Huawei ME909S-120 User Manual

HUAWEI ME909s Series LTE LGA Module

Hardware Guide

Issue

04

Date

2016-12-21

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HUAWEI ME909s Series LTE LGA Module

Hardware Guide

About This Document

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About This Document

Revision History

Document

Version

Date

Chapter

Descriptions

01

2015-08-14

Initial release

02

2016-02-20

2.4

Deleted Application Block Diagram

2.2

Updated Table 2-1 Features

3.2

Updated LGA Interface

3.5

Updated UART Interface

3.9

Updated GPIO Interface

4.2

Updated the NOTE of Operating

Frequencies

4.5.3

Updated Antenna Requirements

5.6

Updated EMC and ESD Features

6.5

Updated Packaging

03

2016-09-06

2

Updated Table 2-1 Features

3.2

Updated Figure 3-1 Sequence of LGA

interface (Top view)

3.4.8

Updated Figure 3-15 Connections of the

USIM_DET pin

3.7

Updated Figure 3-19 Circuit of the USIM

card interface

5.4.2

Updated Table 5-6 Averaged standby DC

power consumption of ME909s-821 LGA

module

6.6.2

Updated Figure 6-4 LGA module Footprint

design (Unit: mm)

6.8.2

Updated Figure 6-8 Recommended stencil

design of LGA module (Unit: mm)

HUAWEI ME909s Series LTE LGA Module

Hardware Guide

About This Document

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Document

Version

Date

Chapter

Descriptions

6.9.3

Updated Figure 6-10 Equipment used for

rework

04

2016-12-21

3.2

Updated Table 3-1 Definitions of pins on the

LGA interface

5.5

Updated Table 5-12 Test conditions and

results of the reliability of the ME909s LGA

module

Scope

ME909s-821

ME909s-120

HUAWEI ME909s Series LTE LGA Module

Hardware Guide

Contents

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Contents

1 Introduction ........................................................................................................................... 8

2 Overall Description ............................................................................................................... 9

2.1 About This Chapter.......................................................................................................................... 9

2.2 Function Overview .......................................................................................................................... 9

2.3 Circuit Block Diagram .................................................................................................................... 11

3 Description of the Application Interfaces ......................................................................... 13

3.1 About This Chapter........................................................................................................................ 13

3.2 LGA Interface ................................................................................................................................ 13

3.3 Power Interface ............................................................................................................................. 24

3.3.1 Overview............................................................................................................................... 24

3.3.2 Power Supply VBAT Interface............................................................................................... 25

3.3.3 Output Power Supply Interface ............................................................................................. 27

3.4 Signal Control Interface ................................................................................................................. 27

3.4.1 Overview............................................................................................................................... 27

3.4.2 Power-on/off Pin ................................................................................................................... 29

3.4.3 RESIN_N .............................................................................................................................. 31

3.4.4 WAKEUP_IN Signal .............................................................................................................. 32

3.4.5 WAKEUP_OUT Signal .......................................................................................................... 33

3.4.6 SLEEP_STATUS Signal........................................................................................................ 33

3.4.7 LED_MODE Signal ............................................................................................................... 34

3.4.8 USIM_DET Pin ..................................................................................................................... 35

3.5 UART Interface.............................................................................................................................. 37

3.5.1 Overview............................................................................................................................... 37

3.5.2 Circuit Recommended for the UART Interface...................................................................... 38

3.6 USB Interface ................................................................................................................................ 39

3.7 USIM Card Interface ..................................................................................................................... 40

3.7.1 Overview............................................................................................................................... 40

3.7.2 Circuit Recommended for the USIM Card Interface.............................................................. 41

3.8 Audio Interface .............................................................................................................................. 42

3.9 GPIO Interface .............................................................................................................................. 44

3.10 ADC Interface .............................................................................................................................. 47

3.11 JTAG Interface............................................................................................................................. 47

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Contents

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3.12 RF Antenna Interface .................................................................................................................. 48

3.13 Reserved Interface ...................................................................................................................... 51

3.14 NC Interface ................................................................................................................................ 51

3.15 Test Points Design....................................................................................................................... 52

4 RF Specifications ................................................................................................................. 53

4.1 About This Chapter........................................................................................................................ 53

4.2 Operating Frequencies .................................................................................................................. 53

4.3 Conducted RF Measurement ........................................................................................................ 55

4.3.1 Test Environment .................................................................................................................. 55

4.3.2 Test Standards ...................................................................................................................... 55

4.4 Conducted Rx Sensitivity and Tx Power ....................................................................................... 55

4.4.1 Conducted Receive Sensitivity ............................................................................................. 55

4.4.2 Conducted Transmit Power .................................................................................................. 57

4.5 Antenna Design Requirements ...................................................................................................... 58

4.5.1 Antenna Design Indicators .................................................................................................... 58

4.5.2 Interference .......................................................................................................................... 61

4.5.3 Antenna Requirements ......................................................................................................... 61

4.6 Suggestions about LTE and 2.4 GHz Wi-Fi Co-existence ............................................................. 62

4.6.1 Theory Analysis .................................................................................................................... 62

4.6.2 Suggestions about the Interference ...................................................................................... 63

5 Electrical and Reliability Features ..................................................................................... 64

5.1 About This Chapter........................................................................................................................ 64

5.2 Absolute Ratings ........................................................................................................................... 64

5.3 Operating and Storage Temperatures ........................................................................................... 64

5.4 Power Supply Features ................................................................................................................. 65

5.4.1 Input Power Supply............................................................................................................... 65

5.4.2 Power Consumption ............................................................................................................. 66

5.5 Reliability Features ........................................................................................................................ 75

5.6 EMC and ESD Features ................................................................................................................ 78

6 Mechanical Specifications .................................................................................................. 81

6.1 About This Chapter........................................................................................................................ 81

6.2 Storage Requirement .................................................................................................................... 81

6.3 Moisture Sensitivity ....................................................................................................................... 81

6.4 Dimensions ................................................................................................................................... 82

6.5 Packaging ..................................................................................................................................... 82

6.6 Customer PCB Design .................................................................................................................. 85

6.6.1 PCB Surface Finish .............................................................................................................. 85

6.6.2 PCB Pad Design ................................................................................................................... 85

6.6.3 Solder Mask .......................................................................................................................... 85

6.6.4 Requirements on PCB Layout .............................................................................................. 85

6.7 Thermal Design Solution ............................................................................................................... 86

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6.8 Assembly Processes ..................................................................................................................... 88

6.8.1 General Description of Assembly Processes ........................................................................ 88

6.8.2 Stencil Design ....................................................................................................................... 88

6.8.3 Reflow Profile ....................................................................................................................... 89

6.9 Specification of Rework ................................................................................................................. 90

6.9.1 Process of Rework................................................................................................................ 90

6.9.2 Preparations of Rework ........................................................................................................ 91

6.9.3 Removing of the Module ....................................................................................................... 91

6.9.4 Welding Area Treatment ....................................................................................................... 92

6.9.5 Module Installation ................................................................................................................ 92

6.9.6 Specifications of Rework....................................................................................................... 92

7 Certifications ........................................................................................................................ 93

7.1 About This Chapter........................................................................................................................ 93

7.2 Certifications ................................................................................................................................. 93

8 Safety Information .............................................................................................................. 94

8.1 About This Chapter........................................................................................................................ 94

8.2 Interference ................................................................................................................................... 94

8.3 Medical Device .............................................................................................................................. 94

8.4 Area with Inflammables and Explosives ........................................................................................ 95

8.5 Traffic Security .............................................................................................................................. 95

8.6 Airline Security .............................................................................................................................. 95

8.7 Safety of Children .......................................................................................................................... 95

8.8 Environment Protection ................................................................................................................. 96

8.9 WEEE Approval............................................................................................................................. 96

8.10 RoHS Approval............................................................................................................................ 96

8.11 Laws and Regulations Observance ............................................................................................. 96

8.12 Care and Maintenance ................................................................................................................ 96

8.13 Emergency Call ........................................................................................................................... 97

8.14 Regulatory Information ................................................................................................................ 97

8.14.1 CE Approval (European Union) .......................................................................................... 97

9 Appendix A Circuit of Typical Interface ........................................................................... 98

10 Appendix B Acronyms and Abbreviations ..................................................................... 99

HUAWEI ME909s Series LTE LGA Module

Hardware Guide

Introduction

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1 Introduction

This document describes the hardware application interfaces and air interfaces

provided by HUAWEI ME909s Series (ME909s-821 and ME909s-120) LTE LGA

Module (hereinafter referred to as the ME909s LGA module).

This document helps hardware engineer to understand the interface specifications,

electrical features and related product information of the ME909s LGA module.

HUAWEI ME909s Series LTE LGA Module

Hardware Guide

Overall Description

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2 Overall Description

2.1 About This Chapter

This chapter gives a general description of the ME909s LGA module and provides:

 Function Overview

 Circuit Block Diagram

2.2 Function Overview

Table 2-1 Features

Feature

Description

Physical

Dimensions

ME909s-821

 Dimensions (L × W × H): 30 mm × 30 mm × 2.57 mm

 Weight: about 5 g

ME909s-120

 Dimensions (L × W × H): 30 mm × 30 mm × 2.52 mm

 Weight: about 5 g

Operating

Bands

ME909s-821

 FDD LTE: Band 1, Band 3, Band 8, all bands with diversity

 TDD LTE: Band 38, Band 39, Band 40, Band 41, all bands with

diversity

 DC-HSPA+/HSPA+/HSPA/WCDMA: Band 1, Band 5, Band 8,

Band 9, all bands with diversity

 TD-SCDMA: Band 34, Band 39

 GSM/GPRS/EDGE: 1800 MHz/900 MHz

HUAWEI ME909s Series LTE LGA Module

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Overall Description

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Feature

Description

ME909s-120

 FDD LTE: Band 1, Band 2, Band 3, Band 4, Band 5, Band 7,

Band 8, Band 20, all bands with diversity

 WCDMA/HSDPA/HSUPA/HSPA+: Band 1, Band 2, Band 5,

Band 8, all bands with diversity

 GSM/GPRS/EDGE: 850 MHz/900 MHz/1800 MHz/1900 MHz

Operating

Temperature

Normal operating temperature: –30°C to +75°C

Extended operating temperature[1]: –40°C to +85°C

Storage

Temperature

–40°C to +85°C

Humidity

RH5% to RH95%

Power

Voltage

DC 3.2 V to 4.2 V (typical value is 3.8 V)

AT

Commands

See the HUAWEI ME909s Series LTE Module AT Command

Interface Specification.

Application

Interface

(145-pin LGA

interface)

One standard USIM (Class B and Class C) interface

Audio interface: PCM interface

USB 2.0 (High Speed)

UART interface:

 8-wire UART0 x 1

 2-wire UART2 x 1 (This is only used for debugging)

GPIO

ADC x 2

LED x 1

Power on/off interface

Hardware reset interface

JTAG interface

SLEEP_STATUS

WAKEUP_IN

WAKEUP_OUT

USIM_DET

Antenna

Interface

 WWAN MAIN antenna pad x 1

 WWAN AUX antenna pad x 1

SMS

New message alert

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Overall Description

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Feature

Description

Management of SMS: read SMS, write SMS, send SMS, delete

SMS and list SMS

Supports MO and MT: Point-to-point

Data Services

ME909s-821

GPRS: UL 85.6 kbit/s; DL 85.6 kbit/s

EDGE: UL 236.8 kbit/s; DL 236.8 kbit/s

WCDMA CS: UL 64 kbit/s; DL 64 kbit/s

WCDMA PS: UL 384 kbit/s; DL 384 kbit/s

HSPA+: UL 5.76 Mbit/s; DL 21.6 Mbit/s

DC-HSPA+: UL 5.76 Mbit/s; DL 42 Mbit/s

TD-HSPA: UL 2.2 Mbit/s; DL 2.8 Mbit/s

TD-SCDMA PS: UL 384 kbit/s; DL 2.8 Mbit/s

LTE FDD: UL 50 Mbit/s; DL 150 Mbit/s @20M BW cat4

LTE TDD: UL 10 Mbit/s; DL 112 Mbit/s @20M BW cat4

(Uplink-downlink configuration 2, 1:3)

ME909s-120

GPRS: UL 85.6 kbit/s; DL 85.6 kbit/s

EDGE: UL 236.8 kbit/s; DL 236.8 kbit/s

WCDMA CS: UL 64 kbit/s; DL 64 kbit/s

WCDMA PS: UL 384 kbit/s; DL 384 kbit/s

HSPA+: UL 5.76 Mbit/s; DL 21.6 Mbit/s

DC-HSPA+: UL 5.76 Mbit/s; DL 42 Mbit/s

LTE FDD: UL 50 Mbit/s; DL 150 Mbit/s @20M BW cat4

Operating

Systems

Android 2.x/3.x/4.x

Linux (Kernel 2.6.29 or later)

Windows 7/8/8.1/10

Windows CE 5.0/6.0/7.0

[1]: When the ME909s LGA module works in the range from –40°C to –30°C or +75°C to +85°C ,

NOT all their RF performances comply with 3GPP specifications.

2.3 Circuit Block Diagram

The ME909s LGA module is developed based on Huawei's Balong Hi6921M platform.

Figure 2-1 shows the circuit block diagram of the module. The major functional units of

the module contain the following parts:

 Power Management

 Baseband Controller

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Overall Description

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 Nand Flash

 RF Circuit

Figure 2-1 Circuit block diagram of the ME909s LGA module

Baseband Controller RFIC and Front end circuits

LGA Interface

VBAT

RESET

Power on/off

GPIO

GND

PCM

USB

UART

JTAG

WAKEUP_IN

USIM_Switch

USIM_DET

MAIN_ANT

AUX_ANT

LED

Nand flash

PMU

ADC

USIM

WAKEUP_OUT

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Hardware Guide

Description of the Application Interfaces

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3 Description of the Application Interfaces

3.1 About This Chapter

This chapter mainly describes the external application interfaces of the ME909s LGA

module, including:

 LGA Interface

 Power Interface

 Signal Control Interface

 UART Interface

 USB Interface

 USIM Card Interface

 Audio Interface

 GPIO Interface

 ADC Interface

 JTAG Interface

 RF Antenna Interface

 Reserved Interface

 NC Interface

 Test Points Design

3.2 LGA Interface

The ME909s LGA module uses the 145-pin LGA as their external interface. For details

about the module and dimensions, see 6.4 Dimensions .

Figure 3-1 shows the sequence of pins on the 145-pin signal interface of the ME909s

LGA module.

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Description of the Application Interfaces

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Figure 3-1 Sequence of LGA interface (Top view)

ADC

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Description of the Application Interfaces

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Figure 3-2 Appearance of the module (Without Label)

Table 3-1 shows the definitions of pins on the 145-pin signal interface of the ME909s

LGA module.

Table 3-1 Definitions of pins on the LGA interface

No.

Pin Name

Pad

Type

Description

Parameter

Min.

(V)

Typ.

(V)

Max.

(V)

Comments

1

Reserved

-

Reserved, please keep

this pin open.

-

2

Reserved

-

Reserved, please keep

this pin open.

-

3

Reserved

-

Reserved, please keep

this pin open.

-

4

Reserved

-

Reserved, please keep

this pin open.

-

5

PCM_SYNC[1]

O

PCM sync

VOH

1.35

1.8

1.98

-

VOL

0

-

0.45

6

PCM_DIN

I

PCM data in

VIH

1.17

1.8

1.98

-

VIL

–0.3

-

0.63

7

PCM_DOUT

O

PCM data out

VOH

1.35

1.8

1.98

-

VOL

0

-

0.45

8

PCM_CLK[1]

O

PCM clock

VOH

1.35

1.8

1.98

-

VOL

0

-

0.45

9

SD_DATA1

I/O

SD Card data signal.

VOH

2.25

3.0

3.15

Only used

for

debugging.

Please

VOL

0

3.0

0.375

VIH

1.875

3.0

3.15

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Description of the Application Interfaces

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No.

Pin Name

Pad

Type

Description

Parameter

Min.

(V)

Typ.

(V)

Max.

(V)

Comments

VIL

–0.3

3.0

0.721

5

reserve this

pin as the

test point.

10

SD_DATA2

I/O

SD Card data signal.

VOH

2.25

3.0

3.15

VOL

0

3.0

0.375

VIH

1.875

3.0

3.15

VIL

–0.3

3.0

0.721

5

11

WAKEUP_IN

I

Sleep authorization

signal.

H: Sleep mode is

disabled.

L: Sleep mode is

enabled (default value).

VIH

1.17

1.8

1.98

-

VIL

–0.3

-

0.63

12

VBAT

PI

Power supply input for

RF.

The rising time of VBAT

must be greater than

100 µs

-

3.2

3.8

4.2

-

13

VBAT

PI

Power supply input

The rising time of VBAT

must be greater than

100 µs

-

3.2

3.8

4.2

-

14

Reserved

I

Reserved, please keep

this pin open.

-

15

SLEEP_STAT

US

O

Sleep status indicator.

H: Module is in wakeup

state.

L: Module is in sleep

state.

VOH

1.35

1.8

1.98

-

VOL

0

-

0.45

16

Reserved

-

Reserved, please keep

this pin open.

-

17

Reserved

-

Reserved, please keep

this pin open.

-

18

Reserved

-

Reserved, please keep

this pin open.

-

19

Reserved

-

Reserved, please keep

this pin open.

-

20

Reserved

-

Reserved, please keep

this pin open.

-

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Description of the Application Interfaces

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No.

Pin Name

Pad

Type

Description

Parameter

Min.

(V)

Typ.

(V)

Max.

(V)

Comments

21

Reserved

-

Reserved, please keep

this pin open.

-

22

Reserved

-

Reserved, please keep

this pin open.

-

23

Reserved

-

Reserved, please keep

this pin open.

-

24

Reserved

-

Reserved, p lease keep

this pin open.

-

25

NC

-

Not connected

-

26

NC

-

Not connected

-

27

Reserved

-

Reserved, please keep

this pin open.

-

28

UART2_TX

O

UART2 transmit output

VOH

1.35

1.8

1.98

Only used

for

debugging.

Please

reserve this

pin as the

test point.

VOL

0

-

0.45

29

UART2_RX

I

UART2 receive data

input

VIH

1.17

1.8

1.98

VIL

–0.3

-

0.63

30

JTAG_TMS

I

JTAG test mode select.

VIH

1.17

1.8

1.98

-

VIL

–0.3

-

0.63

31

Reserved

-

Reserved, please keep

this pin open.

-

32

VCC_EXT1

PO

1.8 V Power output

-

1.62

1.8

1.98

-

33

Reserved

-

Reserved, please keep

this pin open.

-

34

USIM_VCC

PO

Power supply for USIM

card.

-

1.75

1.8

1.98

USIM_VCC=

1.8 V

2.75

3.0

3.3

USIM_VCC=

3.0 V

35

Reserved

-

Reserved, please keep

this pin open.

-

36

JTAG_TRST_

N

I

JTAG reset

VIH

1.17

1.8

1.98

-

VIL

–0.3

-

0.63

37

Reserved

-

Reserved, please keep

this pin open.

-

38

NC

-

Not connected

-

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Description of the Application Interfaces

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No.

Pin Name

Pad

Type

Description

Parameter

Min.

(V)

Typ.

(V)

Max.

(V)

Comments

39

NC

-

Not connected

-

40

NC

-

Not connected

-

41

NC

-

Not connected

-

42

JTAG_TCK

I

JTAG clock input

VIH

1.17

1.8

1.98

-

VIL

–0.3

-

0.63

43

GPIO1

I/O

General Purpose I/O

pins.

VOH

1.35

1.8

1.98

The function

of these pins

has not been

defined.

VOL

0

-

0.45

VIH

1.17

1.8

1.98

VIL

–0.3

-

0.63

44

Reserved

-

Reserved, please keep

this pin open.

-

45

Reserved

-

Reserved, please keep

this pin open.

-

46

GPIO2

I/O

General Purpose I/O

pins.

VOH

1.35

1.8

1.98

The function

of these pins

has not been

defined.

VOL

0

-

0.45

VIH

1.17

1.8

1.98

VIL

–0.3

-

0.63

47

NC

-

Not connected

-

48

GND

-

Ground

-

49

NOT USED

-

Do not design PAD

-

50

GND

-

Ground

-

51

GPIO3

I/O

General Purpose I/O

pins.

VOH

1.35

1.8

1.98

The function

of these pins

has not been

defined.

VOL

0

-

0.45

VIH

1.17

1.8

1.98

VIL

–0.3

-

0.63

52

GND

-

Ground

-

53

NOT USED

-

Do not design PAD

-

54

GND

-

Ground

-

55

GPIO4/USIM_

Switch

I/O

General Purpose I/O

pins (Default) or USIM

VOH

1.35

1.8

1.98

The function

of this pin

can be used

HUAWEI ME909s Series LTE LGA Module

Hardware Guide

Description of the Application Interfaces

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No.

Pin Name

Pad

Type

Description

Parameter

Min.

(V)

Typ.

(V)

Max.

(V)

Comments

Switch control signal.

VOL

0

-

0.45

as GPIO or

USIM

Switch, while

the USIM

Switch

should be

enabled by

AT

command.

VIH

1.17

1.8

1.98

VIL

–0.3

-

0.63

56

GND

-

Ground

-

57

NOT USED

-

Do not design PAD

-

58

GND

-

Ground

-

59

GND

-

Ground

-

60

Reserved

-

Reserved, please keep

this pin open.

-

61

Reserved

-

Reserved, please keep

this pin open.

-

62

Reserved

-

Reserved, please keep

this pin open.

-

63

Reserved

-

Reserved, please keep

this pin open.

-

64

Reserved

-

Reserved, please keep

this pin open.

-

65

Reserved

-

Reserved, please keep

this pin open.

-

66

SD_DATA3

I/O

SD Card data signal.

VOH

2.25

3.0

3.15

Only used

for

debugging.

Please

reserve this

pin as the

test point.

VOL

0

3.0

0.375

VIH

1.875

3.0

3.15

VIL

–0.3

3.0

0.721

5

67

SD_CLK

O

SD Card CLK signal.

VOH

2.25

3.00

3.15

VOL

0

-

0.375

68

SD_DATA0

I/O

SD Card data signal.

VOH

2.25

3.0

3.15

VOL

0

3.0

0.375

VIH

1.875

3.0

3.15

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No.

Pin Name

Pad

Type

Description

Parameter

Min.

(V)

Typ.

(V)

Max.

(V)

Comments

VIL

–0.3

3.0

0.721

5

69

SD_CMD

O

SD Card cmd signal.

VOH

2.25

3.00

3.15

VOL

0

-

0.375

70

USIM_DET

I

USIM hot swap

detection pin.

When it is High, USIM is

present.

When it is Low, USIM is

absent.

VIH

1.62

1.8

1.98

The signal is

internally

pulled up.

Keep

USIM_DET

floating, if it

is not used.

VIL

0

-

0.18

71

WAKEUP_OU

T

O

Module to wake up the

host.

VOH

1.35

1.8

1.98

-

VOL

0

-

0.45

72

JTAG_TDO

O

JTAG test data output

VOH

1.35

1.8

1.98

-

VOL

0

-

0.45

73

UART0_DSR

O

UART0 data set Ready

VOH

1.35

1.8

1.98

-

VOL

0

-

0.45

74

UART0_RTS

O

UART0 request to send

VOH

1.35

1.8

1.98

-

VOL

0

-

0.45

75

UART0_DCD

O

UART0 Data Carrier

Detect

VOH

1.35

1.8

1.98

-

VOL

0

-

0.45

76

UART0_TX

O

UART0 transmit output

VOH

1.35

1.8

1.98

-

VOL

0

-

0.45

77

UART0_RING

O

UART0 Ring Indicator

VOH

1.35

1.8

1.98

-

VOL

0

-

0.45

78

UART0_RX

I

UART0 receive data

input

VIH

1.17

1.8

1.98

-

VIL

–0.3

-

0.63

79

UART0_DTR

I

UART0 Data Terminal

Ready

VIH

1.17

1.8

1.98

-

VIL

–0.3

-

0.63

80

UART0_CTS

I

UART0 Clear to Send

VIH

1.17

1.8

1.98

-

VIL

–0.3

-

0.63

81

POWER_ON_

OFF

I

System power-on or

power-off

VIH

1.62

1.8

1.98

The signal is

internally

pulled up.

VIL

0

-

0.18

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No.

Pin Name

Pad

Type

Description

Parameter

Min.

(V)

Typ.

(V)

Max.

(V)

Comments

82

NC

-

Not connected

-

83

NC

-

Not connected

-

84

NC

-

Not connected

-

85

USB_DM

I/O

USB Data- defined in

the USB 2.0

Specification

-

86

USB_DP

I/O

USB Data+ defined in

the USB 2.0

Specification.

-

87

JTAG_TDI

I

JTAG test data input

VIH

1.17

1.8

1.98

-

VIL

–0.3

-

0.63

88

USIM_RESET

O

USIM card reset

VOH

0.7x

USIM

_VCC

-

3.3

USIM_VCC=

1.8 V or 3.0

V

VOL

0

-

0.2x

USIM

_VCC

89

USIM_DATA

I/O

USIM card data

VOH

0.7 x

USIM

_VCC

-

3.3

USIM_VCC=

1.8 V or 3.0

V

VOL

0

-

0.2 x

USIM

_VCC

VIH

0.65x

USIM

_VCC

-

3.30

VIL

0

-

0.25x

USIM

_VCC

90

USIM_CLK

O

USIM card clock

VOH

0.7 x

USIM

_VCC

-

3.3

USIM_VCC=

1.8 V or 3.0

V

VOL

0

-

0.2 x

USIM

_VCC

91

Reserved

-

Reserved, please keep

this pin open.

-

92

SD_VCC

PO

SD Card power signal.

-

2.85

3.00

3.15

-

93

JTAG_RTCK

O

JTAG return clock, Pin

VOH

1.35

1.8

2.1

-

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No.

Pin Name

Pad

Type

Description

Parameter

Min.

(V)

Typ.

(V)

Max.

(V)

Comments

for trace connection, it

is a reserved test point

for customers.

VOL

0

-

0.45

94

Reserved

-

Reserved, please keep

this pin open.

-

95

Reserved

-

Reserved, please keep

this pin open.

-

96

Reserved

-

Reserved, please keep

this pin open.

-

97

Reserved

-

Reserved, please keep

this pin open.

-

98

Reserved

-

Reserved, please keep

this pin open.

-

99

Reserved

-

Reserved, please keep

this pin open.

-

100

RESIN_N

I

Reset module.

VIH

1.62

1.8

1.98

The signal is

internally

pulled up.

VIL

0

-

0.18

101

LED_MODE

O

Mode indicator

current sink

Drive strength: 10 mA

-

102

ADC_1

AI

Conversion interface for

analog signals to digital

signals

-

0

-

2.5

-

103

Reserved

-

Reserved, please keep

this pin open.

-

104

ADC_2

AI

Conversion interface for

analog signals to digital

signals

-

0

-

2.5

-

105

GPIO5

I/O

General Purpose I/O

pins.

VOH

1.35

1.8

1.98

The function

of these pins

has not been

defined.

VOL

0

-

0.45

VIH

1.17

1.8

1.98

VIL

–0.3

-

0.63

106

GND

-

Ground

-

107

MAIN_ANT

-

RF main antenna pad

-

108

GND

-

Ground

-

109

GPIO6

I/O

General Purpose I/O

VOH

1.35

1.8

1.98

The function

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No.

Pin Name

Pad

Type

Description

Parameter

Min.

(V)

Typ.

(V)

Max.

(V)

Comments

pins.

VOL

0

-

0.45

of these pins

has not been

defined.

VIH

1.17

1.8

1.98

VIL

–0.3

-

0.63

110

GND

-

Ground

-

111

NC

-

Not connected

-

112

GND

-

Ground

-

113

GPIO7

I/O

General Purpose I/O

pins

VOH

1.35

1.8

1.98

The function

of these pins

has not been

defined.

VOL

0

-

0.45

VIH

1.17

1.8

1.98

VIL

–0.3

-

0.63

114

GND

-

Ground

-

115

AUX_ANT

-

RF AUX antenna pad

-

116

GND

-

Ground

-

117

NC

-

Not connected

-

118

NC

-

Not connected

-

119

NC

-

Not connected

-

120

NC

-

Not connected

-

121

GND

-

Thermal Ground Pad

-

122

GND

-

Thermal Ground Pad

-

123

GND

-

Thermal Ground Pad

-

124

GND

-

Thermal Ground Pad

-

125

GND

-

Thermal Ground Pad

-

126

GND

-

Thermal Ground Pad

-

127

GND

-

Thermal Ground Pad

-

128

GND

-

Thermal Ground Pad

-

129

GND

-

Thermal Ground Pad

-

130

GND

-

Thermal Ground Pad

-

131

GND

-

Thermal Ground Pad

-

132

GND

-

Thermal Ground Pad

-

133

GND

-

Thermal Ground Pad

-

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No.

Pin Name

Pad

Type

Description

Parameter

Min.

(V)

Typ.

(V)

Max.

(V)

Comments

134

GND

-

Thermal Ground Pad

-

135

GND

-

Thermal Ground Pad

-

136

GND

-

Thermal Ground Pad

-

137

GND

-

Thermal Ground Pad

-

138

GND

-

Thermal Ground Pad

-

139

GND

-

Thermal Ground Pad

-

140

GND

-

Thermal Ground Pad

-

141

GND

-

Thermal Ground Pad

-

142

GND

-

Thermal Ground Pad

-

143

GND

-

Thermal Ground Pad

-

144

GND

-

Thermal Ground Pad

-

145

GND

-

Thermal Ground Pad

-

 P indicates power pins; PI indicates input power pins; PO indicates output power pins; I

indicates pins for digital signal input; O indicates pins for digital signal output; AI indicates

pins for analog signal input.

 VIL indicates Low-level Input voltage; VIH indicates High-level Input voltage; VOL indicates

Low-level Output voltage; VOH indicates High-level Output voltage.

 The NC (Not Connected) pins are floating and there are no signal connected to these pins.

 The Reserved pins are internally connected to the module. Therefore, these pins should not

be used, otherwise they may cause problems. Please contact with us for more details about

this information.

 [1]: PCM_SYNC and PCM_CLK: Output, when ME909s LGA module is used as PCM

master.

3.3 Power Interface

3.3.1 Overview

The power supply part of the ME909s LGA module contains:

 VBAT pins for the power supply

 VCC_EXT1 pin for external power output with 1.8 V

 USIM_VCC pin for USIM card power output

 SD_VCC pin for SD card power output

Table 3-2 lists the definitions of the pins on the power supply interface.

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Table 3-2 Definitions of the pins on the power supply interface

Pin No.

Name

Pad

Type

Description

Parameter

Min.

(V)

Typ.

(V)

Max.

(V)

Comments

12 and 13

VBAT

PI

Power supply input for

RF.

The rising time of

VBAT must be greater

than 100 µs

-

3.2

3.8

4.2

-

32

VCC_EXT1

PO

1.8 V Power output

-

1.62

1.8

1.98

-

34

USIM_VCC

PO

Power supply for

USIM card

-

1.75

1.8

1.98

USIM_VCC=

1.8 V

2.75

3.0

3.3

USIM_VCC=

3.0 V

92

SD_VCC

PO

SD Card Power.

-

2.85

3.00

3.15

-

48, 50, 52,

54, 56, 58,

59, 106,

108, 110,

112, 114

and 116

GND

-

GND

-

121–145

GND

-

Thermal Ground Pad

-

3.3.2 Power Supply VBAT Interface

When the ME909s LGA module works normally, power is supplied through the VBAT

pins and the voltage ranges from 3.2 V to 4.2 V (typical value: 3.8 V). The 145-pin

LGA provides two VBAT pins and GND pins for external power input. To ensure that

the ME909s LGA module works normally, all the pins must be used efficiently.

When the ME909s LGA module is used for different external applications, pay special

attention to the design for the power supply. When the ME909s LGA module works at

2G mode and transmits signals at the maximum power, the transient current may

reach the transient peak value of about 2.75 A due to the differences in actual network

environments. In this case, the VBAT voltage drops. If you want wireless good

performance, please make sure that the voltage does not decrease below 3.2 V in any

case. Otherwise, exceptions such as restart of the ME909s LGA module may occur.

A low-dropout (LDO) regulator or switch power with current output of more than 3 A is

recommended for external power supply. Furthermore, five 220 µF or above energy

storage capacitors are connected in parallel at the power interface of the ME909s LGA

module. In addition, to reduce the impact of channel impedance on voltage drop, you

are recommended to try to shorten the power supply circuit of the VBAT interface.

It is recommended that customers add the EMI ferrite bead (FBMJ1608HS280NT

manufactured by TAIYO YUDEN or MPZ1608S300ATAH0 manufactured by TDK is

recommended) to directly isolate DTE from DCE in the power circuit. Figure 3-3

shows the recommended power circuit of ME909s LGA module.

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Figure 3-3 Recommended power circuit of ME909s LGA module

When the system power restarts, a discharge circuit is recommended to make sure

the power voltage drops below 1.8 V and stays for 100 ms at least. If

POWER_ON_OFF is asserted when the VBAT ranges from 1.8 V to 3.2 V, the module

may enter an unexpected status.

Figure 3-4 Power supply time sequence for power cycling

Parameter

Remarks

Time (Min.)

Unit

Toff

Power off time

100

ms

The rising time of VBAT should be 100 µs at least.

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3.3.3 Output Power Supply Interface

Output power supply interfaces are VCC_EXT, USIM_VCC and SD_VCC.

Through the VCC_EXT, the module can supply 1.8 V power externally with an output

current of 10 mA (typical value) for external level conversion or other applications. If

the module is in power down mode, the output power supply is in the disabled state.

Through the USIM_VCC, the module can supply 1.8 V or 3.0 V power to the USIM

card.

The SD_VCC is SD card power that only used for debugging. Please reserve the test

point.

3.4 Signal Control Interface

3.4.1 Overview

The signal control part of the interface on the ME909s LGA module consists of the

following:

 Power-on/off (POWER_ON_OFF) pin

 System reset (RESIN_N) pin

 WAKEUP_IN signal (WAKEUP_IN) pin

 WAKEUP_OUT signal (WAKEUP_OUT) pin

 SLEEP_STATUS signal (SLEEP_STATUS) pin

 LED signal (LED_MODE) pin

 USIM_DET signal (USIM_DET) pin

Table 3-3 lists the pins on the signal control interface.

Table 3-3 Definitions of the pins on the signal control interface

No.

Pin Name

Pad

Type

Description

Parameter

Min.

(V)

Typ.

(V)

Max.

(V)

Comments

81

POWER_ON_OFF

I

System power-on

and power-off

VIH

1.62

1.8

1.98

The signal is

internally

pulled up.

VIL

0

-

0.18

100

RESIN_N

I

Reset module.

VIH

1.62

1.8

1.98

The signal is

internally

pulled up。

VIL

0

-

0.18

11

WAKEUP_IN[1]

I

Sleep authorization

signal

H: Sleep mode is

disabled

L: Sleep mode is

enabled (default

value)

VIH

1.17

1.8

1.98

-

VIL

–0.3

-

0.63

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No.

Pin Name

Pad

Type

Description

Parameter

Min.

(V)

Typ.

(V)

Max.

(V)

Comments

71

WAKEUP_OUT[2]

O

Module to wake up

the host.

H: Wake up the

host, the module

hold 1s

high-level-voltage

pulse and then

output

low-level-voltage

L: Do not wake up

the host (default

value)

VOH

1.35

1.8

1.98

-

VOL

0

-

0.45

15

SLEEP_STATUS[3]

O

Sleep status

indicator

H: Module is in

wake state

L: Module is in

sleep state

VOH

1.35

1.8

1.98

-

VOL

0

-

0.45

-

101

LED_MODE

O

Mode indicator

current sink Drive

strength: 10 mA

-

70

USIM_DET

I

USIM hot swap

detection pin.

When it is High,

USIM is present.

When it is Low,

USIM is absent.

VIH

1.62

1.8

1.98

The signal is

internally

pulled up.

Keep

USIM_DET

floating, if it

is not used.

VIL

0

-

0.18

 [1]: The WAKEUP_IN pin can be used to wake up the module.

 [2]: WAKEUP_OUT: When the module is not in sleep mode, this pin's drive current is 4 mA.

When the module is in sleep mode, this pin's output level is low and drive current

smaller than 0.1 mA. The resistance is maintained at 5 kΩ–15 kΩ, as shown in Figure

3-5 . The output level may be changed if there is a stronger pull-up. It is

recommended that customers take Figure 3-12 for reference to design their circuit.

 [3]: SLEEP_STATUS: When the module is not in sleep mode, this pin's drive current is 4

mA.

When the module is in sleep mode, this pin's output level is low and drive current

smaller than 0.1 mA. The resistance is maintained at 5 kΩ–15 kΩ, as shown in Figure

3-5 . The output level may be changed if there is a stronger pull-up. It is

recommended that customers take Figure 3-13 for reference to design their circuit.

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Figure 3-5 Maintaining the resistance in sleep mode

BB Chip

Module

(Modem)

R=5–15 K

3.4.2 Power-on/off Pin

The ME909s LGA module can be controlled to power on/off by the POWER_ON_OFF

pin.

Table 3-4 Two states of POWER_ON_OFF

Item

Pin state

Description

1

Low (when ME909s

LGA module is in

power off state.)

ME909s LGA module is powered on.

POWER_ON_OFF pin should be pulled down for

1.0s at least.

2

Low (when ME909s

LGA module is in

power on state.)

ME909s LGA module is powered off.

POWER_ON_OFF pin should be pulled down for

4.0s at least.

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Figure 3-6 Connections of the POWER_ON_OFF pin

Power-On Time Sequence

After VBAT has been applied and is stable, the POWER_ON_OFF signal is pulled

down, and then the module will boot up.

During power on timing, please make sure the VBAT is stable.

Figure 3-7 Power on timing sequence

Table 3-5 Power on timing

Parameter

Comments

Time (Nominal values)

Units

TPON

POWER_ON_OFF turn on time.

> 1.0

s

TPD+

POWER_ON_OFF valid to USB

D+ high

About 7.0

s

If the DTE needs to detect the PID/VID of module during the BIOS phase, the

detection time should exceed the TPD+ time.

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Power-Off Time Sequence

Figure 3-8 Power off timing sequence

Table 3-6 Power off timing

Parameter

Comments

Time (Nominal values)

Units

TPOFF

POWER_ON_OFF turn off time.

> 4.0

s

TPD+

POWER_ON_OFF valid to USB

D+ low

> 4.0

s

3.4.3 RESIN_N

The RESIN_N pin is used to reset the module's system. When the software stops

responding, the RESIN_N pin can be pulled down to reset the hardware.

Figure 3-9 Connections of the RESIN_N pin

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As the RESIN_N and POWER_ON_OFF signals are relatively sensitive, it is

recommended that you install a 10 nF–0.1 µF capacitor near the RESIN_N and

POWER_ON_OFF pins of the interface for filtering. In addition, when you design a

circuit on the PCB of the interface board, it is recommended that the circuit length not

exceed 20 mm and that the circuit be kept at a distance of 2.54 mm (100 mil) at least

from the PCB edge. Furthermore, you need to wrap the area adjacent to the signal

wire with a ground wire. Otherwise, the module may be reset due to interference.

The ME909s LGA module supports hardware reset function. If the software of the

ME909s LGA module stops responding, you can reset the hardware through the

RESIN_N signal as shown in Figure 3-10 .When a low-level pulse is supplied through

the RESIN_N pin, the hardware will be reset. After the hardware is reset, the software

starts powering on the module and reports relevant information according to the actual

settings. For example, the AT command automatically reports ^SYSSTART.

Figure 3-10 Reset pulse timing

3.4.4 WAKEUP_IN Signal

WAKEUP_IN pin is the authorization signal of ME909s LGA module entering sleep

mode. If this pin is not connected, it will keep in low level by default.

Table 3-3 shows the definition of the WAKEUP_IN signal.

The module cannot enter sleep mode when this pin is pulled up (1.8 V), and the

module should be waked up when the pin is pulled up.

Figure 3-11 Connections of the WAKEUP_IN pin

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3.4.5 WAKEUP_OUT Signal

The WAKEUP_OUT pin is used to wake up the external devices.

 When WAKEUP_OUT pin is in high level, the module can wake up the host.

 When WAKEUP_OUT pin is in low level, the module cannot wake up the host.

(default)

Figure 3-12 Connections of the WAKEUP_OUT pin

3.4.6 SLEEP_STATUS Signal

The SLEEP_STATUS pin is used to indicate the sleep status of the module.

 When SLEEP_STATUS pin is in high level, the module is in wakeup state.

 When SLEEP_STATUS pin is in low level, the module is in sleep state.

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Figure 3-13 Connections of the SLEEP_STATUS pin

3.4.7 LED_MODE Signal

ME909s LGA module provides an LED_MODE signal to indicate the work status.

Table 3-7 State of the LED_MODE pin

No.

Operating Status

LED_MODE

1

No service/Restricted service

Outputs: low (0.1s)-high (0.1s)-low

(0.1s)-high (1.7s)

2s cycle

2

Register to the network

Outputs: low (0.1s)-high (1.9s)

2s cycle

3

Dial-up successfully

Outputs: low

Figure 3-14 shows the recommended circuits of LED_MODE. The brightness of LED

can be adjusted by adjusting the resistance of the resistor.

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Figure 3-14 Driving circuit

LED_MODE

Module

(DCE)

R

VBAT

3.4.8 USIM_DET Pin

ME909s LGA module supports USIM hot swap function.

ME909s LGA module provides an input pin (USIM_DET) to detect whether the USIM

card is present or not. This pin is a level trigger pin, and it is internally pulled up. If the

module does not support USIM card hot swap, keep USIM_DET floating.

Table 3-8 Function of the USIM_DET pin

No.

USIM_DET

Function

1

High level

USIM card insertion.

If the USIM card is present, USIM_DET should be High.

2

Low level

USIM card removal.

If the USIM card is absent, USIM_DET should be Low.

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Figure 3-15 Connections of the USIM_DET pin

Module

(DCE) 1.8 V

USIM_DET

USIM Deck

470 pF

CD

1 kΩ

BB Chip

CD is a pin detecting of USIM in the USIM socket, in normal, there will be a detect pin

in the USIM socket.

 It is recommended not to add a diode on the USIM_DET pin outside the module.

 The normal SHORT USIM connector should be employed. The logic of USIM_DET

is shown as Figure 3-16 . High represents that USIM is inserted; Low represents

that USIM is removed.

 When USIM is inserted (hot), USIM_DET will change from Low to High;

 When USIM is removed (hot), USIM_DET will change from High to Low;

 The module will detect the level of USIM_DET to support the hot swap.

Figure 3-16 Logic of USIM_DET

Modem

Processor

USIM Connector Switch

USIM installed=

Not Connected

USIM not

installed=

GND

WWAN Module

USIM_DET

1.8V

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3.5 UART Interface

3.5.1 Overview

The ME909s LGA module provides the UART0 (8-wire UART) interface for one

asynchronous communication channel. As the UART0 interface supports signal

control through standard modem handshake, AT commands are entered and serial

communication is performed through the UART0 interface. The UART2 (2-wire UART)

interface is provided for only debugging by the ME909s LGA module. The UART have

the following features:

 Full-duplex

 7-bit or 8-bit data

 1-bit or 2-bit stop bit

 Odd parity check, even parity check, or non-check

 Baud rate clock generated by the system clock

 Direct memory access (DMA) transmission

 UART0 supports baud rate: 300 bit/s, 600 bit/s, 1200 bit/s, 2400 bit/s ,4800 bit/s,

9600 bit/s, 19200 bit/s, 38400 bit/s, 57600 bit/s, 115200 bit/s (default), 230400

bit/s, 1000000 bit/s, 3000000 bit/s

 Baud rate auto adaptive change is supported. AP (Access Point) must choose

one default Baud rate to communicate with module in the beginning.

The 2-wire UART is for debugging only. Customers should layout two test points for

them, which are required for system troubleshooting and analysis.

Table 3-9 UART interface signals

No.

Pin Name

Pad

Type

Description

Parameter

Min.

(V)

Typ.

(V)

Max.

(V)

Comments

76

UART0_TX

O

UART0 transmit output

VOH

1.35

1.8

1.98

-

VOL

0

-

0.45

-

78

UART0_RX

I

UART0 receive data

input

VIH

1.17

1.8

1.98

-

VIL

–0.3

-

0.63

-

77

UART0_RING

O

UART0 ring indicator

VOH

1.35

1.8

1.98

-

VOL

0

-

0.45

-

74

UART0_RTS

O

UART0 request to send

VOH

1.35

1.8

1.98

-

VOL

0

-

0.45

-

79

UART0_DTR

I

UART0 data terminal

ready

VIH

1.17

1.8

1.98

-

VIL

–0.3

-

0.63

-

80

UART0_CTS

I

UART0 clear to send

VIH

1.17

1.8

1.98

-

VIL

–0.3

-

0.63

-

75

UART0_DCD

O

UART0 data carrier

VOH

1.35

1.8

1.98

-

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No.

Pin Name

Pad

Type

Description

Parameter

Min.

(V)

Typ.

(V)

Max.

(V)

Comments

detect

VOL

0

-

0.45

-

73

UART0_DSR

O

UART0 data set ready

VOH

1.35

1.8

1.98

-

VOL

0

-

0.45

-

28

UART2_TX

O

UART2 transmit output

VOH

1.35

1.8

1.98

Only used for

debugging.

Please

reserve this

pin as the

test point.

VOL

0

-

0.45

29

UART2_RX

I

UART2 receive data

input

VIH

1.17

1.8

1.98

VIL

–0.3

-

0.63

3.5.2 Circuit Recommended for the UART Interface

Figure 3-17 Connection of the UART interface in the ME909s LGA module (DCE) with

the host (DTE)

The RS-232 chip (must support 921600 bit/s) can be used to connect the module with

UART. In this connection, the CMOS (Complementary Metal Oxide Semiconductor)

logic level and the EIA (Electronic Industries Association) level are converted mutually.

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 The UART cannot wake up the module from the sleep status, and you can pull up the

WAKEUP_IN signal for 1s instead.

 It is recommended to set the pins related to UART2 interface as test points on the DTE

board for debugging. The level of RS-232 transceivers must match that of the ME909s LGA

module.

3.6 USB Interface

The ME909s LGA module is compliant with USB 2.0 High speed protocol. The USB

interface is powered directly from the VBAT supply. The USB signal lines are

compatible with the USB 2.0 signal specifications. Figure 3-18 shows the circuit of the

USB interface.

Table 3-10 Definition of the USB interface

No.

Name

Pad

Type

Description

Parameter

Min.

(V)

Typ.

(V)

Max.

(V)

Comments

85

USB_DM

I/O

USB Data- defined in the

USB 2.0 Specification

-

86

USB_DP

I/O

USB Data+ defined in the

USB 2.0 Specification

-

According to USB protocol, for bus timing or electrical characteristics of ME909s LGA

USB signal, please refer to the chapter 7.3.2 of Universal Serial Bus Specification 2.0.

Figure 3-18 Recommended circuit of USB interface

 USB_DM and USB_DP are required to control the differential impedance 90 Ω (±10%).

 The length of the gap between USB_DM and USB_DP should not exceed 5 mil.

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 The USB differential signal trace must be as short as possible, and laid out away from

high-speed clock signals and other periodic signals as far as possible.

 Minimize through-holes and turning angles on the USB signal trace to reduce signal

reflection and impedance change.

 Do not route the USB signal trace under the following components: crystal, oscillator, clock

circuit, electromagnetic component, and IC that uses or generates clocks.

 Avoid stubs on the USB signal trace because stubs generate reflection and affect the signal

quality.

 Route the USB signal trace on a complete reference plane (GND) and avoid crossing

inter-board gaps because inter-board gaps cause a large reflow channel area and increase

inductance and radiation. In addition, avoid signal traces on different layers.

 The USB signal trace must be far away from core logical components because the high

current pulse generated during the state transitions process of core components may

impose interference on signals.

 The USB signal trace must be far away from board edges with a minimum distance of 20 × h

(h indicates the vertical distance between the trace and the reference layer) to avoid signal

radiation.

 C1 and C2 are ready for dealing with filter differential mode interference and C3 is ready for

dealing with filter common mode interference. You can choose the value of the C1, C2 and

C3 according to the actual PCB which is integrated 30 mm × 30 mm LGA module

3.7 USIM Card Interface

3.7.1 Overview

The ME909s LGA module provides a USIM card interface complying with the ISO

7816-3 standard and supports both Class B and Class C USIM cards.

Table 3-11 USIM card interface signals

No.

Pin Name

Pad

Type

Description

Parameter

Min.(V)

Typ.(V)

Max.(V)

Comments

88

USIM_RESET

O

USIM card

reset

VOH

0.7 x

USIM_V

CC

-

3.3

USIM_VCC=

1.8 V or 3.0 V

VOL

0

-

0.2 x

USIM_V

CC

89

USIM_DATA

I/O

USIM card

data

VOH

0.7 x

USIM_V

CC

-

3.3

USIM_VCC=

1.8 V or 3.0 V

VOL

0

-

0.2 x

USIM_V

CC

VIH

0.65 x

USIM_V

CC

-

3.30

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No.

Pin Name

Pad

Type

Description

Parameter

Min.(V)

Typ.(V)

Max.(V)

Comments

VIL

0

-

0.25 x

USIM_V

CC

90

USIM_CLK

O

USIM card

clock

VOH

0.7 x

USIM_V

CC

-

3.3

USIM_VCC=

1.8 V or 3.0 V

VOL

0

-

0.2 x

USIM_V

CC

34

USIM_VCC

PO

Power supply

for USIM card

-

1.75

1.8

1.98

USIM_VCC=

1.8 V

2.75

3.0

3.3

USIM_VCC=

3.0 V

70

USIM_DET

I

USIM hot

swap

detection pin.

When it is

High, USIM is

present.

When it is

Low, USIM is

absent.

VIH

1.62

1.8

1.98

The signal is

internally

pulled up.

Keep

USIM_DET

floating, if it is

not used.

VIL

0

-

0.18

3.7.2 Circuit Recommended for the USIM Card Interface

As the ME909s LGA module is not equipped with a USIM socket, you need to place a

USIM socket on the user interface board. Figure 3-19 shows the circuit of the USIM

card interface.

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Figure 3-19 Circuit of the USIM card interface

USIM

Module

(DCE)

ESD protection

USIM-VCC

USIM-DET

USIM-CLK

USIM-DATA

USIM-RESET

1 µF

0 Ω

33 pF 33 pF 33 pF

33 pF

470 pF

1 kΩ

 To meet the requirements of 3GPP TS 51.010-1 protocols and electromagnetic

compatibility (EMC) authentication, the USIM socket should be placed near the

LGA interface (it is recommended that the PCB circuit connects the LGA interface

and the USIM socket does not exceed 100 mm), because a long circuit may lead to

wave distortion, thus affecting signal quality.

 It is recommended that you wrap the area adjacent to the USIM_CLK and

USIM_DATA signal wires with ground. The Ground pin of the USIM socket and the

Ground pin of the USIM card must be well connected to the power Ground pin

supplying power to the ME909s LGA module.

 A 100 nF capacitor and 1 μF capacitor are placed between the USIM_VCC and

GND pins in a parallel manner (If USIM_VCC circuit is too long, that the larger

capacitance such as 4.7 μF can be employed if necessary). Three 33 pF

capacitors are placed between the USIM_DATA and Ground pins, the

USIM_RESET and Ground pins, and the USIM_CLK and Ground pins in parallel to

filter interference from RF signals.

 It is recommended to take electrostatic discharge (ESD) protection measures near

the USIM card socket. The TVS diode with Vrwm of 5 V and junction capacitance

less than 10 pF must be placed as close as possible to the USIM socket, and the

Ground pin of the ESD protection component is well connected to the power

Ground pin that supplies power to the ME909s LGA module.

 It is recommended to place a 1 kΩ resistor in series on the USIM_DET interface for

ESD protection if USIM_DET is used.

3.8 Audio Interface

ME909s LGA module provides one PCM digital audio interface. Table 3-12 lists the

signals on the digital audio interface.

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Table 3-12 Signals on the digital audio interface

No.

Pin Name

Pad Type

Description

Parameter

Min.

(V)

Typ.

(V)

Max.

(V)

Comments

5

PCM_SYNC

O

PCM sync

VOH

1.35

1.8

1.98

-

VOL

0

-

0.45

-

6

PCM_DIN

I

PCM data in

VIH

1.17

1.8

1.98

-

VIL

–0.3

-

0.63

-

7

PCM_DOUT

O

PCM data out

VOH

1.35

1.8

1.98

-

VOL

0

-

0.45

-

8

PCM_CLK

O

PCM clock

VOH

1.35

1.8

1.98

-

VOL

0

-

0.45

-

The ME909s LGA PCM interface enables communication with an external codec to

support linear format.

Figure 3-20 Circuit diagram of the interface of the PCM (ME909s LGA module is used as

PCM master)

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Figure 3-21 Circuit diagram of the interface of the PCM (ME909s LGA module is used as

PCM slave)

 The signal level of CODEC must match that of the module.

 ME909s LGA module supports both master and slave mode.

 PCM_CLK: Output when PCM is in master mode; Input when PCM is in slave mode.

 PCM_SYNC: Output when PCM is in master mode; Input when PCM is in slave mode.

 It is recommended that a TVS be used on the related interface, to prevent electrostatic

discharge and protect integrated circuit (IC) components.

3.9 GPIO Interface

The ME909s LGA module provides GPIO pins for customers to use as controlling

signals which are worked at 1.8 V CMOS logic levels. Customers can use AT

command to control the state of logic levels of GPIO output signal. See the HUAWEI

ME909s Series LTE Module AT Command Interface Specification.

Table 3-13 Signals on the GPIO interface

No.

Pin Name

Pad

Type

Description

Parameter

Min.

(V)

Typ.

(V)

Max.

(V)

Comments

55

GPIO5/USIM

Switch

I/O

General Purpose I/O

pins (Default) or

USIM Switch control

signal.

VOH

1.35

1.8

1.98

The function of

this pin can be

defined as

GPIO or USIM

Switch, while

the USIM

Switch should

be enabled by

AT command.

VOL

0

-

0.45

VIH

1.17

1.8

1.98

VIL

–0.3

-

0.63

113

GPIO3

I/O

General Purpose I/O

VOH

1.35

1.8

1.98

The function of

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No.

Pin Name

Pad

Type

Description

Parameter

Min.

(V)

Typ.

(V)

Max.

(V)

Comments

pins (Default)

VOL

0

-

0.45

these pins has

not been

defined.

VIH

1.17

1.8

1.98

VIL

–0.3

-

0.63

51

GPIO2

I/O

General Purpose I/O

pins.

VOH

1.35

1.8

1.98

VOL

0

-

0.45

VIH

1.17

1.8

1.98

VIL

–0.3

-

0.63

105

GPIO1

I/O

General Purpose I/O

pins.

VOH

1.35

1.8

1.98

VOL

0

-

0.45

VIH

1.17

1.8

1.98

VIL

–0.3

-

0.63

109

GPIO4

I/O

General Purpose I/O

pins.

VOH

1.35

1.8

1.98

VOL

0

-

0.45

VIH

1.17

1.8

1.98

VIL

–0.3

-

0.63

43

GPIO1

I/O

General Purpose I/O

pins.

VOH

1.35

1.8

1.98

VOL

0

-

0.45

VIH

1.17

1.8

1.98

VIL

–0.3

-

0.63

46

GPIO2

I/O

General Purpose I/O

pins.

VOH

1.35

1.8

1.98

VOL

0

-

0.45

VIH

1.17

1.8

1.98

VIL

–0.3

-

0.63

When the GPIO interface is used for input, the module will not respond in sleep mode

(it will resume response after being waken up from sleep mode by the WAKEUP_IN

pin) and the module is configured to pull-down inside. In sleep mode, the pull-down

resistance is 5 kΩ–15 kΩ. For the peripheral circuits, see Figure 3-22 .

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Figure 3-22 Reference peripheral circuits when the GPIO interface is used for input

When the GPIO interface is used for output and the module is not in sleep mode, the

drive current is 4 mA. When the module is in sleep mode, the drive current is smaller

than 0.1 mA. The resistance is maintained at 5 kΩ–15 kΩ, as shown in Figure 3-23 .

The output level may be changed if there is a stronger pull-up or pull-down. For the

peripheral circuits, see Figure 3-24 .

Figure 3-23 Maintaining the resistance in sleep mode

BB Chip

Module

(Modem)

Lowoutput level in sleep mode

BB Chip

Module

(Modem)

1.8 V

High output level in sleep mode

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Figure 3-24 Reference peripheral circuits when the GPIO interface is used for output

GPIO

3.10 ADC Interface

The ME909s LGA module provides two ADC interfaces. Customers can query their

voltage through AT^ADCREADEX command. For details, you can see HUAWEI

ME909s Series LTE Module AT Command Interface Specification.

Table 3-14 Signals on the ADC interface

No.

Pin Name

Pad

Type

Description

Min.

(V)

Typ.

(V)

Max.

(V)

Comments

102

ADC_1

AI

Conversion interface for analog

signals to digital signals

0

-

2.5

-

104

ADC_2

AI

Conversion interface for analog

signals to digital signals

0

-

2.5

-

3.11 JTAG Interface

The ME909s LGA module provides Joint Test Action Group (JTAG) interface. Table

3-15 shows the signals on the JTAG interface. It is recommended that route out the 6

pins as test points on the DTE for tracing and debugging.

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Table 3-15 Signals on the JTAG interface

No.

Pin Name

Pad

Type

Description

Parameter

Min.

(V)

Typ.

(V)

Max.

(V)

Comments

30

JTAG_TMS

I

JTAG test mode

select

VIH

1.17

1.8

1.98

-

VIL

–0.3

-

0.63

-

36

JTAG_TRST_N

I

JTAG reset

VIH

1.17

1.8

1.98

-

VIL

–0.3

-

0.63

-

42

JTAG_TCK

I

JTAG clock input

VIH

1.17

1.8

1.98

-

VIL

–0.3

-

0.63

-

72

JTAG_TDO

O

JTAG test data output

VOH

1.35

1.8

1.98

-

VOL

0

-

0.45

-

87

JTAG_TDI

I

JTAG test data input

VIH

1.17

1.8

1.98

-

VIL

–0.3

-

0.63

-

93

JTAG_RTCK

O

JTAG return clock,

Pin for trace

connection, it is a

reserved test point for

customers.

VOH

1.35

1.8

2.1

-

VOL

0

-

0.45

-

3.12 RF Antenna Interface

The ME909s LGA module provides two antenna pads (MAIN_ANT and AUX_ANT) for

connecting the external antennas.

Table 3-16 Definition of the antenna pads

No.

Pin Name

Pad

Type

Description

Parameter

Min.

(V)

Typ.

(V)

Max.

(V)

Comments

107

MAIN_ANT

-

RF MAIN antenna pad

-

115

AUX_ANT

-

RF AUX antenna pad

-

Route the antenna pad as close as possible to antenna connector. In addition, the

impedance of RF signal traces must be 50 Ω.

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Figure 3-25 RF signal trace design about MAIN_ANT for reference (the same for

AUX_ANT)

Figure 3-26 RF signal layout design about MAIN_ANT for reference (the same for

AUX_ANT)

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For the PCB designed by the user, the impedance of all the RF signal tracks must be

50 Ω. Generally, the impedance depends on the medium factor, track width, and

distance from the floor.

In order to reflect the rules of design, the following figures indicate the complete

structure of the microstrip and stripline with an impedance of 50 Ω as well as the

reference design for stack.

Figure 3-27 Complete structure of the microstrip

Figure 3-28 Complete structure of the stripline

Figure 3-29 Pad for the RF interface

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Figure 3-30 RF Pad design for ME909s LGA

Please use impedance simulation tool to calculate RF MAIN pad impedance. The RF

MAIN pad dimension of the module is 1.1 mm (L) x 0.9 mm (W). You can get the

impedance with lower than 50 Ω calculated by the impedance simulation tool. Since

the target impedance is 50 Ω for RF trace, the recommended solution is that to carve

out the copper area of the second layer that projected by the RF MAIN pad at top

layer. How many layers should be carved out depend on the PCB permittivity, track

width, and distance from the floor of your own PCB. Our target is to make the RF

MAIN pad impedance as closer to 50 Ω as possible.

3.13 Reserved Interface

The ME909s LGA module provides some reserved pins. All reserved pins cannot be

used by the customer.

Table 3-17 Reserved pin

Pin No.

Name

Pad

Type

Description

Parameter

Min.

(V)

Typ.

(V)

Max.

(V)

Comments

1-4,14, 16-24, 27,

31, 33, 35, 37, 44,

45, 60–65, 91,

94–99 and 103

Reserved

-

Reserved,

please keep

this pin open.

-

3.14 NC Interface

The ME909s LGA module provides some NC pins. All NC pins should not be

connected. Please keep these pins open.

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Table 3-18 NC pin

Pin No.

Name

Pad

Type

Description

Parameter

Min.

(V)

Typ.

(V)

Max.

(V)

Comments

25, 26, 38–41,

47, 82–84, 111,

117–120

NC

-

Not connected

-

3.15 Test Points Design

In the process of debugging when the module is embedded into the integrated

equipment, test points play an important role. Some problems related to the module

can be quickly resolved when test points are properly designed.

1. The test points below must be designed in the customer board:

− JTAG test points: It is the most common method of debugging.

− USB test points: USB is the most important communication channel between

module and AP (host). Not only test points should be placed, but also a 0 ohm

series resistor should be placed on USB_D+/USB_D- signal. The resistor can

be welded off when necessary, then the USB of module is cut off from AP and

can be connected to PC to do some analyses.

− POWER_ON_OFF, RESIN_N: They are some of the most important signals,

test points should be placed.

− UART2: UART2 is used for printing the log information.

− SD signals: SD signals are used for debugging.

− VBAT: Not only test points should be placed, but also a series magnetic bead

should be placed on VBAT signal. The magnetic bead can be welded off when

necessary, then the power of module is cut off from customer board and can

be connected to external power to do analyses about problems related to

power interference.

− VCC_EXT1: to judge whether the module is powered on or not, just test the

VCC_EXT1.

2. The test points below should be placed according to the requirement in the

customer board: ADC, SLEEP_STATUS, GPIO, PCM, SIM, UART2,

WAKEUP_IN and WAKEUP_OUT, except the two cases below:

− The corresponding signal is not used.

− The corresponding signal is used, but there is already someplace else can be

tested, such as SIM socket pin.

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4 RF Specifications

4.1 About This Chapter

This chapter describes the RF specifications of the ME909s LGA module, including:

 Operating Frequencies

 Conducted RF Measurement

 Conducted Rx Sensitivity and Tx Power

 Antenna Design Requirements

 Suggestions about LTE and 2.4 GHz Wi-Fi Co-existence

4.2 Operating Frequencies

Table 4-1 and Table 4-2 show the RF bands supported by ME909s LGA module.

Table 4-1 RF bands of the ME909s-821 LGA module

Operating Band

Tx

Rx

UMTS Band 1

1920 MHz–1980 MHz

2110 MHz–2170 MHz

UMTS Band 5

824 MHz–849 MHz

869 MHz–894 MHz

UMTS Band 8

880 MHz–915 MHz

925 MHz–960 MHz

UMTS Band 9

1749.9 MHz–1784.9 MHz

1844.9 MHz–1879.9 MHz

GSM 900

880 MHz–915 MHz

925 MHz–960 MHz

GSM 1800

1710 MHz–1785 MHz

1805 MHz–1880 MHz

LTE Band 1

1920 MHz–1980 MHz

2110 MHz–2170 MHz

LTE Band 3

1710 MHz–1785 MHz

1805 MHz–1880 MHz

LTE Band 8

880 MHz–915 MHz

925 MHz–960 MHz

LTE Band 38

2570 MHz–2620 MHz

LTE Band 39

1880 MHz–1920 MHz

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Operating Band

Tx

Rx

LTE Band 40[1]

2300 MHz–2400 MHz

LTE Band 41[2]

2496 MHz–2690 MHz

TD-SCDMA Band 34

2010 MHz–2025 MHz

TD-SCDMA Band 39

1880 MHz–1920 MHz

 [1]: The module may not meet the RF performance requirements at frequency 2390–2400

MHz in the LTE B40 band.

 [2]: The module may not meet the RF performance requirements at frequency 2496–2555

MHz or 2655–2690 MHz in the LTE B41 band.

Table 4-2 RF bands of the ME909s-120 LGA module

Operating Band

Tx

Rx

UMTS Band 1

1920 MHz–1980 MHz

2110 MHz–2170 MHz

UMTS Band 2

1850 MHz–1910 MHz

1930 MHz–1990 MHz

UMTS Band 5

824 MHz–849 MHz

869 MHz–894 MHz

UMTS Band 8

880 MHz–915 MHz

925 MHz–960 MHz

GSM 850

824 MHz–849 MHz

869 MHz–894 MHz

GSM 900

880 MHz–915 MHz

925 MHz–960 MHz

GSM 1800

1710 MHz–1785 MHz

1805 MHz–1880 MHz

GSM 1900

1850 MHz–1910 MHz

1930 MHz–1990 MHz

LTE Band 1

1920 MHz–1980 MHz

2110 MHz–2170 MHz

LTE Band 2

1850 MHz–1910 MHz

1930 MHz–1990 MHz

LTE Band 3

1710 MHz–1785 MHz

1805 MHz–1880 MHz

LTE Band 4

1710 MHz–1755 MHz

2110 MHz–2155 MHz

LTE Band 5

824 MHz–849 MHz

869 MHz–894 MHz

LTE Band 7

2500 MHz–2570 MHz

2620 MHz–2690 MHz

LTE Band 8

880 MHz–915 MHz

925 MHz–960 MHz

LTE Band 20

832 MHz–862 MHz

791 MHz–821 MHz

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4.3 Conducted RF Measurement

4.3.1 Test Environment

Test instrument

R&S CMU200, R&S CMW500, Agilent E5515C, Starpoint

SP6010

Power supply

KEITHLEY 2306; Aglient66319D

RF cable for testing

L08-C014-350 of DRAKA COMTEQ or Rosenberger

Cable length: 29 cm

 The compensation for different frequency bands relates to the cable and the test

environment.

 The instrument compensation needs to be set according to the actual cable conditions.

4.3.2 Test Standards

Huawei modules meet 3GPP test standards. Each module passes strict tests at the

factory and thus the quality of the modules is guaranteed.

4.4 Conducted Rx Sensitivity and Tx Power

4.4.1 Conducted Receive Sensitivity

The conducted receive sensitivity is a key parameter that indicates the receiver

performance of ME909s LGA module.

Table 4-3 and Table 4-4 list the typical tested values of the ME909s LGA module.

Table 4-3 ME909s-821 LGA module conducted Rx sensitivity

Band

Test Value

(Unit: dBm)

Note

GSM 900

–109

BER Class II < 2.44%

GSM 1800

–107

BER Class II < 2.44%

UMTS Band 1

–110.5

BER < 0.1%

UMTS Band 5

–110.5

BER < 0.1%

UMTS Band 8

–110.5

BER < 0.1%

UMTS Band 9

–110.5

BER < 0.1%

LTE Band 1

–103

FDD QPSK throughput > 95%,

10 MHz Bandwidth

LTE Band 3

–102.5

FDD QPSK throughput > 95%,

10 MHz Bandwidth

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Band

Test Value

(Unit: dBm)

Note

LTE Band 8

–102.5

FDD QPSK throughput > 95%,

10 MHz Bandwidth

LTE Band 38

–101.5

TDD QPSK throughput > 95%,

10 MHz Bandwidth

LTE Band 39

–102

TDD QPSK throughput > 95%,

10 MHz Bandwidth

LTE Band 40

–101

TDD QPSK throughput > 95%,

10 MHz Bandwidth

LTE Band 41

–101

TDD QPSK throughput > 95%,

10 MHz Bandwidth

TD-SCMDA Band 34

–112

BER < 0.1%

TD-SCMDA Band 39

–112.5

BER < 0.1%

Table 4-4 ME909s-120 LGA module conducted Rx sensitivity

Band

Test Value

(Unit: dBm)

Note

GSM 850

–109

BER Class II < 2.44%

GSM 900

–109

BER Class II < 2.44%

GSM 1800

–108.5

BER Class II < 2.44%

GSM 1900

–109

BER Class II < 2.44%

UMTS Band 1

–111.5

BER < 0.1%

UMTS Band 2

–111.5

BER < 0.1%

UMTS Band 5

–111.5

BER < 0.1%

UMTS Band 8

–111.5

BER < 0.1%

LTE Band 1

–102.5

Throughput ≥ 95%, 10 MHz Bandwidth

LTE Band 2

–102.5

Throughput ≥ 95%, 10 MHz Bandwidth

LTE Band 3

–102

Throughput ≥ 95%, 10 MHz Bandwidth

LTE Band 4

–102

Throughput ≥ 95%, 10 MHz Bandwidth

LTE Band 5

–102.5

Throughput ≥ 95%, 10 MHz Bandwidth

LTE Band 7

–102.5

Throughput ≥ 95%, 10 MHz Bandwidth

LTE Band 8

–102.5

Throughput ≥ 95%, 10 MHz Bandwidth

LTE Band 20

–102.5

Throughput ≥ 95%, 10 MHz Bandwidth

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 The test values are the average of some test samples.

 LTE sensitivity is tested in SIMO (Main + AUX).

4.4.2 Conducted Transmit Power

The conducted transmit power is another indicator that measures the performance of

ME909s LGA module. The conducted transmit power refers to the maximum power

that the module tested at the antenna pad can transmit. According to the 3GPP

protocol, the required transmit power varies with the power class.

Table 4-5 and Table 4-6 list the required ranges of the conducted transmit power of

ME909s LGA module.

Table 4-5 ME909s-821 LGA module conducted Tx power

Band

Typical Value (Unit: dBm)

Note (Unit: dB)

GSM 900

GMSK (1Tx Slot)

32.5

±1.5

8PSK (1Tx Slot)

27

±1.5

GSM 1800

GMSK (1Tx Slot)

29.5

±1.5

8PSK (1Tx Slot)

26

±1.5

UMTS Band 1

23.5

±1

UMTS Band 5

23.5

±1

UMTS Band 8

23.5

±1

UMTS Band 9

23.5

±1

TD-SCDMA Band 34

23.5

±1

TD-SCDMA Band 39

23.5

±1

TDD LTE Band 38

23

±1.5

TDD LTE Band 39

23

±1.5

TDD LTE Band 40

23

±1.5

TDD LTE Band 41

23

±1.5

FDD LTE Band 1

23

±1.5

FDD LTE Band 3

23

±1.5

FDD LTE Band 8

23

±1.5

Table 4-6 ME909s-120 LGA module conducted Tx power

Band

Typical Value (Unit: dBm)

Note (Unit: dB)

GSM 850

GMSK (1Tx Slot)

32.5

±1.5

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Band

Typical Value (Unit: dBm)

Note (Unit: dB)

8PSK (1Tx Slot)

27

±1.5

GSM 900

GMSK (1Tx Slot)

32.5

±1.5

8PSK (1Tx Slot)

27

±1.5

GSM 1800

GMSK (1Tx Slot)

29.5

±1.5

8PSK (1Tx Slot)

26

±1.5

GSM 1900

GMSK (1Tx Slot)

29.5

±1.5

8PSK (1Tx Slot)

26

±1.5

UMTS Band 1

23.5

±1

UMTS Band 2

23.5

±1

UMTS Band 5

23.5

±1

UMTS Band 8

23.5

±1

LTE Band 1

23

±1.5

LTE Band 2

23

±1.5

LTE Band 3

23

±1.5

LTE Band 4

23

±1.5

LTE Band 5

23

±1.5

LTE Band 7

23

±1.5

LTE Band 8

23

±1.5

LTE Band 20

23

±1.5

Maximum Power Reduction (MPR and AMPR) of LTE is according to 3GPP TS 36.521-1.

4.5 Antenna Design Requirements

4.5.1 Antenna Design Indicators

Antenna Efficiency

Antenna efficiency is the ratio of the input power to the radiated or received power of

an antenna. The radiated power of an antenna is always lower than the input power

due to the following antenna losses: return loss, material loss, and coupling loss. The

efficiency of an antenna relates to its electrical dimensions. To be specific, the

antenna efficiency increases with the electrical dimensions. In addition, the

transmission line from the antenna port of ME909s LGA to the antenna is also part of

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the antenna. The line loss increases with the line length and the frequency. It is

recommended that the line loss is as low as possible.

The following antenna efficiency (free space) is recommended for ME909s LGA to

ensure high radio performance of the module:

 Efficiency of the primary antenna: ≥ 40% (below 960 MHz); ≥ 50% (over 1710

MHz)

 Efficiency of the diversity antenna: ≥ half of the efficiency of the primary

antenna in receiving band

In addition, the efficiency should be tested with the transmission line.

S11 (VSWR）

S11 indicates the degree to which the input impedance of an antenna matches the

reference impedance (50 Ω). S11 shows the resonance feature and impedance

bandwidth of an antenna. Voltage standing wave ratio (VSWR) is another expression

of S11. S11 relates to the antenna efficiency. S11 can be measured with a vector

analyzer.

The following S11 value is recommended for the antenna of ME909s LGA module:

 S11 of the primary antenna: ≤ –6 dB

 S11 of the diversity antenna: ≤ –6 dB

In addition, S11 is less important than the efficiency, and S11 has weak correlation to

wireless performance.

Isolation

For a wireless device with multiple antennas, the power of different antennas is

coupled with each other. Antenna isolation is used to measure the power coupling.

The power radiated by an antenna might be received by an adjacent antenna, which

decreases the antenna radiation efficiency and affects the running of other devices. To

avoid this problem, evaluate the antenna isolation as sufficiently as possible at the

early stage of antenna design.

Antenna isolation depends on the following factors:

 Distance between antennas

 Antenna type

 Antenna direction

The primary antenna must be placed as near as possible to the ME909s LGA to

minimize the cable length. The diversity antenna needs to be installed

perpendicularly to the primary antenna. The diversity antenna can be placed farther

away from the ME909s LGA. Antenna isolation can be measured with a two-port

vector network analyzer.

The following antenna isolation is recommended for the antennas on laptops:

 Isolation between the primary and diversity antennas: ≤ –12 dB

 Isolation between the primary (diversity) antenna and the Wi-Fi antenna: ≤

–15 dB

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Polarization

The polarization of an antenna is the orientation of the electric field vector that rotates

with time in the direction of maximum radiation.

The linear polarization is recommended for the antenna of ME909s LGA.

Radiation Pattern

The radiation pattern of an antenna reflects the radiation features of the antenna in the

remote field region. The radiation pattern of an antenna commonly describes the

power or field strength of the radiated electromagnetic waves in various directions

from the antenna. The power or field strength varies with the angular coordinates (θ

and φ), but is independent of the radial coordinates.

The radiation pattern of half wave dipole antennas is omnidirectional in the horizontal

plane, and the incident waves of base stations are often in the horizontal plane. For

this reason, the receiving performance is optimal.

The following radiation patterns are recommended for the antenna of ME909s LGA.

Primary/diversity antenna: omnidirectional

In addition, the diversity antenna’s pattern should be complementary with the primary

antenna's pattern.

Gain and Directivity

The radiation pattern of an antenna represents the field strength of the radiated

electromagnetic waves in all directions, but not the power density that the antenna

radiates in the specific direction. The directivity of an antenna, however, measures the

power density that the antenna radiates.

Gain, as another important parameter of antennas, correlates closely to the directivity.

The gain of an antenna takes both the directivity and the efficiency of the antenna into

account. The appropriate antenna gain prolongs the service life of relevant batteries.

The following antenna gain is recommended for ME909s LGA.

Gain of the primary/diversity antenna ≤ 2.5 dBi

ECC of the Antenna

ECC is short for Envelope Correlation Coefficient. It is the cross-correlation value of

the complex patterns of the master and diversity antenna. It indicates how similar the

magnitude and the phase patterns of the two antennas are. If two antennas have no

similarity, the ECC should be zero. Actually, the less ECC, the better diversity

performance.

The following ECC is recommended for ME909s LGA module.

 ECC ≤ 0.5 (working frequency below 0.96 GHz)

 ECC ≤ 0.3 (working frequency above 1.4 GHz)

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 The antenna consists of the antenna body and the relevant RF transmission line. Take the

RF transmission line into account when measuring any of the preceding antenna indicators.

 Huawei cooperates with various famous antenna suppliers who are able to make

suggestions on antenna design, for example, Amphenol, Skycross, etc.

4.5.2 Interference

Besides the antenna performance, the interference on the user board also affects the

radio performance (especially the TIS) of the module. To guarantee high performance

of the module, the interference sources on the user board must be properly controlled.

On the user board, there are various interference sources, such as the LCD, CPU,

audio circuits, and power supply. All the interference sources emit interference signals

that affect the normal operation of the module. For example, the module sensitivity

can be decreased due to interference signals. Therefore, during the design, you need

to consider how to reduce the effects of interference sources on the module. You can

take the following measures: Use an LCD with optimized performance; shield the LCD

interference signals; shield the signal line of the board; or design filter circuits.

Huawei is able to make technical suggestions on radio performance improvement of

the module.

4.5.3 Antenna Requirements

The antenna for ME909s LGA module must fulfill the following requirements:

Table 4-7 ME909s LGA module antenna requirements

Antenna Requirements

Frequency range

Depending on frequency band(s) provided by the network

operator, the customer must use the most suitable

antenna for that/those band(s)

Bandwidth of primary

antenna

ME909s-821

250 MHz in UMTS Band 1; LTE Band 1

170 MHz in GSM 1800; LTE Band 3

70 MHz in UMTS Band 5;

80 MHz in GSM 900; UMTS Band 8; LTE Band 8

130 MHz in UMTS Band 9

50 MHz in LTE Band 38

40 MHz in LTE Band 39

100 MHz in LTE Band 40

194 MHz in LTE Band 41

15 MHz in TD-SCDMA Band 34

40 MHz in TD-SCDMA Band 39

ME909s-120

250 MHz in UMTS Band 1; LTE Band 1

140 MHz in GSM 1900; UMTS Band 2; LTE Band 2

170 MHz in GSM 1800; LTE Band 3

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Antenna Requirements

445 MHz in LTE Band 4

70 MHz in GSM 850; UMTS Band 5; LTE Band 5

190MHz in LTE Band 7

80 MHz in GSM 900; UMTS Band 8; LTE Band 8

71 MHz in LTE Band 20

Bandwidth of

secondary antenna

ME909s-821

60 MHz in UMTS Band 1; LTE Band 1

75 MHz in LTE Band 3

25 MHz in UMTS Band 5

35 MHz in UMTS Band 8; LTE Band 8

30 MHz in UMTS Band 9

50 MHz in LTE Band 38

40 MHz in LTE Band 39

100 MHz in LTE Band 40

194 MHz in LTE Band 41

ME909s-120

60 MHz in UMTS Band 1; LTE Band 1

60 MHz in UMTS Band 2; LTE Band 2

75 MHz in LTE Band 3

45 MHz in LTE Band 4

25 MHz in UMTS Band 5; LTE Band 5

70 MHz in LTE Band 7

35 MHz in UMTS Band 8; LTE Band 8

30 MHz in LTE Band 20

Gain

≤ 2.5 dBi

Impedance

50 Ω

VSWR absolute max

≤ 3:1

VSWR recommended

≤ 2:1

4.6 Suggestions about LTE and 2.4 GHz Wi-Fi Co-existence

4.6.1 Theory Analysis

The band gap between LTE Band 38/40/41 and Wi-Fi (2.4 G) is very narrow just as

shown as below.

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B40 TX/RX WIFI TX/RX B38 TX/RX

B41 TX/RX

2300MHz 2400MHz

2401MHz 2495MHz 2570MHz 2620MHz

2500MHz

2496MHz 2690MHz

B7 uplink B7 downlink

The two systems interfere with each other because of nonlinear characteristic of LTE

Band 38/40/41 and Wi-Fi transmitter. The main impacts are as follows:

1. LTE Band transmitter spurious in Wi-Fi Band impacts on the sensitivity of Wi-Fi

receiver.

2. LTE Band output power can block Wi-Fi receiver.

3. Wi-Fi transmitter spurious in LTE Band impacts on the sensitivity of LTE Bands.

4. Wi-Fi output power can block LTE Band receiver.

According to the theoretical analysis, in order to achieve the co-existence between

Wi-Fi and LTE, the rejection between Wi-Fi and LTE Band 41 or Band 40 needs to be

over 60 dB. (The analysis is based on the Wi-Fi chip Broadcom BCM432XX, the

co-existence design depends on the customer’s Wi-Fi chipset specification.)

In fact, the current devices cannot meet this requirement, so we need to increase the isolation

between antennas and disable some channels.

4.6.2 Suggestions about the Interference

These risks have been taken into consideration in the design of the ME909s LGA

module. The system design also should be paid attention:

1. It is recommended that the system should be added Wi-Fi SAW filter to

guarantee good attenuation in the LTE transmit Band (including Band 38, Band

40, Band 41), otherwise, LTE Band output power will block Wi-Fi receiver.

2. The good isolation between LTE antenna and Wi-Fi antenna is more than 25 dB.

3. Two ways above can help to make the isolation to be 60 dB. If they are still not

enough, some channels may need to be disabled.

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5 Electrical and Reliability Features

5.1 About This Chapter

This chapter describes the electrical and reliability features in the ME909s LGA

module, including:

 Absolute Ratings

 Operating and Storage Temperatures

 Power Supply Features

 Reliability Features

 EMC and ESD Features

5.2 Absolute Ratings

Table 5-1 lists the absolute ratings for the ME909s LGA module. Using the ME909s

LGA module beyond these conditions may result in permanent damage to the module.

Table 5-1 Absolute ratings

Symbol

Specification

Min.

Max.

Unit

VBAT

External power voltage

–0.3

4.5

V

VI

Digital input voltage

–0.3

2.3

V

5.3 Operating and Storage Temperatures

Table 5-2 lists the operating and storage temperatures for the ME909s LGA module.

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Table 5-2 Operating and storage temperatures

Specification

Min.

Max.

Unit

Normal working temperatures

–30

+75

°C

Extended temperatures[1]

–40

+85

°C

Ambient temperature for storage

–40

+85

°C

[1]: When the ME909s LGA module works in the range from –40°C to –30°C or +75°C to +85°C ,

NOT all their RF performances comply with 3GPP specifications.

5.4 Power Supply Features

5.4.1 Input Power Supply

Table 5-3 lists the requirements for input power of the ME909s LGA module.

Table 5-3 Requirements for input power

Parameter

Min.

Typ.

Max.

Ripple

Unit

VBAT

3.2

3.8

4.2

0.05

V

Figure 5-1 Power Supply During Burst Emission

The VBAT minimum value must be guaranteed during the burst (with 2.75 A Peak in GPRS or

GSM mode).

Table 5-4 Requirements for input current

Power

Peak (GSM 1 slot)

Normal (WCDMA)

Normal (LTE 23 dbm)

VBAT

2750 mA

1100 mA

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5.4.2 Power Consumption

The power consumptions of ME909s LGA module in different scenarios are

respectively listed in Table 5-5 to Table 5-11 .

The power consumption listed in this section is tested when the power supply of

ME909s LGA module is 3.8 V, and all of test values are measured at room

temperature.

Table 5-5 Averaged power off DC power consumption

Description

Test Value (Unit: µA )

Notes/Configuration

Typical

Power off

65

Normal voltage (3.8 V) is ON while

power on event is not triggered.

Table 5-6 Averaged standby DC power consumption of ME909s-821 LGA module

Description

Bands

Test Value (Unit: mA)

Notes/Configuration

Typical

Sleep

LTE

LTE bands

1.9

Module is powered up.

Paging cycle=256 (2.56s)

Module is registered on the

network.

USB is in suspend

TD-SCDMA

bands

2.5

Module is powered up.

DRX cycle=8 (2.56s)

Module is registered on the

network.

USB is in suspend

HSPA+/WCDMA

UMTS bands

1.7

Module is powered up

DRX cycle=8 (1.28s)

Module is registered on the

network.

USB is in suspend

GPRS/EDGE

GSM bands

2.1

Module is powered up

MFRMS=5 (1.175s)

Module is registered on the

network.

USB is in suspend.

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Description

Bands

Test Value (Unit: mA)

Notes/Configuration

Typical

Idle

LTE

LTE bands

48

Module is powered up.

Paging cycle=256 (2.56s)

Module is registered on the

network, no data is

transmitted.

USB is in active.

TD-SCDMA

bands

50

Module is powered up.

DRX cycle=8 (2.56s)

Module is registered on the

network.

USB is in active

HSPA+/WCDMA

UMTS bands

55

Module is powered up

DRX cycle=8 (1.28s)

Module is registered on the

network, no data is

transmitted

USB is in active.

GPRS/EDGE

GSM bands

55

Module is powered up

MFRMS=5 (1.175s)

Module is registered on the

network, no data is

transmitted

USB is in active.

Table 5-7 Averaged standby DC power consumption of ME909s-120 LGA module

Description

Bands

Test Value (Unit: mA)

Notes/Configuration

Typical

Sleep

LTE

LTE bands

1.85

Module is powered up.

Paging cycle=256 (2.56s)

Module is registered on the

network.

USB is in suspend.

HSPA/WCDMA

UMTS bands

1.5

Module is powered up

DRX cycle=8 (1.28s)

Module is registered on the

network.

USB is in suspend.

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Description

Bands

Test Value (Unit: mA)

Notes/Configuration

Typical

GPRS/EDGE

GSM bands

1.87

Module is powered up

MFRMS=5 (1.175s)

Module is registered on the

network.

USB is in suspend.

Idle

LTE

LTE bands

48

Module is powered up.

Paging cycle=256 (2.56s)

Module is registered on the

network, no data is

transmitted.

USB is in active.

HSPA/WCDMA

UMTS bands

47

Module is powered up

DRX cycle=8 (1.28s)

Module is registered on the

network, no data is

transmitted

USB is in active.

GPRS/EDGE

GSM bands

48

Module is powered up

MFRMS=5 (1.175s)

Module is registered on the

network.

no data is transmitted

USB is in active.

Table 5-8 Averaged Data Transmission DC power consumption of ME909s-821 LGA

module (LTE/HSPA/WCDMA/TD-SCDMA)

Description

Band

Test Value (Unit: mA)

Notes/Configuration

Typical

WCDMA

Band 1

(IMT 2100)

188

0 dBm Tx Power

216

10 dBm Tx Power

603

23.5 dBm Tx Power

Band 5

(850MHz)

181

0 dBm Tx Power

199

10 dBm Tx Power

501

23.5 dBm Tx Power

Band 8

188

0 dBm Tx Power

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Description

Band

Test Value (Unit: mA)

Notes/Configuration

Typical

(900 MHz)

207

10 dBm Tx Power

504

23.5 dBm Tx Power

Band 9

(J1700)

212

0 dBm Tx Power

289

10 dBm Tx Power

719

23.5 dBm Tx Power

HSPA

Band 1

(IMT 2100)

179

0 dBm Tx Power

213

10 dBm Tx Power

578

23.5 dBm Tx Power

Band 5

(850MHz)

172

0 dBm Tx Power

189

10 dBm Tx Power

439

23.5 dBm Tx Power

Band 8

(900 MHz)

177

0 dBm Tx Power

201

10 dBm Tx Power

489

23.5 dBm Tx Power

Band 9

(J1700)

221

0 dBm Tx Power

300

10 dBm Tx Power

743

23.5 dBm Tx Power

TDD LTE

Band 38

195

0 dBm Tx Power

242

10 dBm Tx Power

400

23 dBm Tx Power

Band 39

182

0 dBm Tx Power

213

10 dBm Tx Power

273

23 dBm Tx Power

Band 40

195

0 dBm Tx Power

242

10 dBm Tx Power

438

23 dBm Tx Power

Band 41

195

0 dBm Tx Power

246

10 dBm Tx Power

405

23 dBm Tx Power

FDD LTE

Band 1

263

0 dBm Tx Power

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Description

Band

Test Value (Unit: mA)

Notes/Configuration

Typical

315

10 dBm Tx Power

623

23 dBm Tx Power

Band 3

268

0 dBm Tx Power

338

10 dBm Tx Power

807

23 dBm Tx Power

Band 8

264

0 dBm Tx Power

298

10 dBm Tx Power

520

23 dBm Tx Power

TD-SCDMA

Band 34

84

0 dBm Tx Power

87

10 dBm Tx Power

132

23 dBm Tx Power

Band 39

95

0 dBm Tx Power

101

10 dBm Tx Power

133

23 dBm Tx Power

Table 5-9 Averaged Data Transmission DC power consumption of ME909s-120 LGA

module (WCDMA/HSDPA/LTE)

Description

Band

Test Value (Unit: mA)

Notes/Configuration

Typical

WCDMA

Band 1

(IMT 2100)

190

0 dBm Tx Power

225

10 dBm Tx Power

690

23.5 dBm Tx Power

Band 2

(PCS 1900)

187

0 dBm Tx Power

220

10 dBm Tx Power

670

23.5 dBm Tx Power

Band 5

(850 MHz)

180

0 dBm Tx Power

215

10 dBm Tx Power

555

23.5 dBm Tx Power

Band 8

185

0 dBm Tx Power

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Description

Band

Test Value (Unit: mA)

Notes/Configuration

Typical

(900 MHz)

220

10 dBm Tx Power

635

23.5 dBm Tx Power

HSDPA

Band 1

(IMT2100)

205

0 dBm Tx Power

243

10 dBm Tx Power

631

23.5 dBm Tx Power

Band 2

(PCS 1900)

202

0 dBm Tx Power

238

10 dBm Tx Power

580

23.5 dBm Tx Power

Band 5

(850 MHz)

200

0 dBm Tx Power

235

10 dBm Tx Power

535

23.5 dBm Tx Power

Band 8

(900 MHz)

205

0 dBm Tx Power

247

10 dBm Tx Power

575

23.5 dBm Tx Power

LTE

Band 1

270

0 dBm Tx Power

330

10 dBm Tx Power

725

23 dBm Tx Power

Band 2

275

0 dBm Tx Power

330

10 dBm Tx Power

715

23 dBm Tx Power

Band 3

273

0 dBm Tx Power

340

10 dBm Tx Power

735

23 dBm Tx Power

Band 4

276

0 dBm Tx Power

340

10 dBm Tx Power

705

23 dBm Tx Power

Band 5

280

0 dBm Tx Power

642

10 dBm Tx Power

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Description

Band

Test Value (Unit: mA)

Notes/Configuration

Typical

725

23 dBm Tx Power

Band 7

280

0 dBm Tx Power

340

10 dBm Tx Power

725

23 dBm Tx Power

Band 8

278

0 dBm Tx Power

330

10 dBm Tx Power

645

23 dBm Tx Power

Band 20

280

0 dBm Tx Power

330

10 dBm Tx Power

665

23 dBm Tx Power

Table 5-10 Averaged DC power consumption of ME909s-821 LGA module

(GPRS/EDGE)

Description

Test Value

Units

PCL

Configuration

GPRS 900

314

mA

5

1 Up/1 Down

468

2 Up/1 Down

627

4 Up/1 Down

169

mA

10

1 Up/1 Down

257

2 Up/1 Down

430

4 Up/1 Down

GPRS 1800

190

mA

0

1 Up/1 Down

275

2 Up/1 Down

363

4 Up/1 Down

107

mA

10

1 Up/1 Down

133

2 Up/1 Down

190

4 Up/1 Down

EDGE 900

213

mA

8

1 Up/1 Down

292

2 Up/1 Down

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Description

Test Value

Units

PCL

Configuration

390

4 Up/1 Down

121

mA

15

1 Up/1 Down

157

2 Up/1 Down

238

4 Up/1 Down

EDGE 1800

161

mA

2

1 Up/1 Down

225

2 Up/1 Down

295

4 Up/1 Down

108

mA

10

1 Up/1 Down

136

2 Up/1 Down

194

4 Up/1 Down

Table 5-11 Averaged DC power consumption of ME909s-120 LGA module

(GPRS/EDGE)

Description

Test Value

Units

PCL

Configuration

GPRS 850

307

mA

5

1 Up/1 Down

455

2 Up/1 Down

625

4 Up/1 Down

172

mA

10

1 Up/1 Down

258

2 Up/1 Down

435

4 Up/1 Down

GPRS 900

315

mA

5

1 Up/1 Down

445

2 Up/1 Down

615

4 Up/1 Down

175

mA

10

1 Up/1 Down

257

2 Up/1 Down

430

4 Up/1 Down

GPRS 1800

210

mA

0

1 Up/1 Down

285

2 Up/1 Down

380

4 Up/1 Down

112

mA

10

1 Up/1 Down

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Description

Test Value

Units

PCL

Configuration

145

2 Up/1 Down

195

4 Up/1 Down

GPRS 1900

230

mA

0

1 Up/1 Down

323

2 Up/1 Down

440

4 Up/1 Down

115

mA

10

1 Up/1 Down

145

2 Up/1 Down

205

4 Up/1 Down

EDGE 850

210

mA

8

1 Up/1 Down

295

2 Up/1 Down

387

4 Up/1 Down

125

mA

15

1 Up/1 Down

165

2 Up/1 Down

245

4 Up/1 Down

EDGE 900

205

mA

8

1 Up/1 Down

287

2 Up/1 Down

382

4 Up/1 Down

125

mA

15

1 Up/1 Down

165

2 Up/1 Down

245

4 Up/1 Down

EDGE 1800

170

mA

2

1 Up/1 Down

230

2 Up/1 Down

310

4 Up/1 Down

108

mA

10

1 Up/1 Down

135

2 Up/1 Down

195

4 Up/1 Down

EDGE 1900

187

mA

2

1 Up/1 Down

248

2 Up/1 Down

335

4 Up/1 Down

114

mA

10

1 Up/1 Down

145

2 Up/1 Down

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Description

Test Value

Units

PCL

Configuration

205

4 Up/1 Down

 All power consumption test configuration can be referenced by GSM Association Official

Document TS.09: Battery Life Measurement and Current Consumption Technique.

 LTE test condition: 10/20 MHz bandwidth, QPSK, 1 RB when testing max. Tx power and full

RB when testing 0 dBm or 10 dBm.

 Test condition: For Max. Tx. power, see 4.4.2 Conducted Transmit Power, which are listed in

Table 4-5 and Table 4-6 , for Max. data throughput, see 2.2 Function Overview, which are

listed in Table 2-1 .

5.5 Reliability Features

Table 5-12 lists the test conditions and results of the reliability of the ME909s LGA

module.

Table 5-12 Test conditions and results of the reliability of the ME909s LGA module

Item

Test Condition

Standard

Sample size

Results

Stress

Low-temperature

storage

 Temperature: –40ºC

 Operation mode: no

power, no package

 Test duration: 24 h

JESD22-A1

19-C

3 pcs/group

Visual inspection: OK

Function test: OK

RF specification: OK

High-temperature

storage

 Temperature: 85ºC

 Operation mode: no

power, no package

 Test duration: 24 h

JESD22-A1

03-C

3 pcs/group

Visual inspection: OK

Function test: OK

RF specification: OK

Low-temperature

operating

 Temperature: –40ºC

 Operation mode:

working with service

connected

 Test duration: 24 h

IEC60068-2

-1

3 pcs/group

Visual inspection: OK

Function test: OK

RF specification: OK

High-temperature

operating

 Temperature: 85ºC

 Operation mode:

working with service

connected

 Test duration: 24 h

JESD22-A1

08-C

3 pcs/group

Visual inspection: OK

Function test: OK

RF specification: OK

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Item

Test Condition

Standard

Sample size

Results

Temperature

cycle operating

 High temperature:

85ºC

 Low temperature:

–40ºC

 Operation mode:

working with service

connected

 Tes t duration: 30

cycles;1 h+1 h/cycle

JESD22-A1

05-B

3pcs/group

Visual inspection: OK

Function test: OK

RF specification: OK

Damp heat

cycling

 High temperature:

55ºC

 Low temperature:

25ºC

 Humidity: 95%±3%

 Operation mode:

working with service

connected

 Tes t duration: 6

cycles; 12 h+12

h/cycle

JESD22-A1

01-B

3 pcs/group

Visual inspection: OK

Function test: OK

RF specification: OK

Thermal shock

 Low temperature:

–40ºC

 High temperature:

85ºC

 Temperature

change interval: <

30s

 Operation mode: no

power

 Tes t duration: 100

cycles; 15 min+15

min/cycle

JESD22-A1

06-B

3 pcs/group

Visual inspection: OK

Function test: OK

RF specification: OK

Salty fog test

 Temperature: 35°C

 Density of the NaCl

solution: 5%±1%

 Operation mode: no

power, no package

 Test duration:

Spraying interval: 8

h

Exposing period

after removing the

salty fog

environment: 16 h

JESD22-A1

07-B

3 pcs/group

Visual inspection: OK

Function test: OK

RF specification: OK

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Item

Test Condition

Standard

Sample size

Results

Sine vibration

 Frequency range: 5

Hz to 200 Hz

 Acceleration: 1

Grms

 Frequency scan

rate: 0.5 oct/min

 Operation mode:

working with service

connected

 Tes t duration: 3

axial directions. 2 h

for each axial

direction.

JESD22-B1

03-B

3 pcs/group

Visual inspection: OK

Function test: OK

RF specification: OK

Shock test

 Half-sine wave

shock

 Peak acceleration:

30 Grms

 Shock duration: 11

ms

 Operation mode:

working with service

connected

 Tes t duration: 6

axial directions. 3

shocks for each

axial direction.

JESD-B104

-C

3 pcs/group

Visual inspection: OK

Function test: OK

RF specification: OK

Drop test

 0.8 m in height.

Drop the module on

the marble terrace

with one surface

facing downwards,

six surfaces should

be tested.

 Operation mode: no

power, no package

IEC60068-2

-32

3 pcs/group

Visual inspection: OK

Function test: OK

RF specification: OK

Life

High temperature

operating life

 Temperature: 85ºC

 Operation mode:

working with service

connected

 Tes t duration: 168 h,

336 h, 500 h, 1000 h

for inspection point

JESD22-A1

08-B

50 pcs/group

Visual inspection: OK

Function test: OK

RF specification: OK

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Item

Test Condition

Standard

Sample size

Results

High temperature

& high humidity

 High temperature:

85ºC

 Humidity: 85%

 Operation mode:

powered on and no

working

 Tes t duration: 168 h,

336 h, 500 h, 1000 h

for inspection point

JESD22-A1

10-B

50 pcs/group

Visual inspection: OK

Function test: OK

RF specification: OK

Temperature

cycle-Non

operating

 High temperature:

85ºC

 Low temperature:

–40ºC

 Temperature

change slope:

6ºC/min

 Operation mode: no

power

 Tes t duration: 168

cycle,

336 cycle, 500

cycle, 668cycle for

inspection point

JESD22-A1

04-C

50 pcs/group

Visual inspection: OK

Function test: OK

RF specification: OK

ESD

HBM (Human

Body Model)

 1 kV (Class 1 B)

 Operation mode: no

power

JESD22-A1

14-D

3 pcs/group

Visual inspection: OK

Function test: OK

RF specification: OK

ESD with DVK (or

embedded in the

host)

 Contact Voltage: ±2

kV, ±4 kV

 Air Voltage: ±2 kV,

±4 kV, ±8 kV

 Operation mode:

working with service

connected

IEC61000-4

-2

2 pcs

Visual inspection: OK

Function test: OK

RF specification: OK

Groups ≥ 2

5.6 EMC and ESD Features

The following are the EMC design comments:

 Attention should be paid to static control in the manufacture, assembly, packaging,

handling and storage process to reduce electrostatic damage to HUAWEI

module.

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 RSE (Radiated Spurious Emission) may exceed the limit defined by EN301489 if

the antenna port is protected by TVS (Transient Voltage Suppressor), which is

resolved by making some adjustment on RF match circuit.

 TVS should be added on the USB port for ESD protection, and the parasitic

capacitance of TVS on D+/D- signal should be less than 2 pF. Common-mode

inductor should be added in parallel on D+/D- signal.

 TVS should be added on the USIM interface for ESD protection. The parasitic

capacitance of TVS on USIM signal should be less than 10 pF;

 Resistors in parallel and a 10nF capacitance should be added on RESIN_N and

POWER_ON_OFF signal to avoid shaking, and the distance between the

capacitor and the related pins should be less than 100 mil.

 A TVS should be added to the module power supply. It is recommended that the

TVS's Clamping Voltage (VCL) be smaller than 12 V and Peak Pulse Power (PPP)

at least 100 W.

 PCB routing should be V-type rather than T-type for TVS (Transient Voltage

Suppressor).

 An integrated ground plane is necessary for EMC design.

The following are the requirements of ESD environment control:

 The electrostatic discharge protected area (EPA) must have an ESD floor whose

surface resistance and system resistance are greater than 1 x 104 Ω while less

than 1 x 109 Ω.

 The EPA must have a sound ground system without loose ground wires, and the

ground resistance must be less than 4 Ω.

 The workbench for handling ESD sensitive components must be equipped with

common ground points, the wrist strap jack, and ESD pad. The resistance

between the jack and common ground point must be less than 4 Ω. The surface

resistance and system resistance of the ESD pad must be less than 1 x 109 Ω.

 The EPA must use the ESD two-circuit wrist strap, and the wrist strap must be

connected to the dedicated jack. The crocodile clip must not be connected to the

ground.

 The ESD sensitive components, the processing equipment, test equipment, tools,

and devices must be connected to the ground properly. The indexes are as

follows:

− Hard ground resistance < 4 Ω

− 1 x 105 Ω ≤ Soft ground resistance < 1 x 109 Ω

− 1 x 105 Ω ≤ ICT fixture soft ground resistance < 1 x 1011 Ω

− The electronic screwdriver and electronic soldering iron can be easily oxidized.

Their ground resistance must be less than 20 Ω.

 The parts of the equipment, devices, and tools that touch the ESD sensitive

components and moving parts that are close to the ESD sensitive components

must be made of ESD materials and have sound ground connection. The parts

that are not made of ESD materials must be handled with ESD treatment, such

as painting the ESD coating or ionization treatment (check that the friction voltage

is less than 100 V).

 Key parts in the production equipment (parts that touch the ESD sensitive

components or parts that are within 30 cm away from the ESD sensitive

components), including the conveyor belt, conveyor chain, guide wheel, and SMT

nozzle, must all be made of ESD materials and be connected to the ground

properly (check that the friction voltage is less than 100 V).

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 Engineers that touch IC chips, boards, modules, and other ESD sensitive

components and assemblies must wear ESD wrist straps, ESD gloves, or ESD

finger cots properly. Engineers that sit when handling the components must all

wear ESD wrist straps.

 Noticeable ESD warning signs must be attached to the packages and placement

areas of ESD sensitive components and assemblies.

 Boards and IC chips must not be stacked randomly or be placed with other ESD

components.

 Effective shielding measures must be taken on the ESD sensitive materials that

are transported or stored outside the EPA.

HUAWEI ME909s LGA module does not include any protection against overvoltage.

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6 Mechanical Specifications

6.1 About This Chapter

This chapter describes the process design and mechanical specifications:

 Storage Requirement

 Moisture Sensitivity

 Dimensions

 Packaging

 Customer PCB Design

 Thermal Design Solution

 Assembly Processes

 Specification of Rework

6.2 Storage Requirement

The module must be stored and sealed properly in vacuum package under a

temperature below 40°C and the relative humidity less than 90% in order to ensure

the weldability within 12 months.

6.3 Moisture Sensitivity

 The moisture sensitivity is level 3.

 After unpacking, the module must be assembled within 168 hours under the

environmental conditions that the temperature is lower than 30°C and the relative

humidity is less than 60%. If the preceding conditions cannot be met, the module

needs to be baked according to the parameters specified in Table 6-1 .

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Table 6-1 Baking parameters

Baking Temperature

Baking Condition

Baking Duration

Remarks

125°C ±5°C

Relative humidity ≤ 60%

8 hours

-

Moving, storing, and processing the product must comply with IPC/JEDEC J-STD-033.

6.4 Dimensions

Figure 6-1 shows the dimensions in details.

Figure 6-1 Dimensions (Unit: mm)

6.5 Packaging

HUAWEI LGA module uses five layers ESD pallet, anti-vibration foam and vacuum

packing into cartons. The tray specification complies with Jedec_Tray_DGuide4-10D.

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Figure 6-2 ESD pallet (Unit: mm)

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Figure 6-3 The packaging

Module quantity per tray:

4 x 9 = 36 pcs/tray

Use vacuum packages;

five trays per carton;

module quantity per carton:

5 x 36 = 180 pcs/carton.

8 middle cartons per large carton;

Module quantity per large carton:

180 x 8 = 1440 pcs/carton.

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6.6 Customer PCB Design

6.6.1 PCB Surface Finish

The PCB surface finish recommended is Electroless Nickel, immersion Gold (ENIG).

Organic Solderability Preservative (OSP) may also be used, ENIG preferred.

6.6.2 PCB Pad Design

To achieve assembly yields and solder joints of high reliability, it is recommended that

the PCB pad size be designed as follows:

Figure 6-4 ME909s LGA module Footprint design (Unit: mm)

6.6.3 Solder Mask

NSMD is recommended. In addition, the solder mask of the NSMD (Non-solder Mask

Defined) pad design is larger than the pad so the reliability of the solder joint can be

improved.

The solder mask must be 100 µm–150 µm larger than the pad, that is, the single side

of the solder mask must be 50 µm–75 µm larger than the pad. The specific size

depends on the processing capability of the PCB manufacturer.

6.6.4 Requirements on PCB Layout

 To reduce deformation, a thickness of at least 1.0 mm is recommended.

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 Other devices must be located more than 3 mm (5 mm recommended) away from

the two parallel sides of the LGA module (rework requirement), and other sides

with 0.6 mm. The minimum distance between the LGA module and the PCB edge

is 0.3 mm.

 When the PCB layout is double sided, the module must be placed on the second

side for assembly; so as to avoid module dropped from PCB or component

(located in module) re-melding defects caused by uneven weight.

Figure 6-5 PCB Layout (Unit: mm)

6.7 Thermal Design Solution

When the module works in the maximum power condition, the module has high power

consumption (for details, see Power Consumption). To improve the module reliability

and stability, focus on the thermal design of the device to speed up heat dissipation.

For thermal characteristics of the ME909s LGA module, you can refer to Operating

and Storage Temperatures.

Take the following heat dissipation measures:

 The copper size on the PCB should be 70 mm x 70 mm or larger.

 All copper ground layers of the PCB must be connected to each other through

via-holes.

 Increase the quantity of the PCB ground planes.

 The ground planes should be as continuous as possible.

 If a fan is deployed, place the module at the cold air inlet.

 Use heat sink, thermal conductive material and product enclosure to enhance the

heat dissipation of the module.

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− Use anodized heat sink on the shielding case or the customer PCB on bottom

side for optimal heat dissipation. The recommended heat sink dimensions are

70 mm x 70 mm x1 mm or larger.

− The material of the heat sink should adopt the higher thermal conductivity

metallic materials, e.g. Al or Cu.

− The recommended thermal conductivity of the thermal conductive material is

1.0 W/m-k or higher (recommended manufacturers: Laird or Bergquist).

− Conductive material should obey the following rule: after the heat sink is

fastened to the shielding case, the compression amount of the thermal

conductive material accounts for 15% to 30% of the thermal conductive

material size.

− Conductive material should be as thin as possible.

− The recommended material of the enclosure is metallic materials, especially

you can add pin fin on the enclosure surface.

− If the heat sink is installed above the shielding case, you should attach the

thermal conductive material between the shielding case and the heat sink; if

the heat sink is installed below the bottom side of the customer PCB, you

should attach the thermal conductive material between the customer PCB and

the heat sink, as shown in Figure 6-6 and Figure 6-7 . Preferably, we

recommend the heat sink be installed below the bottom side of the customer

PCB.

− Use more pin fins to enlarge heat dissipation area.

Figure 6-6 Adding heat sink to the module for optimal heat dissipation

Module PCB Heat sink

Conductive material

Customer PCB

Module PCB

Heat sink

Conductive material

Customer PCB

Shielding case

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Figure 6-7 Adding enclosure to enhance the heat dissipation of the module

Module PCB

Heat sink

Conductive material

Customer PCB Enclosure

Shielding case

Heat sink

Conductive material

Customer PCB Enclosure

Module PCB

Shielding case

6.8 Assembly Processes

6.8.1 General Description of Assembly Processes

 Tray modules are required at SMT lines, because LGA modules are placed on

ESD pallets.

 Reflow ovens with at least seven temperature zones are recommended.

 Use reflow ovens or rework stations for soldering, because LGA modules have

large solder pads and cannot be soldered manually.

6.8.2 Stencil Design

It is recommended that the stencil for the LGA module be 0.15 mm in thickness. For

the stencil design, see the following figure:

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Figure 6-8 Recommended stencil design of LGA module (Unit: mm)

The stencil design has been qualified for HUAWEI motherboard assembly, customers can

adjust the parameters by their motherboard design and process situation to assure LGA

soldering quality and no defect.

6.8.3 Reflow Profile

The LGA module must be reflowed on the top side of the customer's development

board. For the soldering temperature of the LGA module, see the following figure.

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Figure 6-9 Reflow profile

240

300

180

217

165

120

60

0s

°C

60s~100s 45s~80s

235°C<Tmax<245°C

Table 6-2 Reflow parameters

Temperature Zone

Time

Key Parameter

Preheat zone

(40°C–165°C)

-

Heating rate: 0.5°C/s–2°C/s

Soak zone

(165°C –217°C)

(t1–t2): 60s–100s

-

Reflow zone (> 217°C)

(t3–t4): 45s–80s

Peak reflow temperature:

235°C –245°C

Cooling zone

Cooling rate: 2°C/s ≤ Slope ≤ 5°C/s

6.9 Specification of Rework

6.9.1 Process of Rework

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6.9.2 Preparations of Rework

 Remove barrier or devices that can’t stand high temperature before rework.

 If the device to be reworked is beyond the storage period, bake the device

according to Table 6-1 .

6.9.3 Removing of the Module

The solder is molten and reflowed through heating during the module removing

process. The heating rate must be quick but controllable in order to melt all the solder

joints simultaneously. Pay attention to protect the module, PCB, neighboring devices,

and their solder joints against heating or mechanical damages.

 The LGA module has many solder pads and the pads are large. Therefore, common

soldering irons and heat guns cannot be used in the rework. Rework must be done using

either infrared heating rework stations or hot air rework stations. Infrared heating rework

stations are preferred, because they can heat components without touching them. In

addition, infrared heating rework stations produce less solder debris and less impact on

modules, while hot air rework stations may cause shift of other components not to be

reworked.

 You must not reuse the module after disassembly from PCB during rework.

 It is proposed that a special clamp is used to remove the module.

Figure 6-10 Equipment used for rework

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6.9.4 Welding Area Treatment

Step 1 Remove the old solder by using a soldering iron and solder braid that can wet the

solder.

Step 2 Clean the pad and remove the flux residuals.

Step 3 Solder pre-filling: Before the module is installed on a board, apply some solder paste

to the pad of the module by using the rework fixture and stencil or apply some solder

paste to the pad on the PCB by using a rework stencil.

It is recommended that a fixture and a mini-stencil be made to apply the solder paste in the

rework.

6.9.5 Module Installation

Install the module precisely on the motherboard and ensure the right installation

direction of the module and the reliability of the electrical connection with the PCB. It is

recommended that the module be preheated in order to ensure that the temperature

of all parts to be soldered is uniform during the reflow process. The solder quickly

reflows upon heating so the parts are soldered reliably. The solder joints undergo

proper reflow duration at a preset temperature to form a favorable Inter-metallic

Compound (IMC).

 It is recommended that a special clamp be used to pick the module when the module is

installed on the pad after applied with some solder.

 A special rework device must be used for the rework.

6.9.6 Specifications of Rework

Temperature parameter of rework: for either the removing or welding of the module,

the heating rate during the rework must be equal to or smaller than 3°C/s, and the

peak temperature between 240°C–250°C. The following parameters are

recommended during the rework.

Figure 6-11 Temperature graph of rework

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Certifications

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7 Certifications

7.1 About This Chapter

This chapter gives a general description of certifications of the ME909s LGA module.

7.2 Certifications

Figure 7-1 shows certifications the ME909s LGA module have been implemented. For more

demands, please contact us for more details about this information.

Figure 7-1 Product Certifications of ME909s LGA module

Certification

Model name

ME909s -821

ME909s -120

CE

-

√

RoHS

√

CCC

√

-

GCF

-

√

WEEE

√

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Safety Information

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8 Safety Information

8.1 About This Chapter

Read the safety information carefully to ensure the correct and safe use of your

wireless device. Applicable safety information must be observed.

 Interference

 Medical Device

 Area with Inflammables and Explosives

 Traffic Security

 Airline Security

 Safety of Children

 Environment Protection

 WEEE Approval

 RoHS Approval

 Laws and Regulations Observance

 Care and Maintenance

 Emergency Call

 Regulatory Information

8.2 Interference

Power off your wireless device if using the device is prohibited. Do not use the

wireless device when it causes danger or interference with electric devices.

8.3 Medical Device

 Power off your wireless device and follow the rules and regulations set forth by

the hospitals and health care facilities.

 Some wireless devices may affect the performance of the hearing aids. For any

such problems, consult your service provider.

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 Pacemaker manufacturers recommend that a minimum distance of 15 cm be

maintained between the wireless device and a pacemaker to prevent potential

interference with the pacemaker. If you are using an electronic medical device,

consult the doctor or device manufacturer to confirm whether the radio wave

affects the operation of this device.

8.4 Area with Inflammables and Explosives

To prevent explosions and fires in areas that are stored with inflammable and

explosive devices, power off your wireless device and observe the rules. Areas stored

with inflammables and explosives include but are not limited to the following:

 Gas station

 Fuel depot (such as the bunk below the deck of a ship)

 Container/Vehicle for storing or transporting fuels or chemical products

 Area where the air contains chemical substances and particles (such as granule,

dust, or metal powder)

 Area indicated with the "Explosives" sign

 Area indicated with the "Power off bi-direction wireless equipment" sign

 Area where you are generally suggested to stop the engine of a vehicle

8.5 Traffic Security

 Observe local laws and regulations while using the wireless device. To prevent

accidents, do not use your wireless device while driving.

 RF signals may affect electronic systems of motor vehicles. For more information,

consult the vehicle manufacturer.

 In a motor vehicle, do not place the wireless device over the air bag or in the air

bag deployment area. Otherwise, the wireless device may hurt you owing to the

strong force when the air bag inflates.

8.6 Airline Security

Observe the rules and regulations of airline companies. When boarding or

approaching a plane, power off your wireless device. Otherwise, the radio signal of

the wireless device may interfere with the plane control signals.

8.7 Safety of Children

Do not allow children to use the wireless device without guidance. Small and sharp

components of the wireless device may cause danger to children or cause suffocation

if children swallow the components.

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8.8 Environment Protection

Observe the local regulations regarding the disposal of your packaging materials,

used wireless device and accessories, and promote their recycling.

8.9 WEEE Approval

The wireless device is in compliance with the essential requirements and other

relevant provisions of the Waste Electrical and Electronic Equipment Directive

2012/19/EU (WEEE Directive).

8.10 RoHS Approval

The wireless device is in compliance with the restriction of the use of certain

hazardous substances in electrical and electronic equipment Directive 2011/65/EU

(RoHS Directive).

8.11 Laws and Regulations Observance

Observe laws and regulations when using your wireless device. Respect the privacy

and legal rights of the others.

8.12 Care and Maintenance

It is normal that your wireless device gets hot when you use or charge it. Before you

clean or maintain the wireless device, stop all applications and power off the wireless

device.

 Use your wireless device and accessories with care and in clean environment.

Keep the wireless device from a fire or a lit cigarette.

 Protect your wireless device and accessories from water and vapour and keep

them dry.

 Do not drop, throw or bend your wireless device.

 Clean your wireless device with a piece of damp and soft antistatic cloth. Do not

use any chemical agents (such as alcohol and benzene), chemical detergent, or

powder to clean it.

 Do not leave your wireless device and accessories in a place with a considerably

low or high temperature.

 Use only accessories of the wireless device approved by the manufacture.

Contact the authorized service center for any abnormity of the wireless device or

accessories.

 Do not dismantle the wireless device or accessories. Otherwise, the wireless

device and accessories are not covered by the warranty.

 The device should be installed and operated with a minimum distance of 20 cm

between the radiator and your body.

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8.13 Emergency Call

This wireless device functions through receiving and transmitting radio signals.

Therefore, the connection cannot be guaranteed in all conditions. In an emergency,

you should not rely solely on the wireless device for essential communications.

8.14 Regulatory Information

The following approvals and notices apply in specific regions as noted.

8.14.1 CE Approval (European Union)

The wireless device is approved to be used in the member states of the EU. The

wireless device is in compliance with the essential requirements and other relevant

provisions of the Radio and Telecommunications Terminal Equipment Directive

1999/5/EC (R&TTE Directive).

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Appendix A Circuit of Typical Interface

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9 Appendix A Circuit of Typical Interface

HUAWEI MU709 Series HSPA+ LGA Module

Hardware Guide

Appendix A Circuit of Typical Interface

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R330

**10K

U304

0HPA00615DRVR

5

3

6

4 7

2

1

OUT

ILIM

EN

IN

FAULT GND1

R33130K

L303 2.2uF

2

1

R328 1MEG

C322

1uF

C321

100nF

C320

4.7uF

C308

100nF

C307

100nF

C306

22uF

C305

150uF 1

C318

22uF

C316

100nF

C304

150uF 1

C319

22uF

C317

1uF

R327180K

R32620K R325

75K

U301

0

RT8015AGQW

SHDN/RT

GND1

LX1

LX2

PGNDPVDD1

PVDD2

GND2

COMP

VDD

FB

C313220pF

C310

22pF

C303

150uF 1

C302

150uF 1

C301

150uF 1

R324

47K

U302

LGA120H-3030A

145

144

143

142

141

140

139

138

137

136

135

134

133

132

131

130

129

128

127

124

123

122

121

116

114

112

110

108

106

59

58

57

56

54

53

52

50

GND

48

NOT used

49

GND

NOT used

GND

NOT used

GND

GND 125

GND 126

GND

ME909s_MISC

5V-P-3

C358

USIM_CLK

USIM_DATA

USIM_RESET

USIM_DET

USIM_VCC

U302

LGA120H-3030A

71

11

35

33

92

31

32

13

12

84

86

85

1

4

2

3

76

78

74

77

79

73

75

80

98

99

65

64

63

62

34

88

70

89

90

66

10

9

68

69

67

5

7

6

8

120

119

118

117

83

82

38

39

40

41

91

101

22

21

20

19

18

27

26

25

24

23

36

30

72

87

42

93

61

60

94

95

113

109

105

55

51

46

45

44

43

29

28

15

14

16

17

97

96

104

102

100

37

47

103

81

111

115

107 MAIN_ANT

AUX_ANT

POWER_ON_OFF

RESIN_N

ADC_1

ADC_2

RESERVED

SLEEP_STATUS

GPIO1

UART2_RX

UART2_TX

RESERVED

GPIO2

GPIO3

GPIO4/USIM Switch

GPIO5

GPIO6

GPIO7/Jamming Detection

RESERVED

UART0_DSR

UART0_DTR

UART0_DCD

RESERVED

JTAG_RTCK

JTAG_TCK

JTAG_TDI

JTAG_TDO

JTAG_TMS

JTAG_TRST_N

NC

RESERVED

NC

PCM_CLK

PCM_DIN

PCM_DOUT

PCM_SYNC

SD_CLK

SD_CMD

SD_DATA0

SD_DATA1

SD_DATA2

SD_DATA3

USIM_CLK

USIM_DATA

USIM_RESET

USIM_VCC

RESERVED

UART0_RING

UART0_CTS

UART0_RTS

UART0_RX

UART0_TX

RESERVED

USB_DM

USB_DP

NC

VBAT

RESERVED

WAKEUP_IN

WAKEUP_OUT

ME909s_MISC

C370

1uF

C360

33pF

C361

33pF 33pF

D310

SMF05CTC

61

3 4

2 5

C363

33pF

J301

WL629D3_T01_TR_A

1

2

3

4

5

6

P6

P5

P4

P3

P2

P1

C362

100nF

C379

Note:"**" means that this component is not welded, but need to reserve component solder pad.

RESERVED

LED_MODE

These are impedance matching

circuit, the specific capacitance

and inductance value needs to

be adjusted, based on the

characteristic impedance of

the practical PCB.

RV301

RV302

R301 0

R302 0

C353

**6.8pF

**6.8pF C354

C357 **2.2pF

C353 and C354 are ready for dealing with filter differentia

l mode interference and C357 is ready for dealing with

filter common mode interference.You can choose

the value of the C353, C354 and C357 according to the actual

PCB which is integrated 30mm×30mm LGA Module.

L320

C350

220uF

1

C351

220uF

1

C352**220uF

1

C355220uF

1

C354220uF

1

C356

C357

C358

33pF

10uF

100nF

R117

**2.2K Q109

BC847ALT1

**NPN-BEC

E2 3

B1

C

**10KR138

VCC_EXT1 WAKEUP_IN_TO_MODULE

WAKEUP_IN_TO_MODULE WAKEUP_IN_FROM_HOST

Note: Pin 49, pin 53 and pin 57 do not

have pad in ME909s module.

0 Ω

b

c

e

R341

R342

R343 R344

R345 1K

0.47K

R340

VBAT

D311

NC

RV303

C372

C366

L310

L313

L314

L311

SMA6251A1_060_20GHT50GH_50

1

52 3 4

**33n

**33n **33n

2 5

J302

C371

SMA6251A1_060_20GHT50GH_50

1C365

J303

22pF

22pF 22pF

USIM_DET

3 4

2

RESERVED

NC

RESERVED

Test point1

Test point2

RESERVED

VCC_EXT1

RESERVED

SD_VCC

2

33pF

C123

VCC_EXT1

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Appendix B Acronyms and

Abbreviations

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10 Appendix B Acronyms and

Abbreviations

Acronym or Abbreviation

Expansion

3GPP

Third Generation Partnership Project

8PSK

8 Phase Shift Keying

AP

Access Point

AUX

Auxiliary

BER

Bit Error Rate

BIOS

Basic Input Output System

CCC

China Compulsory Certification

CE

European Conformity

CMOS

Complementary Metal Oxide Semiconductor

CSD

Circuit Switched Data

DC

Direct Current

DCE

Data Communication Equipment

DL

Down Link

DMA

Direct Memory Access

DTE

Data Terminal Equipment

EDGE

Enhanced Data Rate for GSM Evolution

EIA

Electronic Industries Association

EMC

Electromagnetic Compatibility

ESD

Electrostatic Discharge

EU

European Union

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Appendix B Acronyms and

Abbreviations

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Acronym or Abbreviation

Expansion

FCC

Federal Communications Commission

GMSK

Gaussian Minimum Shift Keying

GPIO

General-purpose I/O

GPRS

General Packet Radio Service

GSM

Global System for Mobile Communication

HBM

Human Body Model

HSDPA

High-Speed Downlink Packet Access

HSPA

Enhanced High Speed Packet Access

HSUPA

High Speed Up-link Packet Access

IMC

Inter-metallic Compound

ISO

International Standards Organization

JTAG

Joint Test Action Group

LED

Light-Emitting Diode

LGA

Land Grid Array

MO

Mobile Originated

MT

Mobile Terminated

NC

Not Connected

NSMD

Non-solder Mask Defined

PCB

Printed Circuit Board

PCM

Pulse Code Modulation

PDU

Protocol Data Unit

PMU

Power Management Unit

PID

Product Identity

RF

Radio Frequency

RoHS

Restriction of the Use of Certain Hazardous

Substances

SMS

Short Message Service

TIS

Total Isotropic Sensitivity

TVS

Transient Voltage Suppressor

UART

Universal Asynchronous Receiver-Transmitter

UL

Up Link

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Appendix B Acronyms and

Abbreviations

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101

Acronym or Abbreviation

Expansion

UMTS

Universal Mobile Telecommunications System

USB

Universal Serial Bus

USIM

Universal Subscriber Identity Module

VIP

Vendor Identity

VSWR

Voltage Standing Wave Ratio

WEEE

Waste Electrical and Electronic Equipment

WCDMA

Wideband Code Division Multiple Access

WWAN

Wireless Wide Area Network

LTE

Long Term Evolution

Table of Contents

Huawei ME909S-120 User Manual

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