Intel NUC7I3BNK User Manual

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Intel® NUC Board NUC7i3BNB

Technical Product Specification

January 2017

Order Number: J52707-001

Intel NUC Board NUC7i3BNB may contain design defects or errors known as errata that may cause the product to deviate from published

specifications. Current characterized errata, if any, are documented in Intel NUC Board NUC7i3BNB Specification Update.

Revision History

Revision

Revision History

Date

001

First release of the Intel NUC Board NUC7i3BNB Technical Product Specification

January 2017

Disclaimer

This product specification applies to only the standard Intel NUC Board with BIOS identifier BNKBL357.86A.

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR

IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT.

EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO

LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR

USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE,

MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.

UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR

ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL

INJURY OR DEATH MAY OCCUR.

All Intel NUC Boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal computers (PC) for

installation in homes, offices, schools, computer rooms, and similar locations. The suitability of this product for other PC

or embedded non-PC applications or other environments, such as medical, industrial, alarm systems, test equipment, etc.

may not be supported without further evaluation by Intel.

Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property

rights that relate to the presented subject matter. The furnishing of documents and other materials and information does

not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or

other intellectual property rights.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or

“undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or

incompatibilities arising from future changes to them.

Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each

processor family, not across different processor families: Go to:

Learn About Intel® Processor Numbers

Intel NUC may contain design defects or errors known as errata, which may cause the product to deviate from published

specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product

order.

Intel, the Intel logo, Intel NUC and Intel Core are trademarks of Intel Corporation in the U.S. and/or other countries.

* Other names and brands may be claimed as the property of others.

The terms HDMI and HDMI High-Definition Multimedia Interface, and the HDMI Logo are trademarks or registered

trademarks of HDMI Licensing LLC in the United States and other countries

DisplayPort™ and the DisplayPort™ logo are trademarks owned by the Video Electronics Standards Association (VESA®) in

the United States and other countries

iii

Board Identification Information

Basic Intel® NUC Board NUC7i3BNB Identification Information

AA Revision

BIOS Revision

Notes

J22859-302

BNKBL357.86A

1,2

Notes:

1. The AA number is found on a small label on the component side of the board.

2. The Intel® Core™ i3-7100U processor used on this AA revision consists of one of the following components:

Device

Stepping

S-Spec Numbers

Intel Core i3

SR343

Intel Core i3

SR2ZW

Product Identification Information

Intel® NUC Products NUC7i3BN{x} Identification Information

Product Name

Intel® NUC Board

Intel® NUC Kit NUC7i3BNK

NUC7i3BNB

Intel® NUC Kit NUC7i3BNH

Specification Changes or Clarifications

The table below indicates the Specification Changes or Specification Clarifications that apply to

the Intel NUC Board NUC7i3BNB.

Specification Changes or Clarifications

Date

Type of Change

Description of Changes or Clarifications

Errata

Current characterized errata, if any, are documented in a separate Specification Update. See

http://www.intel.com/content/www/us/en/nuc/overview.html for the latest documentation.

Intel NUC Board NUC7i3BNB Technical Product Specification

Preface

This Technical Product Specification (TPS) specifies the board layout, components, connectors,

power and environmental requirements, and the BIOS for Intel® NUC Board NUC7i3BNB.

Intended Audience

The TPS is intended to provide detailed, technical information about Intel® NUC Board

NUC7i3BNB and its components to the vendors, system integrators, and other engineers and

technicians who need this level of information. It is specifically not intended for general

audiences.

What This Document Contains

Chapter

Description

A description of the hardware used on Intel NUC Board NUC7i3BNB

A map of the resources of the Intel NUC Board

The features supported by the BIOS Setup program

A description of the BIOS error messages, beep codes, and POST codes

The features of the Intel NUC kit NUC7i3BNK and NUC7i3BNH

Typographical Conventions

This section contains information about the conventions used in this specification. Not all of

these symbols and abbreviations appear in all specifications of this type.

Notes, Cautions, and Warnings

NOTE

Notes call attention to important information.

CAUTION

Cautions are included to help you avoid damaging hardware or losing data.

Other Common Notation

Used after a signal name to identify an active-low signal (such as USBP0#)

Gigabyte (1,073,741,824 bytes)

GB/s

Gigabytes per second

Gb/s

Gigabits per second

Kilobyte (1024 bytes)

Kilobit (1024 bits)

kb/s

1000 bits per second

Megabyte (1,048,576 bytes)

MB/s

Megabytes per second

Megabit (1,048,576 bits)

Mb/s

Megabits per second

TDP

Thermal Design Power

Xxh

An address or data value ending with a lowercase h indicates a hexadecimal value.

x.x V

Volts. Voltages are DC unless otherwise specified.

This symbol is used to indicate third-party brands and names that are the property of their respective

owners.

vii

Contents

Revision History ............................................................................................................... ii

Disclaimer .................................................................................................................................................................. ii

Board Identification Information ..................................................................................................................... iii

Product Identification Information ................................................................................................................. iii

Errata ........................................................................................................................................................................... iii

Preface .............................................................................................................................. iv

Intended Audience ................................................................................................................................................ iv

What This Document Contains ........................................................................................................................ iv

Typographical Conventions .............................................................................................................................. iv

Contents .......................................................................................................................... vii

1 Product Description ............................................................................................... 13

1.1 Overview ...................................................................................................................................................... 13

1.1.1 Feature Summary .................................................................................................................. 13

1.1.2 Board Layout (Top) ............................................................................................................... 15

1.1.3 Board Layout (Bottom) ........................................................................................................ 17

1.1.4 Block Diagram ......................................................................................................................... 19

1.2 Online Support .......................................................................................................................................... 20

1.3 Processor ..................................................................................................................................................... 20

1.4 System Memory ........................................................................................................................................ 21

1.5 Processor Graphics Subsystem .......................................................................................................... 23

1.5.1 Integrated Graphics .............................................................................................................. 23

1.6 USB ................................................................................................................................................................. 26

1.7 SATA Interface ........................................................................................................................................... 26

1.7.1 AHCI Mode ................................................................................................................................ 27

1.7.2 Intel® Rapid Storage Technology / SATA RAID ......................................................... 27

1.7.3 Intel® Next Generation Storage Acceleration ............................................................. 27

1.8 Real-Time Clock Subsystem ................................................................................................................ 28

1.9 Audio Subsystem ..................................................................................................................................... 28

1.9.1 Audio Subsystem Software ............................................................................................... 29

1.10 LAN Subsystem ......................................................................................................................................... 29

1.10.1 Intel® I219V Gigabit Ethernet Controller ..................................................................... 29

1.10.2 LAN Subsystem Software ................................................................................................... 29

1.10.3 RJ-45 LAN Connector with Integrated LEDs .............................................................. 30

1.10.4 Wireless Network Module .................................................................................................. 31

1.11 Hardware Management Subsystem ................................................................................................. 31

1.11.1 Hardware Monitoring ........................................................................................................... 31

1.11.2 Fan Monitoring ........................................................................................................................ 31

viii

1.11.3 Thermal Solution ................................................................................................................... 31

1.12 Power Management ................................................................................................................................ 33

1.12.1 ACPI ............................................................................................................................................. 33

1.12.2 Hardware Support ................................................................................................................. 36

1.13 Intel Platform Security Technologies .............................................................................................. 38

1.13.1 Intel® Virtualization Technology ...................................................................................... 38

1.13.2 Intel® Platform Trust Technology ................................................................................... 38

2 Technical Reference ............................................................................................... 39

2.1 Memory Resources .................................................................................................................................. 39

2.1.1 Addressable Memory ........................................................................................................... 39

2.2 Connectors and Headers....................................................................................................................... 39

2.2.1 Front Panel Connectors ...................................................................................................... 40

2.2.2 Back Panel Connectors ....................................................................................................... 40

2.2.3 Headers and Connectors (Top) ........................................................................................ 41

2.2.4 Connectors and Headers (Bottom) ................................................................................. 42

2.3 BIOS Security Jumper ............................................................................................................................ 53

2.4 Mechanical Considerations .................................................................................................................. 55

2.4.1 Form Factor .............................................................................................................................. 55

2.5 Electrical Considerations ...................................................................................................................... 56

2.5.1 Power Supply Considerations .......................................................................................... 56

2.5.2 Fan Header Current Capability ......................................................................................... 56

2.6 Thermal Considerations ........................................................................................................................ 57

2.7 Reliability ..................................................................................................................................................... 62

2.8 Environmental ........................................................................................................................................... 62

3 Overview of BIOS Features ................................................................................... 63

3.1 Introduction ................................................................................................................................................ 63

3.2 BIOS Flash Memory Organization ..................................................................................................... 64

3.3 System Management BIOS (SMBIOS) .............................................................................................. 64

3.4 Legacy USB Support ............................................................................................................................... 64

3.5 BIOS Updates ............................................................................................................................................. 65

3.5.1 Language Support ................................................................................................................. 65

3.6 BIOS Recovery ........................................................................................................................................... 65

3.7 Boot Options .............................................................................................................................................. 67

3.7.1 Network Boot........................................................................................................................... 67

3.7.2 Booting Without Attached Devices ................................................................................ 67

3.7.3 Changing the Default Boot Device During POST ...................................................... 67

3.7.4 Power Button Menu .............................................................................................................. 68

3.8 Hard Disk Drive Password Security Feature .................................................................................. 69

3.9 BIOS Security Features .......................................................................................................................... 70

4 Error Messages and Blink Codes ......................................................................... 71

4.1 Front-panel Power LED Blink Codes ................................................................................................ 71

4.2 BIOS Error Messages ............................................................................................................................... 71

Contents

5 Intel NUC Kit Features ........................................................................................... 72

5.1 Chassis Front Panel Features .............................................................................................................. 72

5.3 Chassis Rear Panel Features ................................................................................................................ 74

Figures

Figure 1. Major Board Components (Top) ....................................................................................................... 15

Figure 2. Major Board Components (Bottom) ................................................................................................ 17

Figure 3. Block Diagram ........................................................................................................................................... 19

Figure 4. Memory Channel and SO-DIMM Configuration.......................................................................... 22

Figure 5. 4-Pin 3.5 mm (1/8 inch) Audio Jack Pin Out ............................................................................... 28

Figure 6. LAN Connector LED Locations........................................................................................................... 30

Figure 7. Thermal Solution and Fan Header ................................................................................................... 32

Figure 8. Location of the Standby Power LED ............................................................................................... 37

Figure 9. Front Panel Connectors ........................................................................................................................ 40

Figure 10. Back Panel Connectors ...................................................................................................................... 40

Figure 11. Headers and Connectors (Top) ....................................................................................................... 41

Figure 12. Connectors and Headers (Bottom) ............................................................................................... 42

Figure 13. Connection Diagram for Front Panel Header (2.0 mm Pitch) ............................................ 47

Figure 14. Connection Diagram for the Internal USB 2.0 Single-Port Header (1.25 mm Pitch) 51

Figure 15. Location of the CIR Sensor ............................................................................................................... 51

Figure 16. Location of the BIOS Security Jumper ........................................................................................ 53

Figure 17. Board Dimensions ................................................................................................................................ 55

Figure 18. Board Height Dimensions ................................................................................................................. 56

Figure 19. Localized High Temperature Zones ............................................................................................. 58

Figure 20. Installation Area of Thermal Pad for Intel NUC Kit NUC7i3BNK ...................................... 59

Figure 21. Installation area of Thermal Pad for Intel NUC Kit NUC7i3BNH ....................................... 60

Figure 22. Intel NUC Kit NUC7i3BNH Features – Front ............................................................................... 72

Figure 23. Intel NUC Kit NUC7i3BNK Features – Front ................................................................................ 73

Figure 24. Intel NUC Kit NUC7i3BNH Features – Rear ................................................................................. 74

Figure 25. Intel NUC Kit NUC7i3BNK Features – Rear ................................................................................. 75

Tables

Table 1. Feature Summary ..................................................................................................................................... 13

Table 2. Components Shown in Figure 1 ......................................................................................................... 16

Table 3. Components Shown in Figure 2 ......................................................................................................... 18

Table 4. Supported Memory Configurations .................................................................................................. 21

Table 5. Unsupported Memory Configurations............................................................................................. 21

Table 6. DisplayPort Multi-Streaming Resolutions ...................................................................................... 24

Table 7. Multiple Display Configuration Maximum Resolutions ............................................................ 25

Table 8. Audio Formats Supported by the HDMI and USB Type-C Interfaces ................................. 25

Table 9. LAN Connector LED States ................................................................................................................... 30

Table 10. Effects of Pressing the Power Switch ............................................................................................ 33

Table 11. Power States and Targeted System Power ................................................................................. 34

Table 12. Wake-up Devices and Events ........................................................................................................... 35

Table 13. Headers and Connectors Shown in Figure 11 ........................................................................... 41

Table 14. Connectors and Headers Shown in Figure 12 ........................................................................... 43

Table 15. SATA Power Connector (1.25 mm pitch) ..................................................................................... 44

Contents

Table 16. Single-Port Internal USB 2.0 Header (1.25 mm pitch) ........................................................... 44

Table 17. M.2 2280 Module (key type M) Connector .................................................................................. 44

Table 18. Digital Microphone (DMICS) Array Connector (1.25 mm Pitch).......................................... 45

Table 19. Front Panel HDD LED Ring Connector (1.25 mm Pitch) ........................................................ 46

Table 20. CEC Header (1.25 mm pitch) ............................................................................................................. 46

Table 21. Front Panel Header (2.0 mm Pitch) ................................................................................................ 47

Table 22. States for a One-Color Power LED ................................................................................................. 48

Table 23. States for a Dual-Color Power LED ................................................................................................ 48

Table 24. SDXC Card Reader Connector .......................................................................................................... 49

Table 25. HDMI CEC expected behavior ............................................................................................................ 52

Table 26. Front Panel LED Ring ........................................................................................................................... 52

Table 27. BIOS Security Jumper Settings ........................................................................................................ 54

Table 28. Fan Header Current Capability ......................................................................................................... 56

Table 29. Thermal Considerations for Components ................................................................................... 61

Table 30. Tcontrol Values for Components ................................................................................................... 61

Table 31. Environmental Specifications ........................................................................................................... 62

Table 32. Acceptable Drives/Media Types for BIOS Recovery ............................................................... 65

Table 33. Boot Device Menu Options ................................................................................................................ 67

Table 34. Master Key and User Hard Drive Password Functions ........................................................... 69

Table 35. Supervisor and User Password Functions................................................................................... 70

Table 36. Front-panel Power LED Blink Codes ............................................................................................. 71

Table 37. Components Shown in Figure 22 ................................................................................................... 72

Table 38. Components Shown in Figure 23 ................................................................................................... 73

Table 39. Components Shown in Figure 24 ................................................................................................... 74

Table 40. Components Shown in Figure 25 ................................................................................................... 75

1 Product Description

1.1 Overview

1.1.1 Feature Summary

Table 1 summarizes the major features of Intel® NUC Board NUC7i3BNB.

Table 1. Feature Summary

Form Factor

4.0 inches by 4.0 inches (101.60 millimeters by 101.60 millimeters)

Processor

 A soldered-down 7th generation Intel® Core™ i3-7100U dual-core processor with up to a

maximum 15 W TDP (if thermal margin available)

― Intel® HD Graphics 620

― Integrated memory controller

― Integrated PCH

Memory

 Two 260-pin 1.2 V DDR4 SDRAM Small Outline Dual Inline Memory Module (SO-DIMM)

sockets

 Support for DDR4 1866/2133 MHz SO-DIMMs

 Support for 4 Gb and 8 Gb memory technology

 Support for up to 32 GB of system memory with two SO-DIMMs using 8 Gb memory

technology

 Support for non-ECC memory

 Support for 1.2 V low voltage JEDEC memory only

Note: 2 Gb memory technology (SDRAM Density) is not supported

Graphics

 Integrated graphics support for processors with Intel® Graphics Technology:

― One High Definition Multimedia Interface* (HDMI*) back panel connector

― One USB Type-C back panel connector

Audio

 Intel® High Definition (Intel® HD) Audio via the HDMI v2.0 and USB Type-C interfaces

through the processor

 Realtek HD Audio via a stereo microphone/headphone 3.5 mm jack on the front panel

 Digital microphone array (DMICS) connector (internal)

Storage

 SATA ports:

― One SATA 6.0 Gb/s port (black) for 2.5“ storage device

 One SATA 6.0 Gb/s port is reserved for an M.2 storage module supporting M.2 2242 and

M.2 2280 (key type M and B+M) modules

Note: Supports key type M (PCI Express* x1/x2/x4 and SATA)

continued

Table 1. Feature Summary (continued)

Peripheral Interfaces

 One USB 3.1 (Gen 2) port implemented via the external back panel USB Type-C

connector

 USB 3.0 ports:

 Two ports are implemented with external front panel connectors (one blue and one

orange charging capable)

 Two ports are implemented with external back panel connectors (blue)

 USB 2.0 ports:

 Two ports via two single-port internal 1x4 1.25 mm pitch headers (white)

 One port is reserved for the M.2 2230 Wireless module

 Consumer Infrared (CIR)

Expansion Capabilities

 One M.2 connector supporting M.2 2242 and M.2 2280 (key type M and B+M) modules

 One Micro SDXC slot

Note: The Micro SDXC card reader is not supported in Microsoft* Windows* 7

BIOS

 Intel® BIOS resident in the Serial Peripheral Interface (SPI) Flash device

 Support for Advanced Configuration and Power Interface (ACPI), Plug and Play, and

System Management BIOS (SMBIOS)

Instantly Available PC

Technology

 Suspend to RAM support

 Wake on PCI Express, LAN, front panel, CIR, and USB ports

LAN

Gigabit (10/100/1000 Mb/s) LAN subsystem using the Intel® I219V Gigabit Ethernet

Controller

Hardware Monitor

Subsystem

Hardware monitoring subsystem, based on a ITE Tech. IT8987E-VG embedded controller,

including:

 Voltage sense to detect out of range power supply voltages

 Thermal sense to detect out of range thermal values

 One processor fan header

 Fan sense input used to monitor fan activity

 Fan speed control

Wireless

Intel® Dual Band Wireless-AC 8265

 802.11ac, Dual Band, 2x2 Wi-Fi + Bluetooth 4.2

 Maximum Transfer speed up to 867Mbps

 Supports Intel® Smart Connect Technology

Product Description

1.1.2 Board Layout (Top)

Figure 1 shows the location of the major components on the top-side of Intel NUC Board

NUC7i3BNB.

Figure 1. Major Board Components (Top)

Table 2 lists the components identified in Figure 1.

Table 2. Components Shown in Figure 1

Item from Figure 1

Description

USB Type-C connector

Processor fan header

Battery

Thermal solution

Product Description

1.1.3 Board Layout (Bottom)

Figure 2 shows the location of the major components on the bottom-side of Intel NUC Board

NUC7i3BNB.

Figure 2. Major Board Components (Bottom)

Table 3. Components Shown in Figure 2

Item from

Figure 2

Description

Back panel connectors

Front panel header

Digital microphone array connector

Front panel LED ring connector

Intel Dual Band Wireless AC + Bluetooth 8265 module

Micro SDXC slot

M.2 connector (key type M and B+M) for 2242 and 2280 modules

Front panel single-port USB 2.0 header (1.25 mm pitch)

Consumer Infrared (CIR) sensor

Front panel USB 3.0 connector (blue)

SATA 6.0 Gb/s connector

Front panel USB 3.0 connector (orange, charging)

SATA power connector (1.25 mm pitch)

Front panel stereo microphone/headphone jack

Front panel power button

BIOS security jumper

Consumer electronics control (CEC) header

DDR4 SO-DIMM sockets

Product Description

1.1.4 Block Diagram

Figure 3 is a block diagram of the major functional areas of the board.

Figure 3. Block Diagram

1.2 Online Support

To find information about…

Visit this World Wide Web site:

Intel NUC Board NUC7i3BNB

http://www.intel.com/NUC

Intel NUC Support

http://www.intel.com/NUCSupport

Available configurations for Intel NUC Board

NUC7i3BNB

http://ark.intel.com

Product support page NUC7i3BNK

http://www.intel.com/content/www/us/en/support/boards-and-

kits/intel-nuc-kits/intel-nuc-kit-nuc7i3bnk.html

Product support page NUC7i3BNH

http://www.intel.com/content/www/us/en/support/boards-and-

kits/intel-nuc-kits/intel-nuc-kit-nuc7i3bnh.html

BIOS and driver updates

http://downloadcenter.intel.com

BIOS and driver updates for NUC7i3BNK

https://downloadcenter.intel.com/product/95069

BIOS and driver updates for NUC7i3BNH

https://downloadcenter.intel.com/product/95066

Tested memory

http://www.intel.com/content/www/us/en/support/boards-and-

kits/000020648.html

Integration information

http://www.intel.com/NUCSupport

Processor datasheet

http://ark.intel.com

1.3 Processor

A soldered-down 7th generation Intel® Core™ i3-7100U dual-core processor with up to a

maximum 15 W TDP (if thermal margin is available).

 Intel® HD Graphics 620

 Integrated memory controller

 Integrated PCH

NOTE

There are specific requirements for providing power to the processor. Refer to Section 2.5.1 on

page 56 for information on power supply requirements.

Product Description

1.4 System Memory

The board has two 260-pin SO-DIMM sockets and supports the following memory features:

 1.2 V DDR4 SDRAM SO-DIMMs with gold plated contacts

 Two independent memory channels with interleaved mode support

 Unbuffered, single-sided or double-sided SO-DIMMs

 32 GB maximum total system memory (with 8 Gb memory technology). Refer to Section 2.1.1

on page 39 for information on the total amount of addressable memory.

 Minimum recommended total system memory: 2048 MB

 Non-ECC SO-DIMMs

 Serial Presence Detect

 DDR4 1866/2133 MHz SDRAM SO-DIMMs

NOTE

To be fully compliant with all applicable DDR SDRAM memory specifications, the board should be

populated with SO-DIMMs that support the Serial Presence Detect (SPD) data structure. This

allows the BIOS to read the SPD data and program the chipset to accurately configure memory

settings for optimum performance. If non-SPD memory is installed, the BIOS will attempt to

correctly configure the memory settings, but performance and reliability may be impacted or the

SO-DIMMs may not function under the determined frequency.

NOTE

Intel NUC Board NUC7i3BNB supports only 4 Gb and 8 Gb memory technologies (also referred to

as “SDRAM density”). Table 4 lists the supported SO-DIMM configurations. Table 5 lists the SO-

DIMM configurations that are not supported.

Table 4. Supported Memory Configurations

SO-DIMM

Capacity

Configuration (Note)

SDRAM

Density

SDRAM Organization

Front-side/Back-side

Number of SDRAM

Devices

2048 MB

4 Gbit

512 M x4/empty

4096 MB

4 Gbit

512 M x4/512 M x4

4096 MB

8 Gbit

1024 M x4/empty

8192 MB

4 Gbit

512 M x8/512 M x8

8192 MB

8 Gbit

1024 M x4/1024 M x4

16384 MB

8 Gbit

1024 M X8/1024 M x8

Note: “DS” refers to double-sided memory modules and “SS” refers to single-sided memory modules.

Table 5. Unsupported Memory Configurations

SO-DIMM

Capacity

Configuration (Note)

SDRAM

Density

SDRAM Organization

Front-side/Back-side

Number of SDRAM

Devices

1024 MB

1 Gbit

128 M x8/empty

2048 MB

1 Gbit

128 M x8/128 M x8

2048 MB

2 Gbit

256 M x8/empty

4096 MB

2 Gbit

256 M x8/256 M x8

Note: “DS” refers to double-sided memory modules and “SS” refers to single-sided memory modules.

For information about…

Refer to:

Tested Memory

http://www.intel.com/content/www/us/en/support/boards-and-

kits/000020648.html

Figure 4 illustrates the memory channel and SO-DIMM configuration.

Figure 4. Memory Channel and SO-DIMM Configuration

Product Description

1.5 Processor Graphics Subsystem

The board supports graphics through Intel HD Graphics.

1.5.1 Integrated Graphics

The board supports integrated graphics via the processor.

1.5.1.1 Intel® High Definition (Intel® HD) Graphics

The Intel HD graphics controller features the following:

 3D Features

― DirectX* 12.1 support

― OpenGL* 5.0 support

― OpenCL* 2.1 support

 Next Generation Intel® Clear Video Technology HD support is a collection of video playback

and enhancement features that improve the end user’s viewing experience

 Encode/transcode HD content

 Playback of high definition content including Blu-ray* disc

 Superior image quality with sharper, more colorful images

 DirectX* Video Acceleration (DXVA) support for accelerating video processing

 Full AVC/VC1/MPEG2/HEVC HW Encode/Decode

 Intel HD Graphics with Advanced Hardware Video Transcoding (Intel® Quick Sync Video)

NOTE

Intel Quick Sync Video is enabled by an appropriate software application.

1.5.1.2 Video Memory Allocation

Intel® Dynamic Video Memory Technology (DVMT) is a method for dynamically allocating system

memory for use as graphics memory to balance 2D/3D graphics and system performance. If your

computer is configured to use DVMT, graphics memory is allocated based on system

requirements and application demands (up to the configured maximum amount). When memory

is no longer needed by an application, the dynamically allocated portion of memory is returned to

the operating system for other uses.

1.5.1.3 High Definition Multimedia Interface* (HDMI*)

The HDMI port supports standard, enhanced, or high definition video, plus multi-channel digital

audio on a single cable. The port is compatible with all ATSC and DVB HDTV standards and

supports eight full range channels at 24-bit/96 kHz audio of lossless audio formats. The

maximum supported resolution is 4096 x 2160 @ 60 Hz, 24bpp. The HDMI port is compliant with

the HDMI 2.0 specification.

For information about

Refer to

HDMI technology

http://www.hdmi.org

1.5.1.4 DisplayPort* via USB Type-C

DisplayPort is a digital communication interface that utilizes differential signaling to achieve a

high bandwidth bus interface designed to support connections between PCs and monitors,

projectors, and TV displays. DisplayPort is suitable for display connections between consumer

electronics devices such as high definition optical disc players, set top boxes, and TV displays.

The maximum supported resolution is 4096 x 2304 @ 60 Hz, 24bpp. DisplayPort via USB Type-C

connector is compliant with the DisplayPort 1.2 specification.

DisplayPort output supports Multi-Stream Transport (MST) which allows for multiple

independent video streams (daisy-chain connection with multiple monitors) over a single

DisplayPort. This will require the use of displays that support DisplayPort 1.2 and allow for this

feature.

For information about

Refer to

DisplayPort technology

http://www.displayport.org

1.5.1.4.1 DisplayPort 1.2 Multi-Stream Transport Daisy-Chaining

Table 6 lists the maximum resolutions available when using DisplayPort 1.2 Multi-Stream

Transport.

Table 6. DisplayPort Multi-Streaming Resolutions

DisplayPort Usage Models

Monitor 1

Monitor 2

Monitor 3

3 Monitors

1920 x 1200 @ 60 Hz

1920 x 1080 @ 60 Hz

2 Monitors

2560 x 1600 @ 60 Hz

3 Monitors

(with DisplayPort 1.2 hub)

1920 x 1080 @ 60 Hz

Product Description

1.5.1.5 Multiple DisplayPort and HDMI Configurations

Multiple DisplayPort and HDMI configurations feature the following:

 Two independent displays with 4K support

 HDMI and USB Type-C

 Single HDMI 2.0 with 4K support

 Single DisplayPort 1.2 with 4K support via USB Type-C connector

 Collage Display

Table 7. Multiple Display Configuration Maximum Resolutions

Single Display

HDMI

Dual Display

USB Type-C and HDMI

Single Display

DisplayPort via USB Type-C

4096 x 2160 @ 60 Hz

4096 x 2304 @ 60 Hz (USB Type-C)

4096 x 2160 @ 60 Hz (HDMI)

4096 x 2304 @ 60 Hz

Note: Higher resolutions may be achievable but only at lower refresh rates

For information about

Refer to

Multiple display maximum

resolutions

https://www-

ssl.intel.com/content/www/us/en/processors/core/CoreTechnicalResources.html

(Generic link)

1.5.1.6 High-bandwidth Digital Content Protection (HDCP)

HDCP is the technology for protecting high definition content against unauthorized copy or

interception between a source (computer, digital set top boxes, etc.) and the sink (panels,

monitor, and TVs). The PCH supports HDCP 2.2 for content protection over wired displays (USB

Type-C and HDMI).

1.5.1.7 Integrated Audio Provided by the HDMI and USB Type-C Interfaces

The HDMI and USB Type-C interfaces from the PCH support audio. The processor supports two

High Definition audio streams on two digital ports simultaneously.

Table 8 shows the specific audio technologies supported by the PCH.

Table 8. Audio Formats Supported by the HDMI and USB Type-C Interfaces

Audio Formats

HDMI

USB Type-C

AC3 – Dolby* Digital

Yes

Dolby Digital Plus

Yes

DTS-HD*

Yes

LPCM, 192 kHz/24 bit, 8 channel

Yes

Dolby True HD, DTS-HD Master Audio* (Lossless Blu-ray Disc Audio

Format)

Yes

1.6 USB

The USB port arrangement is as follows:

 USB 3.1 Gen 2 Type-C port implemented via the external back panel USB Type-C connector

(maximum current is 3A):

 USB 3.0 ports (maximum current is 900 mA for each blue port, 1.5 A for the orange charging

port):

― Two ports are implemented with external front panel connectors (one blue and one

orange charging capable)

― Two ports are implemented with external back panel connectors (blue)

 USB 2.0 ports (maximum current is 500 mA for each port of the white header (1 A total):

― Two ports via two single-port internal 1x4 1.25 mm pitch headers (white)

― One port is reserved for the M.2 2230 Wireless module

All the USB ports are high-speed, full-speed, and low-speed capable.

NOTE

Computer systems that have an unshielded cable attached to a USB port may not meet FCC

Class B requirements, even if no device is attached to the cable. Use a shielded cable that meets

the requirements for full-speed devices.

For information about

Refer to

The location of the USB connectors on the back panel

Figure 9, page 40

The location of the front panel USB headers

Figure 2, page 17

1.7 SATA Interface

The board provides the following SATA interfaces:

 SATA ports:

― One SATA 6.0 Gb/s port for 2.5” storage device

 One SATA 6.0 Gb/s port is reserved for an M.2 storage module supporting M.2 2242 and

M.2 2280 (key type M and B+M) modules

The PCH provides independent SATA ports with a theoretical maximum transfer rate of 6 Gb/s. A

point-to-point interface is used for host to device connections.

Product Description

1.7.1 AHCI Mode

The board supports AHCI storage mode.

NOTE

In order to use AHCI mode, AHCI must be enabled in the BIOS. Microsoft* Windows* 10 includes

the necessary AHCI drivers without the need to install separate AHCI drivers during the operating

system installation process; however, it is always good practice to update the AHCI drivers to the

latest available by Intel.

1.7.2 Intel® Rapid Storage Technology / SATA RAID

The PCH supports Intel® Rapid Storage Technology, providing both AHCI and integrated RAID

functionality. The RAID capability provides high-performance RAID 0 and 1 functionality on all

SATA ports. Other RAID features include hot spare support, SMART alerting, and RAID 0 auto

replace. Software components include an Option ROM for pre-boot configuration and boot

functionality, a Microsoft Windows compatible driver, and a user interface for configuration and

management of the RAID capability of the PCH.

NOTE

Intel Rapid Storage Technology / SATA RAID is only supported if an M.2 SATA SSD module is used

with the onboard SATA interface. RAID is not available when using M.2 PCIe SSD module and

onboard SATA interface.

1.7.3 Intel® Next Generation Storage Acceleration

Intel® Next Generation Storage Acceleration with Intel® Optane™ Technology is a disk caching

solution that can provide improved computer system performance with improved power savings. It

allows configuration of a computer system with the advantage of having HDDs for maximum

storage capacity and with Intel® Optane™ Technology for improved system performance.

For more information on Intel® Optane™ Technology, go to

http://www.intel.com/content/www/us/en/architecture-and-technology/non-volatile-

memory.html

NOTE

In order to use supported RAID and Intel Next Generation Storage Acceleration with Intel®

Optane™ Technology features, you must first enable RAID in the BIOS.

1.8 Real-Time Clock Subsystem

A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer

is not plugged into a wall socket, the battery has an estimated life of three years. When the

computer is plugged in, the standby current from the power supply extends the life of the battery.

The clock is accurate to  13 minutes/year at 25 ºC with 3.3 VSB applied via the power supply 5 V

STBY rail.

NOTE

If the battery and AC power fail, date and time values will be reset and the user will be notified

during the POST.

When the voltage drops below a certain level, the BIOS Setup program settings stored in CMOS

RAM (for example, the date and time) might not be accurate. Replace the battery with an

equivalent one. Figure 1 on page 15 shows the location of the battery.

1.9 Audio Subsystem

The audio subsystem supports the following features:

 Digital microphone array (DMICS) connectors (internal)

 Analog line-out/Analog Headphone/Analog Microphone (front panel jack)

 Support for 44.1 kHz/48 kHz/96 kHz/192 kHz sample rates on all analog outputs

 Support for 44.1 kHz/48 kHz/96 kHz sample rates on all analog inputs

 Front Panel Audio Jack Support (see Figure 5 for 3.5 mm audio jack pin out):

― Speakers only (Stereo)

― Headphones only (Stereo)

― Microphone only (mono)

― Combo Headphone (Stereo)/Microphone (mono)

Pin Number

Pin Name

Description

Tip

Left Audio Out

Ring

Right Audio Out

Ring

Common/Ground

Sleeve

Audio In/MIC

Figure 5. 4-Pin 3.5 mm (1/8 inch) Audio Jack Pin Out

NOTE

The analog circuit of the front panel audio connector is designed to power headphones or

amplified speakers only. Poor audio quality occurs if passive (nonamplified) speakers are

connected to this output.

Product Description

1.9.1 Audio Subsystem Software

Audio software and drivers are available from Intel’s World Wide Web site.

For information about

Refer to

Obtaining Audio software and drivers

http://downloadcenter.intel.com

1.10 LAN Subsystem

The LAN subsystem consists of the following:

 Intel I219V Gigabit Ethernet Controller (10/100/1000 Mb/s)

 RJ-45 LAN connector with integrated status LEDs

Additional features of the LAN subsystem include:

 CSMA/CD protocol engine

 LAN connect interface between the Processor and the LAN controller

 Power management capabilities

― ACPI technology support

― LAN wake capabilities

 LAN subsystem software

1.10.1 Intel® I219V Gigabit Ethernet Controller

The Intel I219V Gigabit Ethernet Controller supports the following features:

 Compliant with the 1 Gb/s Ethernet 802.3, 802.3u, 802.3z, 802.3ab specifications

 Multi-speed operation: 10/100/1000 Mb/s

 Full-duplex operation at 10/100/1000 Mb/s; Half-duplex operation at 10/100 Mb/s

 Flow control support compliant with the 802.3X specification as well as the specific operation

of asymmetrical flow control defined by 802.3z

 VLAN support compliant with the 802.3q specification

 Supports Jumbo Frames (up to 9 kB)

― IEEE 1588 supports (Precision Time Protocol)

 MAC address filters: perfect match unicast filters, multicast hash filtering, broadcast filter, and

promiscuous mode

1.10.2 LAN Subsystem Software

LAN software and drivers are available from Intel’s World Wide Web site.

For information about

Refer to

Obtaining LAN software and drivers

http://downloadcenter.intel.com

1.10.3 RJ-45 LAN Connector with Integrated LEDs

Two LEDs are built into the RJ-45 LAN connector (shown in Figure 6).

Item

Description

Link LED (Green)

Data Rate LED (Green/Yellow)

Figure 6. LAN Connector LED Locations

Table 9 describes the LED states when the board is powered up and the LAN subsystem is

operating.

Table 9. LAN Connector LED States

LED

LED Color

LED State

Condition

Link

Green

Off

LAN link is not established.

LAN link is established.

Blinking

LAN activity is occurring.

Data Rate

Green/Yellow

Off

10 Mb/s data rate is selected.

Green

100 Mb/s data rate is selected.

Yellow

1000 Mb/s data rate is selected.

Product Description

1.10.4 Wireless Network Module

The Intel Dual Band Wireless-AC 8265 module provides hi-speed wireless connectivity provided

with the following capabilities:

 Compliant IEEE 802.11abgn, 802.11ac, 802.11d, 802.11e, 802.11i, 802.11h, 802.11w

specifications

 Maximum bandwidth of 867 Mbps

 Dual Mode Bluetooth* 4.2

 OS certified with Microsoft Windows 10

 Wi-Fi Direct* for peer to peer device connections

 Wi-Fi Miracast Source

 Authentication: WPA and WPA2, 802.1X (EAP-TLS, TTLS, PEAP, LEAP, EAP-FAST), EAP-SIM,

EAP-AKA

 Encryption: 64-bit and 128-bit WEP, AES-CCMP, TKIP, WPA2, AES-CCMP

For information about

Refer to

Obtaining WLAN software and drivers

http://downloadcenter.intel.com

Full Specifications

http://intel.com/wireless

1.11 Hardware Management Subsystem

The hardware management features enable the board to be compatible with the Wired for

Management (WfM) specification. The board has several hardware management features,

including thermal and voltage monitoring.

For information about

Refer to

Wired for Management (WfM) Specification

www.intel.com/design/archives/wfm/

1.11.1 Hardware Monitoring

The hardware monitoring and fan control subsystem is based on an ITE Tech. IT8987E-VG

embedded controller, which supports the following:

 Processor and system ambient temperature monitoring

 Chassis fan speed monitoring

 Voltage monitoring of CPU IO Vcc (+Vccio), Memory Vcc (V_SM), CPU IN Vcc (+Vccp)

 SMBus interface

1.11.2 Fan Monitoring

Fan monitoring can be implemented using third-party software.

1.11.3 Thermal Solution

Figure 7 shows the location of the thermal solution and processor fan header.

Item

Description

Processor fan header

Thermal solution

Figure 7. Thermal Solution and Fan Header

Product Description

1.12 Power Management

Power management is implemented at several levels, including:

 Software support through Advanced Configuration and Power Interface (ACPI)

 Hardware support:

― Power Input

― Instantly Available PC technology

― LAN wake capabilities

― Wake from USB

― WAKE# signal wake-up support

― Wake from S5

― Wake from CIR

― +5 V Standby Power Indicator LED

1.12.1 ACPI

ACPI gives the operating system direct control over the power management and Plug and Play

functions of a computer. The use of ACPI with this board requires an operating system that

provides full ACPI support. ACPI features include:

 Plug and Play (including bus and device enumeration)

 Power management control of individual devices, add-in boards (some add-in boards may

require an ACPI-aware driver), video displays, and hard disk drives

 Methods for achieving less than 15-watt system operation in the power-on/standby

sleeping state

 A Soft-off feature that enables the operating system to power-off the computer

 Support for multiple wake-up events (see Table 12 on page 35)

 Support for a front panel power and sleep mode switch

Table 10 lists the system states based on how long the power switch is pressed, depending on

how ACPI is configured with an ACPI-aware operating system.

Table 10. Effects of Pressing the Power Switch

If the system is in this state…

…and the power switch is pressed for

…the system enters this state

Off

(ACPI G2/G5 – Soft off)

Less than four seconds

Power-on

(ACPI G0 – working state)

Less than four seconds

Soft-off/Standby

(ACPI G1 – sleeping state) Note

(ACPI G0 – working state)

More than six seconds

Fail safe power-off

(ACPI G2/G5 – Soft off)

Sleep

(ACPI G1 – sleeping state)

Less than four seconds

Wake-up

(ACPI G0 – working state)

Sleep

(ACPI G1 – sleeping state)

More than six seconds

Power-off

(ACPI G2/G5 – Soft off)

Note: Depending on power management settings in the operating system.

1.12.1.1 System States and Power States

Under ACPI, the operating system directs all system and device power state transitions. The

operating system puts devices in and out of low-power states based on user preferences and

knowledge of how devices are being used by applications. Devices that are not being used can be

turned off. The operating system uses information from applications and user settings to put the

system as a whole into a low-power state.

Table 11 lists the power states supported by the board along with the associated system power

targets. See the ACPI specification for a complete description of the various system and power

states.

Table 11. Power States and Targeted System Power

Global States

Sleeping States

Processor

States

Device States

Targeted System

Power (Note 1)

G0 – working

state

S0 – working

C0 – working

D0 – working state.

Full power > 30 W

G1 – sleeping

state

S3 – Suspend to RAM.

Context saved to

RAM.

No power

D3 – no power

except for wake-up

logic.

Power < 5 W (Note 2)

G1 – sleeping

state

S4 – Suspend to disk.

Context saved to disk.

No power

D3 – no power

except for wake-up

logic.

Power < 5 W (Note 2)

G2/S5

S5 – Soft off. Context

not saved. Cold boot

is required.

No power

D3 – no power

except for wake-up

logic.

Power < 5 W (Note 2)

G3 – mechanical

off

AC power is

disconnected

from the

computer.

No power to the

system.

No power

D3 – no power for

wake-up logic,

except when

provided by battery

or external source.

No power to the system.

Service can be performed

safely.

Notes:

1. Total system power is dependent on the system configuration, including add-in boards and peripherals powered by

the system chassis’ power supply.

2. Dependent on the standby power consumption of wake-up devices used in the system.

Product Description

1.12.1.2 Wake-up Devices and Events

Table 12 lists the devices or specific events that can wake the computer from specific states.

Table 12. Wake-up Devices and Events

Devices/events that wake up the system…

…from this sleep state

Comments

Power switch

S3, S4, S51

RTC alarm

S3, S4, S51

Monitor to remain in sleep state

LAN

S3, S4, S51, 3

“S5 WOL after G3” must be supported;

monitor to remain in sleep state

USB

S3, S4, S51, 2, 3

Wake S4, S5 controlled by BIOS option

(not after G3)

WAKE#

S3, S41

Via WAKE; monitor to remain in sleep

state

Consumer IR

S3, S4, S51, 3

Will not wake when in Deep S4/S5 sleep

state

Bluetooth

N/A

Wake from Bluetooth is not supported

Notes:

1. S4 implies operating system support only.

2. Will not wake from Deep S4/S5. USB S4/S5 Power is controlled by BIOS. USB S5 wake is controlled by BIOS. USB S4

wake is controlled by OS driver, not just BIOS option.

3. Windows 8.1 Fast startup will block wake from LAN, USB, and CIR from S5.

NOTE

The use of these wake-up events from an ACPI state requires an operating system that provides

full ACPI support. In addition, software, drivers, and peripherals must fully support ACPI wake

events.

1.12.2 Hardware Support

The board provides several power management hardware features, including:

 Wake from Power Button signal

 Instantly Available PC technology

 LAN wake capabilities

 Wake from USB (not after G3)

 WAKE# signal wake-up support

 Wake from S5

 Wake from CIR

 +5 V Standby Power Indicator LED

NOTE

The use of Wake from USB from an ACPI state requires an operating system that provides full

ACPI support.

1.12.2.1 Power Input

When resuming from an AC power failure, the computer returns to the power state it was in

before power was interrupted (on or off). The computer’s response can be set using the Last

Power State feature in the BIOS Setup program’s Boot menu.

1.12.2.2 Instantly Available PC Technology

Instantly Available PC technology enables the board to enter the ACPI S3 (Suspend-to-RAM)

sleep-state. While in the S3 sleep-state, the computer will appear to be off (the power supply is

only supplying Standby power, and the front panel LED will be amber or secondary color if dual

colored, or off if single colored.) When signaled by a wake-up device or event, the system quickly

returns to its last known wake state. Table 12 on page 35 lists the devices and events that can

wake the computer from the S3 state.

The use of Instantly Available PC technology requires operating system support and drivers for

any installed M.2 add-in card.

1.12.2.3 LAN Wake Capabilities

LAN wake capabilities enable remote wake-up of the computer through a network. The LAN

subsystem monitors network traffic at the Media Independent Interface. Upon detecting a Magic

Packet* frame, the LAN subsystem asserts a wake-up signal that powers up the computer.

1.12.2.4 Wake from USB

USB bus activity wakes the computer from an ACPI S3 state (not after G3).

NOTE

Wake from USB requires the use of a USB peripheral that supports Wake from USB.

Product Description

1.12.2.5 WAKE# Signal Wake-up Support

When the WAKE# signal on the PCI Express bus is asserted, the computer wakes from an ACPI S3

or S4 state.

1.12.2.6 Wake from S5

When the RTC Date and Time is set in the BIOS, the computer will automatically wake from an

ACPI S5 state.

1.12.2.7 Wake from Consumer IR

CIR activity wakes the computer from an ACPI S3, S4, or S5 state.

1.12.2.8 +5 V Standby Power Indicator LED

The standby power indicator LED shows that power is still present even when the computer

appears to be off. Figure 8 shows the location of the standby power LED.

CAUTION

If AC power has been switched off and the standby power indicator is still lit, disconnect the power

cord before installing or removing any devices connected to the board. Failure to do so could

damage the board and any attached devices.

Figure 8. Location of the Standby Power LED

1.13 Intel Platform Security Technologies

Intel platform security technologies provides tools and resources to help the user protect their

information by creating a safer computing environment.

NOTE

Software with security capability is required to take advantage of Intel platform security

technologies.

1.13.1 Intel® Virtualization Technology

Intel Virtualization Technology (Intel® VT) is a hardware-assisted technology that, when

combined with software-based virtualization solutions, provides maximum system utilization by

consolidating multiple environments into a single server or client.

NOTE

A processor with Intel VT does not guarantee that virtualization will work on your system. Intel VT

requires a computer system with a chipset, BIOS, enabling software and/or operating system,

device drivers, and applications designed for this feature.

For information about

Refer to

Intel Virtualization Technology

http://www.intel.com/technology/virtualization/technology.htm

1.13.2 Intel® Platform Trust Technology

Intel® Platform Trust Technology (Intel® PTT) is a platform functionality for credential storage and

key management. Intel® PTT supports Microsoft* BitLocker* Drive Encryption for hard drive

encryption and supports all Microsoft requirements for firmware Trusted Platform Module (fTPM)

2.0.

NOTE

Support for fTPM version 2.0 requires a UEFI-enabled operating system, such as Microsoft*

Windows* 10.

CAUTION

BIOS recovery using the BIOS security jumper clears Intel® Platform Trust Technology (Intel® PTT)

keys. These keys will not be restored after the BIOS recovery.

For information about

Refer to

Intel Platform Trust Technology

http://www.intel.com/content/dam/www/public/us/en/documents

/white-papers/enterprise-security-platform-trust-technology-

white-paper.pdf

2 Technical Reference

2.1 Memory Resources

2.1.1 Addressable Memory

The board utilizes 32 GB of addressable system memory. Typically the address space that is

allocated for PCI Conventional bus add-in cards, PCI Express configuration space, BIOS (SPI Flash

device), and chipset overhead resides above the top of DRAM (total system memory). On a

system that has 32 GB of system memory installed, it is not possible to use all of the installed

memory due to system address space being allocated for other system critical functions. These

functions include the following:

 BIOS/SPI Flash device (64 Mb)

 Local APIC (19 MB)

 Direct Media Interface (40 MB)

 PCI Express configuration space (256 MB)

 PCH base address registers PCI Express ports (up to 256 MB)

 Memory-mapped I/O that is dynamically allocated for M.2 add-in cards (256 MB)

 Integrated graphics shared memory (up to 512 MB; 64 MB by default)

The board provides the capability to reclaim the physical memory overlapped by the memory

mapped I/O logical address space. The board remaps physical memory from the top of usable

DRAM boundary to the 4 GB boundary to an equivalent sized logical address range located just

above the 4 GB boundary. All installed system memory can be used when there is no overlap of

system addresses.

2.2 Connectors and Headers

CAUTION

Only the following connectors and headers have overcurrent protection: back panel and front

panel USB.

The other internal connectors and headers are not overcurrent protected and should connect only

to devices inside the computer’s chassis, such as fans and internal peripherals. Do not use these

connectors or headers to power devices external to the computer’s chassis. A fault in the load

presented by the external devices could cause damage to the computer, the power cable, and the

external devices themselves.

Furthermore, improper connection of USB header single wire connectors may eventually overload

the overcurrent protection and cause damage to the board.

This section describes the board’s connectors and headers. The connectors and headers can be

divided into these groups:

 Front panel I/O connectors

 Back panel I/O connectors

2.2.1 Front Panel Connectors

Figure 9 shows the location of the front panel connectors for the board.

Item

Description

Front panel power button

Front panel Stereo

microphone/headphone jack

USB 3.0 ports (orange charging

capable)

USB 3.0 (blue)

CIR

Figure 9. Front Panel Connectors

2.2.2 Back Panel Connectors

Figure 10 shows the location of the back panel connectors for the board.

Item

Description

USB Type-C connector

USB 3.0 ports (blue)

LAN

HDMI connector

12-19 V DC input jack

Figure 10. Back Panel Connectors

Technical Reference

2.2.3 Headers and Connectors (Top)

Figure 11 shows the location of the headers and connectors on the top-side of the board.

Figure 11. Headers and Connectors (Top)

Table 13 lists the headers and connectors identified in Figure 11.

Table 13. Headers and Connectors Shown in Figure 11

Item from Figure 11

Description

USB Type-C connector

Processor fan header

Battery and header

Thermal solution

2.2.4 Connectors and Headers (Bottom)

Figure 12 shows the locations of the connectors and headers on the bottom-side of the board.

Figure 12. Connectors and Headers (Bottom)

Technical Reference

Table 14 lists the connectors and headers identified in Figure 12.

Table 14. Connectors and Headers Shown in Figure 12

Item from

Figure 12

Description

Front panel header

Digital microphone array connector

Front panel LED ring connector

Micro SDXC slot

M.2 connector (key type M) for 2242 and 2280 modules

Front panel single-port USB 2.0 header (1.25 mm pitch)

SATA 6.0 Gb/s connector

SATA power connector (1.25 mm pitch)

BIOS security jumper

Consumer electronics control (CEC) header

2.2.4.1 Signal Tables for the Connectors and Headers

Table 15. SATA Power Connector (1.25 mm pitch)

Signal Name

+5 V

+3.3 V

GND

NOTE

Connector is Molex* part number 53398-0571, 1.25 mm pitch PicoBlade* header, surface mount,

vertical, lead-free, 5 circuits.

Table 16. Single-Port Internal USB 2.0 Header (1.25 mm pitch)

Signal Name

+5 V DC

D-

D+

Ground

NOTE

Connector is Molex part number 53398-0471, 1.25 mm pitch PicoBlade header, surface mount,

vertical, lead-free, 4 circuits.

Table 17. M.2 2280 Module (key type M) Connector

Signal Name

3.3V

GND

3.3V

GND

3.3V

GND

SUSCLK(32kHz) (O)(0/3.3V)

PEDET (NC-PCIe/GND-SATA)

Connector Key

N/C

Connector Key

N/C

Connector Key

N/C

GND

continued

Technical Reference

Table 17. M.2 2280 Module (key type M) Connector (continued)

Signal Name

PEWAKE# (I/O)(0/3.3V) or N/C

REFCLKP

CLKREQ# (I/O)(0/3.3V) or N/C

REFCLKN

PERST# (O)(0/3.3V) or N/C

GND

N/C

PETp0/SATA-A+

N/C

PETn0/SATA-A-

N/C

GND

N/C

PERp0/SATA-B-

N/C

PERn0/SATA-B+

DEVSLP (O)

GND

N/C

PETp1

N/C

PETn1

N/C

GND

N/C

PERp1

N/C

PERn1

N/C

GND

N/C

PETp2

N/C

PETn2

N/C

GND

3.3V

PERp2

3.3V

PERn2

3.3V

GND

3.3V

PETp3

DAS/DSS# (I/O)/LED1# (I)(0/3.3V)

PETn3

N/C

GND

N/C

PERp3

3.3V

PERn3

3.3V

GND

Table 18. Digital Microphone (DMICS) Array Connector (1.25 mm Pitch)

Signal Name

Ground

+3.3 V DC (+3V3_DMIC)

Clock (DMIC_CLK)

Data (DMIC_DAT)

NOTE

Connector is Aces part number 50273-0047C-002, 1.25 mm pitch header, surface mount, vertical,

lead-free, 4 circuits.

Table 19. Front Panel HDD LED Ring Connector (1.25 mm Pitch)

Signal Name

+5VSB

Red HDD LED

Green HDD LED

Blue HDD LED

NOTE

Connector is Aces part number 50273-0047C-002, 1.25 mm pitch header, surface mount, vertical,

lead-free, 4 circuits.

Table 20. CEC Header (1.25 mm pitch)

Signal Name

5VSTBY

GND

PWR_SWITCH#

HDMI_CEC

NOTE

Connector is Aces part number 50273-0047C-002, 1.25 mm pitch header, surface mount, vertical,

lead-free, 4 circuits.

Technical Reference

2.2.4.2 Add-in Card Connectors

The board supports M.2 2242 and 2280 (key type M) modules.

 Supports M.2 SSD SATA drives

― Maximum bandwidth is approximately 540 MB/s

 Supports M.2 SSD Gen 3 PCIe AHCI and NVMe drives (PCIe x1, x2, and x4)

― Using PCIe x4 M.2 SSD maximum bandwidth is approximately 4000 MB/s

2.2.4.3 USB Type-C connector

The board has several features that are supported via the USB Type-C connector.

 Supports USB 3.1 Gen 2.0

― Maximum bandwidth is approximately 10 Gbit/s

 Supports Display port 1.2

― Maximum bandwidth is approximately 17.28 Gbit/s

2.2.4.4 Front Panel Header (2.0 mm Pitch)

This section describes the functions of the front panel header. Table 21 lists the signal names of

the front panel header. Figure 13 is a connection diagram for the front panel header.

Table 21. Front Panel Header (2.0 mm Pitch)

Signal Name

Description

Signal Name

Description

HDD_POWER_LED

Pull-up resistor (750 Ω)

to +5V

POWER_LED_MAIN

[Out] Front panel LED (main

color)

HDD_LED#

[Out] Hard disk activity

LED

POWER_LED_ALT

[Out] Front panel LED (alt

color)

GROUND

Ground

POWER_SWITCH#

[In] Power switch

RESET_SWITCH#

[In] Reset switch

GROUND

Ground

+5V_DC

Power

Key

No pin

Figure 13. Connection Diagram for Front Panel Header (2.0 mm Pitch)

2.2.4.4.1 Hard Drive Activity LED Header

Pins 1 and 3 can be connected to an LED to provide a visual indicator that data is being read from

or written to a hard drive. Proper LED function requires a SATA hard drive or optical drive

connected to an onboard SATA connector.

2.2.4.4.2 Reset Switch Header

Pins 5 and 7 can be connected to a momentary single pole, single throw (SPST) type switch that is

normally open. When the switch is closed, the board resets and runs the POST.

2.2.4.4.3 Power/Sleep LED Header

Pins 2 and 4 can be connected to a one- or two-color LED. Table 22 and Table 23 show the

possible LED states.

Table 22. States for a One-Color Power LED

LED State

Description

Off

Power off

Blinking

Standby

Steady

Normal operation

Table 23. States for a Dual-Color Power LED

LED State

Description

Off

Power off

Secondary color blinking

(amber)

Standby

Primary color steady (white)

Normal operation

NOTE

The LED behavior shown in Table 22 is default – other patterns may be set via BIOS setup.

2.2.4.4.4 Power Switch Header

Pins 6 and 8 can be connected to a front panel momentary-contact power switch. The switch

must pull the SW_ON# pin to ground for at least 50 ms to signal the power supply to switch on or

off. (The time requirement is due to internal debounce circuitry on the board.) At least two

seconds must pass before the power supply will recognize another on/off signal.

Technical Reference

2.2.4.5 Micro SDXC Card Reader

The board has a micro Secure Digital (Micro SD) card reader that supports the Secure Digital

eXtended Capacity (SDXC) format, 3.01 specification.

Table 24. SDXC Card Reader Connector

Signal Name

Descriptive Name

Card Detection

DATA1

Serial Data 1

DATA0

Serial Data 0

GND

Ground

CLK

Serial Clock

VDD

Power (3.3 V)

CMD

Command

DATA3

Serial Data 3

DATA2

Serial Data 2

NOTE

The Micro SDXC card reader is not supported in Microsoft* Windows* 7

2.2.4.6 Power Supply Connector

The board has the following power supply connector:

 External Power Supply – the board can be powered through a 12-19 V DC connector on the

back panel. The back panel DC connector is compatible with a 5.5 mm/OD (outer diameter)

and 2.5 mm/ID (inner diameter) plug, where the inner contact is +12-19 (±10%) V DC and the

shell is GND. The maximum current rating is 10 A.

NOTE

External power voltage, 12-19 V DC, is dependent on the type of power brick used.

2.2.4.6.1 Power Sensing Circuit

The board has a power sensing circuit that:

 Manages CPU power usage to maintain system power consumption below 65 W.

 Designed for use with 65 W AC-DC adapters.

NOTE

It is recommended that you disable this feature (via BIOS option) when using an AC-DC

adapter greater than 65 W.

Technical Reference

2.2.4.7 Internal USB 2.0 Single-Port Header (1.25 mm Pitch)

Figure 14 is a connection diagram for the internal USB header.

NOTE

 The +5 V DC power on the USB header is fused.

 Use only an internal USB connector that conforms to the USB 2.0 specification for high-speed

USB devices.

Figure 14. Connection Diagram for the Internal

USB 2.0 Single-Port Header (1.25 mm Pitch)

2.2.4.8 Consumer Infrared (CIR) Sensor

The Consumer Infrared (CIR) sensor on the front panel provides features that are designed to

comply with Microsoft Consumer Infrared usage models (RC-6).

The CIR feature is made up of the receiving sensor. The receiving sensor consists of a filtered

translated infrared input compliant with Microsoft CIR specifications.

Customers are required to provide their own media center compatible remote or smart phone

application for use with the Intel NUC. Figure 15 shows the location of the CIR sensor.

Item

Description

CIR Sensor

Figure 15. Location of the CIR Sensor

2.2.4.9 Consumer Electronics Control (CEC) Header

The board contains two mutually-exclusive methods for controlling HDMI CEC devices:

 External CEC adaptor connected via CEC connector (item K in Figure 12; pinout in Table 20)

 Onboard CEC control from the embedded controller via HDMI cable and BIOS setup. Expected

behavior is provided in Table 25 below.

Table 25. HDMI CEC expected behavior

Activity

Current Status

Action

Expected Behavior

PC1,2

TV3

Wake On TV

Off

TV on

PC on

Standby by TV

TV Standby

PC sleep or power off4

Auto Turn Off TV (S0 -> S5)

PC Shutdown

TV standby3

Auto Turn On TV (S5 -> S0)

Off

PC On

TV on3

Auto Turn Off TV (S0 -> S3)

PC Sleep

TV standby3

Auto Turn On TV (S3 -> S0)

Off

PC On

TV on3

Notes:

1. HDMI CEC Control enabled in BIOS Setup and in TV setup, if necessary. Please consult your TV’s documentation.

2. Fast Boot and Deep S4/S5 disabled in BIOS Setup.

3. Results seen with Panasonic LED TV VIERA TH-40A400W. Other TVs may have different results due to variable implementations of

CEC features.

4. PC power off behavior dependent upon power button setting in operating system.

5. If using external CEC adaptor, onboard CEC control must be disabled in BIOS Setup.

NOTE

CEC Connector is Aces part number 50273-0047C-002, 1.25 mm pitch header, surface mount,

vertical, lead-free, 4 circuits.

2.2.4.10 Front Panel HDD LED Ring

The board supports a front panel HDD LED ring which is connected through Item C shown in

Figure 12. The Front panel HDD LED Ring is configurable within the bios under the Power tab

within Advanced settings. Table 19 lists the signal names of the front panel HDD LED ring

connector.

Table 26. Front Panel LED Ring

Bios Option

Possible Configurations

Front Panel HDD LED Ring Color

Yellow, cyan, magenta, blue, red, green and white.

Front Panel HDD LED Ring Brightness

0%, 50% 100%

Front Panel HDD LED Ring Activity Indicator

None, Power indicator, HDD Activity or Software defined

For information about

Refer to

HDMI CEC technology

http://www.hdmi.org/pdf/whitepaper/DesigningCECintoYourNextH

DMIProduct.pdf

Technical Reference

2.2.4.11 Digital Microphone Array

The digital microphone array consists of dual front facing digital microphones located on either

side of the front panel HDD LED ring to minimize acoustic interference. Item L in Figure 12 shows

the location of the digital microphone array connector. Table 18 lists the signal names of the

DMIC connector. See Chapter 5 for the physical location of the DMIC array on the Intel NUC Kit

NUC7i3BN[x] chassis.

2.3 BIOS Security Jumper

CAUTION

Do not move a jumper with the power on. Always turn off the power and unplug the power cord

from the computer before changing a jumper setting. Otherwise, the board could be damaged.

Figure 16 shows the location of the BIOS Security Jumper. The 3-pin jumper determines the

BIOS Security program’s mode.

Table 27 describes the jumper settings for the three modes: normal, lockdown, and

configuration.

Figure 16. Location of the BIOS Security Jumper

Table 27. BIOS Security Jumper Settings

Function/Mode

Jumper Setting

Configuration

Normal

1-2

The BIOS uses current configuration information and passwords for

booting.

Lockdown

2-3

The BIOS uses current configuration information and passwords for

booting, except:

• All POST Hotkeys are suppressed (prompts are not displayed and keys

are not accepted. For example, F2 for Setup, F10 for the Boot Menu).

• Power Button Menu is not available (see Section 3.7.4 Power Button

Menu).

BIOS updates are not available except for automatic Recovery due to flash

corruption.

Configuration

None

BIOS Recovery Update process if a matching *.bio file is found. Recovery

Update can be cancelled by pressing the Esc key.

If the Recovery Update was cancelled or a matching *.bio file was not

found, a Config Menu will be displayed. The Config Menu consists of the

following (selected Power Button Menu options):

[1] Suppress this menu until the BIOS Security Jumper is replaced.

[2] Clear BIOS User and Supervisor Passwords.

See Section 3.7.4 Power Button Menu.

Technical Reference

2.4 Mechanical Considerations

2.4.1 Form Factor

The board is designed to fit into a custom chassis. Figure 17 illustrates the mechanical form

factor for the board. Dimensions are given in inches [millimeters].

Figure 17. Board Dimensions

Figure 18 shows the height dimensions of the board.

Figure 18. Board Height Dimensions

2.5 Electrical Considerations

2.5.1 Power Supply Considerations

System power requirements will depend on actual system configurations chosen by the

integrator, as well as end user expansion preferences. It is the system integrator’s responsibility

to ensure an appropriate power budget for the system configuration is properly assessed based

on the system-level components chosen.

2.5.2 Fan Header Current Capability

Table 28 lists the current capability of the fan header.

Table 28. Fan Header Current Capability

Fan Header

Maximum Available Current

Processor fan

.5 A

Technical Reference

2.6 Thermal Considerations

CAUTION

A chassis with a maximum internal ambient temperature of 50 oC at the processor fan inlet is

recommended. If the internal ambient temperature exceeds 50 oC, further thermal testing is

required to ensure components do not exceed their maximum case temperature.

CAUTION

Failure to ensure appropriate airflow may result in reduced performance of both the processor

and/or voltage regulator or, in some instances, damage to the board.

All responsibility for determining the adequacy of any thermal or system design remains solely

with the system integrator. Intel makes no warranties or representations that merely following the

instructions presented in this document will result in a system with adequate thermal

performance.

CAUTION

Ensure that the ambient temperature does not exceed the board’s maximum operating

temperature. Failure to do so could cause components to exceed their maximum case

temperature and malfunction. For information about the maximum operating temperature, see

the environmental specifications in Section 2.8.

CAUTION

Ensure that proper airflow is maintained in the processor voltage regulator circuit. Failure to do

so may result in shorter than expected product lifetime.

Figure 19 shows the locations of the localized high temperature zones.

Item

Description

Processor voltage regulator area

Thermal solution

Figure 19. Localized High Temperature Zones

Technical Reference

A thermal pad has been installed for the bottom of the chassis to improve the thermal

performance when using M.2 devices that operate at higher temperatures. If the thermal pad

ever needs to be replaced, Figure 20 shows the installation area of the thermal pad for the Intel

NUC Kit NUC7i3BNK.

Item

Description

Thermal Pad

Thermal Pad Installation Area

Figure 20. Installation Area of Thermal Pad for Intel NUC Kit NUC7i3BNK

Figure 21 shows the installation area of the thermal pad for the Intel NUC Kit NUC7i3BNH.

Item

Description

Thermal Pad

Thermal Pad Installation Area

Figure 21. Installation area of Thermal Pad for Intel NUC Kit NUC7i3BNH

Technical Reference

Table 29 provides maximum case temperatures for the components that are sensitive to thermal

changes. The operating temperature, current load, or operating frequency could affect case

temperatures. Maximum case temperatures are important when considering proper airflow to

cool the board.

Table 29. Thermal Considerations for Components

Component

Maximum Case Temperature

Processor

For processor case temperature, see processor datasheets and processor

specification updates

To ensure functionality and reliability, the component is specified for proper operation when

Case Temperature is maintained at or below the maximum temperature listed in Table 30. This is

a requirement for sustained power dissipation equal to Thermal Design Power (TDP is specified

as the maximum sustainable power to be dissipated by the components). When the component is

dissipating less than TDP, the case temperature should be below the Maximum Case

Temperature. The surface temperature at the geometric center of the component corresponds to

Case Temperature.

It is important to note that the temperature measurement in the system BIOS is a value reported

by embedded thermal sensors in the components and does not directly correspond to the

Maximum Case Temperature. The upper operating limit when monitoring this thermal sensor is

Tcontrol.

Table 30. Tcontrol Values for Components

Component

Tcontrol

Processor

For processor case temperature, see processor datasheets and processor

specification updates

For information about

Refer to

Processor datasheets and specification updates

Section 1.2, page 20

2.7 Reliability

The Mean Time Between Failures (MTBF) prediction is calculated using component and

subassembly random failure rates. The calculation is based on the Telcordia SR-332 Issue 2,

Method I, Case 3, 55 ºC ambient. The MTBF prediction is used to estimate repair rates and spare

parts requirements. The MTBF for Intel NUC7i3BNB board is 62,965.

2.8 Environmental

Table 31 lists the environmental specifications for the board.

Table 31. Environmental Specifications

Parameter

Specification

Temperature

Non-Operating

-40 C to +60 C

Operating

0 C to +35 C

The operating temperature of the board may be determined by measuring the air

temperature from the junction of the heatsink fins and fan, next to the attachment screw,

in a closed chassis, while the system is in operation.

Shock

Unpackaged

50 g trapezoidal waveform

Velocity change of 170 inches/s²

Packaged

Half sine 2 millisecond

Product Weight (pounds)

Free Fall (inches)

Velocity Change (inches/s²)

<20

167

21-40

152

41-80

136

81-100

118

Vibration

Unpackaged

5 Hz to 20 Hz: 0.01 g² Hz sloping up to 0.02 g² Hz

20 Hz to 500 Hz: 0.02 g² Hz (flat)

Packaged

5 Hz to 40 Hz: 0.015 g² Hz (flat)

40 Hz to 500 Hz: 0.015 g² Hz sloping down to 0.00015 g² Hz

Note: Before attempting to operate this board, the overall temperature of the board must be above the minimum

operating temperature specified. It is recommended that the board temperature be at least room temperature

before attempting to power on the board. The operating and non-operating environment must avoid condensing

humidity.

3 Overview of BIOS Features

3.1 Introduction

The board uses Intel Visual BIOS that is stored in the Serial Peripheral Interface Flash Memory

(SPI Flash) and can be updated using a disk-based program. The SPI Flash contains the Visual

BIOS Setup program, POST, the PCI auto-configuration utility, LAN EEPROM information, and

Plug and Play support.

The BIOS displays a message during POST identifying the type of BIOS and a revision code. The

initial production BIOSs are identified as BNKBL357.86A.

The Visual BIOS Setup program can be used to view and change the BIOS settings for the

computer. The BIOS Setup program is accessed by pressing the <F2> key after the Power-On

Self-Test (POST) memory test begins and before the operating system boot begins.

NOTE

The maintenance menu is displayed only when the board is in configure mode. Section 2.3 on

page 53 shows how to put the board in configure mode.

3.2 BIOS Flash Memory Organization

The Serial Peripheral Interface Flash Memory (SPI Flash) includes a 64 Mb flash memory device.

3.3 System Management BIOS (SMBIOS)

SMBIOS is a Desktop Management Interface (DMI) compliant method for managing computers in

a managed network.

The main component of SMBIOS is the Management Information Format (MIF) database, which

contains information about the computing system and its components. Using SMBIOS, a system

administrator can obtain the system types, capabilities, operational status, and installation dates

for system components. The MIF database defines the data and provides the method for

accessing this information. The BIOS enables applications such as third-party management

software to use SMBIOS. The BIOS stores and reports the following SMBIOS information:

 BIOS data, such as the BIOS revision level

 Fixed-system data, such as peripherals, serial numbers, and asset tags

 Resource data, such as memory size, cache size, and processor speed

 Dynamic data, such as event detection and error logging

Non-Plug and Play operating systems require an additional interface for obtaining the SMBIOS

information. The BIOS supports an SMBIOS table interface for such operating systems. Using

this support, an SMBIOS service-level application running on a non-Plug and Play operating

system can obtain the SMBIOS information. Additional board information can be found in the

BIOS under the Additional Information header under the Main BIOS page.

3.4 Legacy USB Support

Legacy USB support enables USB devices to be used even when the operating system’s USB

drivers are not yet available. Legacy USB support is used to access the BIOS Setup program, and

to install an operating system that supports USB. By default, Legacy USB support is set to

Enabled.

Legacy USB support operates as follows:

1. When you apply power to the computer, legacy support is disabled.

2. POST begins.

3. Legacy USB support is enabled by the BIOS allowing you to use a USB keyboard to enter and

configure the BIOS Setup program and the maintenance menu.

4. POST completes.

5. The operating system loads. While the operating system is loading, USB keyboards and mice

are recognized and may be used to configure the operating system. (Keyboards and mice are

not recognized during this period if Legacy USB support was set to Disabled in the BIOS

Setup program.)

6. After the operating system loads the USB drivers, all legacy and non-legacy USB devices are

recognized by the operating system, and Legacy USB support from the BIOS is no longer

used.

Overview of BIOS Features

To install an operating system that supports USB, verify that Legacy USB support in the BIOS

Setup program is set to Enabled and follow the operating system’s installation instructions.

3.5 BIOS Updates

The BIOS can be updated using one of the following methods:

 Intel Express BIOS Update Utility, which enables automated updating while in the Windows

environment. Using this utility, the BIOS can be updated from a file on a hard disk, a USB

drive (a flash drive or a USB hard drive), or a CD-ROM, or from the file location on the Web.

 Intel Flash Memory Update Utility, which requires booting from DOS. Using this utility, the

BIOS can be updated from a file on a hard disk, a USB drive (a flash drive or a USB hard drive),

or a CD-ROM.

 Intel® F7 switch during POST allows a user to select where the BIOS .bio file is located and

perform the update from that location/device. Similar to performing a BIOS Recovery without

removing the BIOS configuration jumper.

 Intel® Visual BIOS has an option to update the BIOS from a valid .bio file located on a hard

disk or USB drive. Enter Intel Visual BIOS by pressing <F2> during POST.

 Using Front Panel menu option

Both utilities verify that the updated BIOS matches the target system to prevent accidentally

installing an incompatible BIOS.

NOTE

Review the instructions distributed with the upgrade utility before attempting a BIOS update.

For information about

Refer to

BIOS update utilities

http://www.intel.com/content/www/us/en/support/boards-and-

kits/000005636.html

3.5.1 Language Support

The BIOS Setup program and help messages are supported in US English. Check the Intel web

site for support.

3.6 BIOS Recovery

It is unlikely that anything will interrupt a BIOS update; however, if an interruption occurs, the

BIOS could be damaged. Table 32 lists the drives and media types that can and cannot be used

for BIOS recovery. The BIOS recovery media does not need to be made bootable.

Table 32. Acceptable Drives/Media Types for BIOS Recovery

Media Type (Note)

Can be used for BIOS recovery?

Hard disk drive (connected to SATA or USB)

Yes

CD/DVD drive (connected to SATA or USB)

Yes

USB flash drive

Yes

USB diskette drive (with a 1.4 MB diskette)

No (BIOS update file is bigger than 1.4 MB size limit)

NOTE

Supported file systems for BIOS recovery:

 NTFS (sparse, compressed, or encrypted files are not supported)

 FAT32

 FAT16

 FAT12

 ISO 9660

For information about

Refer to

BIOS recovery

http://www.intel.com/content/www/us/en/support/boards-and-

kits/000005532.html

Overview of BIOS Features

3.7 Boot Options

In the BIOS Setup program, the user can choose to boot from a hard drive, optical drive,

removable drive, or the network. The default setting is for the optical drive to be the first boot

device, the hard drive second, removable drive third, and the network fourth.

NOTE

Optical drives are not supported by the onboard SATA connectors. Optical drives are supported

only via the USB interfaces.

3.7.1 Network Boot

The network can be selected as a boot device. This selection allows booting from the onboard

LAN or a network add-in card with a remote boot ROM installed.

Pressing the <F12> key during POST automatically forces booting from the LAN. To use this key

during POST, the User Access Level in the BIOS Setup program's Security menu must be

set to Full.

3.7.2 Booting Without Attached Devices

For use in embedded applications, the BIOS has been designed so that after passing the POST,

the operating system loader is invoked even if the following devices are not present:

 Video adapter

 Keyboard

 Mouse

3.7.3 Changing the Default Boot Device During POST

Pressing the <F10> key during POST causes a boot device menu to be displayed. This menu

displays the list of available boot devices. Table 33 lists the boot device menu options.

Table 33. Boot Device Menu Options

Boot Device Menu Function Keys

Description

<> or <>

Selects a default boot device

<Enter>

Exits the menu, and boots from the selected device

<Esc>

Exits the menu and boots according to the boot priority defined

through BIOS setup

3.7.4 Power Button Menu

As an alternative to Back-to-BIOS Mode or normal POST Hotkeys, the user can use the power

button to access a menu. The Power Button Menu is accessible via the following sequence:

1. System is in S4/S5 (not G3)

2. User pushes the power button and holds it down for 3 seconds

3. The system will emit three short beeps from the front panel (FP) audio port, then stop to

signal the user to release the power button. The FP power button LED will also change from

Blue to Amber when the user can release the power button.

4. User releases the power button before the 4-second shutdown override

If this boot path is taken, the BIOS will use default settings, ignoring settings in VPD where

possible.

At the point where Setup Entry/Boot would be in the normal boot path, the BIOS will display the

following prompt and wait for a keystroke:

[ESC] Normal Boot

[F2] Intel Visual BIOS

[F3] Disable Fast Boot

[F4] BIOS Recovery

[F7] Update BIOS

[F10] Enter Boot Menu

[F12] Network Boot

[F2] Enter Setup is displayed instead if Visual BIOS is not supported.

[F3] Disable Fast Boot is only displayed if at least one Fast Boot optimization is enabled.

[F9] Remote Assistance is only displayed if Remote Assistance is supported.

If an unrecognized key is hit, then the BIOS will beep and wait for another keystroke. If one of the

listed hotkeys is hit, the BIOS will follow the indicated boot path. Password requirements must

still be honored.

If Disable Fast Boot is selected, the BIOS will disable all Fast Boot optimizations and reset the

system.

Overview of BIOS Features

3.8 Hard Disk Drive Password Security Feature

The Hard Disk Drive Password Security feature blocks read and write accesses to the hard disk

drive until the correct password is given. Hard Disk Drive Passwords are set in BIOS SETUP and

are prompted for during BIOS POST. For convenient support of S3 resume, the system BIOS will

automatically unlock drives on resume from S3. Valid password characters are A-Z, a-z, and 0-9.

Passwords may be up to 19 characters in length.

The User hard disk drive password, when installed, will be required upon each power-cycle until

the Master Key or User hard disk drive password is submitted.

The Master Key hard disk drive password, when installed, will not lock the drive. The Master Key

hard disk drive password exists as an unlock override in the event that the User hard disk drive

password is forgotten. Only the installation of the User hard disk drive password will cause a hard

disk to be locked upon a system power-cycle.

Table 34 shows the effects of setting the Hard Disk Drive Passwords.

Table 34. Master Key and User Hard Drive Password Functions

Password Set

Password During Boot

Neither

None

Master only

None

User only

Master and User Set

Master or User

During every POST, if a User hard disk drive password is set, POST execution will pause with the

following prompt to force the user to enter the Master Key or User hard disk drive password:

Enter Hard Disk Drive Password:

Upon successful entry of the Master Key or User hard disk drive password, the system will

continue with normal POST.

If the hard disk drive password is not correctly entered, the system will go back to the above

prompt. The user will have three attempts to correctly enter the hard disk drive password. After

the third unsuccessful hard disk drive password attempt, the system will halt with the message:

Hard Disk Drive Password Entry Error

A manual power cycle will be required to resume system operation.

NOTE

As implemented on Intel NUC Board NUC7i3BNB Hard Disk Drive Password Security is only

supported on either SATA port 0 (M.2 ) or SATA Port 1 (onboard SATA connector). The passwords

are stored on the hard disk drive so if the drive is relocated to another computer that does not

support Hard Disk Drive Password Security feature, the drive will not be accessible.

Currently, there is no industry standard for implementing Hard Disk Drive Password Security on

AHCI or NVME drives. Hard drive encryption can still be implemented and does not require Hard

Disk Drive Password Security.

3.9 BIOS Security Features

The BIOS includes security features that restrict access to the BIOS Setup program and who can

boot the computer. A supervisor password and a user password can be set for the BIOS Setup

program and for booting the computer, with the following restrictions:

 The supervisor password gives unrestricted access to view and change all the Setup options

in the BIOS Setup program. This is the supervisor mode.

 The user password gives restricted access to view and change Setup options in the BIOS

Setup program. This is the user mode.

 If only the supervisor password is set, pressing the <Enter> key at the password prompt of

the BIOS Setup program allows the user restricted access to Setup.

 If both the supervisor and user passwords are set, users can enter either the supervisor

password or the user password to access Setup. Users have access to Setup respective to

which password is entered.

 Setting the user password restricts who can boot the computer. The password prompt will be

displayed before the computer is booted. If only the supervisor password is set, the

computer boots without asking for a password. If both passwords are set, the user can enter

either password to boot the computer.

 For enhanced security, use different passwords for the supervisor and user passwords.

 Valid password characters are A-Z, a-z, and 0-9. Passwords may be up to 20 characters in

length.

 To clear a set password, enter a blank password after entering the existing password.

Table 35 shows the effects of setting the supervisor password and user password. This table is

for reference only and is not displayed on the screen.

Table 35. Supervisor and User Password Functions

Password Set

Supervisor

Mode

User Mode

Setup Options

Password to

Enter Setup

Password

During Boot

Neither

Can change all

options (Note)

Can change all

options (Note)

None

Supervisor only

Can change all

options

Can change a

limited number

of options

Supervisor Password

Supervisor

None

User only

N/A

Can change all

options

Enter Password

Clear User Password

User

Supervisor and

user set

Can change all

options

Can change a

limited number

of options

Supervisor Password

Enter Password

Supervisor or

user

Supervisor or

user

Note: If no password is set, any user can change all Setup options.

4 Error Messages and Blink Codes

4.1 Front-panel Power LED Blink Codes

Whenever a recoverable error occurs during POST, the BIOS causes the board’s front panel

power LED to blink an error message describing the problem (see Table 36).

Table 36. Front-panel Power LED Blink Codes

Type

Pattern

Note

Power-on

Solid on primary color. Indicates S0 state.

Default to On; can be disabled

via BIOS Setup

S3 Standby

Blink alternate color .25 seconds on, .25 seconds off,

indefinitely. Indicates S3 state.

Default behavior; can be

changed via BIOS Setup

Intel Ready Mode

Blink primary color, 1 second on, 1 second off,

indefinitely.

BIOS update in progress

Off when the update begins, then primary color on for

0.5 seconds, then off for 0.5 seconds. The pattern

repeats until the BIOS update is complete.

Memory error

On-off (1.0 second each) three times, then 2.5-second

pause (off), entire pattern repeats (blinks and pause)

until the system is powered off.

Thermal trip warning

Blink primary color .25 seconds on, .25 seconds off, .25

seconds on, .25 seconds off. This will result in a total of

16 blinks (blink for 8 seconds).

4.2 BIOS Error Messages

Table 30 lists the error messages and provides a brief description of each.

Table 30. BIOS Error Messages

Error Message

Explanation

CMOS Battery Low

The battery may be losing power. Replace the battery soon.

CMOS Checksum Bad

The CMOS checksum is incorrect. CMOS memory may have been

corrupted. Run Setup to reset values.

Memory Size Decreased

Memory size has decreased since the last boot. If no memory was

removed, then memory may be bad.

No Boot Device Available

System did not find a device to boot.

5 Intel NUC Kit Features

5.1 Chassis Front Panel Features

Intel NUC Board NUC7i3BNB board can be found integrated into Intel® NUC Kit NUC7i3BNH and

Intel® NUC Kit NUC7i3BNK. Figure 22 and Figure 23 shows the location of the features located

on or near the front of the chassis.

Figure 22. Intel NUC Kit NUC7i3BNH Features – Front

Table 37 lists the components identified in Figure 22.

Table 37. Components Shown in Figure 22

Item from Figure 22

Description

Kensington* Anti-Theft Key Lock Hole

Micro SDXC Card Reader

Digital Microphone Array

Power Switch and Power LED

Speaker/Headset Jack

USB 3.0 Connectors

Consumer Infrared Sensor

Regulatory Compliance and Battery Disposal Information

Figure 23. Intel NUC Kit NUC7i3BNK Features – Front

Table 38 lists the components identified in Figure 23.

Table 38. Components Shown in Figure 23

Item from Figure 23

Description

Micro SDXC Card Reader

Digital Microphone Array

Power Switch and Power LED

Speaker/Headset Jack

USB 3.0 Connectors

Consumer Infrared Sensor

5.3 Chassis Rear Panel Features

Figure 24 shows the location of the features located on the rear of the chassis.

Figure 24. Intel NUC Kit NUC7i3BNH Features – Rear

Table 39 lists the components identified in Figure 24.

Table 39. Components Shown in Figure 24

Item from Figure 24

Description

19V DC Power Inlet

Cooling Vents

DisplayPort via USB Type-C Connector

USB 3.1 via USB Type-C Connector

USB 3.0 Connectors

Ethernet Port

High Definition Multimedia Interface Connector

Regulatory Compliance and Battery Disposal Information

Figure 25 shows the location of the features located on the rear of the chassis.

Figure 25. Intel NUC Kit NUC7i3BNK Features – Rear

Table 39 lists the components identified in Figure 25.

Table 40. Components Shown in Figure 25

Item from Figure 25

Description

Kensington* Anti-Theft Key Lock Hole

Cooling Vents

DisplayPort via USB Type-C connector

USB 3.1 via USB Type-C connector

USB 3.0 Connectors

Ethernet Port

High Definition Multimedia Interface Connector

19V DC Power Inlet