Table of Contents
Seagate ZP512CM30031 User Manual
Displayed below is the user manual for ZP512CM30031 by Seagate which is a product in the Internal Solid State Drives category. This manual has pages.
Related Manuals
Seagate® BarraCuda™ 510 SSD
Product Manual
User Capacity
Standard (TCG Pyrite)
M.2 2280-S2-M
Models
SED (TCG Opal)
M.2 2280-S2-M
Models
256 GB ZP256CM30011 ZP256CM30031
512 GB ZP512CM30011 ZP512CM30031
250 GB ZP250CM30001 N/A
500 GB ZP500CM30001 N/A
1000 GB ZP1000CM30001 N/A
100847099, Rev D
October 2020
© 2020, Seagate Technology LLC All rights reserved. Publication number: 100847099, Rev D , October 2020 .
Seagate Technology reserves the right to make changes to the product(s) or information disclosed herein at any time without notice.
Seagate, Seagate Technology and the Spiral logo are registered trademarks of Seagate Technology LLC in the United States and/or other countries. Nytro and SeaTools are either trademarks or registered trademarks of
Seagate Technology LLC or one of its affiliated companies in the United States and/or other countries. All other trademarks or registered trademarks are the property of their respective owners.
No part of this publication may be reproduced in any form without written permission of Seagate Technology LLC. Call 877-PUB-TEK1(877-782-8351) to request permission.
The NVMe word mark and/or NVMExpress design mark are trademarks of NVMExpress, Inc. The PCIe word mark and/or PCIExpress design mark are registered trademarks and/or service marks of PCI-SIG.
When referring to drive capacity, one gigabyte, or GB, equals one billion bytes and one terabyte, or TB, equals one trillion bytes. Your computer’s operating system may use a different standard of measurement and report
a lower capacity. In addition, some of the listed capacity is used for formatting and other functions, and thus will not be available for data storage. Actual quantities will vary based on various factors, including file size, file
format, features and application software. Actual data rates may vary depending on operating environment and other factors. The export or re-export of hardware or software containing encryption may be regulated by
the U.S. Department of Commerce, Bureau of Industry and Security (for more information, visit www.bis.doc.gov), and controlled for import and use outside of the U.S. Seagate reserves the right to change, without notice,
product offerings or specifications.
Revision History
Version and Date Description of Changes
Rev D, October 2020 Updated the following:
Section 2.2, Performance
Rev C, August 2020 Reformatting updates throughout.
Rev B, September 2019 Updated the following:
Section 1, Introduction
Section 2.1, Models and Capacity
Section 2.2, Performance
Section 2.3, Power Consumption
Section 2.5, Reliability/Endurance
Section 3, Mechanical Information
Section 6.2.1, NVMe format
Section 7.1, Regulatory Model Numbers
Rev A, February 2019 First document release.
Seagate BarraCuda 510 SSD Product Manual, Rev D 3
Contents
Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.1 Models and Capacity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.2 Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.3 Power Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.4 Environmental Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.5 Reliability/Endurance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3. Mechanical Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4. Pin and Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5. SMART Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
5.1 SMART Attributes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
6. Feature Details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
6.1 Flash Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
6.1.1 Error Correction Code (ECC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
6.1.2 Wear Leveling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
6.1.3 Bad Block Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
6.1.4 TRIM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
6.1.5 SMART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
6.1.6 Over Provisioning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
6.1.7 Firmware Upgrade . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
6.1.8 Thermal Throttling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
6.2 Advanced Device Security Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
6.2.1 NVMe format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
6.2.2 Physical Presence SID (PSID) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
6.2.3 Manufacturer’s Secure ID (MSID) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
6.2.4 Sanitize Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
6.3 SSD Lifetime Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
6.3.1 Total Bytes Written (TBW) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
6.3.2 Media Wear Indicator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
6.3.3 Read Only Mode (End of Life) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
6.4 An Adaptive Approach to Performance Tuning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
6.4.1 Throughput . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
6.4.2 Predict & Fetch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
6.4.3 SLC Caching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
7. Safety, Standards, and Compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
7.1 Regulatory Model Numbers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
7.2 Reference Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Seagate BarraCuda 510 SSD Product Manual, Rev D 4
Support
For Internal SSD Support, visit: https://www.seagate.com/support/products/
For Firmware Download and Tools Download for Secure Erase, visit: https://www.seagate.com/support/downloads/
For information regarding online support and services, visit: http://www.seagate.com/contacts/
For information regarding Warranty Support, visit: http://www.seagate.com/support/warranty-and-replacements/
For information regarding data recovery services, visit:
http://www.seagate.com/services-software/seagate-recovery-services/recover/
For Seagate OEM and Distribution partner and Seagate reseller portal, visit: http://www.seagate.com/partners
Seagate BarraCuda 510 SSD Product Manual, Rev D 5
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1. Introduction
The Seagate® BarraCuda™ 510 SSD is a versatile NVMe SSD with a wide range of application utilities. It is up to 6 x
faster than SATA SSDs and comes with TCG security to keep data safe and secure.
Table 1 The BarraCuda 510 SSD Features
Feature Description
Capacity
(User)
256 GB, 512 GB, 250 GB, 500 GB, 1000 GB
Certifications,
Eco-Compliance
CE, UL, FCC, BSMI, KCC, Microsoft WHQL, VCCI, CB
RoHS
Dimensions Length, Max (mm/in): 80.15 mm/3.156 in
Width, Max (mm/in): 22.15 mm/0.872 in
Height, Max (mm/in): 2.23 mm/0.088 in
Form Factor M.2 2280-S2-M
Weight 256 GB: 6.5g
512 GB: 6.9g
250 GB: 8.7
500 GB: 8.7
1000 GB: 8.7
Endurance Total Bytes Written
256 GB: 160 TB
512 GB: 320 TB
250 GB: 160 TB
500 GB: 320 TB
1000 GB: 640 TB
See Section 2.5, Reliability/Endurance.
Interface
Compliance
NVMe 1.3
PCI Express Base 3.1
NAND 3D TLC
Operating
Systems
Windows® 7 (64 bit), 8.1 (64 bit), and Windows 10 (64 bit)
Ubuntu 18.04
CentOS versions 6 and 7
Performance
Random
Read: Up to 600,000 IOPS
Write: Up to 600,000 IOPS
Actual performance might vary depending on
use conditions and environment.
See Section 2.2, Performance.
Performance
Sequential
Read: Up to 3400MB/s
Write: Up to 3000MB/s
Actual performance might vary depending on
the capacity, use conditions and environment.
See Section 2.2, Performance.
Power
Consumption
Active Power (W): <6.2
Idle Power PS3 (mW): <20
Low Power L1.2 PS 4 (mW): <2
See Section 2.3, Power Consumption.
Power
Management
Supports ActiveStatePower Management (ASPM)
Supports Autonomous Power StateTransition (APST)
Supports L1.2
Security TCG Pyrite supported on standard models
AES-256 and TCG Opal 2.0 IEEE1667 supported on SED models
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Reliability End-to-end data path protection
MTBF: 1.8 million hours
UBER: 1 error in 1016 bits read
Shock and
Vibration
Shock
Non-Operating: 1,500 G, at 0.5 ms
See Section 2.4, Environmental
Conditions.
Vibration
Non-Operating: 1.52 GRMS, (20 to 80 Hz,
Frequency)
Temperature
Range
Operating: 0°C to 70°C
Non-operating: -40°C to 85°C
Voltage 3.3 V±5%
Warranty Five years, or when the device reaches Host TBW, whichever happens first. Endurance rating valid for SSD
Life Remaining > 1%.
Table 1 The BarraCuda 510 SSD Features (continued)
Feature Description
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2. Specifications
2.1 Models and Capacity
NOTE About capacity:
Sector Size: 512 Bytes
User-addressable LBA count = (97696368) + (1953504 x (Desired Capacity
in Gb-50.0)) From International Disk Drive Equipment and Materials
Association (IDEMA) (LBA1-03_standard.doc)
2.2 Performance
NOTE About performance:
Fresh out of box (FOB) performance obtained on newly formatted drive.
Performance may vary based on the SSD’s firmware version, system
hardware, and configuration.
CrystalDiskMark 6.0.2, 1GB range, QD=32, Thread=1, 1GB range, QD=32,
Thread=8 (random)
Sequential Read/Write is measured while testing 1000 MB five times by
CrystalDiskMark.
Table 2 Models and Capacity
User Capacity Standard (TCG Pyrite)
M.2 2280-S2-M
SED (TCG Opal)
M.2 2280-S2-M
256 GB ZP256CM30011 ZP256CM30031
512 GB ZP512CM30011 ZP512CM30031
250 GB ZP250CM30001 N/A
500 GB ZP500CM30001 N/A
1000 GB ZP1000CM30001 N/A
Table 3 Random and Sequential Read and Write Performance
Parameter 1000 GB 512 GB 500 GB 256 GB 250 GB
Sequential Read (Max, MB/s), 128KB 3400 3400 3400 3100 3100
Sequential Write (Max, MB/s), 128KB 3000 2180 2400 1050 1050
Random Read (Max, IOPS), 4KB QD32 T8 600,000 350,000 410,000 180,000 180,000
Random Write (Max, IOPS), 4KB QD32 T8 600,000 530,000 540,000 260,000 260,000
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2.3 Power Consumption
NOTE About power consumption:
The average value of power consumption is based on 100% conversion
efficiency.
The measured power voltage is 3.3 V.
Measured under ambient temperature.
Power Consumption can differ according to flash configuration and
platform.
Power consumption is measured during the sequential read and write
(128KB) operations performed by Linux FIO3.7
2.4 Environmental Conditions
NOTE Temperature is measured without condensation. Operating mode
temperature is measured by temperature sensor, SMART Attribute.
Airflow is suggested. Airflow allows the device to be operated at the
appropriate temperature for each component during heavy workloads
environments.
Storage: The drive can be stored for a maximum of 180 days in the original
unopened Seagate shipping package or 60 days, unpackaged, in the defined
non-operating limits. Storage can be extended to 1 year packaged or
Table 4 Power Consumption
1000 GB 512 GB 500 GB 256 GB 250 GB
Max. Average Read (mW) 6200 5270 5210 5010 4810
Max. Average Write (mW) 5300 4150 4600 2970 3000
Idle PS3 (mW) 20 16.5 16 16.5 16
L1.2 (mW) 22222
Table 5 Temperature, Humidity, Shock
Specification Value
Temperature
Operating (case temperature at specific airflow)
Non-operating
0°C to 70°C
-40°C to 85°C
Humidity
Operating
Non-operating (storage)
90%
93%
Shock
Non-operating 1,500 G, duration 0.5 ms
Vibration
Non-operating 1.52 GRMS, (20Hz to 80Hz, Frequency)
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unpackaged under optimal environmental conditions (<40°C, <40% relative
humidity non-condensing, and non-corrosive environment).
Shock and vibration results assume that the SSD is mounted securely with
the input vibration applied to the SSD mounting. These specifications do not
cover connection issues that may result from testing at this level. The
measured specification is in root mean square (RMS) form.
Non-operating Shock. The limits of non-operating shock applies to all
conditions of handling and transportation. This includes both isolated
SSD and integrated SSDs. Shock may be applied in the X, Y, or Z-axis.
Non-Operating Vibration. The limits of non-operating vibration shall
apply to all conditions of handling and transportation. This includes both
isolated SSD and integrated SSDs. Vibration may be applied in the X, Y, or
Z-axis.
2.5 Reliability/Endurance
NOTE About endurance:
The SSD achieves the specified MTBF in an operational environment that
complies with the operational temperature range specified in this manual.
Operating temperatures are measured by temperature sensor.
Endurance rating valid for SSD Life Remaining > 1%.
Endurance is characterized while running Client JESD219A workload (per
JESD218A specification).
Table 6 Reliability/Endurance
Specification Value
Mean time between failures (MTBF) 1.8 million hours
Bit Error Rate 1 error in 1016 bits read
Endurance Total Bytes Written
1000 GB 640
512 GB: 320 TB
500 GB: 320 TB
256 GB: 160 TB
250 GB: 160 TB
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3. Mechanical Information
Weight: 6.5 g (256 GB), 6.9 g (512 GB)
8.7 g (250 GB, 500 GB, 1000 GB)
Height: 3.5 mm±0.08 mm
Width: 22 mm±0.15 mm
Length: 80 mm±0.15 mm
Figure 1 BarraCuda 510 SSD Top Side View
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Figure 2 BarraCuda 510 SSD Bottom Side View
Figure 3 BarraCuda 510 SSD Side View
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Notes
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4. Pin and Signal Descriptions
Table 7 Pin Descriptions
Pin No. PCIe Pin Description
1GND
CONFIG_3 = GND
23.3V
3.3V source
3GND
Ground
43.3V
3.3V source
5PETn3
PCIe TX Differential signal defined by the PCI Express M.2 spec
6N/C
No connect
7PETp3
PCIe TX Differential signal defined by the PCI Express M.2 spec
8N/C
No connect
9GND
Ground
10 LED1#
Open drain, active low signal. These signals are used to allow the add- in card to provide status
indicators via LED devices that will be provided by the system.
11 PERn3 PCIe RX Differential signal defined by the PCI Express M.2 spec
12 3.3V 3.3V source
13 PERp3 PCIe RX Differential signal defined by the PCI Express M.2 spec
14 3.3V 3.3V source
15 GND Ground
16 3.3V 3.3V source
17 PETn2 PCIe TX Differential signal defined by the PCI Express M.2 spec
18 3.3V 3.3V source
19 PETp2 PCIe TX Differential signal defined by the PCI Express M.2 spec
20 N/C No connect
21 GND Ground
22 N/C No connect
23 PERn2 PCIe RX Differential signal defined by the PCI Express M.2 spec
24 N/C No connect
25 PERp2 PCIe RX Differential signal defined by the PCI Express M.2 spec
26 N/C No connect
27 GND Ground
28 N/C No connect
29 PETn1 PCIe TX Differential signal defined by the PCI Express M.2 spec
30 N/C No connect
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31 PETp1 PCIe TX Differential signal defined by the PCI Express M.2 spec
32 N/C No connect
33 GND Ground
34 N/C No connect
35 PERn1 PCIe RX Differential signal defined by the PCI Express M.2 spec
36 N/C No connect
37 PERp1 PCIe RX Differential signal defined by the PCI Express M.2 spec
38 N/C No connect
39 GND Ground
40 SMB_CLK (I/O)(0/1.8V) SMBus Clock; Open Drain with pull-up on platform
41 PETn0 PCIe TX Differential signal defined by the PCI Express M.2 spec
42 SMB_DATA (I/O)(0/1.8V) SMBus Data; Open Drain with pull-up on platform.
43 PETp0 PCIe TX Differential signal defined by the PCI Express M.2 spec
44 ALERT#(O) (0/1.8V)
Alert notification to master; Open Drain with pull-up on platform;
Active low.
45 GND Ground
46 N/C No connect
47 PERn0 PCIe RX Differential signal defined by the PCI Express M.2 spec
48 N/C No connect
49 PERp0 PCIe RX Differential signal defined by the PCI Express M.2 spec
50 PERST#(I)(0/3.3V)
PE-Reset is a functional reset to the card as defined by the PCIe Mini
CEM specification.
51 GND Ground
52 CLKREQ#(I/O)(0/3.3V)
Clock Request is a reference clock request signal as defined by the
PCIe Mini CEM specification; Also used by L1 PM Sub-states.
53 REFCLKn
PCIe Reference Clock signals (100 MHz)
defined by the PCI Express M.2 spec.
54 PEWAKE#(I/O)(0/3.3V)
PCIe PME Wake.
Open Drain with pull up on platform; Active Low.
55 REFCLKp
PCIe Reference Clock signals (100 MHz)
defined by the PCI Express M.2 spec.
56 Reserved for MFG DATA
Manufacturing Data line. Used for SSD manufacturing only.
Not used in normal operation.
Pins should be left N/C in platform Socket.
Table 7 Pin Descriptions (continued)
Pin No. PCIe Pin Description
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57 GND Ground
58 Reserved for MFG
CLOCK
Manufacturing Clock line. Used for SSD manufacturing only.
Not used in normal operation.
Pins should be left N/C in platform Socket.
59 Module Key M
Module Key
60 Module Key M
61 Module Key M
62 Module Key M
63 Module Key M
64 Module Key M
65 Module Key M
66 Module Key M
67 N/C No connect
68 SUSCLK(32KHz)
(I)(0/3.3V)
32.768 kHz clock supply input that is provided by the platform chipset to reduce power and cost
for the module.
69 N/C PEDET (NC-PCIe)
70 3.3V 3.3V source
71 GND Ground
72 3.3V 3.3V source
73 GND Ground
74 3.3V 3.3V source
75 GND Ground
Table 7 Pin Descriptions (continued)
Pin No. PCIe Pin Description
Seagate BarraCuda 510 SSD Product Manual, Rev D 16
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5. SMART Support
The BarraCuda 510 SSD 510 supports the SMART command set.
5.1 SMART Attributes
The following table lists SMART Attributes and Descriptions.
Table 8 SMART Attributes (Log Identifier 02h)
Bytes Index Bytes Description
[0] 1 Critical Warning
[2:1] 2 Composite Temperature
[3] 1 Available Spare
[4] 1 Available Spare Threshold
[5] 1 Percentage Used
[31:6] 26 Reserved
[47:32] 16 Data Units Read
[63:48] 16 Data Units Written
[79:64] 16 Host Read Commands
[95:80] 16 Host Write Commands
[111:96] 16 Controller Busy Time
[127:112] 16 Power Cycles
[143:128] 16 Power On Hours
[159:144] 16 Unsafe Shutdowns
[175:160] 16 Media and Data Integrity Errors
[191:176] 16 Number of Error Information Log Entries
[195:192] 4 Warning Composite Temperature Time
[199:196] 4 Critical Composite Temperature Time
Seagate BarraCuda 510 SSD Product Manual, Rev D 17
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6. Feature Details
6.1 Flash Management
6.1.1 Error Correction Code (ECC)
Flash memory cells will deteriorate with use, which might generate random bit errors in the stored data. Thus,
BarraCuda 510 SSD 510 applies the 340bit/2KB LDPC(Low Density Parity Check) of ECC algorithm, which can detect
and correct errors that occur during read process, ensure data has been read correctly, as well as protect data from
corruption.
6.1.2 Wear Leveling
NAND flash devices can only undergo a limited number of program/erase cycles, and in most cases, the flash media
are not used evenly. If some areas get updated more frequently than others, the lifetime of the device would be
reduced significantly. Thus, Wear Leveling is applied to extend the lifespan of NAND Flash by evenly distributing write
and erase cycles across the media.
Seagate provides advanced Wear Leveling algorithm, which can efficiently spread out the flash usage through the
whole flash media area. Moreover, by implementing both dynamic and static Wear Leveling algorithms, the life
expectancy of the NAND flash is greatly improved.
6.1.3 Bad Block Management
Bad blocks are blocks that do not function properly or contain more invalid bits causing stored data to become
unstable, and their reliability is not guaranteed. Blocks that are identified and marked as bad by the manufacturer are
referred to as “Early Bad Blocks”. Bad blocks that are developed during the lifespan of the flash are named “Later Bad
Blocks”. Seagate implements an efficient bad block management algorithm to detect the factory- produced bad
blocks and manages bad blocks that appear with use. This practice prevents data being stored into bad blocks and
further improves the data reliability.
6.1.4 TRIM
TRIM is a feature which helps improve the read/write performance and speed of solid-state drives (SSD). Unlike hard
disk drives (HDD), SSDs are not able to overwrite existing data, so the available space gradually becomes smaller with
each use. With the TRIM command, the operating system can inform the SSD which blocks of data are no longer in use
and can be removed permanently. Thus, the SSD will perform the erase action, which prevents unused data from
occupying blocks all the time.
6.1.5 SMART
SMART, an acronym for Self-Monitoring, Analysis and Reporting Technology, is an open standard that allows a hard
disk drive to automatically detect its health and report potential failures. When a failure is recorded by SMART, users
can choose to replace the drive to prevent unexpected outage or data loss. Moreover, SMART can inform users of
impending failures while there is still time to perform proactive actions, such as copy data to another device.
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6.1.6 Over Provisioning
Over Provisioning refers to the inclusion of extra NAND capacity in a SSD, which is not visible and cannot be used by
users. With Over Provisioning, the performance and IOPS (Input/output Operations per Second) are improved by
providing the controller additional space to manage P/E cycles, which enhances the reliability and endurance as well.
Moreover, the write amplification of the SSD becomes lower when the controller writes data to the flash.
6.1.7 Firmware Upgrade
Firmware can be considered as a set of instructions on how the device communicates with the host. Firmware
upgrades are typically available with added features, fixed compatibility issues, and improved read/write
performance.
6.1.8 Thermal Throttling
The purpose of thermal throttling is to prevent any components in a SSD from over-heating during read and write
operations. The device is designed with an on-die and an on-board thermal sensor, and with its accuracy, firmware can
apply different levels of throttling to achieve the purpose of protection efficiently and proactively via SMART reading.
Table 9 Current version: Thermal Throttling 2.0
Item Content
Smart reporting temperature Flash normalized case temperature
Reference of temp. reading On-board thermal sensor, Controller on-die thermal
sensor
tmt1 threshold 68°C per Smart reported
tmt2 threshold 70°C per Smart reported
Protect threshold 80°C per Smart reported
Protect controller threshold 110°C from on-die thermal sensor
Fatal threshold 120°C from on-die thermal sensor
Resume performance threshold 60°C per Smart reported
Temperature polling frequency Every 1 sec
TMT1_state impact ±10% CE
TMT2_state impact -20% CE
Seagate BarraCuda 510 SSD Product Manual, Rev D 19
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6.2 Advanced Device Security Features
6.2.1 NVMe format
Secure Erase is a standard NVMe format command and it writes all “0xFF” to fully wipe all the data on the SSDs. When
this command is issued, the SSD controller erases its storage blocks and returns to its factory default settings.
6.2.2 Physical Presence SID (PSID)
The Physical Presence SID (PSID) is defined by TCG OPAL as a 32-character string and its purpose is to revert the SSD
back to its manufacturing setting when the drive is set via TCG Opal (SED) or TCG Pyrite (non-SED). The PSID code is
printed on the SSD’s label. All user data will be erased when reverting the drive back to manufacturing settings.
6.2.3 Manufacturer’s Secure ID (MSID)
The Manufacturer’s Secure ID (MSID) is defined by TCG OPAL as a 32-character string and is assigned during the
manufacturing process, which is a password that cannot be changed by the host system. MSID can be obtained
electronically from the drive across the interface. On acquiring the SSD, the user must set a new password. If a new
password is not set the SSD might be potentially taken control by anyone who can reset the MSID. Such an attack on
the drive is known as Denial of Service (DoS) since the rightful owner has been locked out.
6.2.4 Sanitize Operation
The Sanitize feature is an alternative to the existing secure erase capabilities through the Format NVM command and
makes a robust data security by ensuring the user data from the drive's media, caches and the Controller Memory
Buffer are all wiped by the block erase operations, overwriting or destroying the encryption key. The following table
illustrates the types of Sanitize Operations supported.
NOTE Crypto Erase is a feature that erases all the data of the AES encrypted data
structure by resetting the cryptographic key of the disk. The previously
encrypted data becomes nonrecoverable.
Instant Security Erase is a feature that erases all the data of the SED drive
with the Opal-activated encrypted data structure by resetting the SSD with
the PSID. Since the key is reset, the previously encrypted data cannot be
accessed.
IEEE 1667 is supported but needs to be activated by SeaChest_Security tool
when required to prevent unintended eDrive implementation and the
following requirement of reverting by PSID before being able to re-install the
Operation System.
Table 10 Supported Sanitize Operations
Drive Security Type
Sanitize Operation TCG Commands IEEE 1667
Overwrite Block Erase Crypto Erase PSID Revert Process Instant Security Erase Windows eDrive
SED (TCG Opal) Yes Yes Yes Yes Yes Yes
Non-SED (TCG Pyrite) Yes Yes No Yes No No
Seagate BarraCuda 510 SSD Product Manual, Rev D 20
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Sanitize Overwrite command completion takes at least one hour per terabyte
per pass. The number of passes is drive-selectable. The NVMe spec default is
16 passes. Contact Seagate Support for more detailed information.
6.3 SSD Lifetime Management
6.3.1 Total Bytes Written (TBW)
TBW (Total Bytes Written) is a measurement of the SSDs’ expected lifespan, which represents the amount of data
written to the device. To calculate the TBW of a SSD, the following equation is applied:
TBW = [(NAND Endurance) x (SSD Capacity)] / WAF
NAND Endurance: NAND endurance refers to the P/E (Program/Erase) cycle of a NAND flash. SSD Capacity: The SSD
capacity is the specific capacity in total of a SSD.
WAF: Write Amplification Factor (WAF) is a numerical value representing the ratio between the amount of data that a
SSD controller needs to write and the amount of data that the host’s flash controller writes. A better WAF, which is near
1, guarantees better endurance and lower frequency of data written to flash memory.
TBW in this document is based on JEDEC 219 workload.
6.3.2 Media Wear Indicator
Actual life indicator reported by SMART Attribute byte index [5], Percentage Used, recommends User to replace drive
when reaching to 100%.
6.3.3 Read Only Mode (End of Life)
When drive is aged by cumulated program/erase cycles, media worn- out may cause increasing numbers of later bad
block. When the number of available spare is less the threshold(5%, SMART attribute log ID 02h Byte4), the drive will
notify Host through AER event and Critical Warning to enter Read Only Mode to prevent further data corruption. User
should start to replace the drive with another one immediately.
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6.4 An Adaptive Approach to Performance Tuning
6.4.1 Throughput
Based on the available space of the disk, the drive will regulate the read/write speed and manage the performance of
throughput. When there still remains a lot of space, the firmware will continuously perform read/write action. There is
still no need to implement garbage collection to allocate and release memory, which will accelerate the read/write
processing to improve the performance. Contrarily, when the space is being used up, the drive will slow down the
read/write processing, and implement garbage collection to release memory. Hence, read/write performance will
become slower.
6.4.2 Predict & Fetch
Normally, when the Host tries to read data from the PCIe SSD, the PCIe SSD will only perform one read action after
receiving one command. However, the drive applies Predict & Fetch to improve the read speed. When the host issues
sequential read commands to the PCIe SSD, the PCIe SSD will automatically expect that the following will also be read
commands. Thus, before receiving the next command, flash has already prepared the data. Accordingly, this
accelerates the data processing time, and the host does not need to wait so long to receive data.
6.4.3 SLC Caching
The firmware design of the device currently adopts dynamic caching to deliver better performance for better
endurance and consumer user experience. The SLC caching size is set up to 24 GB across capacities.
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7. Safety, Standards, and Compliance
Each Hard Drive and Solid State Drive ("device") has a product label that includes certifications that are applicable to
that specific drive. The following information provides an overview of requirements that may be applicable to the
drive.
NOTE The most up to date information on Safety, Standards, and Compliance for this
product is available in the Seagate HDD and SSD Regulatory Compliance and
Safety document. You can find this document on the Seagate Support page
(Scroll down to t he Compliance section.):
https://www.seagate.com/support/products/
7.1 Regulatory Model Numbers
The following regulatory model numbers represent the models in the BarraCuda 510 Series:
STA015 256 GB, 512 GB
STA019 250 GB, 500 GB, 1000 GB
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7.2 Reference Documents
In case of conflict between this document and the following reference document, this document takes precedence.
PCIe Specifications
—PCIe - PCI Express Electromechanical specification, revision 4.0
—NVMe - Non Volatile Memory Express specification 1.3
—PCIe CEM - PCI Express Card Electromechanical specification, revision 1.1
—PCI Express M.2 Specification, revision 1.1
Trusted Computing Group (TCG) Documents
—Storage Work Group Security Subsystem Class: Opal, Version 2.00
Solid State Drive Requirements and Endurance Test Methods
—JESD218
—JESD219
Seagate Documentation
—SeaTools™ SSD GUI User Guide - Publication Number: 100837824
—SeaChest for SSD User Guide - Publication Number: 100847684
Seagate Technology LLC
AMERICAS Seagate Technology LLC 47488 Kato Road, Fremont, California 94538, United States, 510-661-1000
ASIA/PACIFIC Seagate Singapore International Headquarters Pte. Ltd. 90 Woodlands Avenue 7, Singapore 737911, 65-6412-3666
EUROPE, MIDDLE EAST AND AFRICA Seagate Technology (Netherlands) B.V. Koolhovenlaan 1, 1119 NB Schiphol-Rijk, Netherlands, 31-20-316-7300
Publication Number: 100847099, Rev D
October 2020