Huawei FusionServer CH242 V3 User Manual

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Huawei CH242 V3 Compute Node

V100R001

White Paper

Issue 10

Date 2017-01-18

HUAWEI TECHNOLOGIES CO., LTD.

No part of this document may be reproduced or transmitted in any form or by any means without prior written

consent of Huawei Technologies Co., Ltd.

Trademarks and Permissions

and other Huawei trademarks are trademarks of Huawei Technologies Co., Ltd.

All other trademarks and trade names mentioned in this document are the property of their respective

holders.

Notice

The purchased products, services and features are stipulated by the contract made between Huawei and the

customer. All or part of the products, services and features described in this document may not be within the

purchase scope or the usage scope. Unless otherwise specified in the contract, all statements, information,

and recommendations in this document are provided "AS IS" without warranties, guarantees or

representations of any kind, either express or implied.

The information in this document is subject to change without notice. Every effort has been made in the

preparation of this document to ensure accuracy of the contents, but all statements, information, and

recommendations in this document do not constitute a warranty of any kind, express or implied.

Huawei Technologies Co., Ltd.

Address: Huawei Industrial Base

Bantian, Longgang

Shenzhen 518129

People's Republic of China

Website: http://e.huawei.com

Issue 10 (2017-01-18) Huawei Proprietary and Confidential

Contents

1 About This Document.................................................................................................................. 1

2 Introduction.................................................................................................................................... 4

2.1 Functions........................................................................................................................................................................ 5

2.2 Appearance..................................................................................................................................................................... 5

2.3 Indicators........................................................................................................................................................................ 9

2.4 Ports.............................................................................................................................................................................. 10

2.5 Hardware Structure (8HDD).........................................................................................................................................11

2.6 Hardware Structure (4HDD)........................................................................................................................................ 18

2.7 Logical Architecture..................................................................................................................................................... 25

2.8 Technical Specifications............................................................................................................................................... 27

3 Features..........................................................................................................................................29

4 Component Selection..................................................................................................................32

5 Management................................................................................................................................. 38

6 Warranty........................................................................................................................................ 40

7 Certifications................................................................................................................................ 41

Huawei CH242 V3 Compute Node

White Paper Contents

Issue 10 (2017-01-18) Huawei Proprietary and Confidential

1 About This Document

Product Positioning

This document describes the appearance, features, technical specifications, and configuration

of the new-generation CH242 V3 compute node of the HUAWEI E9000 server.

Intended Audience

This document is intended for:

lHuawei presales engineers

lChannel partner presales engineers

lHuawei enterprise presales engineers

Change History

Changes between document issues are cumulative. The latest document issue contains all the

changes made in earlier issues.

Issue 10 (2017-01-18)

This issue is the tenth official release.

Issue 09 (2016-05-13)

This issue is the ninth official release.

Issue 08 (2016-03-31)

This issue is the eighth official release.

Issue 07 (2015-10-19)

This issue is the seventh official release.

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Mode Change Description

Modified Updated the figures of hard disk backplanes in 2.6 Hardware

Structure (4HDD) and 2.5 Hardware Structure (8HDD).

Added The serial number description is added to 2.2 Appearance.

Issue 06 (2015-02-16)

This issue is the sixth official release.

Mode Change Description

Modified The table in 2.6 Hardware Structure (4HDD) and 2.5 Hardware

Structure (8HDD) are updated.

Issue 05 (2014-11-10)

This issue is the fifth official release.

Issue 04 (2014-09-15)

This issue is the fourth official release.

Mode Change Description

Deleted "Tecal" is deleted from the product document.

Modified Maximum power consumption and Altitude in 2.8 Technical

Specifications are updated.

2.6 Hardware Structure (4HDD) is updated, USB 2.0 port is added to

the component figure and description.

Issue 03 (2014-07-30)

This issue is the third official release.

Mode Change Description

Modified The 2.5 Hardware Structure (8HDD) and 2.6 Hardware Structure

(4HDD) are updated.

In 2.8 Technical Specifications, the key components of the CH242 V3

8HDD are added to 2.5 Hardware Structure (8HDD), and the key

components of theCH242 V3 4HDD are added to 2.6 Hardware

Structure (4HDD).

Huawei CH242 V3 Compute Node

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Mode Change Description

Multiple sections in 4 Component Selection are combined as one

section.

Issue 02 (2014-05-13)

This issue is the second official release.

Mode Change Description

Modified The content in 4 Component Selection is modified.

Issue 01 (2014-02-28)

This issue is the first official release.

Huawei CH242 V3 Compute Node

White Paper 1 About This Document

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2 Introduction

About This Chapter

2.1 Functions

This topic describes the functions and components of the CH242 V3.

2.2 Appearance

This topic describes the appearance, front panel, installation position, and slot numbering of

the CH242 V3.

2.3 Indicators

This topic describes the names, meanings, colors, and status of the indicators on the CH242

V3.

2.4 Ports

This topic describes the ports on the CH242 V3 and provides detailed information about the

high-density port.

2.5 Hardware Structure (8HDD)

This topic describes the components of the CH242 V3 8HDD and provides detailed

information about the layouts of the mainboard and hard disk backplane.

2.6 Hardware Structure (4HDD)

This topic describes the components of the CH242 V3 4HDD and provides detailed

information about the layouts of the mainboard and hard disk backplane.

2.7 Logical Architecture

This topic describes the logical structure of the CH242 V3 CPUs, dual in-line memory

modules (DIMMs), and platform controller hub (PCH) and ports on the CH242 V3.

2.8 Technical Specifications

This topic describes specifications of the CH242 V3.

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2.1 Functions

This topic describes the functions and components of the CH242 V3.

The CH242 V3 compute node(CH242 V3 for short) is a large-memory, full-width compute

node that uses the new-generation Intel® Xeon® E7-4800 v2 (IVY Bridge-EX) processors. It

provides strong computing capabilities and flexible scalability.

The CH242 V3 has two types of specifications:

lCH242 V3 8HDD

Supports SAS HDDs, SATA HDDs, and SSDs, and provides two customized PCIe cards.

lCH242 V3 4HDD

Supports SAS HDDs, SATA HDDs, and SSDs, and provides one standard PCIe card of

full-height, half-length and two customized PCIe cards.

The CH242 V3 is installed in a E9000 chassis and managed by the MM910 management

module in a centralized manner.

The CH242 V3 features high density, large-capacity memory and storage, high network I/O

capability, and high reliability, suiting enterprise applications such as virtualization and high-

performance computing (HPC).

2.2 Appearance

This topic describes the appearance, front panel, installation position, and slot numbering of

the CH242 V3.

Appearance

Figure 2-1 shows the CH242 V3 8HDD appearance.

Figure 2-1 CH242 V3 8HDD appearance

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Figure 2-2 shows the CH242 V3 4HDD appearance.

Figure 2-2 CH242 V3 4HDD appearance

Installation Position

The CH242 V3s are installed in the front full-width slots of the E9000 chassis. A chassis

houses a maximum of eight CH242 V3. The installation positions and slots for the CH242 V3

8HDD are the same as those for the CH242 V3 4HDD. The following uses the CH242 V3

8HDD as an example. Figure 2-3 shows the installation positions of the CH242 V3 and their

slot numbers in the chassis.

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Figure 2-3 Installation positions and slot numbering

Front panel

Figure 2-4 shows the front panel of a CH242 V3 8HDD.

Figure 2-4 CH242 V3 8HDD front panel

1 Customization label (with an ESN label) 2 High-density port

3 Power button/indicator 4 UID button/indicator

5 HLY indicator 6 Ejector lever

7 Spring 8 Hard disk

9 Hard disk active indicator 10 Hard disk fault indicator

11 Product model – –

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Figure 2-5 shows the front panel of a CH242 V3 4HDD.

Figure 2-5 CH242 V3 4HDD front panel

0 1 2 3

123459

67810 76

CH242 V3

1 Customization label (with an ESN label) 2 High-density port

3 Power button/indicator 4 UID button/indicator

5 HLY indicator 6 Ejector lever

7 Spring 8 Hard disk

9 Hard disk active indicator 10 Hard disk fault indicator

11 Product model – –

ESNs

An Equipment Serial Number (ESN) is a string that uniquely identifies a product. An ESN is

required when you apply for technical support from Huawei.

Figure 2-6 shows the ESN format.

Figure 2-6 ESN example

No. Description

1 Indicates the ESN ID (two digits).

2 Indicates the item identification code (eight characters).

3 Indicates the vendor code (two characters).

4 Indicates the year and month (two characters).

The first character indicates the year. Digits 1 to 9 indicate 2001

to 2009, and letters A to Z indicate 2010 to 2035. The second

character indicates the month. Digits 1 to 9 indicate January to

September, and letters A to C indicate October to December.

5 Indicates the sequence number (six digits).

6 Indicates RoHS compliance (one character).

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No. Description

7 Indicates the internal model number of the board.

2.3 Indicators

This topic describes the names, meanings, colors, and status of the indicators on the CH242

V3.

You can learn about the status of the CH242 V3 by observing the indicators. Table 2-1

describes the indicators on the CH242 V3.

Table 2-1 Indicators on the front panel

Indicator Meaning Color State Description

PWR Power button/

indicator

Yellow and

green

lOff: The compute node is not

powered on.

lBlinking yellow: The power button

on the compute node is locked.

When iMana 200 is being started

during the compute node power-on

process, the power button is locked.

lSteady yellow: The compute node

is to be powered on.

lSteady green: The compute node is

properly powered on.

NOTE

When the compute node is properly

powered on, pressing and holding the

power button for 6 seconds will forcibly

power off the compute node.

UID UID button/

indicator

Blue The Unit Identification (UID) indicator

helps locate a compute node in a

chassis. You can control the UID

indicator status (off, on, or blinking)

by remotely using the MM910.

lOff: The compute node is not

located or is not powered on.

lOn: The compute node is located.

lBlinking: The compute node is

being located.

NOTE

If a compute node is standby or powered

on, you can hold down the button for 6

seconds to reset iMana 200.

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Indicator Meaning Color State Description

HLY Health status

indicator

Red and

green

lOff: The compute node is not

powered on.

lSteady green: The compute node

hardware is operating properly.

lBlinking red (at 1 Hz): A major

alarm is generated for the compute

node.

lBlinking red (at 5 Hz): A critical

alarm is generated for the compute

node, or the compute node is not

securely installed.

Hard disk active

indicator

Green lOff: The hard disk is not detected

or is faulty.

lBlinking green: Data is being read

from or written to the hard disk.

lSteady green: The hard disk is

inactive.

Hard disk fault

indicator

Yellow lOff: The hard disk is operating

properly.

lBlinking yellow: The hard disk is

being located, or RAID is being

rebuilt.

lSteady yellow: The hard disk is not

detected or is faulty.

2.4 Ports

This topic describes the ports on the CH242 V3 and provides detailed information about the

high-density port.

Table 2-2 describes the ports on the CH242 V3.

Table 2-2 Port description

Port Category Quantity Description

High-density

port

- 1 The high-density port on the front panel

connects to a high-density cable, which

provides a DB15 video graphics array (VGA)

video port, three USB 2.0 ports, and a RJ45

serial port.

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Figure 2-7 High-density cable

1 VGA port 2 Two USB 2.0 ports

3 Serial port 4 One USB 2.0 port

5 High-density port - -

2.5 Hardware Structure (8HDD)

This topic describes the components of the CH242 V3 8HDD and provides detailed

information about the layouts of the mainboard and hard disk backplane.

Components of the CH242 V3 8HDD

Figure 2-8 shows the components of the CH242 V3 8HDD.

Figure 2-8 Components

1 Hard disk 2 Hard disk tray

3 Hard disk backplane 4 (Optional) USB 2.0

5 (Optional) PCIe card 1 6 (Optional) PCIe card tray 1

7 Main board 8 CPU

9 Heat sink 10 (Optional) TPM

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11 (Optional) Micro SD card 12 Mezz module

13 (Optional) PCIe card 2 14 (Optional) PCIe card tray 2

15 DIMM 16 (Optional) iBBU

17 RAID controller card - -

Table 2-3 describes the components of the CH242 V3 8HDD.

Table 2-3 Component description

No. Item Description

1 Hard disk The compute node supports a maximum of eight 2.5-inch hard

disk drives (HDDs), or SSDs. Mixed configuration of hard disk

drives (HDDs) and SSDs is supported. Each hard disk is hot-

swappable and can be installed and removed separately. The

hard disk backplane provides eight Serial Attached SCSI (SAS)

and Serial Advanced Technology Attachment (SATA) ports for

connecting SAS and SATA hard disks.

2 Hard disk

tray

Supports hard disks.

3 Hard disk

backplane

The hard disk backplane helps expand the storage capacity and

control hard disks in real time.

4 (Optional)

USB 2.0

The mainboard provides a built-in USB port for connecting to a

USB 2.0 device within the dimensions of 40.00 mm * 15.00 mm

* 13.00 mm.

5 (Optional)

PCIe card 1

PCIe card 1 is on the left of the mainboard and can be a

customized PCIe card or a standard PCIe SSD.

If a standard PCIe card of full-height, half-length is installed, no

DIMMs can be inserted into the 10 DIMM slots below the PCIe

card due to space limitations.

NOTE

lYou can configure either PCIe card tray 1 and PCIe card 1 or PCIe

card tray 2 and PCIe card 2.

lWhen PCIe card 1 is a standard PCIe SSD, you need to remove the

below 10 DIMMs and configure air ducts in the middle and right.

The CH242 V3 supports a maximum operating temperature of 35° C.

6 (Optional)

PCIe card

tray 1

The PCIe card tray is placed above the DIMMs. Each PCIe card

tray provides one PCIe x16 slot by using a riser card.

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No. Item Description

7 Main board The mainboard holds the CPUs, DIMMs, hard disk interface

modules, power control module, iMana 200 (integrated

management module), logic module, chipset and display adapter.

The server chipset is the Platform Controller Hub (PCH) using

the Intel® C602J chip.

A video chip with 16 MB display memory integrated into the

FPGA chip of iMana 200. The maximum resolution is 1280 x

1024 at 60 Hz with 16 M colors.

8 CPU The mainboard supports two or four Intel® Xeon® E7-4800

V2(Ivy Bridge-EX) CPUs of 105 W, 130 W, and 155 W, with a

maximum of 15 cores per CPU.

lEach CPU integrates two memory controllers for supporting

eight memory channels. Each channel supports one DIMM

and DDR3 1333 MHz, or 1600 MHz.

lEach CPU integrates a PCIe controller for supporting PCIe

3.0, and provides 32 lanes.

lEvery two CPUs are interconnected through two QuickPath

Interconnect (QPI) links, with each link delivering up to 8.0

GT/s.

lThe maximum core frequency supported by the CPUs

reaches 2.8 GHz.

9 Heat sink The heat sink is used to cool CPUs. Each CPU is configured

with one heat sink.

10 (Optional)

TPM

The Trusted Platform Module (TPM) is a security solution that

complies with the Trusted Computing Group (TCG) standards. It

enhances platform security by preventing viruses or

unauthorized operations.

11 (Optional)

Micro SD

card

The mainboard provides two microSD card slots. Each slot

supports a microSD card with a maximum capacity of 32 GB,

and the microSD card can be used as the boot medium for a

compute node. If two microSD cards are installed, they are

configured as RAID 1.

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No. Item Description

12 Mezz

module

The mainboard provides four mezzanine card connectors to

connecting to the slots of switch modules or pass through

modules through the backplane.

lThe upper mezzanine card is Mezz 1 and Mezz 3, and the

lower one is Mezz 2 and Mezz 4.

lSocket CPU 2 provides PCIe x16 bandwidth for connecting

to Mezz 1 and Mezz 2 respectively, socket CPU 3 provides

PCIe x16 bandwidth for connecting to Mezz 3, and socket

CPU 4 provides PCIe x16 bandwidth for connecting to Mezz

lMezz 1 and Mezz3 connect to slots 2X and 3X at the rear of

the E9000 chassis.

lMezz 2 and Mezz4 connect to slots 1E and 4E at the rear of

the E9000 chassis.

13 (Optional)

PCIe card 2

PCIe card 2 is on the right of the mainboard and can be a

customized PCIe card or a standard GPU.

If a standard PCIe card of full-height, half-length is installed, no

DIMMs can be inserted into the 10 DIMM slots below the PCIe

card due to space limitations.

NOTE

You can configure either PCIe card tray 1 and PCIe card 1 or PCIe card

tray 2 and PCIe card 2.

lYou can configure either PCIe card tray 1 and PCIe card 1 or PCIe

card tray 2 and PCIe card 2.

lWhen PCIe card 2 is a standard GPU, you need to remove the below

10 DIMMs and configure air ducts in the middle and right. The

CH242 V3 supports a maximum operating temperature of 35° C.

14 (Optional)

PCIe card

tray 2

The PCIe card tray is placed above the DIMMs. Each PCIe card

tray provides one PCIe x16 slot by using a riser card.

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No. Item Description

15 Dual in-line

memory

module

(DIMM)

Up to 32 DDR3 dual in-line memory module (DIMM) slots for

installing DIMMs (8 DIMMs for each CPU).

lMaximum memory speed: 1600 MHz.

lMemory protection: error-correcting code (ECC), mirroring,

and sparing.

lDIMM type: registered DIMM (RDIMM) and load-reduced

DIMM (LRDIMM).

lA compute node does not allow mixed use of DIMM types

(RDIMMs and LRDIMMs) or DIMM specifications (such as

the capacity, bit width, number of ranks, and height).

Therefore, all DIMMs on a compute node must use the same

BOM number. For details about the BOM numbers, see

Huawei Server Compatibility Checker.

–RDIMMs: up to 512 GB for 32 x 16 GB RDIMMs and

four CPUs

–LRDIMMs: up to 2 TB for 32 x 64 GB LRDIMMs and

four CPUs

16 (Optional)

iBBU

When the LSISAS2208 controller card is installed, you can

install an iBBU to protect data from power failures.

17 RAID

controller

card

The RAID controller card connects to external hard disks to

expand the storage capacity of the compute node. The RAID

controller card provides four Serial Attached SCSI (SAS) or

Serial Advanced Technology Attachment (SATA) ports for

connecting SAS or SATA disks.

CH242 V3 4HDD supports two types of RAID controller cards:

LSISAS2208 and LSISAS2308.

lLSISAS2208: supports RAID 0, 1, 5, 6, 10, 50, and 60.

lLSISAS2308: supports RAID 0, 1, 1E, and 10.

PCIe Slots

Table 2-4 describes the mapping between PCIe slots and CPUs, and the PCIe specifications

of the CH242 V3.

NOTE

The PCIe slots mapping to a vacant CPU socket are unavailable.

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Table 2-4 PCIe slot description

PCIe

Device

CPU PCIe

Standard

Connecto

Bandwid

Bus

Width

Port Device

Size

RAID

controller

card

CPU 1 PCIe 3.0 x8 x8 Port 1C Non-

standard

device

Mezz 1 CPU 2 PCIe 3.0 x16 or two

x16 or two

Port 3A

(for x16)

or ports

3A and 3C

(for two

x8)

Non-

standard

device

Mezz 2 CPU 2 PCIe 3.0 x16 or two

x16 or two

Port 2A

(for x16)

or ports

2A and 2C

(for two

x8)

Non-

standard

device

Mezz 3 CPU 3 PCIe 3.0 x16 or two

x16 or two

Port 2A

(for x16)

or ports

2A and 2C

(for two

x8)

Non-

standard

device

Mezz 4 CPU 4 PCIe 3.0 x16 or two

x16 or two

Port 3A

(for x16)

or ports

3A and 3C

(for two

x8)

Non-

standard

device

PCIe Riser

CPU 3 PCIe 3.0 x16 or two

x16 or two

Port 3A

(for x16)

or ports

3A and 3C

(for two

x8)

Full-

height

half-

length

PCIe Riser

CPU 4 PCIe 3.0 x16 or two

x16 or two

Port 2A

(for x16)

or ports

2A and 2C

(for two

x8)

Full-

height

half-

length

PCIe SSD

CPU 1 PCIe 3.0 x4 x4 Port 2D 2.5-inch

disk

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PCIe

Device

CPU PCIe

Standard

Connecto

Bandwid

Bus

Width

Port Device

Size

PCIe SSD

CPU 1 PCIe 3.0 x4 x4 Port 2C 2.5-inch

disk

PCIe SSD

CPU 1 PCIe 3.0 x4 x4 Port 3C 2.5-inch

disk

PCIe SSD

CPU 1 PCIe 3.0 x4 x4 Port 3D 2.5-inch

disk

Mainboard Layout

Figure 2-9 shows the positions of connectors and other components on the CH242 V3 8HDD

mainboard.

Figure 2-9 Positions of the connectors and other components

1 Mezz module connector 4 2 Mezz module connector 3

3 Riser card power connector 2 4 Riser card connector 2

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5 HDD tray 6 Customer interface board

7 BIOS battery 8 PCH(Platform Controller Hub)

9 RAID controller card connector 10 HDD backplane connector

11 HDD backplane power connector 12 Jordan Creek

13 Riser card connector 1 14 Riser card power connector 1

15 Mezz card connector 1 16 Mezz card connector 2

17 Mezz card tray 18 Positioning pin

19 Midplane signal connector 20 MicroSD card connector 2

21 MicroSD card connector 1 22 Power connector

23 TPM card connector - -

Hard Disk Backplane Layout

Figure 2-10 shows the positions of connectors and other components on the CH242 V3

8HDD hard disk backplane.

Figure 2-10 Hard disk backplane

1 Signal connector, connecting to

the mainboard

2 Power connector, connecting to the mainboard

3 SAS connector, supporting SAS

and SATA

4 SAS connector, supporting SAS, SATA, and PCIe

5 USB port at the back of the hard

disk backplane

6 Hard disk indicator

2.6 Hardware Structure (4HDD)

This topic describes the components of the CH242 V3 4HDD and provides detailed

information about the layouts of the mainboard and hard disk backplane.

Components of the CH242 V3 4HDD

Figure 2-11 shows the components of the CH242 V3 4HDD.

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Figure 2-11 Components

1 Hard disk 2 PCIe card

3 Hard disk tray 4 Hard disk backplane

5 (Optional) USB 2.0 6 (Optional) PCIe card 1

7 (Optional) PCIe card tray 1 8 Main board

9 CPU 10 Heat sink

11 (Optional) TPM 12 (Optional) Micro SD card

13 Mezz module 14 (Optional) PCIe card 2

15 (Optional) PCIe card tray 2 16 Dual in-line memory module (DIMM)

17 (Optional) iBBU 18 RAID controller card

Table 2-5 describes the components of the CH242 V3 4HDD.

Table 2-5 Component description

No. Item Description

1 Hard disk The compute node supports a maximum of four 2.5-inch hard

disk drives (HDDs) or SSDs. Mixed configuration of hard disk

drives (HDDs) and SSDs is supported. Each hard disk is hot-

swappable and can be installed and removed separately.

2 PCIe card The hard disk backplane provides one PCIe x16 slot for

installing the standard PCIe card of full height, half length.

3 Hard disk

tray

Supports hard disks.

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No. Item Description

4 Hard disk

backplane

The hard disk backplane helps expand the storage capacity and

control hard disks in real time.

5 (Optional)

USB 2.0

The mainboard provides a built-in USB port for connecting to a

USB 2.0 device within the dimensions of 40.00 mm * 15.00 mm

* 13.00 mm.

6 (Optional)

PCIe card 1

PCIe card 1 is on the left of the mainboard and can be a

customized PCIe card or a standard PCIe SSD.

If a standard PCIe card of full-height, half-length is installed, no

DIMMs can be inserted into the 10 DIMM slots below the PCIe

card due to space limitations.

NOTE

lYou can configure either PCIe card tray 1 and PCIe card 1 or PCIe

card tray 2 and PCIe card 2.

lWhen PCIe card 1 is a standard PCIe SSD, you need to remove the

below 10 DIMMs and configure air ducts in the middle and right.

The CH242 V3 supports a maximum operating temperature of 35° C.

7 (Optional)

PCIe card

tray 1

The PCIe card tray is placed above the DIMMs. Each PCIe card

tray provides one PCIe x16 slot by using a riser card.

8 Main board The mainboard holds the CPUs, DIMMs, hard disk interface

modules, power control module, iMana 200 (integrated

management module), logic module, chipset and display adapter.

The server chipset is the Platform Controller Hub (PCH) using

the Intel® C602J chip.

A video chip with 16 MB display memory integrated into the

FPGA chip of iMana 200. The maximum resolution is 1280 x

1024 at 60 Hz with 16 M colors.

9 CPU The mainboard supports two or four Intel® Xeon® E7-4800

V2(Ivy Bridge-EX) CPUs of 105 W, 130 W, and 155 W, with a

maximum of 15 cores per CPU.

lEach CPU integrates two memory controllers for supporting

eight memory channels. Each channel supports one DIMM

and DDR3 1333 MHz, or 1600 MHz.

lEach CPU integrates a PCIe controller for supporting PCIe

3.0, and provides 32 lanes.

lEvery two CPUs are interconnected through two QuickPath

Interconnect (QPI) links, with each link delivering up to 8.0

GT/s.

lThe maximum core frequency supported by the CPUs

reaches 2.8 GHz.

10 Heat sink The heat sink is used to cool CPUs. Each CPU is configured

with one heat sink.

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No. Item Description

11 (Optional)

TPM

The Trusted Platform Module (TPM) is a security solution that

complies with the Trusted Computing Group (TCG) standards. It

enhances platform security by preventing viruses or

unauthorized operations.

12 (Optional)

Micro SD

card

The mainboard provides two microSD card slots. Each slot

supports a microSD card with a maximum capacity of 32 GB,

and the microSD card can be used as the boot medium for a

compute node. If two microSD cards are installed, they are

configured as RAID 1.

13 Mezz

module

The mainboard provides four mezzanine card connectors to

connecting to the slots of switch modules or pass through

modules through the backplane.

lThe upper mezzanine card is Mezz 1 and Mezz 3, and the

lower one is Mezz 2 and Mezz 4.

lSocket CPU 2 provides PCIe x16 bandwidth for connecting

to Mezz 1 and Mezz 2 respectively, socket CPU 3 provides

PCIe x16 bandwidth for connecting to Mezz 3, and socket

CPU 4 provides PCIe x16 bandwidth for connecting to Mezz

lMezz 1 and Mezz3 connect to slots 2X and 3X at the rear of

the E9000 chassis.

lMezz 2 and Mezz4 connect to slots 1E and 4E at the rear of

the E9000 chassis.

14 (Optional)

PCIe card 2

PCIe card 2 is on the right of the mainboard and can be a

customized PCIe card or a standard GPU.

If a standard PCIe card of full-height, half-length is installed, no

DIMMs can be inserted into the 10 DIMM slots below the PCIe

card due to space limitations.

NOTE

You can configure either PCIe card tray 1 and PCIe card 1 or PCIe card

tray 2 and PCIe card 2.

lYou can configure either PCIe card tray 1 and PCIe card 1 or PCIe

card tray 2 and PCIe card 2.

lWhen PCIe card 2 is a standard GPU, you need to remove the below

10 DIMMs and configure air ducts in the middle and right. The

CH242 V3 supports a maximum operating temperature of 35° C.

15 (Optional)

PCIe card

tray 2

The PCIe card tray is placed above the DIMMs. Each PCIe card

tray provides one PCIe x16 slot by using a riser card.

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No. Item Description

16 Dual in-line

memory

module

(DIMM)

Up to 32 DDR3 dual in-line memory module (DIMM) slots for

installing DIMMs (8 DIMMs for each CPU).

lMaximum memory speed: 1600 MHz.

lMemory protection: error-correcting code (ECC), mirroring,

and sparing.

lDIMM type: registered DIMM (RDIMM) and load-reduced

DIMM (LRDIMM).

lA compute node does not allow mixed use of DIMM types

(RDIMMs and LRDIMMs) or DIMM specifications (such as

the capacity, bit width, number of ranks, and height).

Therefore, all DIMMs on a compute node must use the same

BOM number. For details about the BOM numbers, see

Huawei Server Compatibility Checker.

–RDIMMs: up to 512 GB for 32 x 16 GB RDIMMs and

four CPUs

–LRDIMMs: up to 2 TB for 32 x 64 GB LRDIMMs and

four CPUs

17 (Optional)

iBBU

When the LSISAS2208 controller card is installed, you can

install an iBBU to protect data from power failures.

18 RAID

controller

card

The RAID controller card connects to external hard disks to

expand the storage capacity of the compute node. The RAID

controller card provides four Serial Attached SCSI (SAS) or

Serial Advanced Technology Attachment (SATA) ports for

connecting SAS or SATA disks.

CH242 V3 4HDD supports two types of RAID controller cards:

LSISAS2208 and LSISAS2308.

lLSISAS2208: supports RAID 0, 1, 5, 6, 10, 50, and 60.

lLSISAS2308: supports RAID 0, 1, 1E, and 10.

PCIe Slots

Table 2-6 describes the mapping between PCIe slots and CPUs, and the PCIe specifications

of the CH242 V3.

NOTE

The PCIe slots mapping to a vacant CPU socket are unavailable.

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Table 2-6 PCIe slot description

PCIe

Device

CPU PCIe

Standard

Connecto

Bandwid

Bus

Width

Port Device

Size

RAID

controller

card

CPU 1 PCIe 3.0 x8 x8 Port 1C Non-

standard

device

Mezz 1 CPU 2 PCIe 3.0 x16 or two

x16 or two

Port 3A

(for x16)

or ports

3A and 3C

(for two

x8)

Non-

standard

device

Mezz 2 CPU 2 PCIe 3.0 x16 or two

x16 or two

Port 2A

(for x16)

or ports

2A and 2C

(for two

x8)

Non-

standard

device

Mezz 3 CPU 3 PCIe 3.0 x16 or two

x16 or two

Port 2A

(for x16)

or ports

2A and 2C

(for two

x8)

Non-

standard

device

Mezz 4 CPU 4 PCIe 3.0 x16 or two

x16 or two

Port 3A

(for x16)

or ports

3A and 3C

(for two

x8)

Non-

standard

device

PCIe Riser

CPU 3 PCIe 3.0 x16 or two

x16 or two

Port 3A

(for x16)

or ports

3A and 3C

(for two

x8)

Full-

height

half-

length

PCIe Riser

CPU 4 PCIe 3.0 x16 or two

x16 or two

Port 2A

(for x16)

or ports

2A and 2C

(for two

x8)

Full-

height

half-

length

PCIe SSD

CPU 1 PCIe 3.0 x4 x4 Port 2D 2.5-inch

disk

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PCIe

Device

CPU PCIe

Standard

Connecto

Bandwid

Bus

Width

Port Device

Size

PCIe SSD

CPU 1 PCIe 3.0 x4 x4 Port 2C 2.5-inch

disk

PCIe SSD

CPU 1 PCIe 3.0 x4 x4 Port 3C 2.5-inch

disk

PCIe SSD

CPU 1 PCIe 3.0 x4 x4 Port 3D 2.5-inch

disk

Mainboard Layout

Figure 2-12 shows the positions of connectors and other components on the CH242 V3

4HDD mainboard.

Figure 2-12 Positions of the connectors and other components

1 Mezz module connector 4 2 Mezz module connector 3

3 Riser card power connector 2 4 Riser card connector 2

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5 HDD tray 6 Customer interface board

7 BIOS battery 8 PCH(Platform Controller Hub)

9 RAID controller card connector 10 HDD backplane connector

11 HDD backplane power connector 12 Jordan Creek

13 Riser card connector 1 14 Riser card power connector 1

15 Mezz card connector 1 16 Mezz card connector 2

17 Mezz card tray 18 Positioning pin

19 Midplane signal connector 20 MicroSD card connector 2

21 MicroSD card connector 1 22 Midplane power connector

23 TPM card connector - -

Hard Disk Backplane Layout

Figure 2-13 shows the positions of connectors and other components on the CH242 V3

4HDD hard disk backplane.

Figure 2-13 Hard disk backplane

1 2 3 4 75 6

1 Signal connector, connecting to

the mainboard.

2 Power connector, connecting to the mainboard.

3 SAS connector, supporting SAS

and SATA.

4 PCIe 3.0 x16 connector.

5 Hard disk indicator. 6 Auxiliary PCIe card power connector.

7 USB ports. - -

2.7 Logical Architecture

This topic describes the logical structure of the CH242 V3 CPUs, dual in-line memory

modules (DIMMs), and platform controller hub (PCH) and ports on the CH242 V3.

lCPU: The CH242 V3 supports a maximum of four Intel® Ivy bridge-EX CPUs.

–Each CPU has two memory controllers. Each memory controller supports two

Intel® Serial Management Interfaces (SMIs). Each SMI supports one Jordan

Creek , and each Jordan Creek supports two memory channels.

–A CPU integrates three QuickPath Interconnect (QPI) 1.1 interfaces. CPUs are

interconnected over the QPI bus with a transmission rate of 8.0 GT/s.

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–The CPUs are interconnected with the PCH over the DMI2 bus with a transmission

rate of 5 GT/s.

lDIMM: The CH242 V3 can be configured with a maximum of 32 DIMMs. Each DIMM

provides a maximum capacity of 32 GB.

lAs the PCH, the Patsburg-J chip is an Intel southbridge for server platforms to provide

external I/O ports and bus expandability. The PCH connects to the integrated

management module (iMana 200) to provide management and service ports.

lI/O ports: The CH242 V3 connects to switch modules and pass through modules by

using four mezz modules.

lHard disk interface module:

–CH242 V3 8HDD: Hard disk interface module: The hard disk interface module

consists of the hard disk backplane and a RAID controller card. The hard disk

backplane for eight hard disks provides eight Serial Attached SCSI (SAS) or Serial

Advanced Technology Attachment (SATA) ports.

–CH242 V3 4HDD: Hard disk interface module: The hard disk interface module

consists of the hard disk backplane and a RAID controller card. The hard disk

backplane for four hard disks provides four SAS or SATA ports and one PCIe x16

port.

lThe iMana 200 provides device management functions, such as compute node power

control, slot ID obtaining, power detection, and KVM over IP.

Figure 2-14 shows the CH242 V3 8HDD logical structure.

Figure 2-14 Logical CH242 V3 8HDD structure

QPI

Patsburg-J

RAID

Card

HDD or

SSD × 8

Mezz Card 3

USB Flash Drive

Micro SD

Card × 2

High-

density

port

USB × 3

iMana

VGA

CPLD

RS232

×16 PCIe

CPU 2

2×DIMM SMI3

2×DIMM SMI2

2×DIMM SMI1

2×DIMM SMI0

CPU 1

2×DIMM SMI3

2×DIMM SMI2

2×DIMM SMI1

2×DIMM SMI0

CPU 3

JC 2×DIMM

SMI3

JC 2×DIMM

SMI2

JC 2×DIMM

SMI1

JC 2×DIMM

SMI0

CPU 4

JC 2×DIMM

SMI3

JC 2×DIMM

SMI2

JC 2×DIMM

SMI1

JC 2×DIMM

SMI0

Mezz Card 4

PCIe Riser 1

PCIe Riser 2

Mezz Card 1

Mezz Card 2

×16 PCIe

×8 PCIe

SAS/

SATA × 8

×16 PCIe

Pass

Through

Module

Switch

Module

Pass

Through

Module

Switch

Module

MM 910

×16 PCIe

DMI2

×16 PCIe

Figure 2-15 shows the CH242 V3 4HDD logical structure.

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Figure 2-15 Logical CH242 V3 4HDD structure

QPI

Patsburg-J

RAID

Card

HDD or

SSD × 4

USB Flash Drive

Micro SD

Card × 2

High-

density

port

USB × 3

iMana

VGA

CPLD

RS232

×16 PCIe

CPU 2

2×DIMM SMI3

2×DIMM SMI2

2×DIMM SMI1

2×DIMM SMI0

CPU 1

2×DIMM SMI3

2×DIMM SMI2

2×DIMM SMI1

2×DIMM SMI0

CPU 3

JC 2×DIMM

SMI3

JC 2×DIMM

SMI2

JC 2×DIMM

SMI1

JC 2×DIMM

SMI0

CPU 4

JC 2×DIMM

SMI3

JC 2×DIMM

SMI2

JC 2×DIMM

SMI1

JC 2×DIMM

SMI0

PCIe Riser 1

PCIe Riser 2

Mezz Card 1

Mezz Card 2

×16 PCIe

×8 PCIe

SAS/

SATA × 4

×16 PCIe

Pass

Through

Module

Switch

Module

Pass

Through

Module

Switch

Module

MM 910

×16 PCIe

DMI2

×16 PCIe

Mezz Card 3

Mezz Card 4

×16 PCIe

2.8 Technical Specifications

This topic describes specifications of the CH242 V3.

Table 2-7 describes the technical specifications of the CH242 V3.

Table 2-7 Technical Specifications

Category Item Specifications

Physical

specifications

Dimensions (H x

W x D)

60.46 mm x 423 mm x 537.2 mm (2.4 in. x 16.65

in. x 21.14 in.)

Color lFront panel: black

lCover: silver white

Weight Net: 16 kg to 17 kg (35.27 lb to 37.48 lb)

Packing materials: 3.6 kg (7.94 lb)

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Category Item Specifications

Environmental

specifications

Temperature lOperating temperature: 5°C to 40°C (41°F to

104°F) (ASHRAE Class A3 compliant)

NOTE

When PCIe card 2 on the right of the mainboard is a

standard GPU, or PCIe card 1 on the left of the

mainboard is a standard NVMe PCIe SSD, the CH242

V3 supports a maximum operating temperature of

35°C.

lStorage temperature: -40°C to +65°C (-40°F to

+149°F)

lLong-term storage temperature: 21°C to 27°C

(69.8°F to 80.6°F)

Temperature

change rate

15°C/h (27°F/h)

Humidity lOperating humidity: 5% RH to 85% RH (non-

condensing)

lStorage humidity: 5% RH to 95% RH (non-

condensing)

lLong-term storage humidity: 30% RH to 69%

RH (non-condensing)

Altitude At an altitude of 900 m (2952.72 ft), the highest

operating temperature is 40°C (104°F).

When the device is used at an altitude of 900 m to

5000 m (2952.8 ft to 16404.2 ft), the highest

operating temperature decreases by 1°C (1.8°F) for

every increase of 300 m (984.24 ft). HDDs are not

supported at an altitude of over 3000 m (9842.5 ft).

Input power

supply

Rated input

voltage

12 V DC

Power

consumption

Maximum

power

consumption

lCH242 V3 8HDD: 1259 W

lCH242 V3 4HDD: 1265 W

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3 Features

Performance and Scalability

lThe CH242 V3 uses the Intel® Xeon® E7-4800 v2 series processors. Each processor has

up to fifteen cores and a L3 cache of 37.5 MB at a dominant frequency of 2.8 GHz, with

three 8 GT/s QuickPath Interconnect (QPI) links between processors. This enables the

CH242 V3 to provide optimal processing performance.

lEach CH242 V3 supports four processors, 60 cores, and 120 threads to maximize the

concurrent execution of multithreaded applications.

lThe intelligent autonegotiation function provided by Intel® Turbo Boost Technology 2.0

enables the processor cores to run at maximum speeds during peak workloads by

temporarily going beyond the processor thermal design power (TDP).

lIntel® Hyper-Threading Technology boosts performance for multithreaded applications

by enabling concurrent execution of multiple threads within each processor core (up to

two threads per core).

lIntel® Virtualization Technology integrates hardware-level virtualization functions to

allow operating system (OS) vendors to better use hardware for addressing virtualization

workloads.

lIntel® Advanced Vector Extensions (Intel® AVX) improves floating-point computing

performance for computing-intensive applications.

lA total of 32 load-reduced DIMMs (LRDIMMs) provides quick speed, high availability,

and a maximum memory capacity of 1024 GB.

lIntel® Xeon® E7-4800 series processors provide a maximum memory bandwidth of

409.6 GB/s (64 bit/8*1600 MHz*8 channel*4) in theory.

lThe use of solid-state drives (SSDs) provides better I/O performance than using hard

disk drives (HDDs) or using SSDs and HDDs. An SSD supports up to 100 times more

input/output operations per second (IOPS) than a typical HDD.

lThe CH242 V3 supports 128-lane PCIe 3.0 I/O. PCIe 3.0 introduces 128b/130b encoding

and improves the maximum I/O bandwidth by 100% (8 GT/s per lane).

lIntel® Integrated I/O enables the PCIe 3.0 controller to be integrated into the Intel®

Xeon® E7 series processors. This shortens I/O latency and enhances overall system

performance.

lThe CH242 V3 supports flexible hard disk configurations and provides elastic and

scalable storage capacity to satisfy various storage capacity and upgrade requirements.

The CH242 V3 8HHD supports a maximum of eight 2.5-inch hard disks. The CH242 V3

supports a maximum of four 2.5-inch hard disks.

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Availability and Serviceability

lThe CH242 V3 provides the memory mirroring and memory backup functions to avoid

system downtime caused by uncorrectable memory errors.

lThe CH242 V3 supports hot-swappable hard disks to protect data and prolong system

running time using redundant array of independent disks (RAID) redundancy. The

CH242 V3 supports RAID 0, 1, 1E, 5, 6, 10, 50, and 60 with a RAID cache, and uses a

backup battery unit (BBU) or supercapacitor for power-off protection.

lThe UID and HLY indicators on the panel and the integrated management module

(iMana 200) web user interface (WebUI) display the status of key components to quickly

lead the technical support personnel to failed (or failing) components. This simplifies

maintenance, accelerates troubleshooting, and improves system availability.

lThe CH242 V3 supports SSDs which offer better reliability than HDDs, prolonging the

system uptime.

lThe integrated BMC module (iMana 200) continuously monitors system parameters,

triggers alarms, and performs recovery actions to minimize system downtime caused by

failures.

Manageability and Security

lThe built-in iMana 200 management module monitors the server running status and

provides remote management functions.

lAn integrated industry-standard Unified Extensible Firmware Interface (UEFI) increases

setting, configuring, and updating efficiencies, and simplifies error handling.

lThe optional Trusted Platform Module (TPM) 1.2 provide advanced encryption

functions, such as digital signatures and remote authentication.

lThe industry-standard Advanced Encryption Standard–New Instruction (AES NI)

implements faster and stronger encryption.

lThe Intel® Execute Disable Bit (EDB) function in a supported OS prevents certain types

of malicious buffer overflow attacks.

lIntel® Trusted Execution Technology provides enhanced security by using hardware-

based resistance against malicious software attacks, allowing an application to run in an

isolated space that is protected from all other applications running on the OS.

Energy Efficiency

lThe Intel® Xeon® E7-4800 series Broadwell-EX processors provide better performance

over the previous-generation processors while supporting the same TDP.

lIntel® Intelligent Power Capability powers on and off a processor based on the site

requirements to reduce power consumption.

lLow-voltage Intel® Xeon® processors consume less energy to satisfy demands of power

and thermally constrained data centers and telecommunication environments.

lLow-voltage 1.35 V DDR3 registered DIMMs (RDIMMs) consume 15% less energy

than 1.5 V DDR3 RDIMMs.

lSSDs consume 80% less power than HDDs.

lThe CH242 V3 uses hexagonal ventilation holes to enable higher ventilation density over

round holes, remarkably increasing system cooling efficiency.

lThe efficient voltage regulator down (VRD) power supply units (PSUs) reduce the loss

in DC/DC power conversion.

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lThe CH242 V3 provides power capping and power control functions.

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4 Component Selection

This topic describes the software and hardware supported by the CH242 V3.

For details about the software and hardware compatible with the CH242 V3, see Huawei

Server Compatibility Checker.

CPU

The mainboard supports two or four Intel® Xeon® E7-4800 V2(Ivy Bridge-EX) CPUs of 105

W, 130 W, and 155 W, with a maximum of 15 cores per CPU.

lEach CPU integrates two memory controllers for supporting eight memory channels.

Each channel supports one DIMM and DDR3 1333 MHz, or 1600 MHz.

lEach CPU integrates a PCIe controller for supporting PCIe 3.0, and provides 32 lanes.

lEvery two CPUs are interconnected through two QuickPath Interconnect (QPI) links,

with each link delivering up to 8.0 GT/s.

lThe maximum core frequency supported by the CPUs reaches 2.8 GHz.

Memory

Up to 32 DDR3 dual in-line memory module (DIMM) slots for installing DIMMs (8 DIMMs

for each CPU).

Memory Configuration Rules

Observe the following rules to configure DIMMs:

1. The CH242 V3 supports 8 GB, 16 GB, and 32 GB DIMMs with a maximum memory

capacity of 1,024 GB in full configuration.

2. The CH242 V3 can be configured with either registered DIMMs (RDIMMs) or load-

reduced DIMMs (LRDIMMs).

3. 1.5 V and 1.35 V DIMMs cannot be used in the same compute node.

4. Each channel supports a maximum of eight ranks.(Only for RDIMMs)

NOTE

A channel supports more than eight ranks for LRDIMMs, because a quad-rank LRDIMM

generates the same electrical load as a single-rank RDIMM on a memory bus.

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5. The maximum number of DIMMs that can be installed in a compute node depends on

the processor type, DIMM type, number of ranks, and operating voltage. See "Maximum

number of DIMMs" in Table 4-1.

NOTE

Note the following rule:

Maximum number of DIMMs supported by each channel ≤ Number of ranks supported by each

channel/Number of ranks supported by each DIMM

6. All DIMMs in the compute node operate at the same speed, whichever of the following

is the lowest:

–Memory speed supported by a specific processor

–For details about the lowest of the maximum operating speeds, see Maximum

Operating Speed in Table 4-1.

Table 4-1 DIMM configuration rules

Parameter RDIMM LRDIM

Rank Dual rank Quad rank Quad rank

Rated speed (MHz) 1333 1600 1333 1333

Rated voltage (V) 1.35 1.35 1.5 1.35 1.35

Operating voltage (V) 1.35 1.35 1.5 1.35 1.35

Maximum number of

DIMMsa

32b32b32b32b32b

Maximum capacity per

DIMM (GB)

16 16 16 32 32

Maximum memory

capacity (GB)

512b512b512b1024b1024b

Maximum memory

capacity at the

maximum operating

speed (GB)

512b512b512b1024b1024b

Maximum

operating

speed

(MHz)

One

DIMM per

channel

1333b1333b1600b1066b1333b

a: The maximum number of DIMMs is given for four-processor configuration. If only one

processor is installed, the maximum number of DIMMs is 1/4 of the values given in this

table.

b: The values with b indicate that all DIMM slots are occupied.

The table is for reference only. For details about the components that can be purchased,

consult the local Huawei sales representatives.

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Memory Slot Configuration Rules

Table 4-2 describes the DIMM slot installation sequence. For details about the DIMM slot

numbers, see Figure 2-9 and Figure 2-12.

Table 4-2 Memory slot configuration rules

CPU DIMM

CPU1,

CPU2

000(1A1), 010(1B1), 200(2A1), 210(2B1), 020(1C1), 030(1D1), 220(2C1),

230(2D1), 100(1E1), 110(1F1), 300(2E1), 310(2F1), 120(1G1), 130(1H1),

320(2G1), 330(2H1)

CPU1,

CPU2,

CPU3, and

CPU4

000(1A1)a, 010(1B1)a, 200(2A1), 210(2B1), 400(3A1), 410(3B1),

600(4A1)b, 610(4B1)b, 020(1C1)a, 030(1D1)a, 220(2C1), 230(2D1),

420(3C1)b, 430(3D1)b, 620(4C1)b, 630(4D1)b, 100(1E1)a, 110(1F1)a,

300(2E1)a, 310(2F1)a, 500(3E1), 510(3F1), 700(4E1)b, 710(4F1)b,

120(1G1)a, 130(1H1)a, 320(2G1), 330(2H1), 520(3G1), 530(3H1),

720(4G1)b, 730(4H1)b

Note:

If a server is configured with four CPUs and full-height half-length PCIe cards, the DIMM

slots under the PCIe cards cannot be used.

lIf a full-height half-length PCIe card is installed on the riser card 1, you do not need to

install DIMMs in the slots marked with a.

lIf a full-height half-length PCIe card is installed on the riser card 2, you do not need to

install DIMMs in the slots marked with b.

If a server is configured with four CPUs and PCIe cards thinner than 10 mm, the DIMM

slots under the PCIe cards are available.

The CH242 V3 provides 32 double data rate 3 (DDR3) slots for installing DIMMs. Each

processor integrates eight memory channels. The memory channels for processor 1 are 1A,

1B, 1C, 1D, 1E, 1F,1G,and 1H, those for processor 2 are 2A, 2B, 2C, 2D, 2E, 2F,2G,and 2H,

those for processor 3 are 3A, 3B, 3C, 3D, 3E, 3F,3G,and 3H, and those for processor 4 are

4A, 4B, 4C, 4D, 4E, 4F,4G,and 4H. Table 4-3 lists memory channels for each processor.

Table 4-3 Memory channels for each processor

Channel Location Memory Channel Composition

CPU1 1A DIMM000(1A1)

1B DIMM010(1B1)

1C DIMM020(1C1)

1D DIMM030(1D1)

1E DIMM100(1E1)

1F DIMM110(1F1)

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Channel Location Memory Channel Composition

1G DIMM120(1G1)

1H DIMM130(1H1)

CPU2 2A DIMM200(2A1)

2B DIMM210(2B1)

2C DIMM220(2C1)

2D DIMM230(2D1)

2E DIMM300(2E1)

2F DIMM310(2F1)

2G DIMM320(2G1)

2H DIMM330(2H1)

CPU3 3A DIMM400(3A1)

3B DIMM410(3B1)

3C DIMM420(3C1)

3D DIMM430(3D1)

3E DIMM500(3E1)

3F DIMM510(3F1)

3G DIMM520(3G1)

3H DIMM530(3H1)

CPU4 4A DIMM600(4A1)

4B DIMM610(4B1)

4C DIMM620(4C1)

4D DIMM630(4D1)

4E DIMM700(4E1)

4F DIMM710(4F1)

4G DIMM720(4G1)

4H DIMM730(4H1)

Storage

lCH242 V3 8HDD:

The compute node supports a maximum of eight 2.5-inch hard disk drives (HDDs) or

SSDs. Mixed configuration of hard disk drives (HDDs) and SSDs is supported. The hard

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disk backplane provides eight Serial Attached SCSI (SAS) and Serial Advanced

Technology Attachment (SATA) ports for connecting SAS and SATA hard disks. Each

hard disk is hot-swappable and can be installed and removed separately.

lCH242 V3 4HDD:

The compute node supports a maximum of four 2.5-inch hard disk drives (HDDs) or

SSDs. Mixed configuration of hard disk drives (HDDs) and SSDs is supported. Each

hard disk is hot-swappable and can be installed and removed separately.

CH242 V3 8HDD supports two types of RAID controller cards: LSISAS2208 and

LSISAS2308.

lLSISAS2208: supports RAID 0, 1, 5, 6, 10, 50, and 60.

lLSISAS2308: supports RAID 0, 1, 1E, and 10.

CH242 V3 4HDD supports two types of RAID controller cards: LSISAS2208 and

LSISAS2308.

lLSISAS2208: supports RAID 0, 1, 5, 6, 10, 50, and 60.

lLSISAS2308: supports RAID 0, 1, 1E, and 10.

Table 4-4 describes the performances of different RAID levels, the minimum number of hard

disks required, and hard disk utilization.

Table 4-4 RAID level comparison

RAID

Level

Reliability Read

Performan

Write

Performan

Minimum

Number of

Hard Disks

Hard Disk

Utilization

RAID 0 Low High High 2 100%

RAID 1 High Low Low 2 50%

RAID 5 Medium High Medium 3 (N-1)/N

RAID 6 Medium High Medium 4 (N-2)/N

RAID 1E High Medium Medium 3 50%

RAID 10 High Medium Medium 4 50%

RAID 50 High High Medium 6 (N-M)/N

RAID 60 High High Medium 8 (N-M*2)/N

Note: N indicates the number of member hard disks in a RAID. M indicates the number of

subgroups of a RAID.

I/O Expansion

The CH242 V3 supports the following types of Peripheral Component Interconnect Express

(PCIe) mezz modules for connecting to switch modules through the midplane. You can

choose a mezz module based on the I/O card type and rate requirements.

lGE expansion card

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l10GE expansion card

lFC expansion card

lHCA expansion card

lIB expansion card

Power Supply

The CH242 V3 is powered by the power supply units (PSUs) in the E9000 chassis, without

any independent power supply.

Peripherals

The CH242 V3 supports the peripherals such as USB DVD-ROM drive and KVM.

OSs and Softwares

For details about the operating systems (OSs) and virtualization softwares supported by the

CH242 V3, see the Huawei Server Compatibility Checker.

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5 Management

Huawei iMana 200, a remote management system for servers, is integrated on the E9000

compute nodes. It complies with the IPMI V2.0 standards and provides reliable hardware

monitoring and management functions. Huawei iMana 200 implements seamless

communications with management modules. The management modules can also be used to

manage compute nodes in a chassis.

The iMana 200 supports the followings:

lKVM and text console redirection

lRemote virtual media

lIPMI V2.0

lCommon information model (CIM)

lWeb-based browser login

Table 5-1 describes the iMana 200 specifications.

Table 5-1 iMana 200 specifications

Item Description

Management interface The iMana 200 supports various management interfaces to

implement system integration. The iMana 200 can integrate

with any standard management systems over the following

interfaces:

lIPMI V2.0

lCLI

lHTTPS

Fault detection The iMana 200 helps to detect faults and accurately locate

hardware faults.

System watchdog The iMana 200 supports BIOS POST, OS watchdog, and

fault timeout automatic system reset. You enable or disable

these functions in the iMana 200.

Boot device configuration The iMana 200 supports out-of-band configuration for boot

devices.

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Item Description

Alarm management The iMana 200 supports alarm management and reports

alarms in various ways such as the (SMTP), and syslog

service to ensure that the server runs properly without

interruption.

Integrated KVM The iMana 200 Provides remote maintenance measures,

such as KVM and KVM over IP, for troubleshooting. The

maximum resolution is 1280 x 1024.

Integrated virtual media The iMana 200 virtualizes local media devices or images to

the media devices for remote compute nodes, which

simplifies operating system (OS) installation. The virtual

DVD-ROM drive supports a transmission rate of up to 8

MB/s.

WebUI The iMana 200 provides visual WebUIs for quick

configuration and information queries.

The following web browsers are supported:

lInternet Explorer 8.0

lFirefox 9.0

lChrome 13.0

lSafari

Fault reproduction The iMana 200 reproduces faults to diagnose the faults

quickly.

Screenshots and videos The iMana 200 allows you to view screenshots and videos

without login, which facilitates preventive maintenance

inspection (PMI).

DNS/LDAP The iMana 200 supports domain management and directory

services, which significantly simplifies network and

configuration management.

Dual-image backup The iMana 200 starts the software from an image backup if

the running software fails.

Asset management The iMana 200 provides intelligent asset management to

ease of assets stocktaking.

Intelligent power

management

The iMana 200 supports power capping to increase

deployment density and uses dynamic energy saving

technology to lower the operating expense (OPEX).

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6 Warranty

According to the Huawei Warranty Policy for Servers & Storage Products (Warranty Policy

for short), Huawei provides a three-year warranty for servers, a one-year warranty for DVD-

ROM drives and iBBUs, and a three-month warranty for software media.

The Warranty Policy stipulates warranty terms and conditions, including the available

services, response time, terms of service, and disclaimer.

The warranty terms and conditions may vary by country, and some service and/or parts may

not be available in all countries. For more information about warranty services in your

country, contact Huawei technical support or your local Huawei representative office.

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7 Certifications

This topic describes the certifications that the E9000 has passed.

Table 7-1 lists the certifications.

Table 7-1 Certifications

Country

/Region

Certifica

tion

Standard

China RoHS SJ/T-11363-20006

SJ/T-11364-20006

GB/T 26572-2011

China China

Environm

en tal

Labeling

GB/T24024:2001 idt ISO14024:1999

HJ 2507-2011

Europe RoHS 2002/95/EC, 2011/65/EU, EN 50581: 2012

Europe REACH EC 1907/2006

Europe WEEE 2002/96/EC, 2012/19/EU

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Country

/Region

Certifica

tion

Standard

Europe CE Safety: IEC 60950-1:2005 (2nd Edition) + A1:2009 and/or EN

60950-1:2006 + A11:2009 + A1:2010 + A12:2011

EMC:

lEN 55022:2010

lCISPR 22:2008

lEN 55024:2010

lCISPR 24:2010

lETSI EN 300 386 V1.5.1:2010

lETSI ES 201 468 V1.3.1:2005

lIEC61000-3-2:2005+A1:2008+A2:2009/EN

61000-3-2:2006+A1:2009+A2:2009

lIEC 61000-3-3:2008/EN 61000-3-3:2008

lIEC 61000-6-2:2005/EN 61000-6-2:2005

lIEC 61000-6-4:2006+A1:2010/EN 61000-6-4:2007 +A1:2011

America FCC FCC CFR47 Part 15 Subpart B:2011

Japan VCCI VCCI V-4:2012

Canada IC ICES-003 Issue 5:2012

Australia C-tick AS/NZS CISPR 22:2009+A1:2010

America NTRL-

UL 60950-1, 2nd Edition, 2011-12-19 (Information Technology

Equipment - Safety - Part 1: General Requirements)

CSA C22.2 No.60950-1-07,2nd Edition,2011-12 (Information

Technology Equipment-Safety-Part 1:General Requirements)

Global CB IEC 60950-1:2005(2nd Edition); Am 1:2009

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Table of Contents

Huawei FusionServer CH242 V3 User Manual

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