags for safe transport.
Lifting equipment
Adhere to the following guidelines when lifting heavy weight equipment:
CAUTION: Do not lift greater than 50 pounds. Always obtain additional resources or use a mechanical lifting device.
1. Get a firm balanced footing. Keep your feet apart for a stable base, and point your toes out.
2. Tighten stomach muscles. Abdominal muscles support your spine when you lift, offsetting the force of the load.
3. Lift with your legs, not your back.
4. Keep the load close. The closer it is to your spine, the less force it exerts on your back.
Working on your computer 7
5. Keep your back upright, whether lifting or setting down the load. Do not add the weight of your body to the load. Avoid twisting your
body and back.
6. Follow the same techniques in reverse to set the load down.
After working inside your computer
After you complete any replacement procedure, ensure that you connect any external devices, cards, and cables before turning on your
computer.
1. Connect any telephone or network cables to your computer.
CAUTION: To connect a network cable, first plug the cable into the network device and then plug it into the
computer.
2. Connect your computer and all attached devices to their electrical outlets.
3. Turn on your computer.
4. If required, verify that the computer works correctly by running ePSA diagnostics.
8 Working on your computer
Technology and components
This chapter details the technology and components available in the system.
Topics:
•DDR4
•USB features
•USB Type-C
•Advantages of DisplayPort over USB Type-C
•HDMI 2.0
•Intel Optane memory
DDR4
DDR4 (double data rate fourth generation) memory is a higher-speed successor to the DDR2 and DDR3 technologies and allows up to 512
GB in capacity, compared to the DDR3's maximum of 128 GB per DIMM. DDR4 synchronous dynamic random-access memory is keyed
differently from both SDRAM and DDR to prevent the user from installing the wrong type of memory into the system.
DDR4 needs 20 percent less or just 1.2 volts, compared to DDR3 which requires 1.5 volts of electrical power to operate. DDR4 also
supports a new, deep power-down mode that allows the host device to go into standby without needing to refresh its memory. Deep
power-down mode is expected to reduce standby power consumption by 40 to 50 percent.
DDR4 Details
There are subtle differences between DDR3 and DDR4 memory modules, as listed below.
Key notch difference
The key notch on a DDR4 module is in a different location from the key notch on a DDR3 module. Both notches are on the insertion edge
but the notch location on the DDR4 is slightly different, to prevent the module from being installed into an incompatible board or platform.
Figure 1. Notch difference
Increased thickness
DDR4 modules are slightly thicker than DDR3, to accommodate more signal layers.
Figure 2. Thickness difference
Curved edge
2
Technology and components 9
DDR4 modules feature a curved edge to help with insertion and alleviate stress on the PCB during memory installation.
Figure 3. Curved edge
Memory Errors
Memory errors on the system display the new ON-FLASH-FLASH or ON-FLASH-ON failure code. If all memory fails, the LCD does not
turn on. Troubleshoot for possible memory failure by trying known good memory modules in the memory connectors on the bottom of the
system or under the keyboard, as in some portable systems.
NOTE: The DDR4 memory is imbedded in board and not a replaceable DIMM as shown and referred.
USB features
Universal Serial Bus, or USB, was introduced in 1996. It dramatically simplified the connection between host computers and peripheral
devices like mice, keyboards, external drivers, and printers.
Let's take a quick look on the USB evolution referencing to the table below.
Table 1. USB evolution
Type Data Transfer Rate Category Introduction Year
USB 2.0 480 Mbps High Speed 2000
USB 3.0/USB 3.1 Gen 1 5 Gbps Super Speed 2010
USB 3.1 Gen 2 10 Gbps Super Speed 2013
USB 3.0/USB 3.1 Gen 1 (SuperSpeed USB)
For years, the USB 2.0 has been firmly entrenched as the de facto interface standard in the PC world with about 6 billion devices sold, and
yet the need for more speed grows by ever faster computing hardware and ever greater bandwidth demands. The USB 3.0/USB 3.1 Gen 1
finally has the answer to the consumers' demands with a theoretically 10 times faster than its predecessor. In a nutshell, USB 3.1 Gen 1
features are as follows:
• Higher transfer rates (up to 5 Gbps)
• Increased maximum bus power and increased device current draw to better accommodate power-hungry devices
• New power management features
• Full-duplex data transfers and support for new transfer types
• Backward USB 2.0 compatibility
• New connectors and cable
The topics below cover some of the most commonly asked questions regarding USB 3.0/USB 3.1 Gen 1.
Speed
Currently, there are 3 speed modes defined by the latest USB 3.0/USB 3.1 Gen 1 specification. They are Super-Speed, Hi-Speed and Full-
Speed. The new SuperSpeed mode has a transfer rate of 4.8Gbps. While the specification retains Hi-Speed, and Full-Speed USB mode,
commonly known as USB 2.0 and 1.1 respectively, the slower modes still operate at 480Mbps and 12Mbps respectively and are kept to
maintain backward compatibility.
USB 3.0/USB 3.1 Gen 1 achieves the much higher performance by the technical changes below:
10 Technology and components
• An additional physical bus that is added in parallel with the existing USB 2.0 bus (refer to the picture below).
• USB 2.0 previously had four wires (power, ground, and a pair for differential data); USB 3.0/USB 3.1 Gen 1 adds four more for two
pairs of differential signals (receive and transmit) for a combined total of eight connections in the connectors and cabling.
• USB 3.0/USB 3.1 Gen 1 utilizes the bidirectional data interface, rather than USB 2.0's half-duplex arrangement. This gives a 10-fold
increase in theoretical bandwidth.
With today's ever increasing demands placed on data transfers with high-definition video content, terabyte storage devices, high
megapixel count digital cameras etc., USB 2.0 may not be fast enough. Furthermore, no USB 2.0 connection could ever come close to the
480Mbps theoretical maximum throughput, making data transfer at around 320Mbps (40MB/s) — the actual real-world maximum.
Similarly, USB 3.0/USB 3.1 Gen 1 connections will never achieve 4.8Gbps. We will likely see a real-world maximum rate of 400MB/s with
overheads. At this speed, USB 3.0/USB 3.1 Gen 1 is a 10x improvement over USB 2.0.
Applications
USB 3.0/USB 3.1 Gen 1 opens up the laneways and provides more headroom for devices to deliver a better overall experience. Where USB
video was barely tolerable previously (both from a maximum resolution, latency, and video compression perspective), it's easy to imagine
that with 5-10 times the bandwidth available, USB video solutions should work that much better. Single-link DVI requires almost 2Gbps
throughput. Where 480Mbps was limiting, 5Gbps is more than promising. With its promised 4.8Gbps speed, the standard will find its way
into some products that previously weren't USB territory, like external RAID storage systems.
Listed below are some of the available SuperSpeed USB 3.0/USB 3.1 Gen 1 products:
• External Desktop USB 3.0/USB 3.1 Gen 1 Hard Drives
• Portable USB 3.0/USB 3.1 Gen 1 Hard Drives
• USB 3.0/USB 3.1 Gen 1 Drive Docks & Adapters
• USB 3.0/USB 3.1 Gen 1 Flash Drives & Readers
• USB 3.0/USB 3.1 Gen 1 Solid-state Drives
• USB 3.0/USB 3.1 Gen 1 RAIDs
• Optical Media Drives
• Multimedia Devices
• Networking
• USB 3.0/USB 3.1 Gen 1 Adapter Cards & Hubs
Compatibility
The good news is that USB 3.0/USB 3.1 Gen 1 has been carefully planned from the start to peacefully co-exist with USB 2.0. First of all,
while USB 3.0/USB 3.1 Gen 1 specifies new physical connections and thus new cables to take advantage of the higher speed capability of
the new protocol, the connector itself remains the same rectangular shape with the four USB 2.0 contacts in the exact same location as
before. Five new connections to carry receive and transmitted data independently are present on USB 3.0/USB 3.1 Gen 1 cables and only
come into contact when connected to a proper SuperSpeed USB connection.
Windows 8/10 will be bringing native support for USB 3.1 Gen 1 controllers. This is in contrast to previous versions of Windows, which
continue to require separate drivers for USB 3.0/USB 3.1 Gen 1 controllers.
Microsoft announced that Windows 7 would have USB 3.1 Gen 1 support, perhaps not on its immediate release, but in a subsequent
Service Pack or update. It is not out of the question to think that following a successful release of USB 3.0/USB 3.1 Gen 1 support in
Windows 7, SuperSpeed support would trickle down to Vista. Microsoft has confirmed this by stating that most of their partners share the
opinion that Vista should also support USB 3.0/USB 3.1 Gen 1.
Technology and components 11
USB Type-C
USB Type-C is a new, tiny physical connector. The connector itself can support various exciting new USB standards like USB 3.1 and USB
power delivery (USB PD).
Alternate Mode
USB Type-C is a new connector standard that is very small. It is about a third the size of an old USB Type-A plug. This is a single
connector standard that every device should be able to use. USB Type-C ports can support a variety of different protocols using
“alternate modes,” which allows you to have adapters that can output HDMI, VGA, DisplayPort, or other types of connections from that
single USB port
USB Power Delivery
The USB PD specification is also closely intertwined with USB Type-C. Currently, smartphones, tablets, and other mobile devices often
use a USB connection to charge. A USB 2.0 connection provides up to 2.5 watts of power — that'll charge your phone, but that's about
it. A laptop might require up to 60 watts, for example. The USB Power Delivery specification ups this power delivery to 100 watts. It's bi-
directional, so a device can either send or receive power. And this power can be transferred at the same time the device is transmitting
data across the connection.
This could spell the end of all those proprietary laptop charging cables, with everything charging via a standard USB connection. You could
charge your laptop from one of those portable battery packs you charge your smartphones and other portable devices from today. You
could plug your laptop into an external display connected to a power cable, and that external display would charge your laptop as you used
it as an external display — all via the one little USB Type-C connection. To use this, the device and the cable have to support USB Power
Delivery. Just having a USB Type-C connection doesn't necessarily mean they do.
USB Type-C and USB 3.1
USB 3.1 is a new USB standard. USB 3's theoretical bandwidth is 5 Gbps same as of USB 3.1 Gen 1, while USB 3.1 Gen 2's bandwidth is 10
Gbps. That's double the bandwidth, as fast as a first-generation Thunderbolt connector. USB Type-C isn't the same thing as USB 3.1. USB
Type-C is just a connector shape, and the underlying technology could just be USB 2 or USB 3.0. In fact, Nokia's N1 Android tablet uses a
USB Type-C connector, but underneath it's all USB 2.0 — not even USB 3.0. However, these technologies are closely related.
Advantages of DisplayPort over USB Type-C
• Full DisplayPort audio/video (A/V) performance (up to 4K at 60Hz)
• Reversible plug orientation and cable direction
• Backwards compatibility to VGA, DVI with adaptors
• SuperSpeed USB (USB 3.1) data
• Supports HDMI 2.0a and is backwards compatible with previous versions
HDMI 2.0
This topic explains the HDMI 2.0 and its features along with the advantages.
HDMI (High-Definition Multimedia Interface) is an industry-supported, uncompressed, all-digital audio/video interface. HDMI provides an
interface between any compatible digital audio/video source, such as a DVD player, or A/V receiver and a compatible digital audio and/or
video monitor, such as a digital TV (DTV). The intended applications for HDMI TVs, and DVD players. The primary advantage is cable
reduction and content protection provisions. HDMI supports standard, enhanced, or high-definition video, plus multichannel digital audio
on a single cable.
HDMI 2.0 Features
•HDMI Ethernet Channel - Adds high-speed networking to an HDMI link, allowing users to take full advantage of their IP-enabled
devices without a separate Ethernet cable
•Audio Return Channel - Allows an HDMI-connected TV with a built-in tuner to send audio data "upstream" to a surround audio
system, eliminating the need for a separate audio cable
•3D - Defines input/output protocols for major 3D video formats, paving the way for true 3D gaming and 3D home theater applications
•Content Type - Real-time signaling of content types between display and source devices, enabling a TV to optimize picture settings
based on content type
•Additional Color Spaces - Adds support for additional color models used in digital photography and computer graphics
12 Technology and components
•4K Support - Enables video resolutions far beyond 1080p, supporting next-generation displays that will rival the Digital Cinema
systems used in many commercial movie theaters
•HDMI Micro Connector - A new, smaller connector for phones and other portable devices, supporting video resolutions up to 1080p
•Automotive Connection System - New cables and connectors for automotive video systems, designed to meet the unique
demands of the motoring environment while delivering true HD quality
Advantages of HDMI
• Quality HDMI transfers uncompressed digital audio and video for the highest, crispest image quality.
• Low -cost HDMI provides the quality and functionality of a digital interface while also supporting uncompressed video formats in a
simple, cost-effective manner
• Audio HDMI supports multiple audio formats from standard stereo to multichannel surround sound
• HDMI combines video and multichannel audio into a single cable, eliminating the cost, complexity, and confusion of multiple cables
currently used in A/V systems
• HDMI supports communication between the video source (such as a DVD player) and the DTV, enabling new functionality
Intel Optane memory
Intel Optane memory functions only as a storage accelerator. It neither replaces nor adds to the memory (RAM) installed on your
computer.
NOTE: Intel Optane memory is supported on computers that meet the following requirements:
• 7th Generation or higher Intel Core i3/i5/i7 processor
• Windows 10 64-bit version 1607 or higher
• Intel Rapid Storage Technology driver version 15.9.1.1018 or higher
Table 2. Intel Optane memory specifications
Feature Specifications
Interface PCIe 3x2 NVMe 1.1
Connector M.2 card slot (2230/2280)
Configurations supported • 7th Generation or higher Intel Core i3/i5/i7 processor
• Windows 10 64-bit version 1607 or higher
• Intel Rapid Storage Technology driver version 15.9.1.1018 or
higher
Capacity 32 GB
Enabling Intel Optane memory
1. On the taskbar, click the search box, and type "Intel Rapid Storage Technology".
2. Click Intel Rapid Storage Technology.
3. On the Status tab, click Enable to enable the Intel Optane memory.
4. On the warning screen, select a compatible fast drive, and then click Yes to continue enabling Intel Optane memory.
5. Click Intel Optane memory > Reboot to enable the Intel Optane memory.
NOTE: Applications may take up to three subsequent launches after enablement to see the full performance
benefits.
Disabling Intel Optane memory
CAUTION: After disabling Intel Optane memory, do not uninstall the driver for Intel Rapid Storage Technology as it will
result in a blue screen error. The Intel Rapid Storage Technology user interface can be removed without uninstalling the
driver.
Technology and components 13
NOTE: Disabling Intel Optane memory is required before removing the SATA storage device, accelerated by the Intel
Optane memory module, from the computer.
1. On the taskbar, click the search box, and then type "Intel Rapid Storage Technology".
2. Click Intel Rapid Storage Technology. The Intel Rapid Storage Technology window is displayed.
3. On the Intel Optane memory tab, click Disable to disable the Intel Optane memory.
4. Click Yes if you accept the warning.
The disabling progress is displayed.
5. Click Reboot to complete disabling Intel Optane memory and restart your computer.
14 Technology and components
Removing and installing components
Side cover
Removing side cover
1. Follow the procedure in Before working inside your computer.
2. To remove the side cover:
a) Loosen the thumbscrew that secures the side cover to the system.
b) Slide the side cover towards the front of the system and lift the cover to remove from the system.
3
Removing and installing components 15
Installing side cover
1. To install the side cover:
a) Place the side cover on the system.
b) Slide the cover towards the back of the system to install it.
16 Removing and installing components
2.5-inch hard drive assembly
Removing 2.5–inch hard drive assembly
1. Follow the procedure in Before working inside your computer.
2. Remove the Side cover.
3. To remove the drive assembly:
a) Press the blue tabs on both sides of the hard drive assembly [1].
b) Push the hard drive assembly to release it from the system and remove the hard drive assembly from the system [2].
Installing 2.5–inch drive assembly
1. To install the hard drive assembly:
a) Insert the hard drive assembly into the slot on the system.
b) Slide the hard drive assembly towards the connector in the system board until it clicks into place.
18 Removing and installing components
2. Install the Side cover.
3. Follow the procedure in After working inside your computer.
Hard drive
Removing the 2.5–inch drive from the drive bracket
1. Follow the procedure in Before Working Inside Your Computer.
2. Remove the:
a) Side cover
b) 2.5 inch hard drive assembly
3. To remove the drive bracket:
a) Pull one side of the drive bracket to disengage the pins on the bracket from the slots on the drive [1] and lift the drive [2].
Removing and installing components 19
Installing the 2.5 inch hard drive into the drive bracket
1. Align and insert the pins on the drive bracket with the slots on one side of the drive.
2. Flex the other side of the drive bracket, and align and insert the pins on the bracket into the drive.
3. Install the:
a) 2.5 inch hard drive assembly
b) Side cover
4. Follow the procedure in After working inside your computer.
Heat sink blower
Removing heat sink blower
1. Follow the procedure in Before working inside your computer.
2. Remove the Side cover.
3. To remove the heat sink blower:
a) Press the blue tabs on both sides of the heat sink blower [1].
b) Slide and lift the heat sink blower to release it from the system.
c) Turn the heat sink blower over to remove it from the system [2].
4. Disconnect the speaker cable and heat sink blower cable from the connectors on the system board.
20 Removing and installing components
Installing heat sink blower
1. To install the heat sink blower:
a) Connect the heat sink blower cable and speaker cable to the connectors on the system board.
b) Place the heat sink blower on the system and slide until it clicks into place.
Removing and installing components 21
2. Install the Side cover.
3. Follow the procedure in After working inside your computer.
Speaker
Removing speaker
1. Follow the procedure in Before working inside your computer.
2. Remove the:
a) Side cover
b) Heat sink blower
3. To remove the speaker:
a) Release the speaker cable from the retention hooks on the heat sink blower [1].
b) Remove the two (M2.5x4) screws that secure the speaker to the heat sink blower [2].
c) Remove the speaker from the heat sink blower [3].
22 Removing and installing components
Installing speaker
1. To install the speaker:
a) Align the slots on the speaker with the slots on the heat sink blower [1].
b) Replace the two (M2.5X4) screws to secure the speaker to the heat sink blower [2].
c) Route the speaker cable through the retention hooks on the heat sink blower [3].
Removing and installing components 23
2. Install the:
a) Heat sink blower
b) Side cover
3. Follow the procedure in After working inside your computer.
Memory modules
Removing memory module
1. Follow the procedure in Before working inside your computer.
2. Remove the:
a) Side cover
b) Heat sink blower
3. To remove the memory module:
a) Pull the securing clips from the memory module until the memory module pops up [1].
b) Remove the memory module from the socket on the system board [2].
24 Removing and installing components
Installing memory module
1. To install the memory module:
a) Align the notch on the memory module with the tab on the memory module connector.
b) Insert the memory module into the memory module socket [1] and press it until it clicks into place [2].
Removing and installing components 25
2. Install the:
a) Heat sink blower
b) Side cover
3. Follow the procedure in After working inside your computer.
Heat sink
Removing heatsink
1. Follow the procedure in Before working inside your computer.
2. Remove the:
a) Side cover
b) 2.5 inch hard drive assembly
c) Heatsink fan
3. To remove the heatsink:
a) Loosen the three(M3) captive screws that secure the heat sink to the system [1].
NOTE: The heatsink is secured to the system board with four screws and three screws for 35 W and 65 W CPU
respectively.
b) Lift the heat sink away from the system [2].
26 Removing and installing components
Installing heatsink
1. To install the heatsink:
a) Place the heatsink on the processor [1].
b) Tighten the three (M3) captive screws to secure the heat sink to the system board [2].
NOTE: The heatsink assembly is secured to the system board with four screws and three screws for 35 W and 65
W CPU respectively.
Removing and installing components 27
2. Install the:
a) Heatsink fan
b) 2.5–inch hard drive assembly
c) Side cover
3. Follow the procedure in After working inside your computer.
Processor
Removing processor
1. Follow the procedure in Before Working Inside Your Computer.
2. Remove the:
a) Side cover
b) 2.5 inch hard drive assembly
c) Heat sink blower
d) Heat sink
3. To remove the processor:
a) Release the socket lever by pushing the lever down and out from under the tab on the processor shield [1].
b) Lift the lever upward and lift the processor shield [2].
CAUTION: The processor socket pins are fragile and can be permanently damaged. Be careful not to bend the
pins in the processor socket when removing the processor out of the socket.
c) Lift the processor out of the socket [3].
28 Removing and installing components
NOTE: After removing the processor, place it in an antistatic container for reuse, return, or temporary storage. Do
not touch the bottom of the processor to avoid damage to the processor contacts. Touch only the side edges of the
processor.
Installing processor
1. To install the processor:
a) Place the processor on the socket such that the slots on the processor align with the socket keys [1].
CAUTION: Do not use force to seat the processor. When the processor is positioned correctly, it engages easily
into the socket.
b) Close the processor shield by sliding it under the retention screw [2].
c) Lower the socket lever and push it under the tab to lock it [3].
Removing and installing components 29
2. Install the:
a) Heat sink
b) Heat sink blower
c) 2.5–inch hard drive assembly
d) Side cover
3. Follow the procedure in After working inside your computer.
WLAN card
Removing the WLAN card
1. Follow the procedure in Before working inside your computer.
2. To remove the external antennae
a) Loosen the antenna screw to remove the antenna from the computer.
30 Removing and installing components
3. Remove the:
a) Side cover
b) 2.5 inch hard drive assembly
4. To remove the WLAN card:
a) Remove the single (M2X3.5) screw that secures the plastic tab to the WLAN card [1].
b) Remove the plastic tab to access the WLAN antenna cables [2].
c) Disconnect the WLAN antenna cables from the connectors on the WLAN card [3].
d) Lift the WLAN card from the connector on the system board [4].
Removing and installing components 31
Installing the WLAN card
1. To install the WLAN card:
a) Insert the WLAN card into the connector on the system board [1].
b) Connect the WLAN antenna cables to the connectors on the WLAN card [2].
c) Place the plastic tab to secure the WLAN cables [3].
d) Replace the single (M2X3.5) screw to secure the plastic tab to the WLAN card [4].
32 Removing and installing components
4. Follow the procedure in After working inside your computer.
M.2 PCIe SSD
Removing the M.2 PCIe SSD
NOTE: The instructions are applicable to M.2 SATA SSD also.
1. Follow the procedure in Before working inside your computer.
2. Remove the:
a) Side cover
b) 2.5 inch hard drive assembly
3. To remove the M.2 PCIe SSD:
a) Remove the single (M2X3.5) screw that secures the M.2 PCIe SSD to the system board [1].
b) Lift and pull out the PCIe SSD from its connector on the system board [2].
34 Removing and installing components
Installing the M.2 PCIe SSD
NOTE: The instructions are applicable to M.2 SATA SSD also.
1. To install M.2 PCIe SSD:
a) Insert the M.2 PCIe SSD to the connector in the system board [1].
b) Replace the single (M2X3.5) screw that secures the M.2 PCIe SSD to the system board [2].
Removing and installing components 35
2. Install the:
a) 2.5 inch hard drive assembly
b) Side cover
3. Follow the procedure in After working inside your computer.
Coin-cell battery
Removing coin cell battery
1. Follow the procedure in Before working inside your computer.
2. Remove the:
a) Side cover
3. To remove the coin cell battery:
a) Press the release latch until the coin cell battery pops out [1].
b) Remove the coin cell battery from the system board [2].
36 Removing and installing components
Installing coin cell battery
1. To install the coin cell battery:
a) Hold the coin cell battery with the "+" sign facing up and slide it under the securing tabs at the positive side of the connector on
the system board [1].
b) Press the battery into the connector until it locks into place [2].
Removing and installing components 37
2. Install the
a) Side cover
3. Follow the procedure in After working inside your computer.
Optional module
Removing optional module
1. Follow the procedure in Before working inside your computer.
2. Remove the :
a) Side cover
b) 2.5 inch hard drive assembly
3. To remove the optional card:
a) Disconnect the optional-card cable from the connector on the system board [1].
b) Remove the two (M2X3.5) screws and two screws that secure the optional card to the system chassis [2, 3].
38 Removing and installing components
c) Pull and lift the optional card away from the system.
Removing and installing components 39
Installing optional module
1. To install the optional card:
a) Place and align the optional card to its place in the system.
b) Replace the two (M2X3.5) screws and two screws to secure the optional card to the system chassis [1,2]
c) Connect the optional card cable to the connector in the system board [3].
40 Removing and installing components
2. Install the:
a) Side cover
b) 2.5 inch hard drive assembly
3. Follow the procedure in After working inside your computer.
System board
Removing system board
1. Follow the procedure in Before working inside your computer.
2. Remove the:
a) Side cover
b) 2.5 hard drive assembly
c) Heat sink blower
d) WLAN
e) M.2 PCIe SSD
f) Memory module
g) Optional module
h) Heat sink
i) Processor
3. To remove the HDD caddy support:
a) Remove the screw that secures the HDD caddy support to the system board [1].
b) Lift the HDD caddy support away from the system board [2].
Removing and installing components 41
4. To remove the system board:
a) Remove the two (M3x4) screws [1] and three (6-32x5.4) screws [2] that secure the system board to the system.
b) Lift the system board to disengage the connectors from the back of the computer [1].
42 Removing and installing components
c) Slide the system board away from the computer [2].
Installing system board
1. To install the system board:
a) Hold the system board by its edges and angle it towards the back of the system.
b) Lower the system board into the system until the connectors at the back of the system board align with the slots on the chassis,
and the screw holes on the system board align with the standoffs on the system [1,2].
Removing and installing components 43
c) Replace the two (M3x4) screws [1] and three (6-32x5.4) screws [2] to secure the system board to the system.
d) Place the HDD caddy support on the system board [1].
44 Removing and installing components
e) Replace the screw that secures the HDD caddy support to the system board [2].
2. Install the:
a) Processor
b) Heat sink
c) Memory module
d) Optional module
e) M.2 PCIe SSD
f) WLAN
g) Heat sink blower
h) 2.5 inch hard drive assembly
i) Side cover
3. Follow the procedure in After working inside your computer.
Removing and installing components 45
Troubleshooting
Enhanced Pre-Boot System Assessment — ePSA
diagnostics
The ePSA diagnostics (also known as system diagnostics) performs a complete check of your hardware. The ePSA is embedded with the
BIOS and is launched by the BIOS internally. The embedded system diagnostics provides a set of options for particular devices or device
groups allowing you to:
The ePSA diagnostics can be initiated by the FN+PWR buttons while powering on the computer.
• Run tests automatically or in an interactive mode
• Repeat tests
• Display or save test results
• Run thorough tests to introduce additional test options to provide extra information about the failed device(s)
• View status messages that inform you if tests are completed successfully
• View error messages that inform you of problems encountered during testing
NOTE: Some tests for specific devices require user interaction. Always ensure that you are present at the computer
terminal when the diagnostic tests are performed.
Running the ePSA Diagnostics
Invoke diagnostics boot by either of the methods that are suggested below:
1. Power on the computer.
2. As the computer boots, press the F12 key when the Dell logo is displayed.
3. In the boot menu screen, use Up/Down arrow key to select the Diagnostics option and then press Enter.
NOTE: The Enhanced Pre-boot System Assessment window displays, listing all devices detected in the computer.
The diagnostics starts running the tests on all the detected devices.
4. Press the arrow in the lower-right corner to go to the page listing.
The detected items are listed and tested.
5. To run a diagnostic test on a specific device, press Esc and click Yes to stop the diagnostic test.
6. Select the device from the left pane and click Run Tests.
7. If there are any issues, error codes are displayed.
Note the error code and contact Dell.
Diagnostics
The computer POST (Power On Self Test) ensures that it meets the basic computer requirements and the hardware is working
appropriately before the boot process begins. If the computer passes the POST, the computer continues to start in a normal mode.
However, if the computer fails the POST, the computer emits a series of LED codes during the start-up. The system LED is integrated on
the Power button.
The following table shows different light patterns and what they indicate.
Table 3. Power LED summary
Amber LED state White LED state System state Notes
Off Off S4, S5 • Hibernate or Suspend to Disk
(S4)
• Power is off (S5)
4
46 Troubleshooting
Amber LED state White LED state System state Notes
Off Blinking S1, S3 System is in a low power state,
either S1 or S3. This does not
indicate a fault condition.
Previous State Previous State S3, no PWRGD_PS This entry provides for the
possibility of a delay from
SLP_S3# active to PWRGD_PS
inactive.
Blinking Off S0, no PWRGD_PS Boot Failure - The computer is
receiving electrical power, and
power supplied by the power
supply is normal. A device might
be malfunctioning or incorrectly
installed. Refer to the table
below for Amber Blinking
Pattern diagnostics suggestion
and possible failures.
Steady Off S0, no PWRGD_PS, Code fetch
= 0
Boot Failure - This is a system
fault error condition, including
the power supply. Only the
+5VSB rail on the power supply
is working correctly.
Off Steady S0, no PWRGD_PS, Code fetch
= 1
This indicates that the host
BIOS has started to execute and
the LED register is now writable.
Table 4. Amber LED blinking failures
Amber LED state White LED state System state Notes
2 1 Bad MBD Bad MBD - Rows A, G, H, and J
from table 12.4 of SIO Spec -
Pre-Post indicators [40]
2 2 Bad MB, PSU or cabling Bad MBD, PSU or PSU cabling -
Rows B, C and D of table 12.4
SIO spec [40]
2 3 Bad MBD, DIMMS, or CPU Bad MBD, DIMMS or CPU -
Rows F and K from table 12.4 of
SIO spec [40]
2 4 Bad coin cell Bad coin cell - Row M of table
12.4 in SIO spec [40]
Table 5. States Under Host BIOS Control
Amber LED state White LED state System state Notes
2 5 BIOS state 1 BIOS Post code (Old LED
pattern 0001) Corrupt BIOS.
2 6 BIOS state 2 BIOS Post code (Old LED
pattern 0010) CPU config or
CPU failure.
2 7 BIOS state 3 BIOS Post code (Old LED
pattern 0011) MEM config in
process. Appropriate mem
modules detected but failure has
occurred.
Troubleshooting 47
Amber LED state White LED state System state Notes
3 1 BIOS state 4 BIOS Post code (Old LED
pattern 0100) Combine PCI
device config or failure with
video sub sytem config or failure.
BIOS to eliminate 0101 video
code.
3 2 BIOS state 5 BIOS Post code (Old LED
pattern 0110) Combine storage
and USB config or failure. BIOS
to eliminate 0111 USB code.
3 3 BIOS state 6 BIOS Post code (Old LED
pattern 1000) MEM config, no
memory detected.
3 4 BIOS state 7 BIOS Post code (Old LED
pattern 1001) Fatal Motherboard
error.
3 5 BIOS state 8 BIOS Post code (Old LED
pattern 1010) Mem config,
modules incompatible or invalid
config.
3 6 BIOS state 9 BIOS Post code (Old LED
pattern 1011) combine "Other
pre-video activity and resource
configuration codes. BIOS to
eliminate 1100 code.
3 7 BIOS state 10 BIOS Post code (Old LED
pattern 1110) Other pre-post
activity, routine subsequent to
video init.
Diagnostic error messages
Table 6. Diagnostic error messages
Error messages Description
AUXILIARY DEVICE FAILURE The touchpad or external mouse may be faulty. For an external
mouse, check the cable connection. Enable the Pointing Device
option in the System Setup program.
BAD COMMAND OR FILE NAME Ensure that you have spelled the command correctly, put spaces in
the proper place, and used the correct path name.
CACHE DISABLED DUE TO FAILURE The primary cache internal to the microprocessor has failed.
Contact Dell
CD DRIVE CONTROLLER FAILURE The optical drive does not respond to commands from the
computer.
DATA ERROR The hard drive cannot read the data.
DECREASING AVAILABLE MEMORY One or more memory modules may be faulty or improperly seated.
Reinstall the memory modules or, if necessary, replace them.
DISK C: FAILED INITIALIZATION The hard drive failed initialization. Run the hard drive tests in Dell
Diagnostics.
DRIVE NOT READY The operation requires a hard drive in the bay before it can
continue. Install a hard drive in the hard drive bay.
48 Troubleshooting
Error messages Description
ERROR READING PCMCIA CARD The computer cannot identify the ExpressCard. Reinsert the card
or try another card.
EXTENDED MEMORY SIZE HAS CHANGED The amount of memory recorded in non-volatile memory (NVRAM)
does not match the memory module installed in the computer.
Restart the computer. If the error appears again, Contact Dell
THE FILE BEING COPIED IS TOO LARGE FOR THE
DESTINATION DRIVE
The file that you are trying to copy is too large to fit on the disk, or
the disk is full. Try copying the file to a different disk or use a larger
capacity disk.
A FILENAME CANNOT CONTAIN ANY OF THE FOLLOWING
CHARACTERS: \ / : * ? " < > | -
Do not use these characters in filenames.
GATE A20 FAILURE A memory module may be loose. Reinstall the memory module or, if
necessary, replace it.
GENERAL FAILURE The operating system is unable to carry out the command. The
message is usually followed by specific information. For example,
Printer out of paper. Take the appropriate
action.
HARD-DISK DRIVE CONFIGURATION ERROR The computer cannot identify the drive type. Shut down the
computer, remove the hard drive, and boot the computer from an
optical drive. Then, shut down the computer, reinstall the hard
drive, and restart the computer. Run the Hard Disk Drive tests in
Dell Diagnostics.
HARD-DISK DRIVE CONTROLLER FAILURE 0 The hard drive does not respond to commands from the computer.
Shut down the computer, remove the hard drive, and boot the
computer from an optical drive. Then, shut down the computer,
reinstall the hard drive, and restart the computer. If the problem
persists, try another drive. Run the Hard Disk Drive tests in Dell
Diagnostics.
HARD-DISK DRIVE FAILURE The hard drive does not respond to commands from the computer.
Shut down the computer, remove the hard drive, and boot the
computer from an optical drive. Then, shut down the computer,
reinstall the hard drive, and restart the computer. If the problem
persists, try another drive. Run the Hard Disk Drive tests in Dell
Diagnostics.
HARD-DISK DRIVE READ FAILURE The hard drive may be defective. Shut down the computer, remove
the hard drive, and boot the computer from an optical. Then, shut
down the computer, reinstall the hard drive, and restart the
computer. If the problem persists, try another drive. Run the Hard
Disk Drive tests in Dell Diagnostics.
INSERT BOOTABLE MEDIA The operating system is trying to boot to non-bootable media, such
as an optical drive. Insert bootable media.
INVALID CONFIGURATION INFORMATION-PLEASE RUN
SYSTEM SETUP PROGRAM
The system configuration information does not match the
hardware configuration. The message is most likely to occur after a
memory module is installed. Correct the appropriate options in the
system setup program.
KEYBOARD CLOCK LINE FAILURE For external keyboards, check the cable connection. Run the
Keyboard Controller test in Dell Diagnostics.
KEYBOARD CONTROLLER FAILURE For external keyboards, check the cable connection. Restart the
computer, and avoid touching the keyboard or the mouse during
the boot routine. Run the Keyboard Controller test in Dell
Diagnostics.
KEYBOARD DATA LINE FAILURE For external keyboards, check the cable connection. Run the
Keyboard Controller test in Dell Diagnostics.
Troubleshooting 49
Error messages Description
KEYBOARD STUCK KEY FAILURE For external keyboards or keypads, check the cable connection.
Restart the computer, and avoid touching the keyboard or keys
during the boot routine. Run the Stuck Key test in Dell
Diagnostics.
LICENSED CONTENT IS NOT ACCESSIBLE IN
MEDIADIRECT
Dell MediaDirect cannot verify the Digital Rights Management
(DRM) restrictions on the file, so the file cannot be played.
MEMORY ADDRESS LINE FAILURE AT ADDRESS, READ
VALUE EXPECTING VALUE
A memory module may be faulty or improperly seated. Reinstall the
memory module or, if necessary, replace it.
MEMORY ALLOCATION ERROR The software you are attempting to run is conflicting with the
operating system, another program, or a utility. Shut down the
computer, wait for 30 seconds, and then restart it. Run the
program again. If the error message still appears, see the software
documentation.
MEMORY DOUBLE WORD LOGIC FAILURE AT ADDRESS,
READ VALUE EXPECTING VALUE
A memory module may be faulty or improperly seated. Reinstall the
memory module or, if necessary, replace it.
MEMORY ODD/EVEN LOGIC FAILURE AT ADDRESS, READ
VALUE EXPECTING VALUE
A memory module may be faulty or improperly seated. Reinstall the
memory module or, if necessary, replace it.
MEMORY WRITE/READ FAILURE AT ADDRESS, READ
VALUE EXPECTING VALUE
A memory module may be faulty or improperly seated. Reinstall the
memory module or, if necessary, replace it.
NO BOOT DEVICE AVAILABLE The computer cannot find the hard drive. If the hard drive is your
boot device, ensure that the drive is installed, properly seated, and
partitioned as a boot device.
NO BOOT SECTOR ON HARD DRIVE The operating system may be corrupted, Contact Dell.
NO TIMER TICK INTERRUPT A chip on the system board may be malfunctioning. Run the
System Set tests in Dell Diagnostics.
NOT ENOUGH MEMORY OR RESOURCES. EXIT SOME
PROGRAMS AND TRY AGAIN
You have too many programs open. Close all windows and open the
program that you want to use.
OPERATING SYSTEM NOT FOUND Reinstall the operating system. If the problem persists, Contact
Dell.
OPTIONAL ROM BAD CHECKSUM The optional ROM has failed. Contact Dell.
SECTOR NOT FOUND The operating system cannot locate a sector on the hard drive. You
may have a defective sector or corrupted File Allocation Table
(FAT) on the hard drive. Run the Windows error-checking utility to
check the file structure on the hard drive. See Windows Help and
Support for instructions (click Start > Help and Support). If a
large number of sectors are defective, back up the data (if
possible), and then format the hard drive.
SEEK ERROR The operating system cannot find a specific track on the hard
drive.
SHUTDOWN FAILURE A chip on the system board may be malfunctioning. Run the
System Set tests in Dell Diagnostics. If the message reappears,
Contact Dell.
TIME-OF-DAY CLOCK LOST POWER System configuration settings are corrupted. Connect your
computer to an electrical outlet to charge the battery. If the
problem persists, try to restore the data by entering the System
Setup program, then immediately exit the program. If the message
reappears, Contact Dell.
TIME-OF-DAY CLOCK STOPPED The reserve battery that supports the system configuration
settings may require recharging. Connect your computer to an
electrical outlet to charge the battery. If the problem persists,
Contact Dell.
50 Troubleshooting
Error messages Description
TIME-OF-DAY NOT SET-PLEASE RUN THE SYSTEM SETUP
PROGRAM
The time or date stored in the system setup program does not
match the system clock. Correct the settings for the Date and
Time options.
TIMER CHIP COUNTER 2 FAILED A chip on the system board may be malfunctioning. Run the
System Set tests in Dell Diagnostics.
UNEXPECTED INTERRUPT IN PROTECTED MODE The keyboard controller may be malfunctioning, or a memory
module may be loose. Run the System Memory tests and the
Keyboard Controller test in Dell Diagnostics or Contact Dell.
X:\ IS NOT ACCESSIBLE. THE DEVICE IS NOT READY Insert a disk into the drive and try again.
System error messages
Table 7. System error messages
System message Description
Alert! Previous attempts at booting this system
have failed at checkpoint [nnnn]. For help in
resolving this problem, please note this
checkpoint and contact Dell Technical Support
The computer failed to complete the boot routine three
consecutive times for the same error.
CMOS checksum error RTC is reset, BIOS Setup default has been loaded.
CPU fan failure CPU fan has failed.
System fan failure System fan has failed.
Hard-disk drive failure Possible hard disk drive failure during POST.
Keyboard failure Keyboard failure or loose cable. If reseating the cable does not
solve the problem, replace the keyboard.
No boot device available No bootable partition on hard disk drive, the hard disk drive cable is
loose, or no bootable device exists.
• If the hard drive is your boot device, ensure that the cables are
connected and that the drive is installed properly and
partitioned as a boot device.
• Enter system setup and ensure that the boot sequence
information is correct.
No timer tick interrupt A chip on the system board might be malfunctioning or
motherboard failure.
NOTICE - Hard Drive SELF MONITORING SYSTEM has
reported that a parameter has exceeded its
normal operating range. Dell recommends that
you back up your data regularly. A parameter
out of range may or may not indicate a
potential hard drive problem
S.M.A.R.T error, possible hard disk drive failure.
Troubleshooting 51
Getting help
Topics:
•Contacting Dell
Contacting Dell
NOTE: If you do not have an active Internet connection, you can find contact information on your purchase invoice,
packing slip, bill, or Dell product catalog.
Dell provides several online and telephone-based support and service options. Availability varies by country and product, and some services
may not be available in your area. To contact Dell for sales, technical support, or customer service issues:
1. Go to Dell.com/support.
2. Select your support category.
3. Verify your country or region in the Choose a Country/Region drop-down list at the bottom of the page.
4. Select the appropriate service or support link based on your need.
5
52 Getting help