Table of Contents
Seagate ZP500GM30013 User Manual
Displayed below is the user manual for ZP500GM30013 by Seagate which is a product in the Internal Solid State Drives category. This manual has pages.
Related Manuals
Seagate® FireCuda® 530 SSD
Product Manual
Form Factor User Capacity Standard Models Heatsink Models
M.2 2280-S2 500 GB ZP500GM300013 ZP500GM30023
1000 GB ZP1000GM300013 ZP1000GM30023
M.2 2280-D2 2000 GB ZP2000GM300013 ZP2000GM30023
4000 GB ZP4000GM300013 ZP4000GM30023
200432500, Rev D
October 2021
© 2021, Seagate Technology LLC All rights reserved. Publication number: 200432500, Rev D, October 2021
Seagate Technology reserves the right to make changes to the product(s) or information disclosed herein at any time without notice.
Seagate, Seagate Technology and the Spiral logo are registered trademarks of Seagate Technology LLC in the United States and/or other countries. Nytro and SeaTools are either trademarks or registered trademarks of
Seagate Technology LLC or one of its affiliated companies in the United States and/or other countries. All other trademarks or registered trademarks are the property of their respective owners.
No part of this publication may be reproduced in any form without written permission of Seagate Technology LLC. Call 877-PUB-TEK1(877-782-8351) to request permission.
The NVMe word mark and/or NVMExpress design mark are trademarks of NVMExpress, Inc. The PCIe word mark and/or PCIExpress design mark are registered trademarks and/or service marks of PCI-SIG.
When referring to drive capacity, one gigabyte, or GB, equals one billion bytes and one terabyte, or TB, equals one trillion bytes. Your computer’s operating system may use a different standard of measurement and report
a lower capacity. In addition, some of the listed capacity is used for formatting and other functions, and thus will not be available for data storage. Actual quantities will vary based on various factors, including file size, file
format, features and application software. Actual data rates may vary depending on operating environment and other factors. The export or re-export of hardware or software containing encryption may be regulated by
the U.S. Department of Commerce, Bureau of Industry and Security (for more information, visit www.bis.doc.gov), and controlled for import and use outside of the U.S. Seagate reserves the right to change, without notice,
product offerings or specifications.
Revision History
Version and Date Description of Changes
Rev D, October 2021 Updated Section 2, Performance.
Rev C, August 2021 Updated the document throughout to add S2 models, and in particular new drawings of drives with
heatsinks.
Rev B, May 2021 Updated the document throughout to add models with heatsinks, different specifications, drawings, and
instructions.
Rev A, December 2020 First document release.
Seagate FireCuda 530 SSD Product Manual, Rev D 3
Contents
Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1.1 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.1 Models and Capacity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.2 Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.3 Power Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.4 Environmental Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.5 Reliability/Endurance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3. Mechanical Dimensions and Drawings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4. Pin and Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
5. NVMe Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
6. SMART Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
6.1 SMART Attributes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
7. Feature Details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
7.1 Flash Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
7.1.1 Error Correction Code (ECC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
7.1.2 Wear Leveling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
7.1.3 Bad Block Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
7.1.4 TRIM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
7.1.5 SMART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
7.1.6 Over Provisioning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
7.1.7 Firmware Upgrade . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
7.1.8 Thermal Throttling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
7.2 Advanced Device Security Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
7.2.1 NVMe format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
7.2.2 Sanitize Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
7.3 SSD Lifetime Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
7.3.1 Total Bytes Written (TBW) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
7.3.2 Media Wear Indicator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
7.3.3 Read Only Mode (End of Life) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
7.4 An Adaptive Approach to Performance Tuning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
7.4.1 Throughput . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
7.4.2 Predict & Fetch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
7.4.3 SLC Caching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
8. Safety, Standards, and Compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
8.1 Regulatory Model Numbers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
9. FireCuda 530 Installation Precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Contents
Seagate FireCuda 530 SSD Product Manual, Rev D 4
9.1 FireCuda 530 SSD Handling Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
9.2 FireCuda 530 SSD Installation Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
9.3 Heatsink Disclosures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Seagate FireCuda 530 SSD Product Manual, Rev D 5
Support
For Internal SSD Support, visit: https://www.seagate.com/support/products/
For Firmware Download and Tools Download for Secure Erase, visit: https://www.seagate.com/support/downloads/
For information regarding online support and services, visit: http://www.seagate.com/contacts/
For information regarding Warranty Support, visit: http://www.seagate.com/support/warranty-and-replacements/
For information regarding data recovery services, visit:
http://www.seagate.com/services-software/seagate-recovery-services/recover/
For Seagate OEM and Distribution partner and Seagate reseller portal, visit: http://www.seagate.com/partners
Seagate FireCuda 530 SSD Product Manual, Rev D 6
www.seagate.com
1. Introduction
The Seagate® FireCuda® 530 SSD is a versatile NVMe SSD with PCIe Gen4 x4 interface. It is up to 12x faster than SATA
SSDs and delivers Ultra-fast performance and enhanced endurance for long term use.
Table 1 The FireCuda 530 SSD Features
Feature Description
Capacity
(User)
500 GB, 1000 GB, 2000 GB, 4000 GB
Certifications,
Eco-Compliance
CE, UL, FCC, BSMI, KCC, Microsoft WHQL, VCCI, CB
RoHS
Dimensions 500 GB, 1000 GB
Length, Max 80.15 mm
Width, Max 22.15 mm
Height, Max 2.23 mm
2000 GB, 4000 GB
Length, Max 80.15 mm
Width, Max 22.15 mm
Height, Max 3.58 mm
With heatsink
Length, Max 24.50 mm
Height, Max 11.04 mm
Form Factor M2 2280-S2-M
M2 2280-D2-M
Weight 500 GB: 7.7 g
1000 GB: 8.1 g
2000 GB: 10.0 g
4000 GB: 10.6 g
With heatsink
47 g (max)
Endurance Total Bytes Written
500 GB: 640 TB
1000 GB: 1275 TB
2000 GB: 2550 TB
4000 GB: 5100 TB
See Section 2.5, Reliability/Endurance.
Interface
Compliance
NVMe 1.4
PCI Express Base 4.0, PCIe Gen 4 x 4 lane, and backward compatible to PCIe Gen3, Gen 2, and Gen 1
NAND TLC
Operating
Systems
Windows 10 (64 bit)
Ubuntu 16.04, 18.04
CentOS 6, 7
Performance
Random
Read: Up to 1,000,000 IOPS
Write: Up to 1,000,000 IOPS
Actual performance might vary depending on
use conditions and environment.
See Section 2.2, Performance.
Performance
Sequential
Read: Up to 7300MB/s
Write: Up to 6900MB/s
Actual performance might vary depending on
the capacity, use conditions and environment.
See Section 2.2, Performance.
Seagate FireCuda 530 SSD Product Manual, Rev D 7
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1.1 References
In case of conflict between this document and the following reference documents, this document takes precedence.
PCIe Specifications
—PCIe - PCI Express Electromechanical specification, revision 4.0
—NVMe - Non Volatile Memory Express specification 1.4
—PCIe CEM - PCI Express Card Electromechanical specification, revision 1.1
—PCI Express M.2 Specification, revision 1.1
Seagate Downloads are available on the Seagate Support page here:
https://www.seagate.com/support/
Power
Consumption
Active Power, Average: <8.6.0 W
Idle Power PS3, Average: <30 mW
Low Power L1.2 mode: < 5 mW
See Section 2.3, Power Consumption.
Power
Management
Supports ActiveStatePower Management (ASPM)
Supports Autonomous Power StateTransition (APST)
Supports L1.2
Reliability End-to-end data path protection
MTBF: 1.9 million hours
UBER: 1 error in 1016 bits read
Shock and
Vibration
Shock
Non-Operating: 1,500 G, at 0.5 ms
See Section 2.4, Environmental
Conditions.
Vibration
Non-Operating: 1.52 GRMS, (20 to 80 Hz,
Frequency)
Temperature
Range
Operating: 0°C to 70°C
Non-operating: -40°C to 85°C
Voltage Min = 3.14V±5%
Max = 3.47V±5%
Warranty Five years, or when the device reaches Host TBW, whichever happens first. Endurance rating valid for SSD
Life Remaining > 1%.
Table 1 The FireCuda 530 SSD Features (continued)
Feature Description
Seagate FireCuda 530 SSD Product Manual, Rev D 8
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2. Specifications
2.1 Models and Capacity
NOTE About capacity:
Sector Size: 512 Bytes (default) and 4K
User-addressable LBA count = (97696368) + (1953504 x (Desired Capacity
in Gb-50.0)) From International Disk Drive Equipment and Materials
Association (IDEMA) (LBA1-03_standard.doc)
2.2 Performance
NOTE About performance:
Fresh out of box (FOB) performance obtained on newly formatted drive.
Performance may vary based on the SSD’s firmware version, system
hardware, and configuration.
Performance is based on AMD Gen4 X570 + 8 Core CPU + 16 GB of DDR4
(3200mHz).
CrystalDiskMark 7.0.0, 1GB range, QD=16, Thread=1 (Default Affinity
enabled).
Table 2 Models and Capacity
User Capacity Standard
Models
Heatsink
Models
500 GB ZP500GM300013 ZP500GM30023
1000 GB ZP1000GM300013 ZP1000GM30023
2000 GB ZP2000GM300013 ZP2000GM30023
4000 GB ZP4000GM300013 ZP4000GM30023
Table 3 Random and Sequential Read and Write Performance
Capacity
CrystalDiskMark
Read
(MB/s)
Write
(MB/s)
Read
(IOPS)
Write
(IOPS)
500 GB 7000 3000 400,000 700,000
1000 GB 7300 6000 800,000 1,000,000
2000 GB 7300 6900 1,000,000 1,000,000
4000 GB 7250 6900 1,000,000 1,000,000
Seagate FireCuda 530 SSD Product Manual, Rev D 9
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Sequential Read/Write is measured while testing 1000 MB five times by
CrystalDiskMark.
2.3 Power Consumption
NOTE About power consumption:
The average value of power consumption is based on 100% conversion
efficiency.
Based on SU6SExxx-series under ambient temperature.
Use CrystalDiskMark 6.0.2 x64 1GB Range, QD128, Thread=1. Measuring
power consumption during sequential Read and sequential Write.
The measured power voltage is 3.3 V.
Measured under ambient temperature.
Power Consumption can differ with flash configuration and platform.
Power consumption during read and write operation is measured on
Gen4 X570 + 8 Core CPU.
Table 4 Power Consumption
Capacity
Power Consumption
Max Avg
Read
(W)
Max Avg
Write
(W)
Idle PS3
(mW)
L1.2
(mW)
500 GB 6 5 15 5
1000 GB 6.3 6.4 20 5
2000 GB 7.8 7.3 25 5
4000 GB 8.6 8.2 30 5
Seagate FireCuda 530 SSD Product Manual, Rev D 10
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2.4 Environmental Conditions
NOTE Temperature is measured without condensation. Operating mode
temperature is measured by temperature sensor, SMART Attribute.
Airflow is suggested. Airflow allows the device to be operated at the
appropriate temperature for each component during heavy workloads
environments.
Shock and vibration results assume that the SSD is mounted securely with
the input vibration applied to the SSD mounting. These specifications do not
cover connection issues that may result from testing at this level. The
measured specification is in root mean square (RMS) form.
Non-operating Shock. The limits of non-operating shock applies to all
conditions of handling and transportation. This includes both isolated
SSD and integrated SSDs. Shock may be applied in the X, Y, or Z-axis.
Non-Operating Vibration. The limits of non-operating vibration shall
apply to all conditions of handling and transportation. This includes both
isolated SSD and integrated SSDs. Vibration may be applied in the X, Y, or
Z-axis.
Table 5 Temperature, Humidity, Shock
Specification Value
Temperature
Operating (case temperature at specific airflow)
Non-operating
0°C to 70°C
-40°C to 85°C
Humidity
Operating
Non-operating (storage)
90%
93%
Shock
Non-operating 1,500 G, duration 0.5 ms
Vibration
Non-operating 1.52 GRMS, (20Hz to 80Hz, Frequency)
Seagate FireCuda 530 SSD Product Manual, Rev D 11
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2.5 Reliability/Endurance
NOTE About endurance:
The SSD achieves the specified MTBF in an operational environment that
complies with the operational temperature range specified in this manual.
Operating temperatures are measured by temperature sensor.
Endurance rating valid for SSD Life Remaining > 1%.
Table 6 Reliability/Endurance
Specification Value
Mean time between failures (MTBF) 1.9 million hours
Bit Error Rate 1 error in 1016 bits read
Endurance Total Bytes Written
500 GB: 640 TB
1000 GB: 1275 TB
2000 GB: 2550 TB
4000 GB: 5100 TB
Seagate FireCuda 530 SSD Product Manual, Rev D 12
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3. Mechanical Dimensions and Drawings
This section includes, weight, dimensions, and mechanical drawings.
Figure 1 FireCuda 530 SSD M2 2280-D2-M Top View
Table 7 FireCuda 530 SSD Weight and Dimensions
Capacity Weight (g) Length
(Max)
Width
(Max)
Height
(Max)
500 GB 7.7
80.15 mm 22.15 mm
2.23 mm
1000 GB 8.1
2000 GB 10.0 3.58 mm
4000 GB 10.6
Table 8 FireCuda 530 SSD with Heatsink Weight and Dimensions
Capacity Weight (g) Length
(Max)
Width
(Max)
Height
(Max)
500 GB 47.0
80.15 mm 24.50 mm
9.84 mm
1000 GB 47.0
2000 GB 44.2 10.39 mm
4000 GB 46.2 11.04 mm
Seagate FireCuda 530 SSD Product Manual, Rev D 13
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Figure 2 FireCuda 530 SSD M2 2280-D2-M Side View
Figure 3 FireCuda 530 SSD M2 2280-D2-M Bottom View
Seagate FireCuda 530 SSD Product Manual, Rev D 14
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Figure 4 FireCuda 530 SSD M2 2280-S2-M Top View
Figure 5 FireCuda 530 SSD M2 2280-S2-M Side View
Seagate FireCuda 530 SSD Product Manual, Rev D 15
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Figure 6 FireCuda 530 SSD M2 2280-S2-M Bottom View
Figure 7 FireCuda 530 SSDs with Heatsink (500 GB and 1000 GB)
Seagate FireCuda 530 SSD Product Manual, Rev D 16
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Figure 8 FireCuda 530 SSDs with Heatsink (2000 GB)
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Figure 9 FireCuda 530 SSDs with Heatsink (4000 GB)
Seagate FireCuda 530 SSD Product Manual, Rev D 18
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4. Pin and Signal Descriptions
Table 9 Pin Descriptions
Pin No. PCIe Pin Description
1GND
CONFIG_3 = GND
23.3V
3.3V source
3GND
Ground
43.3V
3.3V source
5PETn3
PCIe TX Differential signal defined by the PCI Express M.2 spec
6N/C
No connect
7PETp3
PCIe TX Differential signal defined by the PCI Express M.2 spec
8N/C
No connect
9GND
Ground
10 LED1#
Open drain, active low signal. These signals are used to allow the add- in card to provide status
indicators via LED devices that will be provided by the system.
11 PERn3 PCIe RX Differential signal defined by the PCI Express M.2 spec
12 3.3V 3.3V source
13 PERp3 PCIe RX Differential signal defined by the PCI Express M.2 spec
14 3.3V 3.3V source
15 GND Ground
16 3.3V 3.3V source
17 PETn2 PCIe TX Differential signal defined by the PCI Express M.2 spec
18 3.3V 3.3V source
19 PETp2 PCIe TX Differential signal defined by the PCI Express M.2 spec
20 N/C No connect
21 GND Ground
22 N/C No connect
23 PERn2 PCIe RX Differential signal defined by the PCI Express M.2 spec
24 N/C No connect
25 PERp2 PCIe RX Differential signal defined by the PCI Express M.2 spec
26 N/C No connect
27 GND Ground
28 N/C No connect
29 PETn1 PCIe TX Differential signal defined by the PCI Express M.2 spec
30 N/C No connect
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31 PETp1 PCIe TX Differential signal defined by the PCI Express M.2 spec
32 N/C No connect
33 GND Ground
34 N/C No connect
35 PERn1 PCIe RX Differential signal defined by the PCI Express M.2 spec
36 N/C No connect
37 PERp1 PCIe RX Differential signal defined by the PCI Express M.2 spec
38 N/C No connect
39 GND Ground
40 SMB_CLK (I/O)(0/1.8V) SMBus Clock; Open Drain with pull-up on platform
41 PETn0 PCIe TX Differential signal defined by the PCI Express M.2 spec
42 SMB_DATA (I/O)(0/1.8V) SMBus Data; Open Drain with pull-up on platform.
43 PETp0 PCIe TX Differential signal defined by the PCI Express M.2 spec
44 ALERT#(O) (0/1.8V)
Alert notification to master; Open Drain with pull-up on platform;
Active low.
45 GND Ground
46 N/C No connect
47 PERn0 PCIe RX Differential signal defined by the PCI Express M.2 spec
48 N/C No connect
49 PERp0 PCIe RX Differential signal defined by the PCI Express M.2 spec
50 PERST#(I)(0/3.3V)
PE-Reset is a functional reset to the card as defined by the PCIe Mini
CEM specification.
51 GND Ground
52 CLKREQ#(I/O)(0/3.3V)
Clock Request is a reference clock request signal as defined by the
PCIe Mini CEM specification; Also used by L1 PM Sub-states.
53 REFCLKn
PCIe Reference Clock signals (100 MHz)
defined by the PCI Express M.2 spec.
54 PEWAKE#(I/O)(0/3.3V)
PCIe PME Wake.
Open Drain with pull up on platform; Active Low.
55 REFCLKp
PCIe Reference Clock signals (100 MHz)
defined by the PCI Express M.2 spec.
56 Reserved for MFG DATA
Manufacturing Data line. Used for SSD manufacturing only.
Not used in normal operation.
Pins should be left N/C in platform Socket.
Table 9 Pin Descriptions (continued)
Pin No. PCIe Pin Description
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57 GND Ground
58 Reserved for MFG
CLOCK
Manufacturing Clock line. Used for SSD manufacturing only.
Not used in normal operation.
Pins should be left N/C in platform Socket.
59 Module Key M
Module Key
60 Module Key M
61 Module Key M
62 Module Key M
63 Module Key M
64 Module Key M
65 Module Key M
66 Module Key M
67 N/C No connect
68 SUSCLK(32KHz)
(I)(0/3.3V)
32.768 kHz clock supply input that is provided by the platform chipset to reduce power and cost
for the module.
69 N/C PEDET (NC-PCIe)
70 3.3V 3.3V source
71 GND Ground
72 3.3V 3.3V source
73 GND Ground
74 3.3V 3.3V source
75 GND Ground
Table 9 Pin Descriptions (continued)
Pin No. PCIe Pin Description
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5. NVMe Commands
Table 10 Admin Commands
Identifier O/M Command Description Supported
00h M Delete I/O Submission Queue Supported
01h M Create I/O Submission Queue Supported
02h M Get Log Page Supported
04h M Delete I/O Completion Queue Supported
05h M Create I/O Completion Queue Supported
06h M Identify Supported
08h M Abort Supported
09h M Set Feature Supported
0Ah M Get Feature Supported
0Ch M Asynchronous Event Request Supported
10h O Firmware Commit Supported
11h O Firmware Image Download Supported
14h O Device Self-test Supported
80h O Format NVM Supported
81h O Security Send Supported
82h O Security Receive Supported
84h O Sanitize Supported
Table 11 I/O Commands
Identifier O/M Command Description Supported
00h O Flush Supported
01h O Write Supported
02h O Read Supported
04h O Write Uncorrectable Not Supported
05h O Compare Supported
08h O Write Zeroes Supported
09h O Dataset Management Supported
Table 12 Set Feature Commands
Identifier O/M Command Description Supported
00h Reserved
01h MArbitration Supported
02h M Power Management Supported
03h O LBA Range Type Not Supported
04h M Temperature Threshold Supported
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05h M Error Recovery Supported
06h O Volatile Write Cache Supported
07h M Number Of Queues Supported
08h M Interrupt Coalescing Supported
09h M Interrupt Vector Configuration Supported
0Ah M Write Atomicity Normal Supported
0Bh M Asynchronous Event Configuration Supported
0Ch O Autonomous Power State Transition Supported
0Dh O Host Memory Buffer Not Supported
0Eh O Timestamp Supported
10h O Host Controlled Thermal Management Supported
11h O Non-Operational Power State Config Supported
0Eh - 7Dh Reserved
80h O Software Progress Marker Supported
Table 13 Get Log Page Commands
Identifier O/M Command Description Supported
00h Reserved
01h MError Information Supported
02h M SMART / Health Information Supported
03h M Firmware Slot Information Supported
04h O Changed Namespace List Supported
06h O Device Self-test Supported
09h - 7Fh Reserved
81h O Sanitize Status Supported
82h - FFh Reserved
Table 12 Set Feature Commands
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6. SMART Support
The FireCuda 530 SSD supports the SMART command set.
6.1 SMART Attributes
The following table lists SMART Attributes and Descriptions.
Table 14 SMART Attributes (Log Identifier 02h)
Bytes Index Bytes Description
[0] 1 Critical Warning
[2:1] 2 Composite Temperature
[3] 1 Available Spare
[4] 1 Available Spare Threshold
[5] 1 Percentage Used
[31:6] 26 Reserved
[47:32] 16 Data Units Read
[63:48] 16 Data Units Written
[79:64] 16 Host Read Commands
[95:80] 16 Host Write Commands
[111:96] 16 Controller Busy Time
[127:112] 16 Power Cycles
[143:128] 16 Power On Hours
[159:144] 16 Unsafe Shutdowns
[175:160] 16 Media and Data Integrity Errors
[191:176] 16 Number of Error Information Log Entries
[195:192] 4 Warning Composite Temperature Time
[199:196] 4 Critical Composite Temperature Time
[201:200] 2 Temperature Sensor 1 (Current Temperature)
[203:202] 2 Temperature Sensor 2 (N/A)
[205:204] 2 Temperature Sensor 3 (N/A)
[207:206] 2 Temperature Sensor 4 (N/A)
[209:208] 2 Temperature Sensor 5 (N/A)
[211:210] 2 Temperature Sensor 6 (N/A)
[213:212] 2 Temperature Sensor 7 (N/A)
[215:214] 2 Temperature Sensor 8 (N/A)
[511:216] 296 Reserved
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NOTES For (Log Identifier 02h:
"Critical Warning [Byte 0]"
This field indicates critical warnings for the state of the controller.
• Bit#0: Available spare is below threshold
• Bit#1: Temperature exceeded threshold or below an under temperature threshold
• Bit#2: Reliability is degraded due to excessive media or internal errors
• Bit#3: Media is placed in read only mode
• BIt#4: Volatile memory backup device has failed.
• Bit#5 - Bit#7: Reserved
"Available Spare [Byte 3]" Value (percentage) = 100* [(total reserved VB -
consumed VB caused by early, later bad)/ total reserved VB]
"Percentage Used [Byte 5]"
Value (percentage) = 100* (total VB erase count/ PE cycle for total VB)
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Table 15 SMART Attributes (Log Identifier C0h)
Bytes Index Bytes Description
[7:0] 8 Device Capacity
[15:8] 8 User Capacity
[23:16] 8 NAND Read
[31:24] 8 NAND Write
[39:32] 8 NAND Erase Sector
[47:40] 8 SSD Life Remaining Percent D3
[55:48] 8 SSD Life Used Percent D3
[56] 1 WP Water Mark
[58:57] 2 Highest temperature
[62:59] 4 Flash UNC Error Count
[67:63] 5 Data E3D Error
[70:67] 4 PHY Error Count
[74:71] 4 Total Bad Block Count
[78:75] 4 Total Early Bad Block Count
[82:79] 4 Total Later Bad Block Count
[86:83] 4 Read Fail Count
[90:87] 4 Program Fail Count
[94:91] 4 Erase Failure Count
[102:95] 8 System Table Copy Count
[110:103] 8 Read Move Table Count
[114:111] 4 Data read retry count
[118:115] 4 RAID ECC retry count
[122:119] 4 RAID ECC failed count
[130:123] 8 Total Erase Count
[134:131] 4 Max Erase Count
[138:135] 4 Average Erase Count
[142:139] 4 Min Erase Count
[150:143] 8 Background read count
[154:151] 4 Host Write Uncorrectable Sector Count
[158:155] 4 PS3 Enter Success
[162:159] 4 PS4 Enter Success
[166:163] 4 Wear Leveling Count
[167] 1 Chip internal temperature
[169:168] 2 Thermal throttling
[171:170] 2 Thermal throttling time
[179:172] 8 FW Code Update Count
[511:181] 331 RSV
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NOTES For Log Identifier C0h:
"SSD Life Remaining Percent D3 [Byte 47:40]"
• Value (percentage) = 100 *[1 - (Average of the Flash's block erase count / NAND EOL
erase count)]
"SSD Life Used Percent [Byte 55:48]"
• Value (percentage) = 100 *(Average of the Flash's block erase count / NAND EOL erase
count)
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7. Feature Details
7.1 Flash Management
7.1.1 Error Correction Code (ECC)
Flash memory cells will deteriorate with use, which might generate random bit errors in the stored data. Thus,
FireCuda 530 SSD applies the fourth generation LDPC(Low Density Parity Check) of ECC algorithm, which can detect
and correct errors that occur during read process, ensure data has been read correctly, as well as protect data from
corruption.
7.1.2 Wear Leveling
NAND flash devices can only undergo a limited number of program/erase cycles, and in most cases, the flash media
are not used evenly. If some areas get updated more frequently than others, the lifetime of the device would be
reduced significantly. Thus, Wear Leveling is applied to extend the lifespan of NAND Flash by evenly distributing write
and erase cycles across the media.
Seagate provides advanced Wear Leveling algorithm, which can efficiently spread out the flash usage through the
whole flash media area. Moreover, by implementing both dynamic and static Wear Leveling algorithms, the life
expectancy of the NAND flash is greatly improved.
7.1.3 Bad Block Management
Bad blocks are blocks that do not function properly or contain more invalid bits causing stored data to become
unstable, and their reliability is not guaranteed. Blocks that are identified and marked as bad by the manufacturer are
referred to as “Early Bad Blocks”. Bad blocks that are developed during the lifespan of the flash are named “Later Bad
Blocks”. Seagate implements an efficient bad block management algorithm to detect the factory- produced bad
blocks and manages bad blocks that appear with use. This practice prevents data being stored into bad blocks and
further improves the data reliability.
7.1.4 TRIM
TRIM is a feature which helps improve the read/write performance and speed of solid-state drives (SSD). Unlike hard
disk drives (HDD), SSDs are not able to overwrite existing data, so the available space gradually becomes smaller with
each use. With the TRIM command, the operating system can inform the SSD which blocks of data are no longer in use
and can be removed permanently. Thus, the SSD will perform the erase action, which prevents unused data from
occupying blocks all the time.
7.1.5 SMART
SMART, an acronym for Self-Monitoring, Analysis and Reporting Technology, is an open standard that allows a hard
disk drive to automatically detect its health and report potential failures. When a failure is recorded by SMART, users
can choose to replace the drive to prevent unexpected outage or data loss. Moreover, SMART can inform users of
impending failures while there is still time to perform proactive actions, such as copy data to another device.
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7.1.6 Over Provisioning
Over Provisioning refers to the inclusion of extra NAND capacity in a SSD, which is not visible and cannot be used by
users. With Over Provisioning, the performance and IOPS (Input/output Operations per Second) are improved by
providing the controller additional space to manage P/E cycles, which enhances the reliability and endurance as well.
Moreover, the write amplification of the SSD becomes lower when the controller writes data to the flash.
7.1.7 Firmware Upgrade
Firmware can be considered as a set of instructions on how the device communicates with the host. Firmware will be
upgraded when new features are added, compatibility issues are fixed, or read/write performance gets improved.
7.1.8 Thermal Throttling
The purpose of thermal throttling is to prevent any components in a SSD from over-heating during read and write
operations. The device is designed with an on-die and an on-board thermal sensor, and with its accuracy, firmware can
apply different levels of throttling to achieve the purpose of protection efficiently and proactively via SMART reading.
NOTE For optimal performance:
Provide sufficient airflow and cooling.
Table 16 Current version: Thermal Throttling 2.0
Item Content
Reference of temp. reading On-board thermal sensor, Controller on-die thermal sensor
tmt1 threshold (PE < 500) 82°C per Smart reported
tmt2 threshold (PE < 500) 85°C per Smart reported
tmt1 threshold (PE > 500) 68°C per Smart reported
tmt2 threshold (PE > 500) 70°C per Smart reported
Protect controller threshold 115°C from on-die thermal sensor
Fatal threshold 120°C from on-die thermal sensor
Resume performance threshold
(PE < 500)
78°C per Smart reported
Resume performance threshold
(PE > 500)
64°C per Smart reported
Temperature polling frequency Every 1 sec
TMT1_state impact ±10% CE
TMT2_state impact -20% CE
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7.2 Advanced Device Security Features
7.2.1 NVMe format
Secure Erase is a standard NVMe format command and it writes all “0xFF” to fully wipe all the data on the SSDs. When
this command is issued, the SSD controller erases its storage blocks and returns the drive to its factory default settings.
7.2.2 Sanitize Operation
The Sanitize feature is an alternative to the existing secure erase capabilities through the Format NVM command and
makes a robust data security by ensuring the user data from the drive's media, caches and the Controller Memory
Buffer are all wiped by the block erase operations, overwriting or destroying the encryption key. The following table
illustrates the types of Sanitize Operations supported.
NOTE Sanitize Overwrite command completion takes at least one hour per terabyte
per pass. The number of passes is drive-selectable. The NVMe spec default is 16
passes. Contact Seagate Support for more detailed information.
Table 17 Supported Sanitize Operations
Drive Security Type
Sanitize Operation
Overwrite Block Erase Crypto
Erase
Non-SED Yes Yes No
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7.3 SSD Lifetime Management
7.3.1 Total Bytes Written (TBW)
TBW (total bytes written) is a measurement of the SSDs’ expected lifespan, which represents the amount of data
written to the device. To calculate the TBW of a SSD, the following equation is applied:
TBW = [(NAND Endurance) x (SSD Capacity)] / WAF
NAND Endurance: NAND endurance refers to the P/E (Program/Erase) cycle of a NAND flash. SSD Capacity: The SSD
capacity is the specific capacity in total of a SSD.
WAF: Write Amplification Factor (WAF) is a numerical value representing the ratio between the amount of data that a
SSD controller needs to write and the amount of data that the host’s flash controller writes. A better WAF, which is near
1, guarantees better endurance and lower frequency of data written to flash memory.
7.3.2 Media Wear Indicator
Actual life indicator reported by SMART Attribute byte index [5], Percentage Used, recommends User to replace drive
when reaching to 100%.
7.3.3 Read Only Mode (End of Life)
When drive is aged by cumulated program/erase cycles, media worn- out may cause increasing numbers of later bad
block. When the number of available spare is less the threshold(5%, SMART attribute log ID 02h Byte4), the drive will
notify Host through AER event and Critical Warning to enter Read Only Mode to prevent further data corruption. User
should start to replace the drive with another one immediately.
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7.4 An Adaptive Approach to Performance Tuning
7.4.1 Throughput
Based on the available space of the disk, the drive will regulate the read/write speed and manage the performance of
throughput. When there still remains a lot of space, the firmware will continuously perform read/write action. There is
still no need to implement garbage collection to allocate and release memory, which will accelerate the read/write
processing to improve the performance. Contrarily, when the space is being used up, the drive will slow down the
read/write processing, and implement garbage collection to release memory. Hence, read/write performance will
become slower.
7.4.2 Predict & Fetch
Normally, when the Host tries to read data from the PCIe SSD, the PCIe SSD will only perform one read action after
receiving one command. However, the drive applies Predict & Fetch to improve the read speed. When the host issues
sequential read commands to the PCIe SSD, the PCIe SSD will automatically expect that the following will also be read
commands. Thus, before receiving the next command, flash has already prepared the data. Accordingly, this
accelerates the data processing time, and the host does not need to wait so long to receive data.
7.4.3 SLC Caching
The firmware design of the device currently adopts dynamic caching to deliver better performance for better
endurance and consumer user experience. The SLC caching size is up to 1/3 of free capacity of the SSD.
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8. Safety, Standards, and Compliance
Each Hard Drive and Solid State Drive ("device") has a product label that includes certifications that apply to that
specific drive. The following information provides an overview of requirements that may apply to the drive.
NOTE The most up to date information on Safety, Standards, and Compliance for
this product is available in the Seagate HDD and SSD Regulatory Compliance
and Safety document. You can find this document on the Seagate Support
page here:
https://www.seagate.com/support/
8.1 Regulatory Model Numbers
The following regulatory model number represents all features and configurations in the series:
STA025
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9. FireCuda 530 Installation Precautions
9.1 FireCuda 530 SSD Handling Instructions
There are a lot of components assembled on a single SSD device. Handle the drive with care especially when it has any
WLCSP (Wafer Level Chip Scale Packaging) components such as PMIC, thermal sensor or load switch. WLCSP is a
packaging technology widely used for making smaller footprints. However, any bumps or scratches may damage
those ultrasmall parts so you must handle with gentle care. See Figure 9.2, FireCuda 530 SSD Installation Instructions
CAUTION! DO NOT DROP SSD
CAUTION! INSTALL SSD WITH CARE
CAUTION! STORE SSD IN A PROPER PACKAGE
9.2 FireCuda 530 SSD Installation Instructions
FireCuda 530 features the PCIe connector with M-key, which is compatible only with the M-key socket. See Use Case 1
in Figure 10, M-Key M.2 Assembly Precautions. As shown in Use Case 2, misuse may cause severe damage to an SSD
including burn-out.
Figure 10 M-Key M.2 Assembly Precautions
9.3 Heatsink Disclosures
NOTE About Heatsink SSDs.
Heatsinks are pre-installed. Do not remove the heatsink; you can damage
the SSD.
Dimensions exceed standard size specifications for the M.2 without a
heatsink. Please verify that your system has enough space for installation.
SSDs with heatsinks are recommended for M.2 with connectors H3.2 and
above.
Seagate Technology LLC
AMERICAS Seagate Technology LLC 47488 Kato Road, Fremont, California 94538, United States, 510-661-1000
ASIA/PACIFIC Seagate Singapore International Headquarters Pte. Ltd. 90 Woodlands Avenue 7, Singapore 737911, 65-6412-3666
EUROPE, MIDDLE EAST AND AFRICA Seagate Technology (Netherlands) B.V. Koolhovenlaan 1, 1119 NB Schiphol-Rijk, Netherlands, 31-20-316-7300
Publication Number: 200432500, Rev D
October 2021