Intel 540s User Manual
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Order Number: 334047-001US
Intel® Solid State Drive 540s Series (M.2)
Product Specification
Capacities: 120, 180, 240, 360, 480, 1000 GB
Form Factors:
80mm (single-sided) 2280-S3-B-M
(120, 180, 240, 360, 480 GB)
80mm (double-sided) 2280-D3-B-M (1000 GB)
Thickness: S3 – up to 2.38 mm; D3 – up to 3.73mm
Weight: <7 grams
SATA 6Gb/s Bandwidth Performance1,2
(IOMeter* Queue Depth 32)
Sequential Read: up to 560MB/s
Sequential Write: up to 480MB/s
Read and Write IOPS1,2
(IOMeter Queue Depth 32)
Random 4KB Reads: up to 78,000 IOPS
Random 4KB Writes: up to 85,000 IOPS
Additional Compatibility
Intel® SSD Toolbox with Intel® SSD Optimizer
Intel® Data Migration Software
Intel® Rapid Storage Technology
SATA Revision 3.2
ACS-3 (ATA/ATAPI Command Set 3)
SSD Enhanced SMART ATA feature set
AES 256-bit Encryption
Power Management
3.3 V SATA Supply Rail
SATA Link Power Management (LPM)
Device Sleep (DevSleep)
Advanced Power Management (APM)
Power
Active (BAPCo MobileMark* 2012 Workload):
80 mW
Idle3: 40 mW
DevSleep: 3 mW
Temperature
Operating4: 0° C to 70° C
Non-Operating: -55° C to 95° C
Reliability
Uncorrectable Bit Error Rate (UBER):
<1 sector per 1016 bits read
Mean Time Between Failure (MTBF):
1.6 million hours
Shock (non-operating):
1,000 G/0.5 ms
Vibration
Operating: 2.17 GRMS (5-700Hz)
Non-operating: 3.13 GRMS (5-800Hz)
Certifications and Declarations:
UL*
CE*
RCM*
BSMI*
KCC*
Microsoft* WHCK/WHLK
VCCI*
SATA-IO*
Product Ecological Compliance
RoHS*
NOTES:
1. IOMeter Test and System Configurations: Intel® Core™ i7-4790 (8MB L3 Cache, 3.60GHz), ASUS* Deluxe Z97I-PLUS motherboard,
Intel® HD Graphics 4600 driver 10.18.10.3920, BIOS: AMI* 2605 5/19/2015, Chipset: Intel® INF 10.0.16.0, Memory: 8GB (2X4GB)
Kingston DDR3-1555,
Intel® RST driver 13.5, Microsoft* Windows 7 Enterprise 64-bit with SP1.
2. Performance values vary by capacity.
3. Non-DevSleep idle power with SATA Link Power Management (LPM) enabled.
4. As measured by temperature sensor, SMART Attribute BEh. Active airflow is recommended within the system for maintaining proper
device operating temperatures on heavier workloads.
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Ordering Information
Contact your local Intel sales representative for ordering information.
Revision History
Revision Number
Description
Revision Date
001
Initial release
March 2016
Tests document performance of components on a particular test, in specific systems. Differences in hardware, software, or configuration will
affect actual performance. Consult other sources of information to evaluate performance as you consider your purchase.
For more complete information about performance and benchmark results, visit http://www.intel.com/performance.
IOMeter Test and System Configurations: Intel® Core™ i7-4790 (8MB L3 Cache, 3.60GHz), ASUS* Deluxe Z97I-PLUS motherboard, Intel® HD
Graphics 4600 driver 10.18.10.3920, BIOS: AMI* 2605 5/19/2015, Chipset: Intel® INF 10.0.16.0, Memory: 8GB (2X4GB) Kingston DDR3-1555,
Intel® RST driver 13.5, Microsoft* Windows 7 Enterprise 64-bit with SP1.
All documented test results are obtained by Intel in compliance with JESD218 Standards; refer to individual sub-sections within this document
for specific methodologies. See www.jedec.org for detailed definitions of JESD218 Standards.
Low Halogen applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product. Intel components as well
as purchased components on the finished assembly meet JS-709 requirements, and the PCB/substrate meet IEC 61249-2-21 requirements.
The replacement of halogenated flame retardants and/or PVC may not be better for the environment.
Intel disclaims all express and implied warranties, including without limitation, the implied warranties of merchantability, fitness for a particular
purpose, and non-infringement, as well as any warranty arising from course of performance, course of dealing, or usage in trade.
The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from
published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. This document
contains information on products in the design phase of development.
Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling
1-800-548-4725, or go to: http://www.intel.com/design/literature.htm
Intel, Intel Core i7-4790, Intel HD Graphics 4600 Driver, Intel INF, Intel RST and the Intel logo are trademarks of Intel Corporation in the U.S.
and other countries.
*Other names and brands may be claimed as the property of others.
Copyright © 2016 Intel Corporation. All rights reserved.
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Contents
1 Introduction .......................................................................................................................................................................................................... 5
1.1 Terminology ............................................................................................................................................................................................... 5
1.2 Reference Documents ........................................................................................................................................................................... 6
2 Product Specifications..................................................................................................................................................................................... 7
2.1 Capacity ........................................................................................................................................................................................................ 7
2.2 Performance ............................................................................................................................................................................................... 7
2.3 Electrical Characteristics ...................................................................................................................................................................... 8
2.4 Environmental Conditions ................................................................................................................................................................... 9
2.4.1 Temperature, Shock, Vibration ......................................................................................................................................... 9
2.4.2 Altitude ......................................................................................................................................................................................... 9
2.5 Product Regulatory Compliance ....................................................................................................................................................... 9
2.6 Reliability ................................................................................................................................................................................................... 10
3 Mechanical Information ................................................................................................................................................................................ 11
4 Pin and Signal Descriptions ........................................................................................................................................................................ 13
4.1 Pin Locations ............................................................................................................................................................................................ 13
4.2 Signal Descriptions ............................................................................................................................................................................... 14
5 Supported Command and Feature Sets ............................................................................................................................................... 16
5.1 Supported ATA General Feature Command Set ..................................................................................................................... 16
5.2 Security Features ................................................................................................................................................................................... 18
5.2.1 Sanitization Methods ........................................................................................................................................................ 18
5.3 DevSleep .................................................................................................................................................................................................... 18
5.4 SMART Attributes .................................................................................................................................................................................. 19
6 Certifications and Declarations................................................................................................................................................................. 22
7 Appendix ............................................................................................................................................................................................................... 23
7.1 Identify Device ......................................................................................................................................................................................... 23
7.2 Models......................................................................................................................................................................................................... 26
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Tables
Table 1: Terminology ............................................................................................................................................................................................. 5
Table 2: Standard References ............................................................................................................................................................................ 6
Table 3: User Addressable Sectors ................................................................................................................................................................. 7
Table 4: Burst Performance ................................................................................................................................................................................ 7
Table 5: Sustained Performance ...................................................................................................................................................................... 7
Table 6: Latency ....................................................................................................................................................................................................... 8
Table 7: Operating Voltage and Power Consumption ............................................................................................................................ 8
Table 8: Temperature, Shock, Vibration ....................................................................................................................................................... 9
Table 9: Reliability Specifications .................................................................................................................................................................. 10
Table 10: M.2 Serial ATA Power Pin Definitions ........................................................................................................................................ 14
Table 11: Supported ATA Commands and Feature Sets ....................................................................................................................... 16
Table 12: Supported Secure Erase Modes and Definitions .................................................................................................................. 18
Table 13: Supported Sanitize Device Modes and Definitions ............................................................................................................. 18
Table 15: DevSleep Control Parameters ....................................................................................................................................................... 19
Table 16: SMART Attributes ................................................................................................................................................................................ 19
Table 17: SMART Attribute Status Flags ....................................................................................................................................................... 21
Table 18: Device Certifications and Declarations ...................................................................................................................................... 22
Table 19: Identify Device Returned Sector Data ........................................................................................................................................ 23
Table 20: Available Models .................................................................................................................................................................................. 26
Figures
Figure 1: Dimensions for 80 mm single-sided M.2 Form Factor Drives (2280-S3-B-M) ....................................................... 11
Figure 2: Dimensions for 80 mm double-sided M.2 Form Factor Drives (2280-D3-B-M) .................................................... 12
Figure 3: Layout of Signal and Power Segment Pins .............................................................................................................................. 13
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1 Introduction
This document describes the specifications and capabilities of the Intel® Solid State Drive 540s Series
(Intel® SSD 540s Series).
1.1 Terminology
Table 1: Terminology
Term
Description
AHCI*
Advanced Host Controller Interface
ATA
Advanced Technology Attachment
DAS
Device Activity Signal
DevSleep
Device Sleep
DIPM
Device Initiated Power Management
DMA
Direct Memory Access
DPTF
Dynamic Platform Thermal Framework
EXT
Extended
FPDMA
First Party Direct Memory Access
GB
Gigabyte (1,000,000,000 bytes)
Note: The total usable capacity of the SSD may be less than the total physical capacity because a small
portion of the capacity is used for NAND flash management and maintenance purposes.
HDD
Hard Disk Drive
HIPM
Host Initiated Power Management
I/O
Input/Output
IOPS
Input/Output Operations Per Second
KB
Kilobyte (1,024 bytes)
LBA
Logical Block Address
LPM
Link Power Management
MB
Megabyte (1,000,000 bytes)
MLC
Multi-level Cell
MTBF
Mean Time Between Failures
NCQ
Native Command Queuing
NOP
No Operation
PIO
Programmed Input/Output
RDT
Reliability Demonstration Test
RMS
Root Mean Squared
SLC
Single-level Cell
SATA
Serial Advanced Technology Attachment
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Term
Description
SMART
Self-Monitoring, Analysis and Reporting Technology
SSD
Solid State Drive
TYP
Typical
UBER
Uncorrectable Bit Error Rate
1.2 Reference Documents
Table 2: Standard References
Date or Rev. #
Title
Location
Sept 2008
IEC 55022 Information Technology Equipment —
Radio disturbance Characteristics— Limits and
methods of measurement CISPR22:2008 (Modified)
http://www.iec.ch/
Dec 2008
VCCI
http://www.vcci.jp/vcci_e/
June 2009
RoHS
http://qdms.intel.com/
Click Search MDDS Database and search
for material description datasheet
August 2010
IEC 55024 Information Technology Equipment —
Immunity characteristics— Limits and methods of
measurement CISPR24:2010
http://www.iec.ch/
Sept 2010
Solid State Drive (SSD) Requirements and
Endurance Test Method (JESD218)
http://www.jedec.org/standards-
documents/docs/jesd218/
August 2013
Serial ATA Revision 3.2
http://www.sata-io.org/
October 2013
ACS-3 Specification
http://www.t13.org/
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2 Product Specifications
2.1 Capacity
Table 3: User Addressable Sectors
Capacity
Unformatted Capacity (Total User Addressable Sectors in LBA mode)
120GB
234,441,648
180GB
351,651,888
240GB
468,862,128
360GB
703,282,608
480GB
937,703,088
1000GB
1,953,525,168
2.2 Performance
Table 4: Burst Performance
Capacity
Random
4KB Read
(up to)1
Random
4KB Write
(up to)1
Sequential
128KB Read1
Sequential
128KB Write1
IOPS
IOPS
MB/s
MB/s
120GB
60,000
50,000
560
400
180GB
71,000
85,000
560
475
240GB
74,000
85,000
560
480
360GB
74,000
85,000
560
480
480GB
78,000
85,000
560
480
1000GB
78,000
85,000
560
480
Note:
1. Performance measured within the SLC cache buffer using IOMeter* with Queue Depth 32.
Table 5: Sustained Performance
Capacity
Specification
Random
4KB Read
(up to)1
Random
4KB Write
(up to)1
Sequential
128KB Read1
Sequential
128KB Write1
IOPS
IOPS
MB/s
MB/s
120GB
55,000
13,500
560
70
180GB
65,000
22,000
560
90
240GB
70,000
29,000
560
100
360GB
70,000
29,000
560
100
480GB
72,000
36,000
560
125
1000GB
72,000
36,000
560
125
Note:
1. Performance measured using IOMeter* with Queue Depth 32. Measurements are performed on 8GB of Logical
Block Address (LBA) range on a full SSD.
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Table 6: Latency
Specification
Intel® SSD 540s Series Type 2280
Read1
50 µs (TYP)
60 µs (TYP)
500 ms (TYP)
< 10 sec
Write1
Power On To Ready2
Max Power On To Ready3
NOTES:
1. Based on sequential 4KB using IOMeter with Queue Depth 1 workload. Write Cache enabled.
2. Power On To Ready time assumes safe shutdown
3. Max Power On To Ready time assumes unsafe shutdown. Based on statistical measurement of 95% quality of
service.
2.3 Electrical Characteristics
Table 7: Operating Voltage and Power Consumption
Electrical Characteristics
Intel® SSD 540s Series Type 2280
120GB
180GB
240GB
360GB
480GB
1000GB
Operating Voltage for 3.3 V (±5%)
Min
Max
Rise Time (Max/Min)
Fall Time (Max/Min)
Noise Tolerance
Min Off Time1
3.14 V
3.47 V
100 ms / 0.1 ms
5 s / 1 ms
70 mV pp (10 Hz – 30 MHz)
1 s
Power Consumption (TYP)
Active2
Idle3
DevSleep4
80 mW
40 mW
3 mW
Thermal Power5
Regulator Power6
NOTES:
1. Minimum time from when power removed from drive (Vcc < 100 mV) to when power can be reapplied to drive.
2. Active power measured during execution of MobileMark* 2012 with SATA Link Power Management (LPM) enabled.
3. Non-DevSleep idle power with SATA Link Power Management (LPM) enabled.
4. Power consumption during DevSleep state.
5. Power measured during 128kB sequential writes with Queue Depth 32 workload using 100 ms sample period. This
represents power that would be thermal load on system during heavy workloads.
6. Power measured during 128kB sequential writes with Queue Depth 32 workload using 500 us sample period. This
represents power that system power supply would have to regulate for proper device operation.
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2.4 Environmental Conditions
2.4.1 Temperature, Shock, Vibration
Table 8: Temperature, Shock, Vibration
Electrical Characteristics
Range
Module Temperature
Operating1
Non-operating2
0° C – 70° C
-55° C – 95° C
Temperature Gradient3
Operating
Non-operating
30 (TYP)° C/hr
30 (TYP)° C/hr
Humidity
Operating
Non-operating
5 – 95 %
5 – 95 %
Shock and Vibration
Range
Shock4
Non-operating
1,000 G (Max) at 0.5 msec
Vibration5
Operating
Non-operating
2.17 GRMS (5-700 Hz) Max
3.13 GRMS (5-800 Hz) Max
NOTES:
1. As measured by temperature sensor, SMART Attribute BEh. Active airflow is recommended within the system for
maintaining proper device operating temperature on heavier workloads.
2. Please contact your Intel representative for details on the non-operating temperature range.
3. Temperature gradient measured without condensation.
1. Shock specifications assume SSD is mounted securely with the input vibration applied to the drive-mounting
screws. Stimulus may be applied in the X, Y or Z axis. Shock specification is measured using peak acceleration and
pulse width value.
2. Vibration specifications assume the SSD is mounted securely with the input vibration applied to the drive-mounting
screws. Stimulus may be applied in the X, Y or Z axis. Vibration specification is measured using G Root Mean
Squared (GRMS) value.
2.4.2 Altitude
The drive is not sensitive to changes in atmospheric pressure because it has no moving parts. Drive tested under
non-operational conditions to pressures representative of -1 K and +40 K feet.
2.5 Product Regulatory Compliance
The Intel SSD 540s Series meets or exceeds the regulatory or certification requirements as specified in the Intel
SSD 540s Series Declaration of Conformity at http://www.intel.com/content/www/us/en/library/tech-
docs.results.html?mTag=rresourcetype:technicaldocument/declarationofconformity
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2.6 Reliability
The Intel SSD 540s Series meets or exceeds SSD endurance and data retention requirements as specified in the
JESD218 specification.
Table 9: Reliability Specifications
†120GB SSD qualified to 20 GB of host writes per day.
Parameter
Value
Uncorrectable Bit Error Rate (UBER)
Uncorrectable bit error rate will not exceed one sector in the specified number of bits
read. In the unlikely event of a non-recoverable read error, the SSD will report it as a
read failure to the host; the sector in error is considered corrupt and is not returned to
the host.
< 1 sector per 1016 bits read
Mean Time Between Failures (MTBF)
Mean Time Between Failures is estimated based on Telcordia* methodology and
demonstrated through Reliability Demonstration Test (RDT).
≥ 1.6 million hours
Minimum Useful Life/Endurance Rating
The SSD will have a minimum of five years of useful life under typical client workloads
with up to 40 GB† of host writes per day.
5 years
Insertion Cycles
Maximum insertion/removal cycles on M.2 port
250 insertion/removal cycles
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3 Mechanical Information
The following figures show the mechanical information for the single-sided, 80 mm height, M.2 Intel SSD
540s Series. All dimensions are in millimeters.
Figure 1: Dimensions for 80 mm single-sided M.2 Form Factor Drives (2280-S3-B-M)
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Figure 2: Dimensions for 80 mm double-sided M.2 Form Factor Drives (2280-D3-B-M)
Intel® Solid State Drive 540s Series (M.2)
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4 Pin and Signal Descriptions
4.1 Pin Locations
Figure 3: Layout of Signal and Power Segment Pins
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4.2 Signal Descriptions
Table 10: M.2 Serial ATA Power Pin Definitions
Pin
Function
Definition
P1
CONFIG_3
Ground
P2
+3.3 V
3.3 V Source
P3
GND
Ground
P4
+3.3 V
3.3 V Source
P5
Reserved
No Connect
P6
Reserved
No Connect
P7
Reserved
No Connect
P8
Reserved
No Connect
P9
Reserved
No Connect
P10
DAS/DSS#
Device Activity Signal / Disable Staggered Spin-up
P11
Reserved
No Connect
P12
Notch
No Connect
P13
Notch
No Connect
P14
Notch
No Connect
P15
Notch
No Connect
P16
Notch
No Connect
P17
Notch
No Connect
P18
Notch
No Connect
P19
Notch
No Connect
P20
Reserved
No Connect
P21
CONFIG_0
Ground
P22
Reserved
No Connect
P23
Reserved
No Connect
P24
Reserved
No Connect
P25
Reserved
No Connect
P26
Reserved
No Connect
P27
GND
Ground
P28
Reserved
No Connect
P29
Reserved
No Connect
P30
Reserved
No Connect
P31
Reserved
No Connect
P32
Reserved
No Connect
P33
GND
Ground
P34
Reserved
No Connect
P35
Reserved
No Connect
P36
Reserved
No Connect
P37
Reserved
No Connect
P38
DEVSLP
DevSleep Pin
P39
GND
Ground
P40
Reserved
No Connect
P41
+B
Host Receiver Differential Signal Pair (This is an output of the SSD)
P42
Reserved
No Connect
P43
-B
Host Receiver Differential Signal Pair (This is an output of the SSD)
Intel® Solid State Drive 540s Series (M.2)
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Pin
Function
Definition
P44
Reserved
No Connect
P45
GND
Ground
P46
Reserved
No Connect
P47
-A
Host Transmitter Differential Signal Pair (This is an input of the SSD)
P48
Reserved
No Connect
P49
+A
Host Transmitter Differential Signal Pair (This is an input of the SSD)
P50
Reserved
No Connect
P51
GND
Ground
P52
Reserved
No Connect
P53
Reserved
No Connect
P54
Reserved
No Connect
P55
Reserved
No Connect
P56
Two Wire Interface
Two Wire Interface Clock
P57
GND
Ground
P58
Two Wire Interface
Two Wire Interface Data
P59
Notch
No Connect
P60
Notch
No Connect
P61
Notch
No Connect
P62
Notch
No Connect
P63
Notch
No Connect
P64
Notch
No Connect
P65
Notch
No Connect
P66
Notch
No Connect
P67
Reserved
No Connect
P68
Reserved
No Connect
P69
CONFIG_1
Ground
P70
+3.3 V
3.3 V Source
P71
GND
Ground
P72
+3.3 V
3.3 V Source
P73
GND
Ground
P74
+3.3 V
3.3 V Source
P75
CONFIG_2
Ground
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5 Supported Command and Feature Sets
The Intel SSD 540s Series supports all mandatory Advanced Technology Attachment (ATA) and Serial ATA (SATA)
commands defined in the ACS-3 and SATA Revision 3.2 specifications. The mandatory and optional commands are
defined in this section.
5.1 Supported ATA General Feature Command Set
Below are mandatory and optional ATA feature sets supported by Intel SSD 540s Series.
48-Bit Address
General
General Purpose Logging (GPL)
Native Command Queuing (NCQ)
Power Management
Sanitize Device
Security
SMART
Software Settings Preservation (SSP)
Below are mandatory and optional ATA commands supported by Intel SSD 540s Series.
Table 11: Supported ATA Commands and Feature Sets
Commands
Feature Set
BLOCK ERASE EXT
Sanitize Device
CHECK POWER MODE
Power Management
CRYPTO SCRAMBLE EXT
Sanitize Device
DATA SET MANAGEMENT
ATA General Feature
DOWNLOAD MICROCODE
ATA General Feature
EXECUTE DEVICE DIAGNOSTIC
ATA General Feature
FLUSH CACHE
ATA General Feature
FLUSH CACHE EXT
48-Bit Address
IDENTIFY DEVICE 1
ATA General Feature
IDLE
Power Management
IDLE IMMEDIATE
Power Management
NOP
ATA General Feature
READ BUFFER
ATA General Feature
READ DMA
ATA General Feature
READ DMA EXT
48-Bit Address
READ FPDMA QUEUED
Native Command Queuing
READ LOG DMA EXT
General Purpose Logging
READ LOG EXT
General Purpose Logging
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Commands
Feature Set
READ MULTIPLE
ATA General Feature
READ MULTIPLE EXT
48-Bit Address
READ NATIVE MAX ADDRESS
48-Bit Address
READ NATIVE MAX ADDRESS EXT
48-Bit Address
READ SECTOR(S)
ATA General Feature
READ SECTOR(S) EXT
48-Bit Address
READ VERIFY SECTOR(S)
ATA General Feature
READ VERIFY SECTOR(S) EXT
48-Bit Address
SANITIZE FREEZE LOCK EXT
Sanitize Device
SANITIZE STATUS EXT
Sanitize Device
SECURITY DISABLE PASSWORD
ATA Security
SECURITY ERASE PREPARE
ATA Security
SECURITY ERASE UNIT
ATA Security
SECURITY FREEZE LOCK
ATA Security
SECURITY SET PASSWORD
ATA Security
SECURITY UNLOCK
ATA Security
SEEK
ATA General Feature
SET FEATURES
ATA General Feature
SET MAX ADDRESS EXT
48-Bit Address
SET MULTIPLE MODE
ATA General Feature
SLEEP
Power Management
SMART DISABLE OPERATIONS
SMART
SMART ENABLE OPERATIONS
SMART
SMART ENABLE/DISABLE ATTRIBUTE AUTOSAVE
SMART
SMART EXECUTE OFF-LINE IMMEDIATE
SMART
SMART READ DATA
SMART
SMART READ ATTRIBUTE THRESHOLDS
SMART
SMART READ LOG
SMART
SMART READ LOG SECTOR
SMART
SMART RETURN STATUS
SMART
SMART SAVE ATTRIBUTE VALUES
SMART
SMART WRITE LOG SECTOR
SMART
STANDBY
Power Management
STANDBY IMMEDIATE
Power Management
WRITE BUFFER
ATA General Feature
WRITE DMA
ATA General Feature
WRITE DMA EXT
48-Bit Address
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Commands
Feature Set
WRITE DMA FUA EXT
48-Bit Address
WRITE FPDMA QUEUED
Native Command Queuing
WRITE LOG DMA EXT
General Purpose Logging
WRITE LOG EXT
General Purpose Logging
WRITE MULTIPLE
ATA General Feature
WRITE MULTIPLE EXT
48-Bit Address
WRITE MULTIPLE FUA EXT
48-Bit Address
WRITE SECTOR(S)
ATA General Feature
WRITE SECTOR(S) EXT
48-Bit Address
WRITE UNCORRECTABLE EXT
ATA General Feature
NOTES:
1. See the Appendix for details on the sector data returned after issuing an IDENTIFY DEVICE command.
5.2 Security Features
5.2.1 Sanitization Methods
Sanitization refers to a process that renders data inaccessible. Various sanitization methods are listed below.
5.2.1.1 Secure Erase
Secure Erase runs the SECURITY ERASE UNIT command
Table 12: Supported Secure Erase Modes and Definitions
Secure Erase Mode
Definition
Normal Mode
Full NAND erase of user available space and spare area
Enhanced Mode
Cryptographically erase data
5.2.1.2 Sanitize Device
Table 13: Supported Sanitize Device Modes and Definitions
Mode
Definition
Block Erase
Block erase method, all user data areas including user data not currently
allocated, irretrievable
Crypto Scramble Ext
Changes the internal encryption keys
5.3 DevSleep
Intel® SSD 540s Series supports the DevSleep feature. DevSleep must be enabled on the device by the
host system through the SET FEATURES command. If DevSleep is enabled by the host, the host must drive
the DevSleep signal to proper assert/de-assert voltage levels according to the SATA specification. Entry into
DevSleep must be preceded by LPM slumber entry by host and device. The Intel SSD 540s Series also supports
Intel® Solid State Drive 540s Series (M.2)
March 2016 Product Specification
334047-001US 19
DevSleep_to_ReducedPwrState which allows the host to wake the drive using normal LPM COMWAKE
out-of-band signaling.
For the Intel SSD 540s Series, the recommended total time to DevSleep for system active state is 6 sec.
The AHCI* controller has 4 parameters used to define proper DevSleep operation between the host and drive.
The following table provides those recommended values for the Intel SSD 540s Series.
Table 14: DevSleep Control Parameters
Parameter
Definition
Control
Recommended
Settings
DITO
DevSleep Idle Time Out – number of
milliseconds prior to host asserting
DevSleep
Set by Host
Active (lid-up): 375
DM
DITO Multiplier – set once at boot-up
Set by Host
15
MDAT
Minimum DevSleep Assertion Time –
minimum time in milliseconds for
host to assert DevSleep
Reported by Drive
10
DETO
DevSleep Exit Time Out – max time in
milliseconds from when DevSleep is
negated to when device ready to
detect OOB
Reported by Drive
20
Total time to DevSleep entry = DITO * (DM+1)
5.4 SMART Attributes
The following two tables list the SMART attributes supported by the Intel SSD 540s Series, and the corresponding
status flags and threshold settings.
Table 15: SMART Attributes
ID
Attribute
Status Flags
Threshold
SP
EC
ER
PE
OC
PW
05h
Re-allocated Sector Count
The raw value of this attribute shows the
number of retired blocks since leaving the
factory (grown defect count).
1
1
0
0
1
0
0 (none)
09h
Power-On Hours Count
The raw value reports the cumulative number of
power-on hours over the life of the device,
The On/Off status of the Device Initiated
Power Management (DIPM) and Devsleep features will
affect the number of hours reported. If DIPM and/or
Devsleep are turned On, the recorded value for power-
on hours does not include the time
that the device is in those states.
1
1
0
0
1
0
0 (none)
0Ch
Power Cycle Count
The raw value of this attribute reports the
cumulative number of power cycle events
over the life of the device.
1
1
0
0
1
0
0 (none)
AAh
Available Reserved Space (See E8h Attribute)
1
1
0
0
1
1
10
Intel® Solid State Drive 540s Series (M.2)
Product Specification March 2016
20 334047-001US
ID
Attribute
Status Flags
Threshold
SP
EC
ER
PE
OC
PW
ABh
Program Fail Count
The raw value of this attribute shows total
count of program fails and the normalized
value, beginning at 100, shows the percent
remaining of allowable program fails.
1
1
0
0
1
0
0 (none)
ACh
Erase Fail Count
The raw value of this attribute shows total
count of erase fails and the normalized
value, beginning at 100, shows the percent
remaining of allowable erase fails.
1
1
0
0
1
0
0 (none)
AEh
Unexpected Power Loss
The raw value of this attribute reports the
cumulative number of unsafe (unclean)
shutdown events over the life of the device.
An unsafe shutdown occurs whenever the
device is powered off without STANDBY
IMMEDIATE being the last command
1
1
0
0
1
0
0 (none)
B7h
SATA Downshift Count
The raw value counts of the number of times SATA
interface selected lower signaling rate due
to error.
1
1
0
0
1
0
0
B8h
End-to-End Error Detection Count
Reports number of errors encountered during end-to-
end error detection within the SSD data path.
1
1
0
0
1
1
90
BBh
Uncorrectable Error Count
The raw value shows the count of errors that
could not be recovered using Error
Correction Code (ECC) and XOR
1
1
0
0
1
0
0 (none)
BEh
Temperature
Reports real-time temperature of drive as measured
by temperature sensor on drive PCB. The normalized
value reports the current temperature value. The raw
value shows current, lifetime highest and lifetime
lowest temperatures. Byte 1:0 = current temp Celsius;
Byte 3:2 = lifetime highest temp Celsius; Byte 5:4 =
lifetime lowest temp Celsius.
1
1
0
0
1
0
0 (none)
C0h
Power-Off Retract Count (Unsafe Shutdown Count)
The raw value of this attribute reports the cumulative
number of unsafe (unclean) shutdown events over the
life of the device. An unsafe shutdown occurs
whenever the device is powered off without STANDBY
IMMEDIATE being the last command.
1
1
0
0
1
0
0 (none)
C7h
CRC Error Count
The total number of encountered SATA interface
cyclic redundancy check (CRC) errors.
1
1
0
0
1
0
0 (none)
E1h
Host Writes
The raw value of this attribute reports the total
number of sectors written by the host system. The raw
value is increased by 1 for every 65,536 sectors
(32MB) written by the host.
1
1
0
0
1
0
0 (none)
E2h
Timed Workload Media Wear
Measures the wear seen by the SSD (since reset of the
workload timer, attribute E4h), as a percentage of the
maximum rated cycles. Divide raw value by 1024 to
get percentage of wear – accurate to 3 decimal places.
1
1
0
0
1
0
0 (none)
Intel® Solid State Drive 540s Series (M.2)
March 2016 Product Specification
334047-001US 21
ID
Attribute
Status Flags
Threshold
SP
EC
ER
PE
OC
PW
E3h
Timed Workload Host Read/Write Ratio
The raw value shows the percentage of I/O operations
that are read operations (since reset of the workload
timer, attribute E4h).
1
1
0
0
1
0
0 (none)
E4h
Timed Workload Timer
The raw value measures the elapsed time (number of
minutes since starting this workload timer).
1
1
0
0
1
0
0 (none)
E8h
Available Reserved Space
This attribute reports the number of reserve blocks
remaining. The normalized value begins at 100 (64h),
which corresponds to 100 percent availability of the
reserved space. The threshold value for this attribute
is 10 percent availability.
1
1
0
0
1
1
10
E9h
Media Wearout Indicator
This attribute reports the number of cycles the NAND
media has undergone. The normalized value declines
linearly from 100 to 1 as the average erase cycle
count increases from 0 to the maximum rated cycles.
Once the normalized value reaches 1, the number will
not decrease, although it is likely that significant
additional wear can be put on the device
1
1
0
0
1
0
0 (none)
F1h
Total LBAs Written
The raw value of this attribute reports the total
number of sectors written by the host system. The raw
value is increased by 1 for every 65,536 sectors
(32MB) written by the host.
1
1
0
0
1
0
0 (none)
F2h
Total LBAs Read
The raw value of this attribute reports the total
number of sectors read by the host system. The raw
value is increased by 1 for every 65,536 sectors
(32MB) read by the host.
1
1
0
0
1
0
0 (none)
F9h
Total NAND Writes
Raw value reports the number of writes to NAND in 1
GB increments.
1
1
0
0
1
0
0 (none)
Table 16: SMART Attribute Status Flags
Status Flag
Description
Value = 0
Value = 1
SP
Self-preserving attribute
Not a self-preserving attribute
Self-preserving attribute
EC
Event count attribute
Not an event count attribute
Event count attribute
ER
Error rate attribute
Not an error rate attribute
Error rate attribute
PE
Performance attribute
Not a performance attribute
Performance attribute
OC
Online collection attribute
Collected only during offline
activity
Collected during both offline
and online activity
PW
Pre-fail warranty attribute
Advisory
Pre-fail
Intel® Solid State Drive 540s Series (M.2)
Product Specification March 2016
22 334047-001US
6 Certifications and Declarations
The following table describes the Device Certifications supported by the Intel SSD 540s Series.
Table 17: Device Certifications and Declarations
Certification
Description
CE* Compliant
European Economic Area (EEA): Compliance with the essential requirements of EC Council
Directives Low Voltage Directive (LVD) 2006/95/EC, EMC Directive 2004/108/EC and Directive
2011/65/EU.
UL* Certified
Certified Underwriters Laboratories, Inc. Bi-National Component Recognition; UL 60950-1, 2nd
Edition, 2007-03-27 (Information Technology Equipment - Safety - Part 1: General
Requirements)
CSA C22.2 No. 60950-1-07, 2nd Edition, 2007-03 (Information Technology Equipment - Safety -
Part 1: General Requirements)
RCM* Compliant
Compliance with the Australia/New Zealand Standard AS/NZS3548 and Electromagnetic
Compatibility (EMC) Framework requirements of the Australian Communication Authority (ACA).
BSMI* Compliant
Compliance to the Taiwan EMC standard CNS 13438: Information technology equipment - Radio
disturbance Characteristics - limits and methods of measurement, as amended on June 1, 2006,
is harmonized with CISPR 22: 2005.04.
KCC*
Compliance with paragraph 1 of Article 11 of the Electromagnetic Compatibility Control
Regulation and meets the Electromagnetic Compatibility (EMC) Framework requirements of the
Radio Research Laboratory (RRL) Ministry of Information and Communication Republic of Korea.
Microsoft* WHCK/WHLK
Microsoft Windows Hardware Certification
RoHS* Compliant
Restriction of Hazardous Substance Directive
VCCI*
Voluntary Control Council for Interface to cope with disturbance problems caused by personal
computers or facsimile.
SATA-IO*
Indicates certified logo program from Serial ATA International Organization.
Low Halogen
Applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final
product. Intel components as well as purchased components on the finished assembly meet JS-
709 requirements, and the PCB/substrate meet IEC 61249-2-21 requirements. The replacement
of halogenated flame retardants and/or PVC may not be better for the environment.
Intel® Solid State Drive 540s Series (M.2)
March 2016 Product Specification
334047-001US 23
7 Appendix
7.1 Identify Device
The following table describes the sector data returned from an identify device command.
Table 18: Identify Device Returned Sector Data
Word
F = Fixed
V = Variable
X = Both
Default Value
Description
0
F
0040h
General configuration bit-significant information
1
X
3FFFh
Obsolete - Number of logical cylinders (16,383)
2
V
C837h
Specific configuration
3
X
0010h
Obsolete - Number of logical heads (16)
4-5
X
0h
Retired
6
X
003Fh
Obsolete - Number of logical sectors per logical track (63)
7-8
V
0h
Reserved for assignment by the CompactFlash* Association (CFA)
9
X
0h
Retired
10-19
F
varies
Serial number (20 ASCII characters)
20-21
X
0h
Retired
22
X
0h
Obsolete
23-26
F
varies
Firmware revision (8 ASCII characters)
27-46
F
varies
Model number (Intel® Solid State Drive)
47
F
8010h
7:0—Maximum number of sectors transferred per interrupt on
multiple commands
48
F
4000h
Reserved
49
F
2F00h
Capabilities
50
F
4000h
Capabilities
51-52
X
0h
Obsolete
53
F
0007h
Words 88 and 70:64 valid
54
X
3FFFh
Obsolete - Number of logical cylinders (16,383)
55
X
0010h
Obsolete - Number of logical heads (16)
56
X
003Fh
Obsolete - Number of logical sectors per logical track (63)
57-58
X
00FBFC10h
Obsolete
59
V
B110h
Sanitize/Multiple Sector settings
60-61
F
varies
Total number of user-addressable sectors
62
X
0h
Obsolete
63
F
0007h
Multi-word DMA modes supported/selected
Intel® Solid State Drive 540s Series (M.2)
Product Specification March 2016
24 334047-001US
Word
F = Fixed
V = Variable
X = Both
Default Value
Description
64
F
0003h
PIO modes supported
65
F
0078h
Minimum multiword DMA transfer cycle time per word
66
F
0078h
Manufacturer’s recommended multiword DMA transfer cycle time
67
F
0078h
Minimum PIO transfer cycle time without flow control
68
F
0078h
Minimum PIO transfer cycle time with IORDY flow control
69
F
4D10h
Additional Supported
70
F
0h
Reserved
71-74
F
0h
Reserved for IDENTIFY PACKET DEVICE command
75
F
001Fh
Queue depth
76
F
070Eh
Serial ATA capabilities
77
F
0086h
Reserved for future Serial ATA definition
78
F
014Ch
Serial ATA features supported
79
V
0040h
Serial ATA features enabled
80
F
07FCh
Major version number
81
F
FFFFh
Minor version number
82
F
746Bh
Command set supported
83
F
7409h
Command sets supported
84
F
6163h
Command set/feature supported extension
85
V
7469h
Command set/feature enabled
86
V
B409h
Command set/feature enabled
87
V
6163h
Command set/feature default
88
V
407Fh
Ultra DMA Modes
89
F
0002h
Time required for security erase unit completion
90
F
0001h
Time required for enhanced security erase completion
91
V
00FEh
Current advanced power management value
92
V
FFFEh
Master Password Revision Code
93
F
0h
Hardware reset result: the contents of bits (12:0) of this word shall
change only during the execution of a hardware reset
94
V
0h
Vendor’s recommended and actual acoustic management value
95
F
0h
Stream minimum request size
96
V
0h
Streaming transfer time - DMA
97
V
0h
Streaming access latency - DMA and PIO
98-99
F
0h
Streaming performance granularity
100-103
V
varies
Maximum user LBA for 48-bit address feature set
Intel® Solid State Drive 540s Series (M.2)
March 2016 Product Specification
334047-001US 25
Word
F = Fixed
V = Variable
X = Both
Default Value
Description
104
V
0h
Streaming transfer time - PIO
105
F
0008h
Reserved
106
F
4000h
Physical sector size / logical sector size
107
F
0h
Inter-seek delay for ISO-7779 acoustic testing in microseconds
108-111
F
varies
Unique ID
112-115
F
0h
Reserved for world wide name extension to 128 bits
116
V
0h
Reserved for technical report
117-118
F
0h
Words per logical sector
119
F
401Ch
Supported settings
120
F
401Ch
Command set/feature enabled/supported
121-126
F
0h
Reserved
127
F
0h
Removable Media Status Notification feature set support
128
V
0021h
Security status
129-159
X
varies
Vendor-specific
160
F
0h
CompactFlash Association (CFA) power mode 1
161-167
X
0h
Reserved for assignment by the CFA
168
F
0007h (M.2)
Nominal Form Factor
169
X
0001h
Data set management Trim attribute support
170-173
F
0h
Additional Product Identifier
174-175
F
0h
Reserved
176-205
V
0h
Current media serial number
206
X
0039h
SCT Command Transport
207-208
X
0h
Reserved
209
X
4000h
Alignment of logical blocks within a physical block
210-211
X
0h
Write-Read-Verify Sector Count Mode 3 (DWord)
212-213
X
0h
Write-Read-Verify Sector Count Mode 2 (DWord)
214
X
0h
NV Cache Capabilities
215-216
X
0h
NV Cache Size in Logical Blocks (DWord)
217
X
0001h
Nominal media rotation rate
218
X
0h
Reserved
219
X
0h
NV Cache Options
220
X
0h
Write-Read-Verify feature set
221
X
0h
Reserved
Intel® Solid State Drive 540s Series (M.2)
Product Specification March 2016
26 334047-001US
Word
F = Fixed
V = Variable
X = Both
Default Value
Description
222
X
10FFh
Transport major version number
223
X
0h
Transport minor version number
224-229
X
0h
Reserved
230-233
X
0h
Extended Number of User Addressable Sectors (QWord)
234
X
0002h
Minimum number of 512-byte data blocks per DOWNLOAD
MICROCODE command for mode 03h
235
X
0080h
Maximum number of 512-byte data blocks per DOWNLOAD
MICROCODE command for mode 03h
236-254
X
0h
Reserved
255
X
varies
Integrity word
NOTES:
F = Fixed. The content of the word is fixed and does not change. For removable media devices, these values may change
when media is removed or changed.
V = Variable. The state of at least one bit in a word is variable and may change depending on the state of the device or the
commands executed by the device.
X = F or V. The content of the word may be fixed or variable.
7.2 Models
The following table lists the available M.2 single-sided models of the Intel® SSD 540s Series.
Table 19: Available Models
Model String
Capacity
SSDSCKKW120H6
120GB
SSDSCKKW180H6
180GB
SSDSCKKW240H6
240GB
SSDSCKKW360H6
360GB
SSDSCKKW480H6
480GB
SSDSCKKW010X6
1000GB