1 Introduction
2 Precautions
3 MS2131 Overall Description
4 MS2131 Interface Features and Design Requirements
5 MS2131 RF Features and Design Requirements
6 MS2131 Structure Features and Design Requirements
7 MS2131 Power Design Guide
8 MS2131 PCB Design Guide
9 MS2131 ESD Design Guide
- 9.1 PCB Design Recommendations for the Host
- 9.2 Shell Design Recommendations for the Host
10 MS2131 Electrical and Reliability Features
11 Appendix

Huawei MS2131I-8 User Manual

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MS2131

Hardware Design Guide

Issue 02

Date 2017-1-13

Huawei Technologies Co., Ltd. provides customers with comprehensive technical support and service. For any

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Address: Huawei Industrial Base

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Email: mobile@huawei.com

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MS2131

Hardware Design Guide

About This Document

Issue 02 (2017-1-13) Huawei Proprietary and Confidential

About This Document

Change History

Issue Date Chapter Note

V1.0 2014-9-20 All Initial Release

V1.1 2017-1-13 6.3.2 Modify Peripheral

Staking Requirements

MS2131

Hardware Design Guide

Contents

Issue 02 (2017-1-13) Huawei Proprietary and Confidential

Contents

1 Introduction ........................................................................................................................... 6

2 Precautions ............................................................................................................................. 7

3 MS2131 Overall Description ................................................................................................ 8

3.1 About This Chapter ............................................................................................................................................................... 8

3.2 Product Information .............................................................................................................................................................. 8

3.3 Function Overview ............................................................................................................................................................... 9

3.4 Circuit Diagram .................................................................................................................................................................. 10

3.5 Port Application Diagram................................................................................................................................................... 11

4 MS2131 Interface Features and Design Requirements .................................................... 12

4.1 About This Chapter ............................................................................................................................................................. 12

4.2 MS2131 Interface Introduction .......................................................................................................................................... 12

4.2.1 USB Port and Reference Circuits ................................................................................................................................... 12

4.2.2 Power Port Introduction .................................................................................................................................................. 13

4.3 SIM Card Port Introduction ............................................................................................................................................... 14

5 MS2131 RF Features and Design Requirements ............................................................... 15

5.1 About This Chapter ............................................................................................................................................................. 15

5.2 Working Bands .................................................................................................................................................................... 15

5.3 Wireless Performance Specifications ................................................................................................................................ 16

5.3.1 TIS .................................................................................................................................................................................... 16

5.3.2 TRP ................................................................................................................................................................................... 16

5.4 Antenna Design Requirements ........................................................................................................................................... 16

5.5 Antenna Test Environment ................................................................................................................................................. 19

6 MS2131 Structure Features and Design Requirements .................................................... 21

6.1 About This Chapter ............................................................................................................................................................. 21

6.2 Dimensions and Weight ...................................................................................................................................................... 21

6.3 MS2131 Design Requirements Addressing the Host Structure ....................................................................................... 22

6.3.1 USB Connector Outline Dimensions.............................................................................................................................. 22

6.3.2 MS2131 Peripheral Staking Requirements .................................................................................................................... 24

7 MS2131 Power Design Guide ............................................................................................. 26

7.1 About This Chapter ............................................................................................................................................................. 26

MS2131

Hardware Design Guide

Contents

Issue 02 (2017-1-13) Huawei Proprietary and Confidential

7.2 MS2131 Power Supply ....................................................................................................................................................... 26

7.3 MS2131 Power Requirements in 2G Mode ...................................................................................................................... 26

7.4 MS2131 Power Requirements in 3G Mode ...................................................................................................................... 28

7.5 MS2131 Power Consumption Features ............................................................................................................................. 29

7.6 Peripheral Power Design Requirements ............................................................................................................................ 29

7.6.1 Recommended Power Supply Structure ......................................................................................................................... 29

7.6.2 Derating Requirements .................................................................................................................................................... 30

7.6.3 Peripheral Power Supply Design Rules.......................................................................................................................... 30

8 MS2131 PCB Design Guide ................................................................................................ 31

8.1 General PCB Design Rules ................................................................................................................................................ 31

8.2 Power Design ...................................................................................................................................................................... 31

8.3 Cable Routing Rules ........................................................................................................................................................... 32

8.3.1 Power Design ................................................................................................................................................................... 32

8.3.2 USB Signal Cable Routing Design ................................................................................................................................. 32

8.3.3 Grounding Measure ......................................................................................................................................................... 33

9 MS2131 ESD Design Guide ................................................................................................ 34

9.1 PCB Design Recommendations for the Host .................................................................................................................... 34

9.2 Shell Design Recommendations for the Host ................................................................................................................... 34

10 MS2131 Electrical and Reliability Features ..................................................................... 35

10.1 About This Chapter ........................................................................................................................................................... 35

10.2 Ultra Working Conditions ................................................................................................................................................ 35

10.3 Working and Storage Environment.................................................................................................................................. 36

10.4 Power Features .................................................................................................................................................................. 36

10.4.1 Input Power .................................................................................................................................................................... 36

10.4.2 Working Current ............................................................................................................................................................ 36

10.5 Reliability Features ........................................................................................................................................................... 36

11 Appendix ............................................................................................................................ 40

11.1 Appendix One MS2131 Power Consumption Data in Different Scenarios .................................................................. 40

11.2 Appendix Two MS2131 OTA Data .................................................................................................................................. 42

11.3 Appendix Three MS2131 Thermal Test........................................................................................................................... 44

MS2131

Hardware Design Guide

Introduction

Issue 02 (2017-1-13) Huawei Proprietary and Confidential

1 Introduction

This document describes the MS2131's hardware specifications, port design requirements,

design guide, and working principles. The next five chapters describe the MS2131's

specifications and design requirements of its host. Chapter 6 to Chapter 9 provide details of

the MS2131'S working principles and design guides. Chapter 10 introduces the MS2131's

electrical features and reliability.

Upon learning this document, you will understand the MS2131's port standards, electricity

supply characteristics, design requirements, and product information. The document provides

you reference for related design.

MS2131

Hardware Design Guide

Precautions

Issue 02 (2017-1-13) Huawei Proprietary and Confidential

2 Precautions

This chapter describes the precautions for using the MS2131, especially for the user device or

host design. If not properly used, the MS2131 may not function normally and require design

changes on the host.

1. The MS2131 has strict peripheral power supply requirement. Strictly follow the design

requirements in Chapter 7 when designing the power supply circuits. Otherwise, cases

may occur that the board restarts in 2G large power events.

2. The MS2131 has its antennas embedded. Strictly follow the stacking design

requirements in section 5.4 "Antenna Design Requirements" when designing a host.

Otherwise, the antennas may deteriorate. As a result, exceptions, such as network access

fa ilures and call failures, may occur and adversely affect user experience.

Pay attention to the preceding precautions, especially for designing the host.

MS2131

Hardware Design Guide

MS2131 Overall Description

Issue 02 (2017-1-13) Huawei Proprietary and Confidential

3 MS2131 Overall Description

3.1 About This Chapter

This chapter describes the MS2131's basic information, functions, circuit diagram, and

application ports to help you understand its application scenarios and feasible functions for

future usage and integration.

3.2 Product Information

HUAWEI MS2131 (MS2131 for short) is a wire less terminal de vice that implements

high-speed wireless network access and supports various network modes as follows:

 HSPA+ (High Speed Packet Access+)

 UMTS (Universal Mobile Telecommunications System)

 EDGE (Enhanced Data Rates for Global Evolution)

 GPRS (General Packet Radio Service)

 GSM (Global System for Mobile Communications)

The MS2131 supports the following services:

 HSUPA-based packet services

 HSPA+/UMT-based high-speed packet services

 EDGE/GPRS-based packet services

 WCDMA/GSM short message service (SMS)

The MS2131 can be connected to a host over a USB port to implement data card functions.

In the coverage area of the HSPA+/UMTS or EDGE/GPRS/GSM network, you can access

wireless networks, use SMS for communication, send and receive emails, and more.

An enhanced user experience is ensured by the MS2131 as it provides high-speed connectivity,

reliable performance, and convenient operations. With the Universal Plug and Play (UPnP)

service, the MS2131 can be connected to USB port–supported devices to implement the

2G/3G communication. The MS2131 authentication is independent from its peripherals, and

therefore, users do not need to authenticate the MS2131 by themselves.

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MS2131 Overall Description

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3.3 Function Overview

Table 3-1 Product features

Product Features Description

Working bands HSPA+/WCDMA 2100/1900/900/850 MHz

EDGE/GPRS/GSM 1800/1900/900/850 MHz

Chipset platform Hi6758

Working

temperature

–20°C to +55°C

Storage

temperature

–40°C to +70°C

Power vo lta ge 4.75 V to 5.25 V (5 V is recommended)

Protocol WCDMA/HSPA/HSPA+ (R7)

AT commands For details, see AT Command Interface Specification.

Application

interfaces

One standard SIM card slot (3 V or 1.8 V)

USB2.0 port

Antenna interface Embedded FPC support antenna

TS-5 external antenna port

SMS Text messages in TEXT mode

Data services WCDMA CS domain: UL 64 kbps/DL 64 kbps

WCDMA/HSPA+ PS domain: DL 21 Mbps(64QAM)/UL 5.76 Mbps

HSDPA Category 14

GSM CS domain: 9.6/14.4 kbps

GPRS: UL 85.6 kbps/DL 85.6 kbps

EDGE: only DL 236.8 kbps

Physical features Dimensions: 85 mm x 27 mm x 12.3 mm (33.5 in x 10.6 in x 4.8 in)

Weight: about 22 g

Certification CE, FCC, and GCF

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Hardware Design Guide

MS2131 Overall Description

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3.4 Circuit Diagram

The MS2131 contains the following functional modules, as shown in Figure 3-1.

 Baseband processor (BB) and RF processor (RTR)

 Nand flash

 19.2 MHz crystal resonator

 RF c ircuit

 Antenna

 USB2.0 port

Figure 3-1 MS2131function block diagram

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Hardware Design Guide

MS2131 Overall Description

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3.5 Port Application Diagram

The MS2131 contains the following ports, as shown in Figure 3-2.

 USB2.0 port

 SIM card slot (1.8 V or 3.0 V)

 TS-5 external antenna port

Figure 3-2 MS2131 application diagram

MS2131

Application interfaces

USB SIM TS-5

SIM

card

External

antenna

MS2131

Hardware Design Guide

MS2131 Interface Features and Design Requirements

Issue 02 (2017-1-13) Huawei Proprietary and Confidential

4 MS2131 Interface Features and Design

Requirements

4.1 About This Chapter

This chapter describes the port connector specifications and usage requirements of the

MS2131. Strictly follow the specified design requirements when designing the interface

circuits of a host.

4.2 MS2131 Interface Introduction

4.2.1 USB Port and Reference Circuits

The MS2131 communicates with the host over the USB port, which supports the USB2.0

protocol. The MS2131 has the USB signals adjusted and provides build-out circuits. The host

must be able to perform impedance matching and protection. Figure 4-1 shows the reference

circuits.

Table 4-1 Signals on the USB port

Pin No. Signal Name I/O Description

1 USB_D+ I/O USB differential data signal+

2 USB_D- I/O USB differential data signal-

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MS2131 Interface Features and Design Requirements

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Figure 4-1 USB port reference circuit diagram

 The serial impedance of the USB differential data cables depends on the actual situation. Th e USB

cable routing design must strictly follow the USB2.0 protocol requirements. Cable routing must be

differentiated mode. The control impedance must be 90 Ω.

 Electro-static discharge (ESD) components must be as close to the USB port as possible. It is

recommended that you use components with a rated reverse working voltage of 5 V and a junction

capacitance less than 10 pF.

4.2.2 Power Port Introduction

Table 4-2 Power pins

Signal

Name

I/O Description Direct Current Features (V)

Minimum

Value

Typical

Value

Maximum

Value

GND P Power ground

VBUS P USB power supply 4.75 5 5.25

The working power of the MS2131 is provided through the USB port with an input voltage

range from 4.75 V to 5.25 V (typical value: 5 V). Ensure that the power pins are properly

connected during the use of the MS2131 as to maintain its normal performance.

When the MS2131 is dedicated for different applications, attach importance to the power

supply design. In some network environments, when the MS2131works at its largest power

capacity (for example, when it works in GSM mode, a USB voltage dip may occur. Therefore,

make sure the power supply voltage for the host is 3.5 V at the minimum. Otherwise, the

MS2131 may restart.

External power supplies with the current output capacity larger than 2 A are recommended

and that a capacitor of larger than 300 μF and a decoupling capacitor of 0.1 μF must be

paralleled at the power port of the host. When the MS2131 works in GSM mode, its peak

current can reach 2 A. To prevent the MS2131's voltage from dropping to lower than 3.5 V

and help ensure the MS2131 function properly, place a large-capacity capacitor (at least 300

μF) near the USB port.

If the host is powered by batteries, configure a control switching diode or current limiting

chip between the battery power and the MS2131 power port. If a DC/DC converter or

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Hardware Design Guide

MS2131 Interface Features and Design Requirements

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low-dropout regulator (LDO) is used for the power supply, the transient current capacity must

be considered.

4.3 SIM Card Port Introduction

A standard SIM card port is embedded in the MS2131. The port supports the 3.0 V and 1.8 V

SIM cards. No external design is required.

MS2131

Hardware Design Guide

MS2131 RF Features and Design Requirements

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5 MS2131 RF Features and Design

Requirements

5.1 About This Chapter

This chapter describes the MS2131's RF parameters, such as its working bands and wire less

performance specifications, to help you understand the basic MS2131 RF features. As the

design of the host imposes a great impact on the MS2131's wireless performance, this chapter

provides detailed requirements for the host layout and stacking design. The antenna test

environment is also introduced to help you understand the wireless performance test methods

for the MS2131.

5.2 Working Bands

Table 5-1 describes the working bands that the MS2131 supports.

Table 5-1 MS2131 working bands

Working Band Tx Rx

UMTS Band I 1920–1980 MHz 2110–2170 MHz

UMTS Band II 1850–1910 MHz 1930–1990 MHz

UMTS Band V 824–849 MHz 869–894 MHz

UMTS Band VIII 880–915 MHz 925–960 MHz

GSM1900 1850–1910 MHz 1930–1990 MHz

GSM1800 1710–1785 MHz 1805–1880 MHz

GSM 900 880–915 MHz 925–960 MHz

GSM 850 824–849 MHz 869–894 MHz

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MS2131 RF Features and Design Requirements

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5.3 Wireless Performance Specifications

5.3.1 TIS

Total Isotropic Sensitivity (TIS) is an important specification that determines the MS2131's

receiving performance. Table 5-2 describes the TIS specifications of the MS2131.

Table 5-2 MS2131 TIS specifications

Frequency

Band W2100 W1900 W900 W850 G1900 G1800 G900 G850

TIS

specification

(dBm)

–103 –101.5 –100 –98.5 –98.5 –100 –100 –98.5

The preceding design specifications can be realized only when the MS2131 is in optimal layout with

comprehensive shielding measures. Strictly follow the antenna design and stacking requirements to help

realize the optimal MS2131 performance.

5.3.2 TRP

Total Radiated Power (TRP) is an important transmission performance specification of the

MS2131. Table 5-3 describes the optimal TRP specifications of the MS2131.

Table 5-3 MS2131 TRP specifications

Frequency

Band W2100 W1900 W900 W850 G1900 G1800 G900 G850

TRP

specification

(dBm)

18 16.5 18 16.5 22.5 24 27 25.5

The preceding TRP specifications can be realized only when the MS2131 is in optimal layout. Therefore,

strictly follow the antenna design and stacking requirements to help realize the optimal MS2131

performance.

5.4 Antenna Design Requirements

The MS2131 has its antennas embedded and therefore, you do not need to design the antenna.

To ensure the MS2131 antenna performance, the following layout requirements shall be met:

1. The USB dongle be connected to a PCB that has a dimension not less than 10 cm x 10

cm (L x W) (as ① in Figure 5-2). The larger the PCB, the better the antenna

performance can be.

2. If the PCB is approximately a square, the layout shown in Figure 5-2 (excluding the ②

part) be adopted. The USB dongle is placed in the upper or lower part of the PCB side

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MS2131 RF Features and Design Requirements

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(as ③ in Figure 5-2). It is not recommended that the USB dongle be placed in the middle

of the PCB (as ⑧ and ⑨ in Figure 5-4).

3. The USB socket must be properly grounded to the PCB to ensure the optimal antenna

performance. It is not recommended that the PCB extend to the side of the USB dongle.

If this is required (as ② in Figure 5-2), reserve a minimum distance of 5 mm between the

USB dongle and the PCB.

4. Ensure that the USB dongle is in an open area without any other metals shielding around

(such as an earpiece or loudspeaker), except for cases of recommended layouts. If metals

cannot be avoided, a distance larger than 2 cm is required between the USB dongle and

the metal.

5. If there are other antennas in auxiliary devices, the antennas must keep a distance from

the USB dongle to avoid coupling.

6. If the diversity antenna (as ④ in Figure 5-2) is in one side of the USB dongle, the

clearance opening should be faced outwards (as shown in Figure 5-2) to ensure the

optimal antenna performance.

7. In order to minimize devices' impact to the USB dongle, corollary equipment must be

filtered or shielded

8. Do not place any components that adversely affect the antenna performance on the top of

the USB dongle, especially of the main antenna (as ⑤ in Figure 5-2). The antenna

performance will decrease by at least 1.5 dB if any adverse effect occurs.

9. It do not place any metal components around the antenna. Reference Figure 5-3.

Follow the preceding requirements to ensure the optimal MS2131 performance. If any

discrepancy exists, the MS2131 may fail to connect to the network or provide data, voice, or

SMS services.

Figure 5-1 MS2131 antenna area

Main

antenna

Diversity antenna

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MS2131 RF Features and Design Requirements

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Figure 5-2 Recommended peripheral layout for the MS2131

Figure 5-3 Two common PCB layouts

Layout 1: The USB dongle is embedded in the longer edge of the PCB. Layout 2: The USB dongle is embedded in the shorter edge of the PCB.

If the terminal device is a rectangle (such as a POS device), the layouts shown in Figure 5-3

are recommended.

min

①

②

③

④

⑤

MS2131

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Figure 5-4 Two incorrect layouts

Layout 1: The USB dongle is embedded in the middle of the shorter edge.Layout 2: The USB dongle is embedded in the middle of the longer edge.

Figure 5-4 shows two incorrect layouts with the USB dongle embedded in the middle of the

PCB. The omni-directivity of the antenna deteriorates and the efficiency decreases due to the

closed space where the antennas are.

Strictly follow the antenna layout requirements and the stacking requirements specified in

section 6.3.2 "MS2131 Peripheral Staking Requirements" when designing the system. If you

fail to follow the requirements, the TRP and TIS specifications of the MS2131 will deteriorate,

and exceptions, such as network access failures and call failures, will occur.

5.5 Antenna Test Environment

The tests of antenna efficiency, gain, radiation pattern, and TRP and TIS specifications can be

performed in a microwave testing chamber. The following describes the test items in detail:

 Passive tests:

− Antenna efficiency

− Antenna gain

− Antenna radiation pattern

− Envelope correlation coeffic ient

 Active tests:

− TRP: GSM and WCDMATIS: GSM and WCDMA

CAUTION

MS2131

Hardware Design Guide

MS2131 RF Features and Design Requirements

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Figure 5-5 SATIMO microwave testing chamber system

− Auxiliary dedicated test platform:

Design the MS2131 dedicated test platform based on the stacking layout in Figure 5-2. Figure

5-6 shows the platform where a Thinkpad T61 is used. This dedicated platform simulates the

actual system layout to the maximum extent and all the tests and commissioning on the

MS2131 are performed in the platform.

Figure 5-6 Dedicated test platform

MS2131

Hardware Design Guide

MS2131 Structure Features and Design Requirements

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6 MS2131 Structure Features and Design

Requirements

6.1 About This Chapter

This chapter describes the MS2131 structure features, including the system dimensions and

design requirements addressing the host structure. This chapter also describes the USB

connector dimensions and its design requirements and guides addressing the host structure.

6.2 Dimensions and Weight

The MS2131 has dimensions of 84.9 mm x 27 mm x 12.3 mm (including the USB cap) and

weighs about 30.0 g.

Figure 6-1 shows the outline dimensions of the MS2131.

Figure 6-1 MS2131 dimensions

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MS2131 Structure Features and Design Requirements

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6.3 MS2131 Design Requirements Addressing the Host

Structure

6.3.1 USB Connector Outline Dimensions

A standard USB2.0 connector, shown in Figure 6-2, is used for the MS2131. The thickness of

the PCB where the connector is inserted must range from 0.6 mm to 1.0 mm. The

recommended thickness is 0.8 mm.

Figure 6-2 USB connector for the MS2131

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MS2131 Structure Features and Design Requirements

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Figure 6-3 Dimensions of the USB connector

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MS2131 Structure Features and Design Requirements

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Figure 6-4 Package of the MS2131 USB connector (unit: mm)

6.3.2 MS2131 Peripheral Staking Requirements

When the MS2131 is used in conjunction with the other device，the customer must complete

the design in accordance with the following rules，otherwise it will affect the wireless

performance of MS2131. Detailed rules as follows:

·The customer should be according to the requirements of antenna in section 5.4 to

complete the design firstly，when the MS2131 is used with other device.

·The USB interface between other device and the MS2131，the D+/D- digital line and

VBUS line must be routed at inner layer and packaged with the ground.

·It recommended that the LC parallel resonant network should be reserved at the D+/D-

digital line of the USB interface which is between other device and MS2131 to reduce the

influence of harmonics on low frequency.

·It recommended that the two sides of the component of the interface should leakage of

copper on the PCB surface.

·It recommended that the other high speed communication interfaces such as other USB

interface, SIDO, PCIE, MIPI and so on must be routed at inner layer and packaged with the

ground, and the component of the interface should be shielded，also we suggest the

component of the interface keep 10mm away from the side of the MS2131.

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·If there are some digital storage unit, such as SIM card, SD card, Flash and so on, these

components and the Peripheral device must be shielded，and keep 10mm away from the side

of the MS2131.

·If there are some Communication FPC boards，such as the LCD，the Touch，the MIC，

and the SPK+， the FPC board suggest doing EMI processing，and the FPC cables should not

be placed near the MS2131.

·If there are some fast switching circuit, such as DCDC circuit, PMU power management

circuit, and other circuit that can produce a large electric current ，they must be shielded， and

keep 10mm away from the side of the MS2131.

·If there are some clock circuit, such as the TCXO circuit，they must be shielded， and

keep 10mm away from the side of the MS2131.

·If there are other baseband signal processing circuit or control circuit, they must be

shielded，and keep 10mm away from the side of the MS2131.

·If there are other RF communication unit, such as WIFI,BT, GPS,NFC and so on, they

must be shielded， and keep 10mm away from the side of the MS2131.

·Some test points for high speed digital signal should be placed far away from the MS2131

about 5mm.

In addition, other components or circuit which can produce strong EMI should be shie lded

and placed far away from the MS2131.

We have given some design rules above for customers to solve the strong interference. If the customers

are unable to meet the design rules, it may decrease the MS2131 performance even the MS2131 cannot

work normally.

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MS2131 Power Design Guide

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7 MS2131 Power Design Guide

7.1 About This Chapter

This chapter describes the MS2131's power features and power supply requirements in

different scenarios and its power consumption data in sleep mode. For details about the power

supply circuit over which the host powers an embedded MS2131, see section 7.6 "Peripheral

Power Design Requirements."

7.2 MS2131 Power Supply

The working power of the MS2131 is provided through the USB port with an input voltage

ranging from 4.75 V to 5.25 V (typical value: 5 V).

7.3 MS2131 Power Requirements in 2G Mode

This section describes the MS2131 power features when in use in 2G mode. The power

consumption of the MS2131 increases with its transmit power. Transmit power, also called

uplink power, is the amount of power used during transmission from a wireless terminal to a

base station.

The Time Division Multiple Access (TDMA) uses GSM as the access method, and therefore,

the MS2131 transmits signals only in slots specified by the base station. Each GSM

transmission cycle has eight slots, 577 µs each. The MS2131 transmits power in one out of

the eight slots. As calculated, each GSM transmission cycle lasts 4.61 ms and the transmission

duration lasts 577 µs. This transmission mode is called "burst". The better signal reception

quality is, the less power consumption of the MS2131 will produce, and vice versa. The

maximum power consumption is 33 dBm (GSM900).

Figure 7-1 shows the GSM working principle.

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Figure 7-1 GSM working principle

For GPRS mode, the uplink transmission occurs in two or more than two continuous slots, as

shown in Figure 7-2.

Figure 7-2 GPRS working principle

In GSM mode, the MS2131 power transmission occurs in cycles and has transient changes

during each transmission, as shown in Figure 7-3.

577uS 577uS

577uS x 8 slot

4.61ms 4.61ms 4.61ms

Power

Max 33dBm

577uS

577uS x 8 slot

4.61ms 4.61ms 4.61ms

Power

1.15ms

Max 30dBm

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Figure 7-3 Transient power changes

Seen from Figure 7-3, the GMS power amplifier (PA) performs the transmission in the

transmission slots. In case of poor signal reception, the PA transmission power may reach 33

dBm. The transient MS2131 power supply current may reach 2 A and a voltage drop then

occurs.

The following are two reasons accounting for the MS2131 power supply voltage drop:

 The transient response function of the power supply cannot meet the requirement for the

2 A transient output within several microseconds.

 There is output impedance at the MS2131 power connector, and the currents are large.

When the transmission slot ends, the GSM PA shuts down, the power supply current then

drops, and the voltage resumes. After 4.651 ms, another transmission slot comes, causing a

voltage drop again.

Therefore, the MS2131 operating in 2G mode must have good transient response performance

and small internal resistance to prevent voltage drop. Considering the product cost and that

the MS2131 can operate within a certain range of voltages, the minimum voltage of the power

supply is 3.5 V.

7.4 MS2131 Power Requirements in 3G Mode

In a 3G network, no correlation exists between the transmission power and time.

Figure 7-4 shows the transmission power in a 3G network.

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Figure 7-4 3G network transmission

7.5 MS2131 Power Consumption Features

The maximum transmission power capacity for a wireless terminal in a 3G network is 24 dBm

while the maximum transient power supply current is about 2 A. Therefore, a minimum

current output capacity of 800 mA at average is required to satisfy the load requirements. The

following specifications are for reference only:

Power consumption in a 3G network with a 7.2 Mbps download speed and an RF power

capacity of 10 dB: 5 V and less than 250 mA

Power consumption in a 3G network with a 2 Mbps download speed and an RF power

capacity of 22 dB: 5 V and less than 500 mA

Power consumption in standby mode with a 3G network connected: 5 V and less than 100 mA

7.6 Peripheral Power Design Requirements

Power supplied to the MS2131 must have a minimum general current of 800 mA and a

minimum transient current of 2 A. The peripheral power design must be dedicated to these

requirements, to help the MS2131 bear the power supply voltage drop for transmission in

GSM mode.

To address the voltage drop, the following requirements must be met for peripheral power

design:

 Reducing the peripheral power impedance (including the power cable routing to the

MS2131)

 Adding energy storage capacitors

 Using the dynamic response function of power module chips

7.6.1 Recommended Power Supply Structure

A power structure of a DC-DC output, power supply over a switching diode, and a current

limiting circuit is recommended. The host can then be enabled to control the MS2131 power

time

Power

Max 24dBm

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switch and disconnect the power to the MS2131 when exceptions occur. The DC impedance

of the current limiting circuit or switching diode must be less than 50 mΩ. To avoid an

oversize impedance, reserve space for a 0 Ω resistor for compatible purpose.

Figure 7-5 Recommended power structure

Compatible with a 0 ohm resistor

Current limiting chip or

power control circuit

7.6.2 Derating Requirements

It is recommended that an 85% derating capacity be provided for the external power supply

voltage and current. If a DC/DC converter or LDO is used, ensure its derating capacity and

transient conductivity.

7.6.3 Peripheral Power Supply Design Rules

The peripheral power supply design rules for the MS2131 are described as follows:

1. The power cable routing path must be as wide as possible to bear currents larger than 2

A during transmission in GSM mode.

2. A large-capacity capacitor (at least 300 uF) must be placed near the USB port to prevent

its voltage from dropping lower than 3.5 V. Energy storage capacitors used for must be

placed near the MS2131 as much as possible to ensure optimal discharge performance of

the capacitors.

3. Overvoltage and anti-reversion diodes must be connected to external power supply

connectors to protect the power circuits when exceptions occur.

4. If the host supplies power to the MS2131 over a DC/DC converter, the converter must be

able to bear the 2 A transient current.

5. The USB power cable voltage fluctuates in GSM mode. Therefore, do not route sensitive

signal cables near the USB power cable.

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8 MS2131 PCB Design Guide

This chapter describes the PCB interconnection design requirements and precautions for the

host. Complying with these requirements and following these precautions help ensure the

performance of the MS2131 when interconnected with the host and reduce user costs.

8.1 General PCB Design Rules

 To ensure the signal integrity and conductivity between the MS2131 and its peripherals,

maximize the power cable routing width. Ensure a conductivity of 2 A.

 The two surfaces of USB differentiated signal must be surrounded by grounds and the

impedance must be controlled in a proper range. Do not interrupt the signal with strong

interference or sensitive signals.

8.2 Power Design

The power design is a key factor for the MS2131 performance, which has impacts on the

following specifications:

 EMC performance

 Radio modulation spectrum

 Phase and receiving sensitivity

The general power design rules are described as follows:

 Ensure a good power quality. Reduce the power ripple for a switched-mode power

supply and noise interference for a linear power supply.

 Place the filter capacitors for the power supply as close to the power pins for the USB

connector as possible. Place the capacitor with less capacitance closer to the power pins.

Use capacitors of 150 μF, 4.7 μF, 10 nF, 100 pF, and 33 pF.

Try to minimize the voltage drop caused by the power cable routing and ensure a conductivity

of 2 A.

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8.3 Cable Routing Rules

8.3.1 Power Design

The power consumption of the MS2131 varies by network standard. Working in GSM mode,

the MS2131 has a peak current of larger than 2 A. To ensure a sufficient power capacity and

minimize the voltage drop caused by cable routing, a 100-mil cable routing width is

recommended and the finish copper thickness is 1 OZ. If possible, maximize the power cable

routing width.

8.3.2 USB Signal Cable Routing Design

The impedance for the USB signal cable on the user PCB must be 90 Ω. The impedance is

dependent on the dielectric constant, cable width, and the distance from the ground. Figure

8-1 and Figure 8-2 show the structures and stacking designs of the 90 Ω impedance

microstrips and strip lines that can be adopted for the cabling impedance design.

Figure 8-1 Microstrip structure

Figure 8-2 Strip line structure

You can use either of the preceding ways to design the 90 Ω cabling impedance.

Note that the USB signal cabling impedance must be dedicatedly designed and the two sides

of the USB must be fully surrounded by grounds.

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8.3.3 Grounding Measure

 To protect the USB signals from interference and sensitive sources, surround the USB

surfaces by grounds.

 Ensure the continuity of reference grounds for all signal cables to avoid cross division.

Ensure a minimum loop path for each signal cable.

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9 MS2131 ESD Design Guide

9.1 PCB Design Recommendations for the Host

1. A four-layer or six-layer PCB is recommended. Two-layer PCBs are not recommended.

2. Use a large-capacity ceramic bypass capacitor and decoupling capacitor on the MS2131

power supply. Place the capacitors within 30 mils from the connector. The PCB cable

routing width must be at least 20 mils. Deploy dedicated power cable plane and ground

or tight power and ground grid. Use a transient voltage suppressor (TVS) for external

electrical overstress (EOS) protection. It is recommended that a component that has a

peak power larger than 100 W at 8/20 µs be used.

3. If the signal cable length is larger than 300 mm (12 inches), surround the sides of the

signal cables by grounds. Drill holes on the grounds to connect them to the main ground.

4. When connecting the host to the MS2131, ensure the grounding reliability.

5. Use TVSs at the joint between the MS2131 and the host. The TVS on the male connector

must have a parasitic capacitance less than 1 pF while the TVS on the power supply must

have a peak power larger than 100 W at 8/20 μs

9.2 Shell Design Recommendations for the Host

The MS2131 comes with ESD protection. The SIM card and connector have high

requirements for ESD protection.

To prevent users from directly touching the SIM card area, cover the area with a mechanical

part.

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MS2131 Electrical and Reliability Features

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10 MS2131 Electrical and Reliability

Features

10.1 About This Chapter

This chapter describes the electrical and reliability features of the MS2131 interfaces,

inc luding:

 Ultra working conditions

 Working and storage environment

 Power features

 Reliability features

 ESD features

10.2 Ultra Working Conditions

Table 10-1 lists the working condition limitation for the MS2131. Permanent damage may be

caused to the MS2131 if used beyond the conditions.

Table 10-1 Ultra working conditions of the MS2131

Symbol Parameter Minimum Value Maximum

Value

Unit

VBUS External power supply –0.3 5.25 V

WARNING

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10.3 Working and Storage Environment

Table 10-2 lists the working and storage environment for the MS2131.

Table 10-2 Working and storage environment for the MS2131

Parameter Minimum Value Maximum

Value

Unit

Normal working temperature –20 55 °C

Storage temperature –40 70 °C

Humidity range 5 95 %

10.4 Power Features

10.4.1 Input Power

Table 10-3 lists the specifications for the MS2131 input power.

Table 10-3 Specifications for the MS2131 input power

Parameter Minimum

Value

Typical

Value

Maximum

Value

Ripple Unit

VBUS 4.75 5 5.25 < 50 mVpp

(0 Hz to 2.5 GHz)

10.4.2 Working Current

The MS2131 working current is specified in section 11.1 "Appendix One MS2131 Power

Consumption Data in Different Scenarios", obtained from a test using direct current and

having a typical power supply of 5 V.

10.5 Reliability Features

Table 10-4 describes the MS2131 reliability test conditions and results.

Table 10-4 MS2131 reliability test conditions and results

Test Item Test

Result Test Parameter

1 Drop test in common

temperature PASS 0.8 m for six surfaces

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Test Item Test

Result Test Parameter

2 Weight bearing test PASS 70 kgf for 2s on the front and rear surfaces

3 Pressing test PASS 120 N for the surfaces

4 Bending test PASS 2 kgf for 1min

5 Twisting test PASS 0.5 Nm for 500 times

6 Swapping/disassembling

endurance test PASS Connecting to an antenna for 3000 times

7 Working vibration PASS

Sine wave vibration

1. Frequency range: 5 to 500 Hz

2. Acceleration: 2G

3. Sweep frequency: 0.5 oct/min

4. Test duration: three directions (X, Y, and Z),

2h for each direction

Random Vibration

1. Frequency range: 5 to 500 Hz

2. PSD: 0.04 g²/Hz

3. Test duration: three directions (X, Y, and Z),

1h for each direction

8 Working shock PASS

1. Half sine wave with an acceleration speed of

300 m/s²

2. Pulse duration: 11 ms

3. Shock times: Six directions, three times for

each direction, 18 times in total

9 Low-temperature

storage PASS

–40°C for 24 hours with all specifications,

functions, and mechanical performance

remaining normal

10 High-temperature

storage PASS

85°C for 24 hours with all specifications,

functions, and mechanical performance

remaining normal

11 Low-temperature

operation PASS

–20°C for 24 hours with all RF specifications

and electrical performance remaining normal

(during developing phase)

12 High-temperature

operation PASS

55°C for 24 hours with all RF specifications and

electrical performance remaining normal (during

developing phase)

13 Damp heat cycling PASS

Raise the humidity to 95% within 1h and keep

the test chamber temperature at 25°C. Raise the

temperature to 55°C within 3h and keep the

humidity at 95%. Keep the temperature at 55°C

and the humidity at 95% for 9h. Decrease the

temperature to 25°C within 3h and keep the

humidity at 95%. Keep the test chamber

temperature at 25°C and humidity at 95% for 9h.

The pr

eceding operations are one cycle. Perform

two cycles for the test.

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Test Item Test

Result Test Parameter

14 Temperature shock PASS

Use two chambers. Keep the temperature at

–40°C for one hour and then 70°C for another

hour at a maximum interval of 20 seconds.

Perform 24 cycles for this test.

15 Solar radiation PASS 1120 W/m² for 20h and dark for 4h. Perform

three cycles for the test.

Salt fog test PASS Keep the density at 5% for 8h for the entire

system.

17 High temperature and

high humidity PASS

1. Power on the sample. Ensure the sample

functions at a maximum transmit power.

2. Test temperature: 55±1°C

3. Test humidity: 95±2% RH

4. Test duration: 168h

5. Test time point: 48h, 96h, 144h, and 168h

6. Restoration temperature and duration: 25°C

for 2h

18 Temperature cycle test PASS

1. Power on the sample. Ensure the sample

functions at a maximum transmit power.

2. Temperature change ranges: –10±1°C to

+55±1°C

3. Temperature change rate: 10°C/min

4. Number of recycles: 120 cycles, one cycle

including 30min at low temperature and 30min

at high temperature

19 Radiated emission (RE) PASS Frequency range: 30 MHz–6 GHz

Criterion: CISP R22 Class B

20 Conducted emission

(CE) PASS Frequency range: 150 KHz–30 MHz

Criterion:

CISPR22 Class B

21 Radiated spurious

emission (RSE) PASS Frequency range: 30 MHz–12.75 GHz

22 ESD PASS

Interference voltage:

Air discharge: 10 kV; contact discharge 6 kV

Criterion: TT/TR

23 Radiated susceptibility

(RS) PASS

Frequency range: 80 MHz–2.7 GHz. No test is

required for the main working bands.

Interference field strength: 4 V/m (80% AM is

performed)

Criterion: CT/CR

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The MS2131 has dedicated ESD requirements. To ensure the proper connection between the

MS2131 and the user interface board reference ground, it is recommended that copper studs

or other low-impedance metal fasteners be used for the copper exposure (to connect to an

interface reference ground) of the positioning holes on the user interface board.

CAUTION

MS2131

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Appendix

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11 Appendix

11.1 Appendix One MS2131 Power Consumption Data in

Different Scenarios

Table 11-1 MS2131 working current (5 V) in common scenarios

Description Bands

Current

Units Notes/Configuration

HSDPA/WCDMA

UMTS

bands

Power up and idle (DRX cycle = 8

[2.56 sec])

230 mA

Phone call (TX power = 10 dBm)

230

DL Rate = 7.2 Mbps (TX power =

10 dBm)

GSM/GPRS/EDGE

GSM

bands 50

Power up and idle (MFRMS = 5

[1.175 sec])

140 mA

Phone call (TX power = 10 dBm)

Table 11-2 Peak working currents in GPRS mode

Bands Averaged

Current

Peak

Current

Units TX Power TX slot

GPRS 850

230

1640

PCL = 5

1 Up/1 Down

GPRS 900

240

1540

PCL = 5

1 Up/1 Down

GPRS 1800

180

1000

PCL = 2

1 Up/1 Down

GPRS 1900

160 1050 mA

PCL = 0

1 Up/1 Down

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Table 11-3 Working currents in all WCDMA service scenarios

Description

Bands Current Units TX power (dBm)

WCDMA

Band

I(W2100) 200

230

400

Band II

(W1900) 200 mA

230 10

300 22

Band

V(W850) 200 mA

240 10

350 22

Band

VIII(W900)

200

240

380

HSDPA

Band

I(W2100) 220

250

410

Band II

(W2100) 220 mA

250 10

330 22

Band

V(W850) 220 mA

250 10

380 22

Band

VIII(W900)

220

250

410

Values in Table 11-3 are average values obtained from a certain number of test samples.

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11.2 Appendix Two MS2131 OTA Data

Table 11-4 MS2131 TIS

Description

Bands Channel Test Value Units

WCDMA

Band I(W2100)

10562

-104

dBm

10700

10838

Band II

(W1900) 9662

-104

dBm

9800

9938

Band V(W850)

4357

-103

dBm

4408

4458

Band

VIII(W900) 2937

-102

dBm

3012

3088

GSM

GSM 850

128

-102

dBm

190

251

GSM 900

975

-102

dBm

124

GSM 1800

512

-103

dBm

698

885

GSM 1900

512

-103

dBm

661

810

Values in Table 11-4 are average values obtained from a certain number of test samples, which are tested

in the stacking conditions shown in Figure 5-2. The tests are implemented with a PC. If the stacking fails

to meet requirements made in section 5.4 "Antenna Design Requirements", the MS2131 performance

may worsen compared with data in Table 11-4.

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Table 11-5 MS2131 TRP

Description Bands Channel Test Value Units

WCDMA

Band I(W2100)

9612

dBm

9750

9888

Band II (W1900)

9662

dBm

9800

9938

Band V(W850)

4132

19.5

dBm

4183

4233

Band VIII(W900)

2712

19.5

dBm

2787

2863

GSM

GSM 850

128

27.5

dBm

190

251

GSM 900

975

dBm

124

GSM 1800

512

dBm

698

885

GSM 1900

512

23.5

dBm

661

810

The preceding values are average values obtained from a certain number of test samples. Figure 5-2

shows the MS2131 deployed in a PCB. Samples are tested deployed in the board. If the PCB is not

designed as required in section 5.4 "Antenna Design Requirements", the MS2131 performance may

worsen compared with data in Table 11-4.

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Hardware Design Guide

Appendix

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11.3 Appendix Three MS2131 Thermal Test

Thermal Test

Report of Huawei M

MS2131

Hardware Design Guide

Acronyms and Abbreviations

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A Acronyms and Abbreviations

Acronym or Abbreviation Expansion

CDMA Code Division Multiple Access

DL Down link

DTE Data Terminal Equipment

EDGE Enhanced Data Rate for GSM Evolution

EMI Electro Magnetic Interference

ESD Electro- Static discharge

GND Ground

GPIO General-purpose I/O

GPRS General Packet Radio Service

GPS Global Positioning System

GSM Global System of Mobile communication

HSDPA High Speed Downlink Packet Access

NC Not connected

PCM Pulse-code modulation

USB Universal Serial BUS

WCDMA Wideband CODE division multiple access

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