Huawei USG9520 AC User Manual

HUAWEI USG9500 Series

Terabit-level Next-Generation Firewall

Hardware Guide

Issue

01

Date

2017-03-13

HUAWEI TECHNOLOGIES CO., LTD.

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Huawei Proprietary and Confidential

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No part of this document may be reproduced or transmitted in any form or by any means without prior

written consent of Huawei Technologies Co., Ltd.

Trademarks and Permissions

and other Huawei trademarks are trademarks of Huawei Technologies Co., Ltd.

All other trademarks and trade names mentioned in this document are the property of their respective

holders.

Notice

The purchased products, services and features are stipulated by the contract made between Huawei and

the customer. All or part of the products, services and features described in this document may not be

within the purchase scope or the usage scope. Unless otherwise specified in the contract, all statements,

information, and recommendations in this document are provided "AS IS" without warranties, guarantees or

representations of any kind, either express or implied.

The information in this document is subject to change without notice. Every effort has been made in the

preparation of this document to ensure accuracy of the contents, but all statements, information, and

recommendations in this document do not constitute a warranty of any kind, express or implied.

Huawei Technologies Co., Ltd.

Address:

Huawei Industrial Base

Bantian, Longgang

Shenzhen 518129

People's Republic of China

Website:

http://e.huawei.com

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About This Document

Related Version

The following table lists the product version related to this document.

Product Name

Version

The USG9500 has the

following models:

 USG9520

 USG9560

 USG9580

V500R001C50

Intended Audience

This document describes hardware structure, installation guide, and hardware maintenance.

The content of this document includes the appearance and specifications of the product, the

supported expansion cards, preparation before the installation, installation, cabling, and

hardware replacement.

This document is intended for installation personnel and administrators who install and

maintain USG. The installation personnel or administrators must have experience in the

installation and maintenance of networking devices.

Symbol Conventions

The symbols that may be found in this document are defined as follows.

Symbol

Description

Indicates an imminently hazardous situation which, if not

avoided, will result in death or serious injury.

Indicates a potentially hazardous situation which, if not

avoided, could result in death or serious injury.

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Symbol

Description

Indicates a potentially hazardous situation which, if not

avoided, may result in minor or moderate injury.

Indicates a potentially hazardous situation which, if not

avoided, could result in equipment damage, data loss,

performance deterioration, or unanticipated results.

NOTICE is used to address practices not related to personal

injury.

Calls attention to important information, best practices and

tips.

NOTE is used to address information not related to

personal injury, equipment damage, and environment

deterioration.

Command Conventions

The command conventions that may be found in this document are defined as follows.

Convention

Description

Boldface

The keywords of a command line are in boldface.

Italic

Command arguments are in italics.

[ ]

Items (keywords or arguments) in brackets [ ] are optional.

{ x | y | ... }

Optional items are grouped in braces and separated by

vertical bars. One item is selected.

[ x | y | ... ]

Optional items are grouped in brackets and separated by

vertical bars. One item is selected or no item is selected.

{ x | y | ... } *

Optional items are grouped in braces and separated by

vertical bars. A minimum of one item or a maximum of all

items can be selected.

[ x | y | ... ] *

Optional items are grouped in brackets and separated by

vertical bars. Several items or no item can be selected.

&<1-n>

The parameter before the & sign can be repeated 1 to n

times.

#

A line starting with the # sign is comments.

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GUI Conventions

The GUI conventions that may be found in this document are defined as follows.

Convention

Description

Boldface

Buttons, menus, parameters, tabs, window, and dialog titles

are in boldface. For example, click OK.

>

Multi-level menus are in boldface and separated by the ">"

signs. For example, choose File > Create > Folder.

Update History

Updates between document issues are cumulative. Therefore, the latest document issue

contains all updates made in previous issues.

Updates in Issue 01 (2017-03-13)

Initial commercial release.

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Contents

About This Document .................................................................................................................... ii

1 Hardware Overview ..................................................................................................................... 1

1.1 USG9580 ...................................................................................................................................................................... 1

1.1.1 Device Overview ....................................................................................................................................................... 1

1.1.2 Components of the USG9580 .................................................................................................................................... 3

1.1.3 Slots Layout and Supported Boards ........................................................................................................................... 6

1.1.4 Power Supply System .............................................................................................................................................. 10

1.1.4.1 Features and Distributed Architecture of the Power Supply System .................................................................... 10

1.1.4.2 DC Power Supply System ..................................................................................................................................... 11

1.1.4.3 AC Power Supply System ..................................................................................................................................... 15

1.1.5 Heat Dissipation System .......................................................................................................................................... 19

1.1.5.1 System Air Channel .............................................................................................................................................. 19

1.1.5.2 Fan Module ........................................................................................................................................................... 20

1.1.5.3 Air Filter ............................................................................................................................................................... 22

1.1.6 Switch Fabric ........................................................................................................................................................... 23

1.1.7 Control Plane ........................................................................................................................................................... 24

1.1.8 Technical Specifications .......................................................................................................................................... 25

1.2 USG9560 .................................................................................................................................................................... 28

1.2.1 Device Overview ..................................................................................................................................................... 28

1.2.2 Components of the USG9560 .................................................................................................................................. 30

1.2.3 Slots Layout and Supported Boards ......................................................................................................................... 32

1.2.4 Power Supply System .............................................................................................................................................. 35

1.2.4.1 Features and Distributed Architecture of the Power Supply System .................................................................... 35

1.2.4.2 DC Power Supply System ..................................................................................................................................... 36

1.2.4.3 AC Power Supply System ..................................................................................................................................... 38

1.2.5 Heat Dissipation System .......................................................................................................................................... 42

1.2.5.1 System Air Channel .............................................................................................................................................. 42

1.2.5.2 Fan Module ........................................................................................................................................................... 43

1.2.5.3 Air Filter ............................................................................................................................................................... 45

1.2.6 Switch Frabric .......................................................................................................................................................... 45

1.2.7 Control Plane ........................................................................................................................................................... 47

1.2.8 Technical Specifications .......................................................................................................................................... 48

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1.3 USG9520 .................................................................................................................................................................... 50

1.3.1 Device Overview ..................................................................................................................................................... 50

1.3.2 Components of the USG9520 .................................................................................................................................. 51

1.3.3 Slots Layout and Supported Boards ......................................................................................................................... 54

1.3.4 Power Supply System .............................................................................................................................................. 57

1.3.4.1 Features of the Power Supply System................................................................................................................... 57

1.3.4.2 DC Power Supply System ..................................................................................................................................... 58

1.3.4.3 AC Power Supply System ..................................................................................................................................... 59

1.3.5 Heat Dissipation System .......................................................................................................................................... 63

1.3.5.1 System Air Channel .............................................................................................................................................. 63

1.3.5.2 Fan Module ........................................................................................................................................................... 64

1.3.5.3 Air Filter ............................................................................................................................................................... 66

1.3.6 Control Plane ........................................................................................................................................................... 67

1.3.7 Technical Specifications .......................................................................................................................................... 68

1.4 Boards ......................................................................................................................................................................... 70

1.4.1 Board Overview ....................................................................................................................................................... 70

1.4.1.1 Types and Mappings of Boards ............................................................................................................................. 70

1.4.1.2 Board Structure ..................................................................................................................................................... 88

1.4.1.3 Rules for Numbering Slots and Interfaces ............................................................................................................ 89

1.4.2 MPUs and SRUs ...................................................................................................................................................... 92

1.4.2.1 EKEX16-FWCD00MPUB00 ................................................................................................................................ 92

1.4.2.2 E8KE-X8-SRUA-200 ........................................................................................................................................... 95

1.4.2.3 E8KE-X3-MPU .................................................................................................................................................... 99

1.4.2.4 MPUD ................................................................................................................................................................. 102

1.4.3 SFUs ...................................................................................................................................................................... 105

1.4.3.1 E8KE-X16-SFUC-200SP ................................................................................................................................... 105

1.4.3.2 E8KE-X8-SFUC-200 .......................................................................................................................................... 107

1.4.4 SPUs and SPCs ...................................................................................................................................................... 108

1.4.4.1 X3 SPU (SPU-X3-B) .......................................................................................................................................... 108

1.4.4.2 X3 SPU (SPU-X3-B2) ........................................................................................................................................ 109

1.4.4.3 X8&X16 SPU (SPU-X8X16-B) ......................................................................................................................... 111

1.4.4.4 Firewall Service Processing Unit (SPU-X3-20-O-E8KE, for USG9520) ........................................................... 112

1.4.4.5 Firewall Service Processing Unit (SPUA-20-O-M, for USG9520) .................................................................... 114

1.4.4.6 Firewall Service Processing Unit (SPUB-20-O-M, for USG9520) .................................................................... 115

1.4.4.7 Firewall Service Processing Unit (SPU-X8X16-20-O-E8KE, for USG9560/USG9580) ................................... 117

1.4.4.8 Firewall Service Processing Unit (SPUA-20-O-H, for USG9560/USG9580) .................................................... 118

1.4.4.9 Firewall Service Processing Unit (SPUB-20-O-H, for USG9560/USG9580) .................................................... 120

1.4.4.10 Firewall Performance Expansion Card (SPC-20-O-E8KE) .............................................................................. 122

1.4.4.11 Firewall Performance Expansion Card (SPCA-20-O-H&M) ........................................................................... 123

1.4.4.12 Firewall Performance Expansion Card (SPCB-20-O-H&M) ............................................................................ 124

1.4.4.13 Application Security Service Processing Card (SPC-APPSEC-FW) ................................................................ 125

1.4.4.14 Application Security Service Processing Card (SPC-IPS-20) ........................................................................... 127

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1.4.5 LPUF-240 and FPICs ............................................................................................................................................ 128

1.4.5.1 LPUF-240 ........................................................................................................................................................... 128

1.4.5.2 20-Port 10/100/1000Base-RJ45 FPIC (FW-20X1G-RJ45) ................................................................................. 130

1.4.5.3 24-Port 100/1000 Base-X-SFP FPIC (E8KE-X-101-24XGE-SFP) .................................................................... 131

1.4.5.4 5-Port 10GBase LAN/WAN-SFP+ FPIC A (E8KE-X-101-5X10GE-SFP+) ...................................................... 133

1.4.5.5 6*10GE SFP+ Daughter Card (FW-6X10GE-SFP+) .......................................................................................... 134

1.4.5.6 12*10GE SFP+ Daughter Card (FW-12X10GE-SFP+) ...................................................................................... 135

1.4.5.7 3-Port 40GBase QSFP+ FPIC (FW-3X40G-QSFP+) ......................................................................................... 137

1.4.5.8 1-Port 40GBase LAN-CFP FPIC A (E8KE-X-101-1X40GE-CFP) .................................................................... 138

1.4.5.9 1*100GE CFP Daughter Card (FW-1X100GE-CFP) ......................................................................................... 140

1.4.6 LPUF-120 and FPICs ............................................................................................................................................ 141

1.4.6.1 LPUF-120 ........................................................................................................................................................... 141

1.4.6.2 20-Port 10/100/1000Base-RJ45 FPIC (FW-20X1G-RJ45) ................................................................................. 143

1.4.6.3 24-Port 100/1000 Base-X-SFP FPIC (E8KE-X-101-24XGE-SFP) .................................................................... 144

1.4.6.4 5-Port 10GBase LAN/WAN-SFP+ FPIC A (E8KE-X-101-5X10GE-SFP+) ...................................................... 146

1.4.6.5 6*10GE SFP+ Daughter Card (FW-6X10GE-SFP+) .......................................................................................... 147

1.4.6.6 12*10GE SFP+ Daughter Card (FW-12X10GE-SFP+) ...................................................................................... 148

1.4.6.7 3-Port 40GBase QSFP+ FPIC (FW-3X40G-QSFP+) ......................................................................................... 150

1.4.6.8 1-Port 40GBase LAN-CFP FPIC A (E8KE-X-101-1X40GE-CFP) .................................................................... 151

1.4.6.9 1*100GE CFP Daughter Card (FW-1X100GE-CFP) ......................................................................................... 153

1.4.7 LPUF-101 and FPICs ............................................................................................................................................ 154

1.4.7.1 LPUF-101 ........................................................................................................................................................... 154

1.4.7.2 24-Port 100/1000 Base-X-SFP FPIC (E8KE-X-101-24XGE-SFP) .................................................................... 156

1.4.7.3 4-Port 10G Base LAN -SFP+ FPIC (E8KE-X-101-4X10GE-SFP+) .................................................................. 157

1.4.7.4 5-Port 10GBase LAN/WAN-SFP+ FPIC A (E8KE-X-101-5X10GE-SFP+) ...................................................... 159

1.4.7.5 1-Port 40GBase LAN-CFP FPIC A (E8KE-X-101-1X40GE-CFP) .................................................................... 160

1.4.8 LPUF-40-A and FPIC ............................................................................................................................................ 162

1.4.8.1 LPUF-40-A ......................................................................................................................................................... 162

1.4.8.2 20-Port 100/1000Base-X-SFP Flexible Card (P40-20xGE/FE-SFP) .................................................................. 163

1.4.8.3 2-Port 10GBase LAN/WAN-XFP Flexible Card (P40-2x10GBase LAN/WAN-XFP) ....................................... 165

1.4.8.4 4-port 10GBase LAN/WAN-XFP FPIC (P40-4x10GBase LAN/WAN-XFP) .................................................... 166

1.4.9 LPUF-21 and FPIC ................................................................................................................................................ 168

1.4.9.1 LPUF-21 ............................................................................................................................................................. 168

1.4.9.2 12-port 10Base-T/100Base-TX/1000Base-T-RJ45 FPIC (12x10/100/1000Base-TX-RJ45) .............................. 169

1.4.9.3 12-port 100Base-FX/1000Base-X-SFP FPIC (12x100/1000Base-SFP) ............................................................. 171

1.4.9.4 1-port OC-192c/STM-64c POS-XFP FPIC (1 x OC-192c/STM-64c POS-XFP) ............................................... 172

1.4.9.5 1-port 10GBase LAN/WAN-XFP FPIC (1 x 10GBase LAN/WAN) .................................................................. 174

1.4.9.6 4-Port 10GBase WAN/LAN-XFP FPIC (4x10GBase LAN/WAN) .................................................................... 175

1.4.10 1-Port 100GBase-CFP Integrated Line Processing Unit (LPUI-101) .................................................................. 177

1.5 Optical/Electrical Module ......................................................................................................................................... 178

1.5.1 1 Gbit/s Electrical Transceiver ............................................................................................................................... 178

1.5.2 1.25 Gbit/s SFP/eSFP Optical Module................................................................................................................... 180

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1.5.3 10 Gbit/s XFP Optical Module .............................................................................................................................. 185

1.5.4 10 Gbit/s SFP+ Optical Module ............................................................................................................................. 191

1.5.5 40 Gbit/s CFP Optical Modules ............................................................................................................................. 196

1.5.6 40 Gbit/s QSFP+ Optical Module .......................................................................................................................... 199

1.5.7 100 Gbit/s CFP Optical Modules ........................................................................................................................... 203

2 Hardware Installation .............................................................................................................. 207

2.1 Installation Preparation ............................................................................................................................................. 207

2.1.1 Preparing Technical Documents ............................................................................................................................ 207

2.1.2 Preparing Tools and Meters ................................................................................................................................... 208

2.1.3 Checking the Installation Environment ................................................................................................................. 209

2.1.4 Unpacking and Checking the Products .................................................................................................................. 210

2.1.4.1 Checking the Package Container ........................................................................................................................ 210

2.1.4.2 Unpacking the Wooden Case .............................................................................................................................. 211

2.1.4.3 Unpacking the Carton ......................................................................................................................................... 215

2.1.4.4 Checking the Boards ........................................................................................................................................... 216

2.2 Installing USG9580 .................................................................................................................................................. 217

2.2.1 Preparing the Site ................................................................................................................................................... 217

2.2.2 Installing the Chassis into the Cabinet ................................................................................................................... 218

2.2.3 Installing the PGND Cable .................................................................................................................................... 222

2.2.4 Installing Boards and Subcards .............................................................................................................................. 223

2.2.5 Installing Chassis Components .............................................................................................................................. 226

2.2.6 Installing Power Cables-DC Power Distribution ................................................................................................... 228

2.2.7 Installing Power Cables-AC Power Distribution ................................................................................................... 231

2.2.8 Connecting Network Cables .................................................................................................................................. 234

2.2.9 Connecting Optical Fibers ..................................................................................................................................... 237

2.2.10 Checking After Installation .................................................................................................................................. 240

2.2.11 Powering On the USG9580-DC Power Distribution ........................................................................................... 241

2.2.12 Powering On the USG9580-AC Power Distribution ........................................................................................... 244

2.3 Installing USG9560 .................................................................................................................................................. 248

2.3.1 Preparing the Site ................................................................................................................................................... 248

2.3.2 Installing the Chassis into the Cabinet ................................................................................................................... 250

2.3.3 Installing the PGND Cable .................................................................................................................................... 254

2.3.4 Installing Boards and Subcards .............................................................................................................................. 255

2.3.5 Installing Chassis Components .............................................................................................................................. 257

2.3.6 Installing Power Cables-DC Power Distribution ................................................................................................... 259

2.3.7 Installing Power Cables-AC Power Distribution ................................................................................................... 262

2.3.8 Connecting Network Cables .................................................................................................................................. 265

2.3.9 Connecting Optical Fibers ..................................................................................................................................... 267

2.3.10 Checking After Installation .................................................................................................................................. 270

2.3.11 Powering On the USG9560-DC Power Distribution ........................................................................................... 271

2.3.12 Powering On the USG9560-AC Power Distribution ........................................................................................... 274

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2.4 Installing USG9520 .................................................................................................................................................. 277

2.4.1 Preparing the Site ................................................................................................................................................... 277

2.4.2 Installing Cable Racks and Mounting Ears ............................................................................................................ 279

2.4.3 Installing the Chassis into the Cabinet ................................................................................................................... 280

2.4.4 Installing the PGND Cable .................................................................................................................................... 282

2.4.5 Installing Boards and Subcards .............................................................................................................................. 283

2.4.6 Installing Power Cables-DC Power Distribution ................................................................................................... 285

2.4.7 Installing Power Cables-AC Power Distribution ................................................................................................... 288

2.4.8 Connecting Network Cables .................................................................................................................................. 291

2.4.9 Connecting Optical Fibers ..................................................................................................................................... 293

2.4.10 Checking After Installation .................................................................................................................................. 295

2.4.11 Powering On the USG9520-DC Power Distribution ........................................................................................... 297

2.4.12 Powering On the USG9520-AC Power Distribution ........................................................................................... 299

2.5 Guide to Power Distribution Design ......................................................................................................................... 302

2.5.1 Guide to Power Distribution Design of the USG9580 ........................................................................................... 302

2.5.1.1 Guide to the DC Power Distribution ................................................................................................................... 302

2.5.1.2 Guide to the AC Power Distribution ................................................................................................................... 304

2.5.2 Guide to Power Distribution Design of the USG9560 ........................................................................................... 306

2.5.2.1 Guide to the DC Power Distribution ................................................................................................................... 306

2.5.2.2 Guide to the AC Power Distribution ................................................................................................................... 309

2.5.3 Guide to Power Distribution Design of the USG9520 ........................................................................................... 310

2.5.3.1 Guide to the DC Power Distribution ................................................................................................................... 310

2.5.3.2 Guide to the AC Power Distribution ................................................................................................................... 312

3 Hardware Maintenance ............................................................................................................ 314

3.1 Replacing Boards ...................................................................................................................................................... 314

3.1.1 Replacing an MPU/SRU ........................................................................................................................................ 314

3.1.2 Replacing an SFU .................................................................................................................................................. 318

3.1.3 Replacing an LPU .................................................................................................................................................. 322

3.1.4 Replacing an FPIC of the LPU .............................................................................................................................. 326

3.1.5 Replacing an SPU .................................................................................................................................................. 329

3.1.6 Replacing the SPC of the SPU ............................................................................................................................... 333

3.2 Expanding SPU Capacities ....................................................................................................................................... 336

3.2.1 Expanding SPU Capacities for the Active and Standby FWs in Hot Standby Scenarios (for V500R001C50 and

Later Versions) ................................................................................................................................................................ 336

3.2.2 Expanding SPC Capacities for the Active and Standby FWs in Hot Standby Scenarios (for V500R001C50 and

Later Versions) ................................................................................................................................................................ 342

3.3 Replacing a Fan Frame ............................................................................................................................................. 348

3.3.1 Replacing the Fan Module of the USG9580 .......................................................................................................... 348

3.3.2 Replacing the Fan Module of the USG9560 .......................................................................................................... 350

3.3.3 Replacing the Fan Frame of the USG9520 ............................................................................................................ 353

3.4 Replacing a Power Module ....................................................................................................................................... 356

3.4.1 Replacing the DC PEM of the USG9580............................................................................................................... 356

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3.4.2 Replacing the DC PEM of the USG9560............................................................................................................... 360

3.4.3 Replacing a DC Power Module of USG9520 ........................................................................................................ 363

3.4.4 Replacing an AC Power Module of USG9520 ...................................................................................................... 367

3.5 Replacing a CF Card ................................................................................................................................................. 372

3.5.1 Replacing CF Card 1 ............................................................................................................................................. 372

3.5.2 Replacing CF Card 2 ............................................................................................................................................. 374

3.6 Replacing an Optical Module ................................................................................................................................... 377

3.7 Replacing an Air Filter .............................................................................................................................................. 381

3.7.1 Replacing the Air Filter of the USG9580............................................................................................................... 381

3.7.2 Replacing the Air Filter of the USG9560............................................................................................................... 384

3.7.3 Replacing the Air Filter of the USG9520............................................................................................................... 386

3.8 Replacing Cables ...................................................................................................................................................... 388

3.8.1 Replacing a Power Cable ....................................................................................................................................... 388

3.8.2 Replacing a Network Cable ................................................................................................................................... 389

3.8.3 Replacing an Optical Cable ................................................................................................................................... 391

A Appendix ................................................................................................................................... 393

A.1 Cable ........................................................................................................................................................................ 393

A.1.1 DC Power Cable ................................................................................................................................................... 393

A.1.1.1 DC Power Cable of the USG9580 ..................................................................................................................... 393

A.1.1.2 DC Power Cable of the USG9560 ..................................................................................................................... 397

A.1.1.3 DC Power Cable of the USG9520 ..................................................................................................................... 401

A.1.2 AC Power Cable .................................................................................................................................................... 403

A.1.2.1 AC Power Cable of the USG9580 ...................................................................................................................... 403

A.1.2.2 AC Power Cable of the USG9560 ...................................................................................................................... 405

A.1.2.3 AC Power Cable of the USG9520 ...................................................................................................................... 406

A.1.3 PGND Cable ......................................................................................................................................................... 408

A.1.4 Console Cable ....................................................................................................................................................... 410

A.1.5 Auxiliary Port Cable ............................................................................................................................................. 411

A.1.6 Ethernet Cable....................................................................................................................................................... 413

A.1.7 Optical Fiber ......................................................................................................................................................... 418

A.2 On-site Cable Assembly and Installation ................................................................................................................. 421

A.2.1 Cable Assembling Precautions .............................................................................................................................. 421

A.2.2 Assembling Power Cables ..................................................................................................................................... 422

A.2.2.1 Assembling the OT Terminal and the Power Cable ........................................................................................... 422

A.2.2.2 Assembling the JG Terminal and the Power Cable ............................................................................................ 425

A.2.2.3 Assembling the Cord End Terminal and the Power Cable ................................................................................. 428

A.2.3 Assembling Ethernet Cables ................................................................................................................................. 431

A.2.3.1 Assembling the Shielded RJ45 Connector and the Ethernet Cable .................................................................... 431

A.2.3.2 Assembling the Unshielded RJ45 Connector and the Ethernet Cable ................................................................ 437

A.2.3.3 Checking the Appearance of Metal Contact Strips ............................................................................................ 439

A.2.3.4 Testing the Connection of Assembled Cables .................................................................................................... 442

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A.3 Environmental Requirements for Device Running .................................................................................................. 445

A.3.1 Requirements for Selecting a Site for an Equipment Room ................................................................................. 445

A.3.2 Equipment Room Layout ...................................................................................................................................... 446

A.3.3 Construction Requirements for the Equipment Room .......................................................................................... 446

A.3.4 Requirements for Temperature, Humidity, and Altitude ....................................................................................... 448

A.3.5 Requirements for Neatness ................................................................................................................................... 448

A.3.6 Requirements for Corrosive Gases ....................................................................................................................... 449

A.3.7 Requirements for ESD Prevention ........................................................................................................................ 450

A.3.8 Electromagnetism Requirements for the Equipment Room .................................................................................. 450

A.3.9 Requirements for Lightning Proof Grounding ...................................................................................................... 450

A.3.10 Requirements for Power Supply ......................................................................................................................... 452

A.4 Equipment Grounding Specifications ...................................................................................................................... 455

A.4.1 General Grounding Specifications ........................................................................................................................ 455

A.4.2 Grounding Specifications for an Equipment Room .............................................................................................. 455

A.4.3 Grounding Specifications for the Device .............................................................................................................. 456

A.4.4 Grounding Specifications for Communications Power Supply ............................................................................ 456

A.4.5 Grounding Specifications for Signal Cables ......................................................................................................... 457

A.4.6 Specifications for Laying Out Grounding Cables ................................................................................................. 458

A.5 Engineering Labels for Cables ................................................................................................................................. 458

A.5.1 Introduction to Labels ........................................................................................................................................... 459

A.5.1.1 Label Materials .................................................................................................................................................. 459

A.5.1.2 Type and Structure ............................................................................................................................................. 459

A.5.1.3 Label Printing .................................................................................................................................................... 461

A.5.1.4 Writing Labels .................................................................................................................................................... 463

A.5.1.5 Affixing Labels .................................................................................................................................................. 464

A.5.1.6 Contents of Engineering Labels ......................................................................................................................... 466

A.5.1.7 Precautions for Using Engineering Labels ......................................................................................................... 467

A.5.2 Engineering Labels for Optical Fibers .................................................................................................................. 467

A.5.2.1 Labels for the Optical Fibers Connecting Devices ............................................................................................. 467

A.5.2.2 Labels for the Optical Fibers Connecting the Device and an ODF .................................................................... 469

A.5.3 Engineering Labels for Network Cables ............................................................................................................... 470

A.5.4 Engineering Labels for Trunk Cables ................................................................................................................... 472

A.5.4.1 Engineering Labels for Trunk Cables Between Devices .................................................................................... 472

A.5.4.2 Engineering Labels for Trunk Cables Between the Device and a DDF ............................................................. 474

A.5.5 Engineering Labels for User Cables ..................................................................................................................... 475

A.5.6 Engineering Labels for Power Cables ................................................................................................................... 476

A.5.6.1 Engineering Labels for DC Power Cables ......................................................................................................... 476

A.5.6.2 Engineering Labels for AC Power Cables ......................................................................................................... 478

A.6 Requirements on Customers' Cabinets Purchased from Other Vendors ................................................................... 479

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1 Hardware Overview

1.1 USG9580

The USG9580 is a 32 U device. It employs an integrated chassis and provides 16 LPU/SPU

slots. Its MPUs, SFUs, power modules, and fans work in redundancy mode.

1.1.1 Device Overview

This section describes the appearance and hardware system features of the USG9580.

Appearance

The USG9580 has an integrated chassis, and adopts a centralized routing engine and a

distributed forwarding architecture.

Figure 1-1 shows the chassis of the USG9580.

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Figure 1-1 Appearance of the chassis

System Features

The USG9580 provides the following system features:

 Unblocked switching network that can be upgraded, with switching capacity at the Tbit/s

level

 Distributed hardware-based forwarding and fast service deployment

 Compact structure to increase interface density

 Normalized design of system components

 Separation of the control channel, service channel, and monitoring channel to ensure

non-blacking control channels and monitoring channels

 Carrier-class high reliability and manageability

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 Shielding at the modular level to meet Electro Magnetic Compatibility (EMC)

requirements

 Hot-swappable boards, power modules, and fans

 U-shaped air channels to improve system heat dissipation

 Distributed power supply to enhance power supply capability for a single chassis

 200-mm fans with a power filter module

 MPUs in 1:1 backup mode

 SFUs in load balancing mode

 Backup for key components such as power modules, fan modules, clocks, and

management buses

 Protection against incorrect of boards

 Queries about alarm prompts, alarm indications, running status, and alarm status of the

voltage and ambient temperature

1.1.2 Components of the USG9580

The section describes main components on the front and rear panels of the USG9580.

The USG9580 has an integrated chassis, Figure 1-2 and Figure 1-3 show the architecture and

main components of the USG9580.

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Front Panel

Figure 1-2 USG9580 Front Panel

No.

Name

Description

1

Air filter

The USG9580 has three air filters that are deployed on the air intake

vents of the upper and lower air channels and air intake vent at the left

side of the SFU area to protect the device against dust.

2

MPU

The Main Processing Unit (MPU) on the USG9580 is in charge of

system control and route information learning. It is the central control

unit of the device. The USG9580 MPU uses the 1:1 backup

mechanism. When the active MPU is faulty, the standby MPU

immediately takes over the work. The backup mechanism ensures the

proper running of services.

3

LPU/SPU

slot

It holds an LPU or SPU.

4

SFU

The SFUs of the USG9580 are responsible for data switching of the

entire system. The USG9580 has four SFUs that work in 3+1 backup

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No.

Name

Description

mode for load balancing.

5

ESD jack

The equipment end of the wrist strap is inserted into the ESD jack. For

the wrist strap to be effective, ensure that the device is already

grounded.

6

Front

cable rack

It is used to deploy optical fibers and cables. The front cable rack is

divided into the upper and lower racks. The logo of the upper cable

rack is "HUAWEI", the logo of the lower cable rack is "USG9500

Series".

Rear Panel

Figure 1-3 USG9580 Rear Panel

No.

Name

Description

1

Fan

The USG9580 has four fan modules, each two arranged side by side.

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No.

Name

Description

module

The fan modules are deployed on the air exhaust vents of the upper

and lower air channels respectively and work in 2+2 backup mode.

2

PEM

module

The USG9580 uses eight PEM power modules for DC power supply.

The USG9580 backplane is divided into four areas, each of which has

two PEM power inputs. These eight power inputs work in 4+4 backup

mode.

If the USG9580 uses the AC power supply, two additional external AC

power chassises are required.

3

Rear cable

rack

It is used to deploy optical fibers and cables. There are four rear cable

racks on the upper parts of the power modules.

4

Power

supply

areas

Power supply areas of the eight PEM power modules on the USG9580.

5

Protective

ground

terminal

The OT terminal of the ground cable is connected to the protective

ground terminal of the device, and the other terminal of the ground

cable is connected to the ground point of the cabinet or workbench or

the ground bar of the equipment room.

1.1.3 Slots Layout and Supported Boards

This section describes the layout of slots and supported boards on the USG9580.

Slots Layout

Figure 1-4shows the slot layout on the USG9580.

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Figure 1-4 Slot layout on the USG9580

Table 1-1 describes the slot layout on the USG9580.

Table 1-1 Table 1 Board distribution in the board cage of the USG9580

Slot

Name

Slot

Number

Quant

ity

Slot Height

Remarks

LPU/SPU

1 to 16

16

41 mm (1.6

inches)

These slots are used to hold LPUs

or SPUs.

MPU

17 to 18

2

41 mm (1.6

inches)

These slots hold MPUs that work

in 1:1 backup mode.

SFU

19 to 22

4

41 mm (1.6

inches)

These slots are used to hold SFUs.

Supported Boards

Table 1-2 lists the specifications of boards supported by the USG9580.

Table 1-2 Supported boards by the USG9580

Type

BOM

Description

Hot

Swap

MPU

0305G06U

1.4.2.1 EKEX16-FWCD00MPUB00

Yes

SFU

0305G08Q

1.4.3.1 E8KE-X16-SFUC-200SP

Yes

SPUs and SPCs

03056638

1.4.4.3 X8&X16 SPU (SPU-X8X16-B)

Yes

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Type

BOM

Description

Hot

Swap

0305G09U

1.4.4.7 Firewall Service Processing Unit

(SPU-X8X16-20-O-E8KE, for

USG9560/USG9580)

Yes

03057426

1.4.4.8 Firewall Service Processing Unit

(SPUA-20-O-H, for USG9560/USG9580)

Yes

03057520

1.4.4.9 Firewall Service Processing Unit

(SPUB-20-O-H, for USG9560/USG9580)

Yes

0305G09V

1.4.4.10 Firewall Performance Expansion

Card (SPC-20-O-E8KE)

Yes

03057429

1.4.4.11 Firewall Performance Expansion

Card (SPCA-20-O-H&M)

Yes

03057522

1.4.4.12 Firewall Performance Expansion

Card (SPCB-20-O-H&M)

Yes

03056688

1.4.4.13 Application Security Service

Processing Card (SPC-APPSEC-FW)

Yes

03056639

1.4.4.14 Application Security Service

Processing Card (SPC-IPS-20)

Yes

LPUF-240 and

FPIC

03056683

1.4.5.1 LPUF-240

Yes

03056890

1.4.5.2 20-Port 10/100/1000Base-RJ45

FPIC (FW-20X1G-RJ45)

No

03056633

1.4.5.3 24-Port 100/1000 Base-X-SFP

FPIC (E8KE-X-101-24XGE-SFP)

No

03056632

1.4.5.4 5-Port 10GBase LAN/WAN-SFP+

FPIC A (E8KE-X-101-5X10GE-SFP+)

No

03056684

1.4.5.5 6*10GE SFP+ Daughter Card

(FW-6X10GE-SFP+)

No

03056686

1.4.5.6 12*10GE SFP+ Daughter Card

(FW-12X10GE-SFP+)

No

03056848

1.4.5.7 3-Port 40GBase QSFP+ FPIC

(FW-3X40G-QSFP+)

No

03056631

1.4.5.8 1-Port 40GBase LAN-CFP FPIC A

(E8KE-X-101-1X40GE-CFP)

No

03056685

1.4.5.9 1*100GE CFP Daughter Card

(FW-1X100GE-CFP)

No

LPUF-120 and

FPIC

03056682

1.4.6.1 LPUF-120

Yes

03056890

1.4.6.2 20-Port 10/100/1000Base-RJ45

FPIC (FW-20X1G-RJ45)

No

03056633

1.4.6.3 24-Port 100/1000 Base-X-SFP

No

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Type

BOM

Description

Hot

Swap

FPIC (E8KE-X-101-24XGE-SFP)

03056632

1.4.6.4 5-Port 10GBase LAN/WAN-SFP+

FPIC A (E8KE-X-101-5X10GE-SFP+)

No

03056684

1.4.6.5 6*10GE SFP+ Daughter Card

(FW-6X10GE-SFP+)

No

03056686

1.4.6.6 12*10GE SFP+ Daughter Card

(FW-12X10GE-SFP+)

No

03056848

1.4.6.7 3-Port 40GBase QSFP+ FPIC

(FW-3X40G-QSFP+)

No

03056631

1.4.6.8 1-Port 40GBase LAN-CFP FPIC A

(E8KE-X-101-1X40GE-CFP)

No

03056685

1.4.6.9 1*100GE CFP Daughter Card

(FW-1X100GE-CFP)

No

LPUF-101 and

FPIC

03056630

1.4.7.1 LPUF-101

Yes

03056633

1.4.7.2 24-Port 100/1000 Base-X-SFP

FPIC (E8KE-X-101-24XGE-SFP)

No

0305G09L

1.4.7.3 4-Port 10G Base LAN -SFP+ FPIC

(E8KE-X-101-4X10GE-SFP+)

No

03056632

1.4.7.4 5-Port 10GBase LAN/WAN-SFP+

FPIC A (E8KE-X-101-5X10GE-SFP+)

No

03056631

1.4.7.5 1-Port 40GBase LAN-CFP FPIC A

(E8KE-X-101-1X40GE-CFP)

No

LPUF-40-A and

FPIC

03056627

1.4.8.1 LPUF-40-A

Yes

03056629

1.4.8.2 20-Port 100/1000Base-X-SFP

Flexible Card (P40-20xGE/FE-SFP)

No

03056628

1.4.8.3 2-Port 10GBase LAN/WAN-XFP

Flexible Card (P40-2x10GBase

LAN/WAN-XFP)

No

0305G07X

1.4.8.4 4-port 10GBase LAN/WAN-XFP

FPIC (P40-4x10GBase LAN/WAN-XFP)

No

LPUF-21 and

FPIC

03056624

1.4.9.1 LPUF-21

Yes

0305G054

1.4.9.2 12-port

10Base-T/100Base-TX/1000Base-T-RJ45

FPIC (12x10/100/1000Base-TX-RJ45)

No

03056626

1.4.9.3 12-port

100Base-FX/1000Base-X-SFP FPIC

(12x100/1000Base-SFP)

No

0305G055

1.4.9.4 1-port OC-192c/STM-64c

No

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Type

BOM

Description

Hot

Swap

POS-XFP FPIC (1 x OC-192c/STM-64c

POS-XFP)

03056625

1.4.9.5 1-port 10GBase LAN/WAN-XFP

FPIC (1 x 10GBase LAN/WAN)

No

0305G07W

1.4.9.6 4-Port 10GBase WAN/LAN-XFP

FPIC (4x10GBase LAN/WAN)

No

Integrated Line

Process Unit

03056637

1.4.10 1-Port 100GBase-CFP Integrated

Line Processing Unit (LPUI-101)

Yes

1.1.4 Power Supply System

This section describes the power supply system architecture, power supply area division, and

AC/DC power systems of the USG9580.

1.1.4.1 Features and Distributed Architecture of the Power Supply System

This section describes the power supply mode and power supply area division of the

USG9580.

The USG9580 supports either DC or AC power supply.

 If DC power source is used, connect the DC power cables to the PEM input terminals.

 If AC power source is used, use two suitable external AC-DC convertors. The number of

rectifier modules of the AC-DC convertors depends on the system power consumption.

The AC-DC convertor converts AC power to DC power and supplies DC power to the

PEMs.

As shown in Figure 1-5, the USG9580 backplane is divided into four areas, with each area

having two power inputs. These eight power inputs work in backup mode.

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Figure 1-5 Distributed Architecture of the power supply for the USG9580

1.1.4.2 DC Power Supply System

This section describes the power supply architecture of the DC power system and the

appearance and technical specifications of the DC power modules of the USG9580.

The USG9580 uses eight 70 A PEM modules that work in 4+4 backup mode for DC power

supply. Table 1-3 describes the power supply solution.

Table 1-3 Power supply solution of the USG9580 DC power system

DC power

module

Powered Area

Powered Part

PEM-A1

PEM-B1

Zone1

 Front panel: slots 5-7, 19-21.

 Rear panel: fan modules (upper left side)

PEM-A2

Zone2

 Front panel: slots 1-4, 17, and 18.

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DC power

module

Powered Area

Powered Part

PEM-B2

 Rear panel: fan modules (upper right side)

PEM-A3

PEM-B3

Zone3

 Front panel: slots 13-16 and 22.

 Rear panel: fan modules (lower left side)

PEM-A4

PEM-B4

Zone4

 Front panel: slots 8-12.

 Rear panel: fan modules (lower right side)

NOTE

PEMs A and B back up each other.

Figure 1-6 shows the relationships between the power modules and chassis parts. Each DC

power input contains one -48 V power input and one RTN input. Two separated RTN inputs

join on the board.

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Figure 1-6 Power supply architecture of the USG9580 DC power system

Figure 1-7 shows the appearance of the PEM.

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Figure 1-7 Appearance of the PEM

The LED indicators on the PEM are described in Table 1-4.

Table 1-4 Description of the indicators of the PEM

Indicator

Color

Description

RUN

Green

Indicates normal power output. If the indicator is steady on, it

implies the normal output.

ALM

Red

Power failure indicator. If the indicator is steady on, it

indicates the following:

 The lightning protection link of the power module failed.

 The power module does not have input power.

Table 1-5 lists the technical specifications of the PEM.

Table 1-5 Technical specifications of the DC PEM

Item

Technical Specification

Type

PEMB

Dimensions (Width x

Depth x Height)

58mm x 115mm x 220mm

Weight

1.1 kg

Number of power inputs

1

Input voltage range

-72 V DC to -38 V DC

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Item

Technical Specification

Input rated voltage

-48 V DC/-60 V DC

Maximum input current

70 A

Output voltage

-72 V DC to -38 V DC

Output current

70 A

Rated current of the

air-break

70 A (Each PEM is controlled by an air switch).

1.1.4.3 AC Power Supply System

This section describes the power supply architecture of the AC power system and the

appearance and technical specifications of the AC power chassis of the USG9580.

Table 1-6 shows the power supply solution of the USG9580 AC power supply system. The

input AC power is output as steady DC power after being converted by the AC/DC module

and transmitted along external cables to the PEM to power all boards and fans.

Table 1-6 Power supply solution of the USG9580 AC power system

AC Power

Module

DC Power

Module

Powered

Area

Powered Part

AC power

chassis A

PEM-A1

PEM-B1

Zone1

 Front panel: slots 5-7, 19-21.

 Rear panel: fan modules (upper left

side)

PEM-A2

PEM-B2

Zone2

 Front panel: slots 1-4, 17, and 18.

 Rear panel: fan modules (upper right

side)

AC power

chassis B

PEM-A3

PEM-B3

Zone3

 Front panel: slots 13-16 and 22.

 Rear panel: fan modules (lower left

side)

PEM-A4

PEM-B4

Zone4

 Front panel: slots 8-12.

 Rear panel: fan modules (lower right

side)

NOTE

PEMs A and B back up each other.

Figure 1-8 shows the relationships between the AC power chassis, power modules, and

chassis parts. Each DC power input contains one -48 V power input and one RTN input. Two

separated RTN inputs join on the board.

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Figure 1-8 Power supply architecture of the USG9580 AC power system

An AC power chassis is 2 U high. Installing the AC power chassis in the same cabinet as the

chassis is recommended. If the AC power chassis cannot be installed in the same cabinet as

the chassis, it should be placed near the cabinet and careful attention needs to be paid to the

cabling. Two AC power chassises work in 1+1 backup mode. Each AC power chassis

provides four circuit breakers and eight AC power inputs. Each circuit breaker is 20 A.

Figure 1-9 and Figure 1-10 show the appearance of the AC power chassis.

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Figure 1-9 Front view of the AC power chassis

Figure 1-10 Rear view of the AC power chassis

As USG9580 do not support AC power chassis management, the DB9 interface on the rear of an AC

power chassis does not need to connect to the monitoring cable in the installation auxiliary material

package.

Table 1-7 shows the description of indicators on the panel of the AC power chassis.

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Table 1-7 Indicator description

Indicator

Color

Normal

Abnormal

Cause

Power running

indicator

Green

On

Off

Power failure

(no AC input,

over-voltage

AC input, or

under-voltage

AC input) and

no output by the

power module

Protection

indicator

Yellow

Off

On

Temperature

alarm (When

the ambient

temperature

exceeds 65°C,

the device is

powered off.)

Dormant (When

the device is in

dormant state,

the protection

indicator of the

module is on,

but the module

does not report

alarms.)

Fault indicator

Red

Off

On

No output due

to the

over-voltage

output

power-off, fan

fault,

over-temperatur

e power-off, or

internal module

fault.

Table 1-8 lists the technical specifications of the AC power chassis.

Table 1-8 Technical specifications of the AC power supply module

Item

Technical Specification

Type

EPS200-4850A

Dimensions (Width x

Depth x Height)

442 mm x 650 mm x 88 mm

Number of power inputs

4

Maximum input voltage

90 V AC to 264 V AC; 50/60 Hz

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Item

Technical Specification

range

Maximum input current

18.5 A/single module

Number of power outputs

4

Maximum output current

50 A/single module

Maximum output power

2900 W/single module

1.1.5 Heat Dissipation System

This section describes the components of the heat dissipation system and the appearance,

functions, and technical specifications of fan modules.

1.1.5.1 System Air Channel

This section describes the system air channels and air flows of the USG9580.

The USG9580 has three air channels.

 The upper and lower chassis have separate air channels that draw air from the front and

exhausts air from the rear. The air filters are installed over the air intake vents. Each filter

has a curved face, large area, and small windage resistance. These features help to

improve heat dissipation efficiency. Air filters on the upper and lower chassis are

identical.

 The air channel in the SFU slot area is located on the left of the chassis. The depth of the

air filter is the same as that of an SFU, and the height of the air filter is four times the

height of the SFU.

The air intake vent on the upper chassis is located above the board area on the front chassis;

the air exhaust vent is located above the board area on the rear chassis. The lower chassis and

the upper chassis are opposites. The upper chassis and the lower chassis also have separate

heat dissipation systems.

The middle area of the USG9580 is for SFU slots. The air intake vent of this area is located

on the left of the chassis. Two upper SFU slots in the area draw in air from the left. When

flowing to the right, the air joins the air from the upper chassis. Two lower SFU slots in the

area also draw in air from the left. When flowing to the right, the air joins the air from the

lower chassis.

Figure 1-11 shows the air flow in the USG9580.

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Figure 1-11 Air flow in the USG9580

1.1.5.2 Fan Module

This section describes the appearance, technical specifications, and speed adjustment of fans.

Appearance and Technical Specifications of Fan Modules

The four fan modules of the USG9580 are located at the air exhaust vents side by side and

work in 2+2 backup mode. Each fan module is equipped with one fan. When one fan fails, the

heat dissipation system can still allow the device to work at the ambient temperature of 40°C

for a short period. Figure 1-12 shows the fan module appearance.

Short-term operation means that the continuous operation time does not exceed 96 hours and the

accumulated operation time per year does not exceed 15 days.

The fan module is hot swappable.

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Figure 1-12 Appearance of a fan module

Table 1-9 describes the indicators on the fan module.

Table 1-9 Description of the indicators on the fan module

Indicator

Color

Description

STATUS

Green

If the indicator blinks once every two seconds (0.5 Hz), the fan

module is working normally.

Red

If the indicator blinks once every two seconds (0.5 Hz), the fan

module or PEM is faulty (including the case that not all PEMs

are powered on).

Table 1-10 lists the technical specifications of the fan module.

Table 1-10 Technical specifications of the fan module

Item

Technical Specification

Dimensions (Width x

Depth x Height)

210.4 mm x 100 mm x 243.7 mm

Weight

3.4 kg

Power consumption

(typical value)

30 W

Maximum noise

74 dB

Fan Speed Adjustment

When the system is fully configured, temperatures reported by the temperature sensors on the

LPUs, SPUs, SFUs and MPUs serve as the basis for fan speed adjustment. Table 1-11 lists

general principles.

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Table 1-11 Fan Speed Adjustment Principles

Ambient

Temperat

ure

Rotationa

l Speed

Noise and Dissipation Standards

-5°C -

+27°C

(23°F -

80.6°F)

Low speed

(50%

rotational

speed)

When fans rotate at a constantly low speed, the noises meet the

NEBS standard and the fans meet heat dissipation

requirements of a fully configured system.

27°C -

50°C

(80.6°F -

122°F)

Linear

variation

The fan speed is adjusted smoothly in linear mode, without a

sharp increase in noises.

Over 45°C

(113°F)

High speed

(100%

rotational

speed)

Fans

Fans rotate at high speed to meet heat dissipation requirements.

1.1.5.3 Air Filter

This section describes the appearance and features of air filters.

The USG9580 draws in air from the front and exhausts air from the rear. The two air filters on

the upper and lower chassis are identical. To maximize air intake, the filters are fully

perforated. Air filters are fixed to the chassis by fasteners to facilitate filter removal and

replacement. Figure 1-13 shows the appearance of an air filter.

Figure 1-13 Air filter

The air channel in the SFU area is located on the left of the chassis. The air filter uses front

access. The depth of the air filter is the same as that of an SFU and the height of the air filter

is four times the width of an SFU as shown in Figure 1-14.

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Figure 1-14 Air filter in the SFU area

Placing a black sponge air filter at the air intake vent helps to prevent dust from entering the system. It is

recommended that air filters be removed and cleaned at least once every three months.

1.1.6 Switch Fabric

This section describes the mechanism of the switch fabric on the USG9580.

The USG9580 has four independent switch fabric units (SFUs) that work in 3+1 backup mode

for load balancing. The four SFUs load balance services at the same time. When one SFU is

faulty or replaced, the other three SFUs automatically take over its tasks to ensure service

continuity. For details on USG9580 SFUs, see 1.4.3.1 E8KE-X16-SFUC-200SP.

The switching network responsible for switching data between LPUs/SPUs is a key

component of the USG9580. The USG9580 uses switching chips developed by Huawei and

Memory-Crossbar-Memory (M-C-M) to provide a three-level switching mode. Level-1 and

level-3 switching use a shared-memory model and are performed on LPUs/SPUs; level-2

switching uses a Crossbar model and is performed on SFUs. Figure 1-15 shows the switching

network of the USG9580. The following takes the LPU for example.

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Figure 1-15 Switching network of the USG9580

The level-1 switching chip on one LPU is fully connected to the level-2 switching chips on

SFUs. The level-2 switching chips on the SFUs are also fully connected to the level-3

switching chip on another LPU. In addition, the level-2 crossbar switching chips work in load

balancing mode on multiple switching planes. The entire switching network is unblocked. The

following describes how data packets are transmitted across the switching network.

1. Data packets enter an LPU through physical interfaces and are fragmented into cells of a

fixed length. These cells are then sent to the level-1 switching chips. After being

buffered and scheduled, the cells enter the crossbar switching chips on the SFU. The

level-1 switching chip on an LPU is fully connected with all of the level-2 switching

chips. As a result, the same number of cells can be distributed to each level-2 switching

plane. This implements load balancing on switching planes and facilitates fault tolerance.

2. After the cells reach the crossbar switching chips, the crossbar switching chips schedule

the cells to the corresponding outbound interfaces according to the destination interfaces

of the data packets. The cells are then sent to the level-3 switching chips on another LPU.

At this point, the switching of the cells by the level-2 switching chips is completed.

3. After the cells reach the level-3 switching chips on another LPU, the system searches for

the destination interfaces. Once found, the cells are reassembled and sent out through

physical interfaces. At this point, switching of the data packets is completed.

1.1.7 Control Plane

This section describes the functions and features of the control plane.

USG9580 uses the MPU to implement the functions of the control plane. For MPU details,

see 1.4.2.1 EKEX16-FWCD00MPUB00. The functions of the MPU are described from the

following aspects:

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System Control and Management Unit

As the system control and management unit, the MPU provides the following functions on the

system control panel:

 Route calculation: All routing protocol packets are sent by the forwarding engine to the

MPU for processing. In addition, the MPU broadcasts and filters packets, and downloads

routing policies from the policy server.

 Outband communication between boards: The LAN switch modules integrated on the

MPU provide outband communications between boards. In this manner, messages can be

controlled, maintained, and exchanged among the SFUs, LPUs and SPUs.

 Device management and maintenance: Devices can be managed and maintained through

the management interfaces (serial interfaces) provided by the MPU.

 Data configuration: The MPU stores configuration data, startup files, upgrade software,

and system logs.

 Data storage: The MPU provides two interfaces for CF cards, which serve as mass

storage devices to store data files.

System Maintenance Unit

As the system maintenance unit, the MPU collects monitored information to test system units

locally or remotely, or implement in-service upgrading of system units.

The MPU periodically collects information about the operation of system units through the

Monitorbus. The MPU then generates related control information based on the collected

information, for example, the detection of board installations and adjustments to fan speed.

Through the joint test action group (JTAG) bus, the MPU remotely or locally tests system

units, or performs in-service upgrades of system units.

Reliability

The main control modules, clock modules, and LAN switch modules on the MPU work in 1:1

hot backup mode, thus improving system reliability.

The two MPUs work in 1:1 backup mode. Each MPU monitors the status of the other. If the

master MPU is faulty, the slave MPU automatically takes over as the master MPU.

1.1.8 Technical Specifications

This section describes the dimensions, weight, power, and environment specifications of the

USG9580.

Table 1-12 lists the technical specifications of the USG9580.

Table 1-12 USG9580 Technical Specifications

Item

Description

System specifications

Processing unit of the

MPU

Main frequency: 1.5 GHz

BootROM capacity of

the MPU

8 MB

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Item

Description

SDRAM capacity of the

MPU

4 GB

NVRAM capacity of the

MPU

4 MB

Flash capacity of the

MPU

32 MB

CF card

2 x 2 GB

Number of slots

MPU

2 (slots 17 and 18)

SFU

4 (slots 19 to 22)

LPU/

SPU

16 (slots 1 to 16)

Dimensions and weight

Dimensions (Widtha x

Depth x Heightb)

442 mm x 650 mm x 1420 mm (32 U). The depth is 770 mm

covering the dust filter and cable rack.

Installation position

N68E cabinet or a standard 19-inch cabinet

Weight

Empt

y

chassi

s

94.4 kg

Full

config

uratio

n

(maxi

mal)

233.9 kg

Power specifications

Power supply

mode

DC

8 hot-swappable PEM modules

AC

8 PEM modules+2 external AC power chassises

Rated input

voltage

DC

-48 V

AC

175 V AC to 264 V AC; 50/60 Hz

Maximum input

voltage range

DC

-72 V to -38 V

AC

90 V AC to 264 V AC; 50/60 Hz (The output power reduces to

half of the maximum output when the input voltage is in the

range of 90 V AC to 175 V AC.)

Typical power

(six LPUF-240s

and nine SPUs

are configured.)

DC

7387 W

AC

7858 W

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Item

Description

Maximum

Power (six

LPUF-240s and

nine SPUs are

configured.)

DC

8930 W

AC

9500 W

Heat dissipation

Fan module

4 hot-swappable fan modules, each of which has one fan

Air flow

Upper and lower air channels: draw air from the front and

discharge air from the back.

Middle air channels: draw air from the left side and discharge

air from the upper and lower back.

Air filter

3 air filters in the air intake vents of air channels

Environment specifications

System

reliability

MTB

F

(year)

25

MTT

R

(hour)

0.5

Ambient

temperaturec

Long-

termd

0°C to 45°C

Short-

term

-5°C to 50°C

Rema

rks

Limit of the temperature change rate: 30°C/hour

Storage temperature

-40°C to 70°C

Ambient

relative

humidity

Long-

term

5% RH to 85% RH, no coagulation

Short-

term

5% RH to 95% RH, no coagulation

Storage relative

humidity

0% RH to 95% RH

Long-term altitude

Lower than 3000 m

Storage altitude

Lower than 5000 m

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Item

Description

NOTE

a. The width does not include the width of the mounting ear attached.

b. The height is 1 U (1 U = 1.75 inches, or about 44.45 mm), which is a height unit defined in

International Electrotechnical Commission (IEC) 60297 standards.

c. The measurement point of the temperature and humidity is 1.5 m over the floor and 0.4 m in front of

the cabinet without the front and the back doors.

d . Short-term operation means that the continuous operation time does not exceed 96 hours and the

accumulated operation time per year does not exceed 15 days. Otherwise, it is called long-term

operation.

1.2 USG9560

The USG9560 is a 14 U device. It employs an integrated chassis and provides 8 LPU/SPU

slots. Its SRUs, SFUs, power modules, and fans work in redundancy mode.

1.2.1 Device Overview

This section describes the appearance and hardware system features of the USG9560.

Appearance

The USG9560 has an integrated chassis, and adopts a centralized routing engine and a

distributed forwarding architecture.

Figure 1-16 shows the chassis of the USG9560.

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Figure 1-16 Appearance of the chassis

System Features

The USG9560 provides the following system features:

 Unblocked switching network that can be upgraded, with switching capacity at the Tbit/s

level

 Distributed hardware-based forwarding and fast service deployment

 Compact structure to increase interface density

 Normalized design of system components

 Separation of the control channel, service channel, and monitoring channel to ensure

non-blacking control channels and monitoring channels

 Carrier-class high reliability and manageability

 Shielding at the modular level to meet Electro Magnetic Compatibility (EMC)

requirements

 Hot swappable boards, power modules, and fans

 U-shaped air channels to improve system heat dissipation

 Distributed power supply to enhance power supply capabilities for a single chassis

 200-mm fans with a PFU

 SRUAs in 1:1 backup mode

 SFUs in load balancing mode

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 Backup for key components such as power modules, fan modules, clocks, and

management buses

 Protection against incorrect insertion of boards

 Queries about alarm prompts, alarm indications, running status, and alarm status of the

voltage and ambient temperature

1.2.2 Components of the USG9560

This section describes the main components of the USG9560.

The USG9560 has an integrated chassis, Figure 1-17 and Figure 1-18 show the architecture

and main components of the USG9560.

Front Panel

Figure 1-17 USG9560 Front Panel

No.

Name

Description

1

Air filter

The air filters of the USG9560 are deployed on the air intake vents of

chassis air channels to protect the device against dust.

2

SRU

The Switch Router Unit (SRU) on the USG9560 is in charge of system

control and route information learning. It is the central control unit of

the device. The USG9560 SRU uses the 1:1 backup mechanism. When

the active SRU is faulty, the standby SRU immediately takes over the

work. The backup mechanism ensures the proper running of services.

The USG9560 SRU is integrated with an SFU for data switching.

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No.

Name

Description

3

SFU

The SFUs of the USG9560 are responsible for data switching of the

entire system. The USG9560 has one separate SFU. It works with the

SFUs integrated in two SRUs in 2+1 backup mode for load balancing.

4

LPU/SPU

slot

It holds an LPU or SPU.

5

Front

cable rack

It is used to deploy optical fibers and cables.

Rear Panel

Figure 1-18 USG9560 Rear Panel

No.

Name

Description

1

Fan

module

The USG9560 has two fan modules. They are deployed on the air

intake vents of chassis air channels and work in 1+1 backup mode.

2

ESD jack

The equipment end of the wrist strap is inserted into the ESD jack. For

the wrist strap to be effective, ensure that the device is already

grounded.

3

Protective

ground

terminal

The OT terminal of the ground cable is connected to the protective

ground terminal of the device, and the other terminal of the ground

cable is connected to the ground point of the cabinet or workbench or

the ground bar of the equipment room.

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No.

Name

Description

4

Rear cable

rack

It is used to deploy optical fibers and cables. There are two rear cable

racks on the upper parts of the power modules.

5

Power

supply

areas

Power supply areas of the four PEM power modules on the USG9560.

6

PEM

module

The USG9560 uses four PEM power module for DC power supply.

The USG9560 backplane is divided into two areas, each of which has

two PEM power inputs. These eight power inputs work in 2+2 backup

mode.

If the USG9560 uses the AC power supply, one additional external AC

power chassis is required.

1.2.3 Slots Layout and Supported Boards

This section describes the layout of slots and supported boards on the USG9560.

Slots Layout

Figure 1-19shows the slot layout on the USG9560.

Figure 1-19 Slot layout on the USG9560

Table 1-13 describes the slot layout on the USG9560.

Table 1-13 Table 1 Board distribution in the board cage of the USG9560

Slot

Name

Slot

Number

Quant

ity

Slot Height

Remarks

LPU/SPU

1 to 8

8

41 mm (1.6

inches)

These slots are used to hold LPUs

or SPUs.

SRU

9 to 10

2

36 mm (1.4

inches)

These slots hold SRUs that work

in 1:1 backup mode.

SFU

11

1

36 mm (1.4

inches)

These slots are used to hold an

SFU.

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Supported Boards

Table 1-14 lists the specifications of boards supported by the USG9560.

Table 1-14 Supported boards by the USG9560

Type

BOM

Description

Hot

Swap

SRU

0305G08N

1.4.2.2 E8KE-X8-SRUA-200

Yes

SFU

0305G08P

1.4.3.2 E8KE-X8-SFUC-200

Yes

SPUs and SPCs

03056638

1.4.4.3 X8&X16 SPU (SPU-X8X16-B)

Yes

0305G09U

1.4.4.7 Firewall Service Processing Unit

(SPU-X8X16-20-O-E8KE, for

USG9560/USG9580)

Yes

03057426

1.4.4.8 Firewall Service Processing Unit

(SPUA-20-O-H, for USG9560/USG9580)

Yes

03057520

1.4.4.9 Firewall Service Processing Unit

(SPUB-20-O-H, for USG9560/USG9580)

Yes

0305G09V

1.4.4.10 Firewall Performance Expansion

Card (SPC-20-O-E8KE)

Yes

03057429

1.4.4.11 Firewall Performance Expansion

Card (SPCA-20-O-H&M)

Yes

03057522

1.4.4.12 Firewall Performance Expansion

Card (SPCB-20-O-H&M)

Yes

03056688

1.4.4.13 Application Security Service

Processing Card (SPC-APPSEC-FW)

Yes

03056639

1.4.4.14 Application Security Service

Processing Card (SPC-IPS-20)

Yes

LPUF-240 and

FPIC

03056683

1.4.5.1 LPUF-240

Yes

03056890

1.4.5.2 20-Port 10/100/1000Base-RJ45

FPIC (FW-20X1G-RJ45)

No

03056633

1.4.5.3 24-Port 100/1000 Base-X-SFP

FPIC (E8KE-X-101-24XGE-SFP)

No

03056632

1.4.5.4 5-Port 10GBase LAN/WAN-SFP+

FPIC A (E8KE-X-101-5X10GE-SFP+)

No

03056684

1.4.5.5 6*10GE SFP+ Daughter Card

(FW-6X10GE-SFP+)

No

03056686

1.4.5.6 12*10GE SFP+ Daughter Card

(FW-12X10GE-SFP+)

No

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Type

BOM

Description

Hot

Swap

03056848

1.4.5.7 3-Port 40GBase QSFP+ FPIC

(FW-3X40G-QSFP+)

No

03056631

1.4.5.8 1-Port 40GBase LAN-CFP FPIC A

(E8KE-X-101-1X40GE-CFP)

No

03056685

1.4.5.9 1*100GE CFP Daughter Card

(FW-1X100GE-CFP)

No

LPUF-120 and

FPIC

03056682

1.4.6.1 LPUF-120

Yes

03056890

1.4.6.2 20-Port 10/100/1000Base-RJ45

FPIC (FW-20X1G-RJ45)

No

03056633

1.4.6.3 24-Port 100/1000 Base-X-SFP

FPIC (E8KE-X-101-24XGE-SFP)

No

03056632

1.4.6.4 5-Port 10GBase LAN/WAN-SFP+

FPIC A (E8KE-X-101-5X10GE-SFP+)

No

03056684

1.4.6.5 6*10GE SFP+ Daughter Card

(FW-6X10GE-SFP+)

No

03056686

1.4.6.6 12*10GE SFP+ Daughter Card

(FW-12X10GE-SFP+)

No

03056848

1.4.6.7 3-Port 40GBase QSFP+ FPIC

(FW-3X40G-QSFP+)

No

03056631

1.4.6.8 1-Port 40GBase LAN-CFP FPIC A

(E8KE-X-101-1X40GE-CFP)

No

03056685

1.4.6.9 1*100GE CFP Daughter Card

(FW-1X100GE-CFP)

No

LPUF-101 and

FPIC

03056630

1.4.7.1 LPUF-101

Yes

03056633

1.4.7.2 24-Port 100/1000 Base-X-SFP

FPIC (E8KE-X-101-24XGE-SFP)

No

0305G09L

1.4.7.3 4-Port 10G Base LAN -SFP+ FPIC

(E8KE-X-101-4X10GE-SFP+)

No

03056632

1.4.7.4 5-Port 10GBase LAN/WAN-SFP+

FPIC A (E8KE-X-101-5X10GE-SFP+)

No

03056631

1.4.7.5 1-Port 40GBase LAN-CFP FPIC A

(E8KE-X-101-1X40GE-CFP)

No

LPUF-40-A and

FPIC

03056627

1.4.8.1 LPUF-40-A

Yes

03056629

1.4.8.2 20-Port 100/1000Base-X-SFP

Flexible Card (P40-20xGE/FE-SFP)

No

03056628

1.4.8.3 2-Port 10GBase LAN/WAN-XFP

Flexible Card (P40-2x10GBase

LAN/WAN-XFP)

No

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Type

BOM

Description

Hot

Swap

0305G07X

1.4.8.4 4-port 10GBase LAN/WAN-XFP

FPIC (P40-4x10GBase LAN/WAN-XFP)

No

LPUF-21 and

FPIC

03056624

1.4.9.1 LPUF-21

Yes

0305G054

1.4.9.2 12-port

10Base-T/100Base-TX/1000Base-T-RJ45

FPIC (12x10/100/1000Base-TX-RJ45)

No

03056626

1.4.9.3 12-port

100Base-FX/1000Base-X-SFP FPIC

(12x100/1000Base-SFP)

No

0305G055

1.4.9.4 1-port OC-192c/STM-64c

POS-XFP FPIC (1 x OC-192c/STM-64c

POS-XFP)

No

03056625

1.4.9.5 1-port 10GBase LAN/WAN-XFP

FPIC (1 x 10GBase LAN/WAN)

No

0305G07W

1.4.9.6 4-Port 10GBase WAN/LAN-XFP

FPIC (4x10GBase LAN/WAN)

No

Integrated Line

Process Unit

03056637

1.4.10 1-Port 100GBase-CFP Integrated

Line Processing Unit (LPUI-101)

Yes

1.2.4 Power Supply System

This section describes the power supply system architecture, power supply area division, and

DC/AC power system of the USG9560.

1.2.4.1 Features and Distributed Architecture of the Power Supply System

This section describes the power supply mode and power supply area division of the

USG9560.

The USG9560 supports either DC or AC power supply.

 If DC power source is used, connect the DC power cables to the PEM input terminals.

 If AC power source is used, use two suitable external AC-DC convertors. The number of

rectifier modules of the AC-DC convertors depends on the system power consumption.

The AC-DC convertor converts AC power to DC power and supplies DC power to the

PEMs.

As shown in Figure 1-20, the USG9560 backplane is divided into two areas, with each area

having two power inputs. These four power inputs work in backup mode.

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Figure 1-20 Distributed architecture of the power supply for the USG9560

1.2.4.2 DC Power Supply System

This section describes the power supply architecture of the DC power system and the

appearance and technical specifications of the DC power modules of the USG9560.

The USG9560 uses four 70 A PEM modules that work in 2+2 backup mode for DC power

supply. Figure 1-21 describes the power supply solution.

Table 1-15 Power supply solution of the USG9560 DC power system

DC Power

Module

Powered Area

Powered Part

PEM-A1

PEM-B1

Zone1

 Front panel: slots 5-8 and 10.

 Rear panel: fan modules (upper left side)

PEM-A2

PEM-B2

Zone2

 Front panel: slots 1-4, 9, and 11.

 Rear panel: fan modules (upper right side)

NOTE

PEMs A and B back up each other.

Figure 1-21 shows the relationships between the power modules and chassis parts. Each DC

power input contains one -48 V power input and one RTN input. Two separated RTN inputs

join on the board.

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Figure 1-21 Power supply architecture of the USG9560 DC power system

Figure 1-22 shows the appearance of the PEM.

Figure 1-22 Appearance of the PEM

The LED indicators on the PEM are described in Table 1-16.

Table 1-16 Description of the indicators of the PEM

Indicator

Color

Description

RUN

Green

Indicates normal power output. If the indicator is steady on, it

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Indicator

Color

Description

implies the normal output.

ALM

Red

Power failure indicator. If the indicator is steady on, it

indicates the following:

 The lightning protection link of the power module failed.

 The power module does not have input power.

Table 1-17 lists the technical specifications of the PEM.

Table 1-17 Technical specifications of the DC PEM

Item

Technical Specification

Type

PEMB

Dimensions (Width x

Depth x Height)

58mm x 115mm x 220mm

Weight

1.1 kg

Number of power inputs

1

Input voltage range

-72 V DC to -38 V DC

Input rated voltage

-48 V DC/-60 V DC

Maximum input current

70 A

Output voltage

-72 V DC to -38 V DC

Output current

70 A

Rated current of the

air-break

70 A (Each PEM is controlled by an air switch).

1.2.4.3 AC Power Supply System

This section describes the power supply architecture of the AC power system and the

appearance and technical specifications of the AC power chassis of the USG9560.

Figure 1-23 shows the power supply architecture of the USG9560 AC power supply system.

The input AC power is output as steady DC power after being converted by the AC/DC

module and transmitted along external cables to the PEM to power all boards and fans.

Table 1-18 Power supply solution of the USG9560 AC power system

AC Power

Module

DC Power

Module

Powered

Area

Powered Part

AC power

chassis

PEM-A1

PEM-B1

Zone1

 Front panel: slots 5-8 and 10.

 Rear panel: fan modules (upper left

side)

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AC Power

Module

DC Power

Module

Powered

Area

Powered Part

PEM-A2

PEM-B2

Zone2

 Front panel: slots 1-4, 9, and 11.

 Rear panel: fan modules (upper right

side)

NOTE

PEMs A and B back up each other.

Figure 1-23 shows the relationships between the AC power chassis, power modules, and

chassis parts. Each DC power input contains one -48 V power input and one RTN input. Two

separated RTN inputs join on the board.

Figure 1-23 Power supply architecture of the USG9560 AC power system

An AC power chassis of the USG9560 is 2 U high, and you are advised to install the AC

power chassis in the same cabinet with the device. If they cannot be installed in the same

cabinet, deploy them as closely as possible and pay attention to cabling. The USG9560 uses

one AC power chassis. There are four air circuit breakers on the AC power chassis. The

current of each air circuit breaker is 20 A.

Figure 1-24 and Figure 1-25 show the appearance of the AC power chassis.

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Figure 1-24 Front view of the AC power chassis

Figure 1-25 Rear view of the AC power chassis

As USG9580 do not support AC power chassis management, the DB9 interface on the rear of an AC

power chassis does not need to connect to the monitoring cable in the installation auxiliary material

package.

Table 1-19 shows the description of indicators on the panel of the AC power chassis.

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Table 1-19 Indicator description

Indicator

Color

Normal

Abnormal

Cause

Power running

indicator

Green

On

Off

Power failure

(no AC input,

over-voltage

AC input, or

under-voltage

AC input) and

no output by the

power module

Protection

indicator

Yellow

Off

On

Temperature

alarm (When

the ambient

temperature

exceeds 65°C,

the device is

powered off.)

Dormant (When

the device is in

dormant state,

the protection

indicator of the

module is on,

but the module

does not report

alarms.)

Fault indicator

Red

Off

On

No output due

to the

over-voltage

output

power-off, fan

fault,

over-temperatur

e power-off, or

internal module

fault.

Table 1-20 lists the technical specifications of the AC power chassis.

Table 1-20 Technical specifications of the AC power supply module

Item

Technical Specification

Type

EPS200-4850A

Dimensions (Width x

Depth x Height)

442 mm x 650 mm x 88 mm

Number of power inputs

4

Maximum input voltage

90 V AC to 264 V AC; 50/60 Hz

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Item

Technical Specification

range

Maximum input current

18.5 A/single module

Number of power outputs

4

Maximum output current

50 A/single module

Maximum output power

2900 W/single module

1.2.5 Heat Dissipation System

This section describes the air channel features of the heat dissipation system and the

appearance, functions, and technical specifications of fan modules.

1.2.5.1 System Air Channel

This section describes the system air channels and air flows of the USG9560.

The USG9560 draws in air from the front and exhausts air from the rear. The air intake vent is

located above the board area on the front chassis; the air exhaust vent is located above the

board area on the rear chassis. The air filter has a curved face, large area, and small windage

resistance. These features help to improve heat dissipation efficiency.

The entire system dissipates heat by drawing in air, as shown in USG9560.

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Figure 1-26 Air flow in the USG9560

1.2.5.2 Fan Module

This section describes the appearance, technical specifications, and speed adjustment of fans.

Appearance and Technical Specifications of Fan Modules

The two fan modules of the USG9560 are located at the air exhaust vents side by side and

work in 1+1 backup mode. Each fan module is equipped with one fan. When one fan fails, the

heat dissipation system can still allow the device to work at the ambient temperature of 40°C

for a short period. Figure 1-27 shows the fan module appearance.

Short-term operation means that the continuous operation time does not exceed 96 hours and the

accumulated operation time per year does not exceed 15 days.

The fan module is hot swappable.

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Figure 1-27 Appearance of a fan module

Table 1-21 describes the indicators on the fan module.

Table 1-21 Description of the indicators on the fan module

Indicator

Color

Description

STATUS

Green

If the indicator blinks once every two seconds (0.5 Hz), the fan

module is working normally.

Red

If the indicator blinks once every two seconds (0.5 Hz), the fan

module or PEM is faulty (including the case that not all PEMs

are powered on).

Table 1-22 lists the technical specifications of the fan module.

Table 1-22 Technical specifications of the fan module

Item

Technical Specification

Dimensions (Width x

Depth x Height)

210.4 mm x 100 mm x 243.7 mm

Weight

3.4 kg

Power consumption

(typical value)

30 W

Maximum noise

74 dB

Fan Speed Adjustment

When the system is fully configured, temperatures reported by the temperature sensors on the

LPUs, SPUs, SFUs and MPUs serve as the basis for fan speed adjustment. Table 1-23 lists

general principles.

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Table 1-23 Fan Speed Adjustment Principles

Ambient

Temperat

ure

Rotationa

l Speed

Noise and Dissipation Standards

-5°C -

+27°C

(23°F -

80.6°F)

Low speed

(50%

rotational

speed)

When fans rotate at a constantly low speed, the noises meet the

NEBS standard and the fans meet heat dissipation

requirements of a fully configured system.

27°C -

50°C

(80.6°F -

122°F)

Linear

variation

The fan speed is adjusted smoothly in linear mode, without a

sharp increase in noises.

Over 45°C

(113°F)

High speed

(100%

rotational

speed)

Fans

Fans rotate at high speed to meet heat dissipation requirements.

1.2.5.3 Air Filter

This section describes the appearance and features of air filters.

The USG9560 draws in air from the front top and exhausts air from the rear top. There is a 3

U space in the upper part of the chassis and an air filter on the front of the chassis. To

maximize air intake, the filter is fully perforated. The air filter is fixed to the chassis by a

fastener to facilitate filter removal and replacement. Figure 1-28 shows the appearance of an

air filter.

Figure 1-28 An air filter

Placing a black sponge air filter at the air intake vent helps to prevent dust from entering the system. It is

recommended that the air filter be removed and cleaned once every three months.

1.2.6 Switch Frabric

This section describes the mechanism of the switch fabric on the USG9560.

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The USG9560 has three SFUs, two of which integrated on two SRUs and another being

independent. Another SFU is an independent SFU. These three SFUs work in 2+1 backup

mode. The three SFUs load balance services at the same time. When one SFU is faulty or

replaced, the other two SFUs automatically take over its tasks to ensure normal running of

services. For details on USG9560 SFUs, see 1.4.3.2 E8KE-X8-SFUC-200.

The switching network responsible for switching data between LPUs/SPUs is a key

component of the USG9560. The USG9560 uses the switching chips developed by Huawei

and Memory-Crossbar-Memory (M-C-M) to provide a three-level switching mode. Level-1

and level-3 switching adopts the shared-memory model and is performed on LPUs/SPUs;

level-2 switching adopts the Crossbar model and is performed on an SFU. Figure 1-29 shows

the switching network of the USG9560. The following takes the LPU for example.

Figure 1-29 Switching network of the USG9560

The level-1 switching chip on one LPU is fully connected to all the level-2 switching chips on

the SFUs. The level-2 switching chips on the SFUs are also fully connected to the level-3

switching chip on another LPU. In addition, the level-2 crossbar switching chips work in load

balancing mode across multiple switching planes. The entire switching network is unblocked.

The following describes how data packets are transmitted across the switching network.

1. Data packets enter an LPU through physical interfaces and are fragmented into cells of a

fixed length. These cells are then sent to the level-1 switching chips. After being

buffered and scheduled, the cells enter the crossbar switching chips on the SFU. The

level-1 switching chip on an LPU is fully connected with all of the level-2 switching

chips on SFUs. As a result, the same number of cells can be distributed to each level-2

switching plane. This implements load balancing across switching planes and facilitates

fault tolerance.

2. After the cells reach the crossbar switching chips, the crossbar switching chips schedule

the cells to the corresponding outbound interfaces according to the destination interfaces

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of the data packets. The cells are then sent to the level-3 switching chips on another LPU.

At this point, the switching of the cells by the level-2 switching chips is completed.

3. After the cells reach the level-3 switching chips on another LPU, the system searches for

the destination interfaces. Once found, the cells are reassembled and sent out through

physical interfaces. At this point, the switching of the data packets is completed.

1.2.7 Control Plane

This section describes the functions and features of the control plane.

USG9560 uses the SRU to implement the functions of the control plane. For SRU details, see

1.4.2.2 E8KE-X8-SRUA-200. The functions of the SRU are described from the following

aspects:

System Control and Management Unit

As the system control and management unit, the SRU provides the following functions on the

system control panel:

 Route calculation: All routing protocol packets are sent by the forwarding engine to the

SRU for processing. In addition, the SRU broadcasts and filters packets, and downloads

routing policies from the policy server.

 Outband communication between boards: The LAN switch modules integrated on the

SRU provide outband communications among the SFUs, LPUs and SPUs. In this manner,

messages can be controlled, maintained, and exchanged between the boards.

 Device management and maintenance: Devices can be managed and maintained through

the management interfaces (serial interfaces) provided by the SRU.

 Data configuration: The SRU stores configuration data, startup files, upgrade software,

and system logs.

 Data storage: The SRU provides two interfaces for CF cards, which serve as mass

storage devices to store data files.

System Maintenance Unit

As the system maintenance unit, the SRU collects system monitoring information to test

system units locally or remotely, or implement in-service upgrading of system units.

The SRU periodically collects information about the operation of system units through the

Monitorbus. The SRU then generates related control information based on the collected

information, for example, the detection of board installations and adjustments to fan speed.

Through the joint test action group (JTAG) bus, the SRU remotely or locally tests system

units, or performs in-service upgrading of system units.

Reliability

The main control modules, clock modules, and LAN switch modules on the SRU work in 1:1

hot backup mode, thus improving system reliability.

The two SRUs work in 1:1 backup mode. Each SRU monitors the status of the other. If the

master SRU is faulty, the slave SRU automatically takes over as the master SRU.

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1.2.8 Technical Specifications

This section describes the dimensions, weight, power, and environment specifications of the

USG9560.

Table 1-24 lists the technical specifications of the USG9560.

Table 1-24 USG9560 Technical Specifications

Item

Description

System specifications

Processing unit of the SRU

Main frequency: 1.5 GHz

BootROM capacity of the

SRU

8 MB

SDRAM capacity of the

SRU

4 GB

NVRAM capacity of the

SRU

4 MB

Flash capacity of the SRU

32 MB

CF card

2 x 2 GB

Number of

slots

SRU

2 (slots 9 and 10)

SFU

1 (slot 11)

LPU/SPU

8 (slots 1 to 8)

Dimensions and weight

Dimensions (Widtha x

Depth x Heightb)

442 mm x 650 mm x 620 mm (14 U). The depth is 770 mm

covering the dust filter and cable rack.

Installation position

N68E cabinet or a standard 19-inch cabinet

Weight

Empty

chassis

43.2 kg

Full

configuratio

n (maximal)

112.9 kg

Power specifications

Power

supply mode

DC

4 hot-swappable PEM modules

AC

4 PEM modules+1 external AC power chassis

Rated input

voltage

DC

-48 V

AC

175 V AC to 264 V AC; 50/60 Hz

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Maximum

input

voltage

range

DC

-72 V to -38 V

AC

90 V AC to 264 V AC; 50/60 Hz (The output power reduces

to half of the maximum output when the input voltage is in

the range of 90 V AC to 175 V AC.)

Typical

power

(Three

LPUF-240s

and five

SPUs are

configured.)

DC

4025 W

AC

4282 W

Maximum

power

(Three

LPUF-240s

and five

SPUs are

configured.)

DC

4823 W

AC

5132 W

Heat dissipation

Fan module

2 hot-swappable fan modules, each having one fan

Air flow

Front-to-back airflow

Air filter

1 air filter in the air intake vent of the air channel

Environment specifications

System

reliability

MTBF

(year)

25

MTTR

(hour)

0.5

Ambient

temperaturec

Long-termd

0°C to 45°C

Short-term

-5°C to 50°C

Remarks

Limit of the temperature change rate: 30°C/hour

Storage temperature

-40°C to 70°C

Ambient

relative

humidity

Long-term

5% RH to 85% RH, no coagulation

Short-term

5% RH to 95% RH, no coagulation

Storage relative humidity

0% RH to 95% RH

Long-term altitude

Lower than 3000 m

Storage altitude

Lower than 5000 m

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NOTE

a. The width does not include the width of the mounting ear attached.

b. The height is 1 U (1 U = 1.75 inches, or about 44.45 mm), which is a height unit defined in

International Electrotechnical Commission (IEC) 60297 standards.

c. The measurement point of the temperature and humidity is 1.5 m over the floor and 0.4 m in front of

the cabinet without the front and the back doors.

d . Short-term operation means that the continuous operation time does not exceed 96 hours and the

accumulated operation time per year does not exceed 15 days. Otherwise, it is called long-term

operation.

1.3 USG9520

The USG9520 has DC (4 U) and AC (5 U) chassis models. It employs an integrated chassis

and provides 3 LPU/SPU slots. Its MPUs, power modules, and fans work in redundancy

mode.

1.3.1 Device Overview

This section describes the appearance and hardware system features of the USG9520.

Appearance

The USG9520 has an integrated chassis, and adopts a centralized routing engine and a

distributed forwarding architecture.

The USG9520 chassis have both AC and DC models. Figure 1-30 shows the DC chassis, and

the Figure 1-31 shows the AC chassis.

Figure 1-30 Appearance of the DC chassis

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Figure 1-31 Appearance of the AC chassis

System Features

The USG9520 provides the following system features:

 Distributed hardware-based forwarding

 Separation of control channels and service channels to ensure non-blocking control

channels

 Carrier-class high reliability and manageability

 Shielding at the modular level to meet Electro Magnetic Compatibility (EMC)

requirements

 Hot swappable boards, power modules, and fans

 MPUs in 1:1 backup mode

 Backup for key components such as power modules, fan modules, clocks, and

management buses

 Protection against incorrect insertion of boards

 Queries about alarm prompts, alarm indications, running status, and alarm status of the

power supply

 Queries about alarm prompts, alarm indications, running status, and alarm status of the

voltage and ambient temperature

1.3.2 Components of the USG9520

This section describes the main components of the USG9520.

The USG9520 has AC and DC chassis models. Figure 1-32 and Figure 1-33 shows the parts

in the DC chassis of the USG9520. Figure 1-34 and Figure 1-35 shows the part in the AC

chassis of the USG9520.

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DC Chassis

Figure 1-32 Front panel of the USG9520 DC chassis

No.

Name

Description

1

MPU

The Main Processing Unit (MPU) on the USG9520 is in charge of

system control and route information learning. It is the central control

unit of the device. The USG9520 MPU uses the 1:1 backup

mechanism. When the active MPU is faulty, the standby MPU

immediately takes over the work. The backup mechanism ensures the

proper running of services.

2

LPU/SPU

slot

It holds an LPU or SPU.

3

ESD jack

The equipment end of the wrist strap is inserted into the ESD jack. For

the wrist strap to be effective, ensure that the device is already

grounded.

Figure 1-33 Rear panel of the USG9520 DC chassis

No.

Name

Description

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No.

Name

Description

1

Fan

module

The USG9520 has one fan module that has two fans. The fans are

deployed on the air intake vents of chassis air channels and work in

1+1 backup mode.

2

Protective

ground

terminal

The OT terminal of the ground cable is connected to the protective

ground terminal of the device, and the other terminal of the ground

cable is connected to the ground point of the cabinet or workbench or

the ground bar of the equipment room.

3

Air filter

The air filters of the USG9520 are deployed on the air intake vents of

chassis air channels to protect the device against dust.

4

DC power

module

The DC power supply system of the USG9520 consists of two DC

power modules that are connected to an external direct current

distribution panel and work 1+1 backup mode.

5

ESD jack

The equipment end of the wrist strap is inserted into the ESD jack. For

the wrist strap to be effective, ensure that the device is already

grounded.

AC Chassis

Figure 1-34 Front panel of the USG9520 AC chassis

No.

Name

Description

1

MPU

The Main Processing Unit (MPU) on the USG9520 is in charge of

system control and route information learning. It is the central control

unit of the device. The USG9520 MPU uses the 1:1 backup

mechanism. When the active MPU is faulty, the standby MPU

immediately takes over the work. The backup mechanism ensures the

proper running of services.

2

LPU/SPU

slot

It holds an LPU or SPU.

3

ESD jack

The equipment end of the wrist strap is inserted into the ESD jack. For

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No.

Name

Description

the wrist strap to be effective, ensure that the device is already

grounded.

4

AC power

module

The AC power supply system of the USG9520 consists of two DC

power modules that are connected to an external direct current

distribution panel and work 1+1 backup mode.

Figure 1-35 Rear panel of the USG9520 AC chassis

No.

Name

Description

1

Fan

module

The USG9520 has one fan module that has two fans. The fans are

deployed on the the air intake vents of chassis air channels and work in

1+1 backup mode.

2

Air filter

The air filters of the USG9520 are deployed on the air intake vents of

chassis air channels to protect the device against dust.

3

Protective

ground

terminal

The OT terminal of the ground cable is connected to the protective

ground terminal of the device, and the other terminal of the ground

cable is connected to the ground point of the cabinet or workbench or

the ground bar of the equipment room.

1.3.3 Slots Layout and Supported Boards

This section describes the layout of slots and supported boards on the USG9520.

Slots Layout

Figure 1-36 shows the slot layout on the USG9520.

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Figure 1-36 Slot layout on the USG9520

Table 1-25 describes the slot layout on the USG9520.

Table 1-25 Table 1 Board distribution in the board cage of the USG9520

Slot

Name

Slot

Numbe

r

Quan

tity

Slot Height

Remarks

LPU/SP

U

1 to 3

3

41 mm (1.6

inches)

These slots are used to hold LPUs or

SPUs.

MPU

4 to 5

2

41 mm (1.6

inches)

These slots hold MPUs that work in

1:1 backup mode.

Supported Boards

Table 1-26 lists the specifications of boards supported by the USG9520.

Table 1-26 Supported boards by the USG9520

Type

BOM

Description

Hot

Swap

MPU

03056305

1.4.2.3 E8KE-X3-MPU

Yes

0305G06R

1.4.2.4 MPUD

Yes

SPUs and SPCs

03056640

1.4.4.1 X3 SPU (SPU-X3-B)

Yes

03056989

1.4.4.2 X3 SPU (SPU-X3-B2)

Yes

0305G09T

1.4.4.4 Firewall Service Processing Unit

(SPU-X3-20-O-E8KE, for USG9520)

Yes

03057427

1.4.4.5 Firewall Service Processing Unit

(SPUA-20-O-M, for USG9520)

Yes

03057518

1.4.4.6 Firewall Service Processing Unit

(SPUB-20-O-M, for USG9520)

Yes

0305G09V

1.4.4.10 Firewall Performance Expansion

Card (SPC-20-O-E8KE)

Yes

03056688

1.4.4.13 Application Security Service

Processing Card (SPC-APPSEC-FW)

Yes

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Type

BOM

Description

Hot

Swap

03056639

1.4.4.14 Application Security Service

Processing Card (SPC-IPS-20)

Yes

LPUF-120 and

FPIC

03056682

1.4.6.1 LPUF-120

Yes

03056890

1.4.6.2 20-Port 10/100/1000Base-RJ45

FPIC (FW-20X1G-RJ45)

No

03056633

1.4.6.3 24-Port 100/1000 Base-X-SFP

FPIC (E8KE-X-101-24XGE-SFP)

No

03056632

1.4.6.4 5-Port 10GBase LAN/WAN-SFP+

FPIC A (E8KE-X-101-5X10GE-SFP+)

No

03056684

1.4.6.5 6*10GE SFP+ Daughter Card

(FW-6X10GE-SFP+)

No

03056686

1.4.6.6 12*10GE SFP+ Daughter Card

(FW-12X10GE-SFP+)

No

03056848

1.4.6.7 3-Port 40GBase QSFP+ FPIC

(FW-3X40G-QSFP+)

No

03056631

1.4.6.8 1-Port 40GBase LAN-CFP FPIC A

(E8KE-X-101-1X40GE-CFP)

No

03056685

1.4.6.9 1*100GE CFP Daughter Card

(FW-1X100GE-CFP)

No

LPUF-101 and

FPIC

03056630

1.4.7.1 LPUF-101

Yes

03056633

1.4.7.2 24-Port 100/1000 Base-X-SFP

FPIC (E8KE-X-101-24XGE-SFP)

No

0305G09L

1.4.7.3 4-Port 10G Base LAN -SFP+ FPIC

(E8KE-X-101-4X10GE-SFP+)

No

03056632

1.4.7.4 5-Port 10GBase LAN/WAN-SFP+

FPIC A (E8KE-X-101-5X10GE-SFP+)

No

03056631

1.4.7.5 1-Port 40GBase LAN-CFP FPIC A

(E8KE-X-101-1X40GE-CFP)

No

LPUF-40-A and

FPIC

03056627

1.4.8.1 LPUF-40-A

Yes

03056629

1.4.8.2 20-Port 100/1000Base-X-SFP

Flexible Card (P40-20xGE/FE-SFP)

No

03056628

1.4.8.3 2-Port 10GBase LAN/WAN-XFP

Flexible Card (P40-2x10GBase

LAN/WAN-XFP)

No

0305G07X

1.4.8.4 4-port 10GBase LAN/WAN-XFP

FPIC (P40-4x10GBase LAN/WAN-XFP)

No

LPUF-21 and

03056624

1.4.9.1 LPUF-21

Yes

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Type

BOM

Description

Hot

Swap

FPIC

0305G054

1.4.9.2 12-port

10Base-T/100Base-TX/1000Base-T-RJ45

FPIC (12x10/100/1000Base-TX-RJ45)

No

03056626

1.4.9.3 12-port

100Base-FX/1000Base-X-SFP FPIC

(12x100/1000Base-SFP)

No

0305G055

1.4.9.4 1-port OC-192c/STM-64c

POS-XFP FPIC (1 x OC-192c/STM-64c

POS-XFP)

No

03056625

1.4.9.5 1-port 10GBase LAN/WAN-XFP

FPIC (1 x 10GBase LAN/WAN)

No

0305G07W

1.4.9.6 4-Port 10GBase WAN/LAN-XFP

FPIC (4x10GBase LAN/WAN)

No

Integrated Line

Process Unit

03056637

1.4.10 1-Port 100GBase-CFP Integrated

Line Processing Unit (LPUI-101)

Yes

1.3.4 Power Supply System

This section describes the power supply features, power supply area division, and AC/DC

power systems of the USG9520.

1.3.4.1 Features of the Power Supply System

This section describes the power supply modes of the USG9520.

The USG9520 supports either DC or AC power supply.

Power modules convert the input voltage into -48 V DC voltage to supply power for the entire

system. The power supply system has the following features:

 The power supply system consists of two AC power modules or two DC power modules

working in 1+1 backup mode.

When AC 110 V input is used, the AC power module is half-load output, which cannot afford

the maximum system power consumption with the full configuration. Therefore, two AC

power modules are required, so that the device can work properly. If one AC power module

fails, the other cannot afford the maximum system power consumption. That is, 1+1

redundancy fails.

 Both AC power modules and DC power modules support alarm functions.

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1.3.4.2 DC Power Supply System

This section describes the appearance, functions, and technical specifications of the DC power

module.

The USG9520 DC power module is 1 U high, as shown in Figure 1-37.

The power modules are hot-swappable.

Figure 1-37 Appearance of the DC power module and panel

The indicators of the USG9520 DC power module are visible on the panel through light

emitting diode. Table 1-27 describes the indicators.

Table 1-27 Description of the indicators on the DC power module

Name

Color

Description

RUN

Green

Normal output indicator. If the indicator is steady green,

the PEM has normal output.

ALM

Red

Power failure indicator. If the indicator is steady red,

 The lightning protection circuit of the PEM is faulty.

 One of the power modules does not have input

power.

The DC power module has the following functions:

The USG9520 power module can output straight-through power and provide the following

functions:

 Surge protection, filtering, and short circuit protection

 Alarm function.

Table 1-28 lists the technical specifications of the DC power module.

Table 1-28 Technical specifications of the DC power module

Item

Parameter

Model

CR52PEMA

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Item

Parameter

Dimensions (Height × Width ×

Depth)

40 mm × 100 mm × 190 mm

Weight

0.7 kg

Number of inputs

1

Input voltage range

-72 V DC to -38 V DC

Rated input voltage

-48V DC/-60V DC

Maximum input current

42 A

Output voltage

-72 V DC to -38 V DC

Outgoing current

42 A

Current of customer's air

breakers for power distribution

50 A (Each module corresponds to an air breaker.)

1.3.4.3 AC Power Supply System

This section describes the appearance, functions, and technical specifications of the AC power

module and AC power distribution box (PDB).

If a newly shipped USG9520 uses the 2200 W AC power module, which requires the 2200 W AC PDB

and power cable with the C19 straight connector. Early shipped USG9520 uses the 1600 W AC power

module, which requires the 1600 W AC PDB and power cable with the C13 straight connector.

2200 W AC Power System

The USG9520 2200 W AC PDB is in the 1 U standard modular structure. It contains the

R4850G2 AC power module. Both the 2200 W AC PDB and R4850G2 AC power module are

hot swappable. Figure 1-38 shows the appearance and panel of the AC PDB.

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Figure 1-38 Appearance of the 2200 W AC PDB

Name

Description

Power cable clip

Binds and fix the power cable.

Power receptacle

Connects the C19 plug of the AC power cable.

Power switch

The power switch allows you to turn on or off the

power output.

RUN indicator (green)

 Steady on: The power module works properly.

 Off: The power input or power module is faulty.

 Blink once every 2 seconds (0.5 Hz): The power

module is in manual query state. This is a normal

state, and no action is required.

 Blink four times every second (4 Hz): The power

module is in program loading state. This is a

normal state, and no action is required. After the

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Name

Description

program is loaded, the indicator blinks once every

2 seconds.

ALARM indicator (yellow)

 Off: The power module does not have alarms.

 Steady on: The power module has ever had a

fault, such as overvoltage, undervoltage, or

overcurrent.

 Blink once every 2 seconds (0.5 Hz): The

communication of the power module is

interrupted.

FAULT indicator (red)

 Steady on: The power module has an

unrecoverable fault, such as the fan fault, no

current output, or output current short circuit.

 Off: The power module does not have faults.

Buckle and ejector lever

-

The R4850G2 AC power module provides the following protection functions:

 Input overvoltage protection

 Input undervoltage protection

 Output overvoltage protection

 Output current limiting protection

 Output short circuit protection

 Overtemperature protection

Table 1-29 lists the technical specifications of the 4850G2 AC power module.

Table 1-29 Technical specifications of R4850G2 AC power module

Item

Description

Model

R4850G2

Dimensions (Height × Width ×

Depth)

40.8 mm x 105 mm x 281 mm

Weight

1.8 kg

Number of inputs

1

Maximum input voltage range

90 V AC to 264 V AC; 50/60 Hz

Maximum input current

17 A

Output voltage

-53.3V DC

Maximum output current

-53.3 V DC/30 A

Maximum output power

2200 W (rated input voltage: 220 V AC)/1100 W

(rated input voltage: 110V AC)

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1600 W AC Power System

The USG9520 1600 W AC PDB is in the 1 U standard modular structure. It contains the

EPW30B-48A AC power module. Both the 1600 W AC PDB and EPW30B-48A AC power

module are hot swappable. Figure 1-39 shows the appearance and panel of the AC PDB.

Figure 1-39 Appearance and panel of the EPW30B-48A AC power module

Name

Description

RUN indicator (green)

It indicates the running status. If it is steady on, the

power module is working normally.

ALARM indicator (yellow)

It indicates alarms. If it is on, a recoverable fault

occurs on the power module.

 If it is blinking, the communication is interrupted.

 If it is steady on, faults occur, such as overvoltage

or undervoltage of input power or overcurrent.

FAULT indicator (red)

It indicates a fault. If it is steady on, an unrecoverable

fault occurs in the power supply module, such as fan

failure, no output current, or short circuit of output

current.

The EPW30B-48A AC power module provides the following protection functions:

 Protection against output overcurrent

 Output overvoltage protection

 Protection against short circuit

 Alarm function

Table 1-30 lists the technical specifications of the EPW30B-48A AC power module.

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Table 1-30 Technical specifications of EPW30B-48A AC power module

Item

Description

Model

EPW30B-48A

Dimensions (Height × Width ×

Depth)

40 mm x 116 mm x 208 mm

Weight

1.8 kg

Number of inputs

1

Maximum input voltage range

90 V AC to 264 V AC; 50/60 Hz

Maximum input current

10 A

Output voltage

-53.3V DC

Maximum output current

-53.3 V DC/30 A

Maximum output power

1600 W (rated input voltage: 220 V AC)/800 W

(rated input voltage: 110V AC)

1.3.5 Heat Dissipation System

This section describes the air channel features of the heat dissipation system and the

appearance, functions, and technical specifications of fan modules.

1.3.5.1 System Air Channel

This section describes the system air channels and air flows of the USG9520.

The USG9520 draws in air from the left and exhausts air from the rear. The air intake vent is

located at the left side of the chassis and the air exhaust vent is located at the rear of the

chassis. The air filter has a curved face, large area, and small windage resistance. These

features help to improve heat dissipation efficiency.

The system draws in air for heat dissipation, as shown in Figure 1-40 and Figure 1-41.

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Figure 1-40 Air flow in the USG9520 DC chassis

Figure 1-41 Air flow in the USG9520 AC chassis

The heat dissipation system consists of the following components:

 Two fan modules

 An air intake vent and an air exhaust vent

 An air filter

 Fans on power modules

1.3.5.2 Fan Module

This section describes the appearance, technical specifications, and speed adjustment of fans.

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Appearance and Technical Specifications of Fan Modules

The fan modules of the USG9520 is located at the back of the chassis. Each fan module has

two fans that work in 1+1 backup mode. When a single fan fails, the heat dissipation system

enables the system to work in a short period of time at ambient temperature of 40°C. Figure

1-42 shows the fan module appearance.

Short-term operation means that the continuous operation time does not exceed 96 hours and the

accumulated operation time per year does not exceed 15 days.

The fan module is hot swappable.

Figure 1-42 Appearance of a fan module

Table 1-31 describes the indicators on the fan module.

Table 1-31 Description of the indicators on the fan module

Indicator

Color

Description

STATUS

Green

If the indicator blinks once every two seconds (0.5 Hz), the fan

module is working normally.

Red

If the indicator blinks once every two seconds (0.5 Hz), the fan

module or power module is faulty (including the case that one

power module does not have input power).

Table 1-32 lists the technical specifications of the fan module.

Table 1-32 Technical specifications of the fan module

Item

Technical Specification

Dimensions (width x

depth x height)

160 mm x 108 mm x 213 mm

Weight

1.5 kg

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Item

Technical Specification

Maximum wind pressure

700 Pa

Maximum wind rate

850 m3/h

Maximum noise

78 dB

Fan Speed Adjustment

When the system is fully configured, temperatures reported by the temperature sensors on the

LPUs, SPUs and MPUs serve as the basis for fan speed adjustment. Table 1-33 lists general

principles.

Table 1-33 Fan Speed Adjustment Principles

Ambient

Temperat

ure

Rotationa

l Speed

Noise and Dissipation Standards

-5°C-+27°

C (23°F -

80.6°F)

Low speed

(50%

rotational

speed)

When fans rotate at a constantly low speed, the noises meet the

ETSI standard and the fans meet heat dissipation requirements

of a fully configured system.

27°C-45°C

(80.6°F

-113°F)

Linear

variation

The fan speed is adjusted smoothly in linear mode, without a

sharp increase in noises.

Over 45°C

(113°F)

High speed

(100%

rotational

speed)

Fans rotate at high speed to meet heat dissipation requirements.

1.3.5.3 Air Filter

This section describes the appearance and features of air filters.

The air filter of the USG9520 is located on the left rear of the chassis, as shown in Figure

1-43.

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Figure 1-43 Air filter on the USG9520 air intake frame

The air filter of the USG9520 can be bent, which facilitates the maintenance within a limited space in

the rear of the chassis.

Placing a black sponge air filter at the air intake vent helps to prevent dust from entering the system. It is

recommended that the air filter be removed and cleaned once every three months.

1.3.6 Control Plane

This section describes the functions and features of the control plane.

USG9520 uses the MPU to implement the functions of the control plane. The functions

include centralized control and management and data exchange. For MPU details, see 1.4.2.3

E8KE-X3-MPU. The functions of the MPU are described from the following aspects:

System Control and Management Unit

As the system control and management unit, the MPU provides the following functions on the

system control panel:

 Route calculation: All routing protocol packets are sent by the forwarding engine to the

MPU for processing. In addition, the MPU broadcasts and filters packets, and downloads

routing policies from the policy server.

 Outband communication between boards: The LAN switch modules integrated on the

MPU provide outband communications between boards. In this manner, communications

between the LPUs and SPUs are controlled and maintained, and messages can be

exchanged.

 Device management and maintenance: Devices can be managed and maintained through

the management interfaces (serial interfaces) provided by the MPU.

 Data configuration: The MPU stores configuration data, startup files, upgrade software,

and system logs.

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 Data storage: The MPU provides one USB card, which serve as mass storage devices to

store data files.

System Maintenance Unit

As the system maintenance unit, the MPU collects monitored information to test system units

locally or remotely, or implements in-service upgrading of system units.

The MPU periodically collects information about the operation of system units through the

Monitorbus. The MPU then generates related control information based on the collected

information, for example, the detection of board installations and adjustments to fan speed.

Through the joint test action group (JTAG) bus, the MPU remotely or locally tests system

units, or performs in-service upgrading of system units.

Reliability

The main control modules, clock modules, and LAN switch modules on the MPU work in 1:1

hot backup mode, thus improving system reliability.

The two MPUs work in 1:1 backup mode. Each MPU monitors the status of the other. If the

master MPU is faulty, the slave MPU automatically takes over as the master MPU.

1.3.7 Technical Specifications

This section describes the dimensions, weight, power, and environment specifications of the

USG9520.

Table 1-34 lists the technical specifications of the USG9520.

Table 1-34 USG9520 Technical Specifications

Item

Description

System specifications

Processing unit of the MPU

Main frequency: 1 GHz

BootROM capacity of the MPU

1 MB

SDRAM capacity of the MPU

2 GB

NVRAM capacity of the MPU

512 MB

Flash capacity of the MPU

32 MB

CF card

1 x 2 GB

Number of slots

MPU

2 (slots 4 and 5)

SFU

-

LPU/SPU

3 (slots 1, 2, and 3)

Dimensions and weight

Dimensions (Widtha x Depth x

Heightb)

DC chassis: 442 mm x 650 mm x 175 mm (4 U)

AC chassis: 442 mm x 650 mm x 220 mm (5 U)

The depth is 750 mm covering the dust filter and

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Item

Description

cable rack.

Installation position

N68E cabinet or a standard 19-inch cabinet

Weight

Empty chassis

DC chassis: 15kg

AC chassis: 25kg

Full

configuration

(maximal)

DC chassis: 30.7 kg

AC chassis: 40.7 kg

Power specifications

Power supply

mode

DC

Double hot-swappable power modules

AC

Double hot-swappable power modules

Rated input

voltage

DC

-48 V

AC

175 V AC to 264 V AC; 50/60 Hz

Maximum input

voltage range

DC

-72 V to -38 V

AC

90 V AC to 264 V AC; 50/60 Hz (The output power

reduces to half of the maximum output when the

input voltage is in the range of 90 V AC to 175 V

AC.)

Typical power

(One LPUF-120

and two SPUs

are configured.)

DC

1066 W

AC

1185 W

Maximum

Power (One

LPUF-120 and

two SPUs are

configured.)

DC

1272 W

AC

1414 W

Heat dissipation

Fan module

1 hot-swappable fan module that has two fans

Air flow

Left-to-back airflow

Air filter

1 air filter in the air intake vent of the air channel

Environment specifications

System

reliability

MTBF (year)

25

MTTR (hour)

0.5

Ambient

temperaturec

Long-termd

0°C to 45°C

Short-term

-5°C to 50°C

Remarks

Limit of the temperature change rate: 30°C/hour

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Item

Description

Storage temperature

-40°C to 70°C

Ambient

relative

humidity

Long-term

5% RH to 85% RH, no coagulation

Short-term

5% RH to 95% RH, no coagulation

Storage relative humidity

0% RH to 95% RH

Long-term altitude

Lower than 3000 m

Storage altitude

Lower than 5000 m

NOTE

a. The width does not include the width of the mounting ear attached.

b. The height is 1 U (1 U = 1.75 inches, or about 44.45 mm), which is a height unit defined in

International Electrotechnical Commission (IEC) 60297 standards.

c. The measurement point of the temperature and humidity is 1.5 m over the floor and 0.4 m in front of

the cabinet without the front and the back doors.

d . Short-term operation means that the continuous operation time does not exceed 96 hours and the

accumulated operation time per year does not exceed 15 days. Otherwise, it is called long-term

operation.

1.4 Boards

This section describes various supported boards and their specifications.

1.4.1 Board Overview

This section describes types, structures, and mappings of boards and the rules for numbering

board/subcard slots and interfaces.

1.4.1.1 Types and Mappings of Boards

This section describes the board types supported by the USG9500 and mappings between

boards and cards.

The USG9500 supports the following types of boards:

 MPU/SRU

The USG9500 MPU/SRU adopts the integrated board structure. It controls the system in

the centralized manner and learns routing information. It is the controlling center of the

system.

 SFU

The USG9500 SFU adopts the integrated board structure. It is responsible for data

switching between boards.

 SPU

The USG9500 SPU adopts the flexible plug-in card (FPIC) structure. It is responsible for

processing security services in a centralized manner.

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An FPIC SPU consists of two parts: mother board and FPIC. The USG9500 provides

multiple types of SPUs with different performance. An SPU mother board can hold one

or two Service Processing Cards (SPCs).

 LPU

The USG9500 LPU adopts either the FPIC or integrated board structure and provides

network interfaces externally.

Table 1-35, Table 1-36, and Table 1-37 show USG9500 board mappings.

In this document, first supported software versions only refer to V300 and V500. For the support to

V200, see the related V200 product document.

Unless otherwise specified, the first supported software versions and their later versions support these

boards. For example, if the first version supporting a board is V500R001C00, V500R001C00 and later

versions also support this board.

Table 1-35 Board mappings

Typ

e

Board Name

BO

M

US

G9

520

US

G9

560

US

G95

80

First

Software

Version

Supporti

ng the

Board

Subcard

Hot

Sw

ap

MP

U/S

RU

1.4.2.1

EKEX16-FW

CD00MPUB0

0

030

5G

06

U

-

Yes

V300R00

1C01

-

Yes

1.4.2.2

E8KE-X8-SR

UA-200

030

5G

08

N

-

Yes

-

V300R00

1C01

-

Yes

1.4.2.3

E8KE-X3-MP

U

030

563

05

Yes

-

V500R00

1C00

-

Yes

1.4.2.4

MPUD

030

5G

06R

Yes

-

V300R00

1C01

-

Yes

SFU

1.4.3.1

E8KE-X16-S

FUC-200SP

030

5G

08

Q

-

Yes

V300R00

1C01

-

Yes

1.4.3.2

E8KE-X8-SF

UC-200

030

5G

08P

-

Yes

-

V300R00

1C01

-

Yes

SPU

1.4.4.1 X3

SPU

(SPU-X3-B)

030

566

40

Yes

-

V300R00

1C01

 1.4.4.10

Firewall

Performance

Expansion

Card

Yes

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Typ

e

Board Name

BO

M

US

G9

520

US

G9

560

US

G95

80

First

Software

Version

Supporti

ng the

Board

Subcard

Hot

Sw

ap

(SPC-20-O-E8

KE)

 1.4.4.13

Application

Security

Service

Processing

Card

(SPC-APPSE

C-FW)

 1.4.4.14

Application

Security

Service

Processing

Card

(SPC-IPS-20)

1.4.4.2 X3

SPU

(SPU-X3-B2)

030

569

89

Yes

-

V500R00

1C50

 1.4.4.10

Firewall

Performance

Expansion

Card

(SPC-20-O-E8

KE)

 1.4.4.13

Application

Security

Service

Processing

Card

(SPC-APPSE

C-FW)

 1.4.4.14

Application

Security

Service

Processing

Card

(SPC-IPS-20)

 1.4.4.11

Firewall

Performance

Expansion

Card

(SPCA-20-O-

Yes

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Typ

e

Board Name

BO

M

US

G9

520

US

G9

560

US

G95

80

First

Software

Version

Supporti

ng the

Board

Subcard

Hot

Sw

ap

H&M)

 1.4.4.12

Firewall

Performance

Expansion

Card

(SPCB-20-O-

H&M)

1.4.4.3

X8&X16 SPU

(SPU-X8X16-

B)

030

566

38

-

Yes

V300R00

1C01

 1.4.4.10

Firewall

Performance

Expansion

Card

(SPC-20-O-E8

KE)

 1.4.4.13

Application

Security

Service

Processing

Card

(SPC-APPSE

C-FW)

 1.4.4.14

Application

Security

Service

Processing

Card

(SPC-IPS-20)

 1.4.4.11

Firewall

Performance

Expansion

Card

(SPCA-20-O-

H&M)

 1.4.4.12

Firewall

Performance

Expansion

Card

(SPCB-20-O-

H&M)

Yes

1.4.4.4

030

Yes

-

V300R00

 1.4.4.10

Yes

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Typ

e

Board Name

BO

M

US

G9

520

US

G9

560

US

G95

80

First

Software

Version

Supporti

ng the

Board

Subcard

Hot

Sw

ap

Firewall

Service

Processing

Unit

(SPU-X3-20-

O-E8KE, for

USG9520)

5G

09T

1C01

Firewall

Performance

Expansion

Card

(SPC-20-O-E8

KE)

 1.4.4.13

Application

Security

Service

Processing

Card

(SPC-APPSE

C-FW)

 1.4.4.14

Application

Security

Service

Processing

Card

(SPC-IPS-20)

1.4.4.5

Firewall

Service

Processing

Unit

(SPUA-20-O-

M, for

USG9520)

030

574

27

Yes

-

V500R00

1C50

-

Yes

1.4.4.6

Firewall

Service

Processing

Unit

(SPUB-20-O-

M, for

USG9520)

030

575

18

Yes

-

V500R00

1C50

-

Yes

1.4.4.7

Firewall

Service

Processing

Unit

(SPU-X8X16-

20-O-E8KE,

for

030

5G

09

U

-

Yes

V300R00

1C01

 1.4.4.10

Firewall

Performance

Expansion

Card

(SPC-20-O-E8

KE)

 1.4.4.13

Yes

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Typ

e

Board Name

BO

M

US

G9

520

US

G9

560

US

G95

80

First

Software

Version

Supporti

ng the

Board

Subcard

Hot

Sw

ap

USG9560/US

G9580)

Application

Security

Service

Processing

Card

(SPC-APPSE

C-FW)

 1.4.4.14

Application

Security

Service

Processing

Card

(SPC-IPS-20)

 1.4.4.11

Firewall

Performance

Expansion

Card

(SPCA-20-O-

H&M)

 1.4.4.12

Firewall

Performance

Expansion

Card

(SPCB-20-O-

H&M)

1.4.4.8

Firewall

Service

Processing

Unit

(SPUA-20-O-

H, for

USG9560/US

G9580)

030

574

26

-

Yes

V500R00

1C50

 1.4.4.10

Firewall

Performance

Expansion

Card

(SPC-20-O-E8

KE)

 1.4.4.13

Application

Security

Service

Processing

Card

(SPC-APPSE

C-FW)

 1.4.4.14

Application

Security

Yes

HUAWEI USG9500 Series Terabit-level Next-Generation Firewall

Hardware Guide

Contents

Issue 01 (2017-03-13)

Huawei Proprietary and Confidential

76

Typ

e

Board Name

BO

M

US

G9

520

US

G9

560

US

G95

80

First

Software

Version

Supporti

ng the

Board

Subcard

Hot

Sw

ap

Service

Processing

Card

(SPC-IPS-20)

 1.4.4.11

Firewall

Performance

Expansion

Card

(SPCA-20-O-

H&M)

 1.4.4.12

Firewall

Performance

Expansion

Card

(SPCB-20-O-

H&M)

1.4.4.9

Firewall

Service

Processing

Unit

(SPUB-20-O-

H, for

USG9560/US

G9580)

030

575

20

-

Yes

V500R00

1C50

 1.4.4.10

Firewall

Performance

Expansion

Card

(SPC-20-O-E8

KE)

 1.4.4.13

Application

Security

Service

Processing

Card

(SPC-APPSE

C-FW)

 1.4.4.14

Application

Security

Service

Processing

Card

(SPC-IPS-20)

 1.4.4.11

Firewall

Performance

Expansion

Card

(SPCA-20-O-

HUAWEI USG9500 Series Terabit-level Next-Generation Firewall

Hardware Guide

Contents

Issue 01 (2017-03-13)

Huawei Proprietary and Confidential

77

Typ

e

Board Name

BO

M

US

G9

520

US

G9

560

US

G95

80

First

Software

Version

Supporti

ng the

Board

Subcard

Hot

Sw

ap

H&M)

 1.4.4.12

Firewall

Performance

Expansion

Card

(SPCB-20-O-

H&M)

Flexi

ble

Card

LPU

1.4.5.1

LPUF-240

030

566

83

-

Yes

V500R00

1C00

 1.4.5.2

20-Port

10/100/1000B

ase-RJ45

FPIC

(FW-20X1G-

RJ45)

 1.4.5.3

24-Port

100/1000

Base-X-SFP

FPIC

(E8KE-X-101

-24XGE-SFP)

 1.4.5.4 5-Port

10GBase

LAN/WAN-S

FP+ FPIC A

(E8KE-X-101

-5X10GE-SFP

+)

 1.4.5.5

6*10GE SFP+

Daughter Card

(FW-6X10GE

-SFP+)

 1.4.5.6

12*10GE

SFP+

Daughter Card

(FW-12X10G

E-SFP+)

 1.4.5.7 3-Port

40GBase

QSFP+ FPIC

(FW-3X40G-

QSFP+)

Yes

HUAWEI USG9500 Series Terabit-level Next-Generation Firewall

Hardware Guide

Contents

Issue 01 (2017-03-13)

Huawei Proprietary and Confidential

78

Typ

e

Board Name

BO

M

US

G9

520

US

G9

560

US

G95

80

First

Software

Version

Supporti

ng the

Board

Subcard

Hot

Sw

ap

 1.4.5.8 1-Port

40GBase

LAN-CFP

FPIC A

(E8KE-X-101

-1X40GE-CF

P)

 1.4.5.9

1*100GE CFP

Daughter Card

(FW-1X100G

E-CFP)

1.4.6.1

LPUF-120

030

566

82

Yes

V500R00

1C00

 1.4.6.2

20-Port

10/100/1000B

ase-RJ45

FPIC

(FW-20X1G-

RJ45)

 1.4.6.3

24-Port

100/1000

Base-X-SFP

FPIC

(E8KE-X-101

-24XGE-SFP)

 1.4.6.4 5-Port

10GBase

LAN/WAN-S

FP+ FPIC A

(E8KE-X-101

-5X10GE-SFP

+)

 1.4.6.5

6*10GE SFP+

Daughter Card

(FW-6X10GE

-SFP+)

 1.4.6.6

12*10GE

SFP+

Daughter Card

(FW-12X10G

E-SFP+)

 1.4.6.7 3-Port

Yes

HUAWEI USG9500 Series Terabit-level Next-Generation Firewall

Hardware Guide

Contents

Issue 01 (2017-03-13)

Huawei Proprietary and Confidential

79

Typ

e

Board Name

BO

M

US

G9

520

US

G9

560

US

G95

80

First

Software

Version

Supporti

ng the

Board

Subcard

Hot

Sw

ap

40GBase

QSFP+ FPIC

(FW-3X40G-

QSFP+)

 1.4.6.8 1-Port

40GBase

LAN-CFP

FPIC A

(E8KE-X-101

-1X40GE-CF

P)

 1.4.6.9

1*100GE CFP

Daughter Card

(FW-1X100G

E-CFP)

1.4.7.1

LPUF-101

030

566

30

Yes

V300R00

1C01

 1.4.7.2

24-Port

100/1000

Base-X-SFP

FPIC

(E8KE-X-101

-24XGE-SFP)

 1.4.7.3 4-Port

10G Base

LAN -SFP+

FPIC

(E8KE-X-101

-4X10GE-SFP

+)

 1.4.7.4 5-Port

10GBase

LAN/WAN-S

FP+ FPIC A

(E8KE-X-101

-5X10GE-SFP

+)

 1.4.7.5 1-Port

40GBase

LAN-CFP

FPIC A

(E8KE-X-101

-1X40GE-CF

P)

Yes

1.4.8

030

Yes

V300R00

 1.4.8.2

Yes

HUAWEI USG9500 Series Terabit-level Next-Generation Firewall

Hardware Guide

Contents

Issue 01 (2017-03-13)

Huawei Proprietary and Confidential

80

Typ

e

Board Name

BO

M

US

G9

520

US

G9

560

US

G95

80

First

Software

Version

Supporti

ng the

Board

Subcard

Hot

Sw

ap

LPUF-40-A

and FPIC

566

27

1C01

20-Port

100/1000Base

-X-SFP

Flexible Card

(P40-20xGE/F

E-SFP)

 1.4.8.3 2-Port

10GBase

LAN/WAN-X

FP Flexible

Card

(P40-2x10GB

ase

LAN/WAN-X

FP)

 1.4.8.4 4-port

10GBase

LAN/WAN-X

FP FPIC

(P40-4x10GB

ase

LAN/WAN-X

FP)

1.4.9

LPUF-21 and

FPIC

030

566

24

Yes

V300R00

1C01

 1.4.9.2 12-port

10Base-T/100

Base-TX/1000

Base-T-RJ45

FPIC

(12x10/100/10

00Base-TX-R

J45)

 1.4.9.3 12-port

100Base-FX/1

000Base-X-SF

P FPIC

(12x100/1000

Base-SFP)

 1.4.9.4 1-port

OC-192c/ST

M-64c

POS-XFP

FPIC (1 x

OC-192c/ST

M-64c

POS-XFP)

 1.4.9.5 1-port

Yes

HUAWEI USG9500 Series Terabit-level Next-Generation Firewall

Hardware Guide

Contents

Issue 01 (2017-03-13)

Huawei Proprietary and Confidential

81

Typ

e

Board Name

BO

M

US

G9

520

US

G9

560

US

G95

80

First

Software

Version

Supporti

ng the

Board

Subcard

Hot

Sw

ap

10GBase

LAN/WAN-X

FP FPIC (1 x

10GBase

LAN/WAN)

 1.4.9.6 4-Port

10GBase

WAN/LAN-X

FP FPIC

(4x10GBase

LAN/WAN)

Integ

rated

LPU

1.4.10 1-Port

100GBase-CF

P Integrated

Line

Processing

Unit

(LPUI-101)

030

566

37

Yes

V300R00

1C01

-

Yes

Table 1-36 Mappings between SPUs and cards

SPU Card

B

SPU Mother Board

Fi

H

HUAWEI USG9500 Series Terabit-level Next-Generation Firewall

Hardware Guide

Contents

Issue 01 (2017-03-13)

Huawei Proprietary and Confidential

82

O

M

1.4.4.

4

Fire

wall

Serv

ice

Proc

essin

g

Unit

(SPU

-X3-2

0-O-

E8K

E,

for

USG

9520)

1.4.4.

7

Fire

wall

Serv

ice

Proc

essin

g

Unit

(SPU

-X8X

16-20

-O-E

8KE,

for

USG

9560/

USG

9580)

1.4.4

.1

X3

SPU

(SP

U-X

3-B)

1.4.4

.2

X3

SPU

(SP

U-X

3-B2

)

1.4

.4.

3

X8

&

X1

6

SP

U

(S

PU

-X

8X

16-

B)

1.4

.4.

5

Fir

ew

all

Se

rvi

ce

Pr

oc

ess

in

g

Un

it

(S

PU

A-

20-

O-

M,

for

US

G9

52

0)

1.4

.4.

8

Fir

ew

all

Se

rvi

ce

Pr

oc

ess

in

g

Un

it

(S

PU

A-

20-

O-

H,

for

US

G9

56

0/

US

G9

58

0)

1.4

.4.

6

Fir

ew

all

Se

rvi

ce

Pr

oc

ess

in

g

Un

it

(S

PU

B-

20-

O-

M,

for

US

G9

52

0)

1.4

.4.

9

Fir

ew

all

Se

rvi

ce

Pr

oc

ess

in

g

Un

it

(S

PU

B-

20-

O-

H,

for

US

G9

56

0/

US

G9

58

0)

rs

t

S

of

t

w

ar

e

V

er

si

o

n

S

u

p

or

ti

n

g

th

e

B

oa

rd

ot

S

w

ap

1.4.4.10

Firewall

Performanc

e

Expansion

Card

(SPC-20-O

-E8KE)

03

05

G0

9V

Yes

Ye

s

-

Ye

s

-

Ye

s

V

30

0

R

00

1

C

01

Y

es

1.4.4.13

Application

Security

Service

Processing

Card

(SPC-APP

SEC-FW)

03

05

66

88

Yes

Ye

s

-

Ye

s

-

Ye

s

V

50

0

R

00

1

C

00

Y

es

1.4.4.14

Application

Security

Service

03

05

G0

9V

Yes

Ye

s

-

Ye

s

-

Ye

s

V

30

0

R

Y

es

HUAWEI USG9500 Series Terabit-level Next-Generation Firewall

Hardware Guide

Contents

Issue 01 (2017-03-13)

Huawei Proprietary and Confidential

83

SPU Card

B

O

M

SPU Mother Board

Fi

rs

t

S

of

t

w

ar

e

V

er

si

o

n

S

u

p

or

ti

n

g

th

e

B

oa

rd

H

ot

S

w

ap

1.4.4.

4

Fire

wall

Serv

ice

Proc

essin

g

Unit

(SPU

-X3-2

0-O-

E8K

E,

for

USG

9520)

1.4.4.

7

Fire

wall

Serv

ice

Proc

essin

g

Unit

(SPU

-X8X

16-20

-O-E

8KE,

for

USG

9560/

USG

9580)

1.4.4

.1

X3

SPU

(SP

U-X

3-B)

1.4.4

.2

X3

SPU

(SP

U-X

3-B2

)

1.4

.4.

3

X8

&

X1

6

SP

U

(S

PU

-X

8X

16-

B)

1.4

.4.

5

Fir

ew

all

Se

rvi

ce

Pr

oc

ess

in

g

Un

it

(S

PU

A-

20-

O-

M,

for

US

G9

52

0)

1.4

.4.

8

Fir

ew

all

Se

rvi

ce

Pr

oc

ess

in

g

Un

it

(S

PU

A-

20-

O-

H,

for

US

G9

56

0/

US

G9

58

0)

1.4

.4.

6

Fir

ew

all

Se

rvi

ce

Pr

oc

ess

in

g

Un

it

(S

PU

B-

20-

O-

M,

for

US

G9

52

0)

1.4

.4.

9

Fir

ew

all

Se

rvi

ce

Pr

oc

ess

in

g

Un

it

(S

PU

B-

20-

O-

H,

for

US

G9

56

0/

US

G9

58

0)

Processing

Card

(SPC-IPS-2

0)

00

1

C

01

1.4.4.11

Firewall

Performanc

e

Expansion

Card

(SPCA-20-

O-H&M)

03

05

74

29

-

Yes

-

Yes

Ye

s

-

Ye

s

-

Ye

s

V

50

0

R

00

1

C

50

Y

es

1.4.4.12

Firewall

Performanc

e

Expansion

Card

(SPCB-20-

03

05

75

22

-

Yes

-

Yes

Ye

s

-

Ye

s

-

Ye

s

V

50

0

R

00

1

C

Y

es

HUAWEI USG9500 Series Terabit-level Next-Generation Firewall 
Hardware Guide 
Contents 
 
Issue 01 (2017-03-13) 
Huawei Proprietary and Confidential                                     
Copyright © Huawei Technologies Co., Ltd. 
84 
 
SPU Card 
B
O
M 
SPU Mother Board 
Fi
rs
t 
S
of
t
w
ar
e 
V
er
si
o
n 
S
u
p
p
or
ti
n
g 
th
e 
B
oa
rd 
H
ot 
S
w
ap 
1.4.4.
4 
Fire
wall 
Serv
ice 
Proc
essin
g 
Unit 
(SPU
-X3-2
0-O-
E8K
E, 
for 
USG
9520) 
1.4.4.
7 
Fire
wall 
Serv
ice 
Proc
essin
g 
Unit 
(SPU
-X8X
16-20
-O-E
8KE, 
for 
USG
9560/
USG
9580) 
1.4.4
.1 
X3 
SPU 
(SP
U-X
3-B) 
1.4.4
.2 
X3 
SPU 
(SP
U-X
3-B2
) 
1.4
.4.
3 
X8
&
X1
6 
SP
U 
(S
PU
-X
8X
16-
B) 
1.4
.4.
5 
Fir
ew
all 
Se
rvi
ce 
Pr
oc
ess
in
g 
Un
it 
(S
PU
A-
20-
O-
M, 
for 
US
G9
52
0) 
1.4
.4.
8 
Fir
ew
all 
Se
rvi
ce 
Pr
oc
ess
in
g 
Un
it 
(S
PU
A-
20-
O-
H, 
for 
US
G9
56
0/
US
G9
58
0) 
1.4
.4.
6 
Fir
ew
all 
Se
rvi
ce 
Pr
oc
ess
in
g 
Un
it 
(S
PU
B-
20-
O-
M, 
for 
US
G9
52
0) 
1.4
.4.
9 
Fir
ew
all 
Se
rvi
ce 
Pr
oc
ess
in
g 
Un
it 
(S
PU
B-
20-
O-
H, 
for 
US
G9
56
0/
US
G9
58
0) 
O-H&M) 
50 
 
Table 1-37 Mappings between FPIC LPUs and cards 
FPIC LPU 
Card 
BOM 
FPIC LPU Mother Board 
First 
Softw
are 
Versi
on 
Supp
orting 
the 
Board 
Hot 
Swap 
1.4.5.1 
LPUF
-240 
1.4.6.1 
LPUF
-120 
1.4.7.1 
LPUF
-101 
1.4.8 
LPUF
-40-A 
and 
FPIC 
1.4.9 
LPUF
-21 
and 
FPIC 
1.4.9.2 
12-port 
10Base-T/10
0Base-TX/10
0305G0
54 
- 
- 
- 
- 
Yes 
V300
R001
C01 
No 

HUAWEI USG9500 Series Terabit-level Next-Generation Firewall

Hardware Guide

Contents

Issue 01 (2017-03-13)

Huawei Proprietary and Confidential

85

FPIC LPU

Card

BOM

FPIC LPU Mother Board

First

Softw

are

Versi

on

Supp

orting

the

Board

Hot

Swap

1.4.5.1

LPUF

-240

1.4.6.1

LPUF

-120

1.4.7.1

LPUF

-101

1.4.8

LPUF

-40-A

and

FPIC

1.4.9

LPUF

-21

and

FPIC

00Base-T-RJ

45 FPIC

(12x10/100/1

000Base-TX-

RJ45)

1.4.5.2

20-Port

10/100/1000

Base-RJ45

FPIC

(FW-20X1G-

RJ45)

030568

90

Yes

-

V500

R001

C50

No

1.4.9.3

12-port

100Base-FX/

1000Base-X-

SFP FPIC

(12x100/100

0Base-SFP)

030566

26

-

Yes

V300

R001

C01

No

1.4.8.2

20-Port

100/1000Bas

e-X-SFP

Flexible Card

(P40-20xGE/

FE-SFP)

030566

29

-

Yes

-

V300

R001

C01

No

1.4.7.2

24-Port

100/1000

Base-X-SFP

FPIC

(E8KE-X-10

1-24XGE-SF

P)

030566

33

Yes

-

V300

R001

C01

No

1.4.9.5 1-port

10GBase

LAN/WAN-

XFP FPIC (1

x 10GBase

LAN/WAN)

030566

25

-

Yes

V300

R001

C01

No

HUAWEI USG9500 Series Terabit-level Next-Generation Firewall

Hardware Guide

Contents

Issue 01 (2017-03-13)

Huawei Proprietary and Confidential

86

FPIC LPU

Card

BOM

FPIC LPU Mother Board

First

Softw

are

Versi

on

Supp

orting

the

Board

Hot

Swap

1.4.5.1

LPUF

-240

1.4.6.1

LPUF

-120

1.4.7.1

LPUF

-101

1.4.8

LPUF

-40-A

and

FPIC

1.4.9

LPUF

-21

and

FPIC

1.4.8.3 2-Port

10GBase

LAN/WAN-

XFP Flexible

Card

(P40-2x10G

Base

LAN/WAN-

XFP)

030566

28

-

Yes

-

V300

R001

C01

No

1.4.8.4 4-port

10GBase

LAN/WAN-

XFP FPIC

(P40-4x10G

Base

LAN/WAN-

XFP)

0305G0

7X

-

Yes

-

V300

R001

C01

No

1.4.9.6 4-Port

10GBase

WAN/LAN-

XFP FPIC

(4x10GBase

LAN/WAN)

0305G0

7W

-

Yes

V300

R001

C01

No

1.4.7.3 4-Port

10G Base

LAN -SFP+

FPIC

(E8KE-X-10

1-4X10GE-S

FP+)

0305G0

9L

-

Yes

-

V300

R001

C01

No

1.4.7.4 5-Port

10GBase

LAN/WAN-

SFP+ FPIC

A

(E8KE-X-10

1-5X10GE-S

FP+)

030566

32

Yes

-

V300

R001

C01

No

1.4.5.5

6*10GE

SFP+

030566

84

Yes

-

V500

R001

C00

No

HUAWEI USG9500 Series Terabit-level Next-Generation Firewall

Hardware Guide

Contents

Issue 01 (2017-03-13)

Huawei Proprietary and Confidential

87

FPIC LPU

Card

BOM

FPIC LPU Mother Board

First

Softw

are

Versi

on

Supp

orting

the

Board

Hot

Swap

1.4.5.1

LPUF

-240

1.4.6.1

LPUF

-120

1.4.7.1

LPUF

-101

1.4.8

LPUF

-40-A

and

FPIC

1.4.9

LPUF

-21

and

FPIC

Daughter

Card

(FW-6X10G

E-SFP+)

1.4.5.6

12*10GE

SFP+

Daughter

Card

(FW-12X10

GE-SFP+)

030566

86

Yes

-

V500

R001

C00

No

1.4.7.5 1-Port

40GBase

LAN-CFP

FPIC A

(E8KE-X-10

1-1X40GE-C

FP)

030566

31

Yes

-

V300

R001

C01

No

1.4.5.9

1*100GE

CFP

Daughter

Card

(FW-1X100

GE-CFP)

030566

85

Yes

-

V500

R001

C00

No

1.4.5.7 3-Port

40GBase

QSFP+ FPIC

(FW-3X40G-

QSFP+)

030568

48

Yes

-

V500

R001

C50

No

1.4.9.4 1-port

OC-192c/ST

M-64c

POS-XFP

FPIC (1 x

OC-192c/ST

M-64c

POS-XFP)

0305G0

55

-

Yes

V300

R001

C01

No

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1.4.1.2 Board Structure

This section describes the appearance and structures of boards and cards.

Structure of the Integrated Board

The integrated board on the USG9500 is a plug-in board and consists of a circuit board,

connectors, upward and downward ejector levers, setscrews, and a bolt, as shown in Figure

1-44.

Figure 1-44 Structure of the integrated board

1. Ejector lever

2. Captive screw

3. Connector

4. Bolt

Structure of the flexible board

A flexible board consists of two parts:

 Motherboard

 Flexible subcard

The flexible board is a plug-in board and consists of the circuit board, connector, heat sinks,

ejector lever, and captive screws, as shown in Figure 1-45.

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Figure 1-45 Structure of the flexible board

1. Ejector lever

2. Subcard slot 0

3. Subcard slot 1

4. Captive screw

5. Connector

The flexible subcard is a plug-in board and consists of the circuit board, connector, heat sinks,

ejector lever, and captive screws, as shown in Figure 1-46.

Figure 1-46 Structure of the flexible subcard

1. Circuit board

2. Captive screw

3. Connector

4. Heat sinks

1.4.1.3 Rules for Numbering Slots and Interfaces

The section describes the rule for numbering board slots, card slots, and interfaces.

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Board Slot Numbering

Slots are numbered in left-right and top-down order. The slot number is marked on the slots.

Use the USG9560 as an example. Slot numbers start from 1 and range from 1 to 8, as shown

in Figure 1-47.

Figure 1-47 Slot layout on the USG9560

Card Numbering

The slot numbers start from 0. The numbering rules are as follows:

 For the cards without subcards, the default subcard slot number is 0, as shown in Figure

1-48.

Figure 1-48 Subcard slot numbering for the cards without subcards

 For the cards with subcards, if a card provides only half-width subcards, the subcard slot

numbers are 0 and 1, as shown in Figure 1-49.

Figure 1-49 Subcard slot numbering for the cards providing only half-width subcards

 For the cards with subcards, if a card provides both half-width and one-quarter-width

subcards, such as LPUF-101, the subcard slot number is related to the type of inserted

subcards, as shown in Figure 1-50.

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Figure 1-50 Subcard slot numbering for the cards providing half-width and

one-quarter-width subcards

Interface Numbering

Interfaces are named in the format of LPU slot/FPIC slot/interface number.

Interfaces are numbered from 0 in right-left and top-down order.

Interfaces are arranged in a single row or two rows. Figure 1-51 shows how interfaces are

numbered.

Figure 1-51 Interface numbers

Use the USG9560 as an example. As shown in Figure 7, the LPU slot number is 7, the FPIC

slot number is 1, and the interface number is 2. Therefore, the interface is named 7/1/2.

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If the LPU is a fixed interface board, the FPIC slot number is considered 0.

1.4.2 MPUs and SRUs

The MPU/SRU controls the system in a centralized manner and learns routing information. It

is the controlling center of the system.

1.4.2.1 EKEX16-FWCD00MPUB00

EKEX16-FWCD00MPUB00 is the USG9580 MPU. It is hot-swappable.

Panel

Figure 1-52 shows the appearance of the EKEX16-FWCD00MPUB00.

Figure 1-52 Appearance of the EKEX16-FWCD00MPUB00

Name

Description

Buttons and indicators on the panel

OFL button

To remove a board, you must press and hold the button for six

seconds until the OFL indicator turns on.

NOTE

This button takes effect only on the slave MPU.

OFL indicator (red)

Steady on: You can remove the board.

RUN indicator (green)

 Blinks every two seconds (0.5 Hz): The system is running

normally.

 Blinks twice each second (2 Hz): The system is in the alarm

state.

ALM indicator (red)

 Steady on: The system is in the alarm state.

 Off: The system is running normally.

ACT active/standby

indicator (green)

 Steady on: The MPU is in the active state.

 Off: The MPU is in the standby state.

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Name

Description

RESET button

The button is used for resetting the MPU. If you press the

RESET button, you can reset the MPU.

CF card slot, button, and indicator

CF SLOT2

MPUs of the USG9580 have two CF cards numbered CF card

1 and CF card 2.

CF card 1 lies on the circuit board of the MPU and is used to

store system files and configuration files. CF card 2 lies on the

panel of the MPU and is used to store logs and alarms.

CF ACT indicator

(green)

 On: The CF is in position.

 Blinking: Data is being read or written.

 Off: The CF is not in position or can be removed.

CF OFL button

If you press the CF OFL button, all operations on the CF card

will be ended and the CF card will be powered off.

Interfaces and indicators

CTL-ETH-SFP interface

(1000MBase-X)

It is reserved for the use after capacity expansion.

SFP LINK/ACT

indicator (green)

 Steady on: The link is normal.

 Blinking: Data is being transmitted.

MGMT-ETH interface

(10M/100M/1000M

Base-TX auto-sensing)

It connects to the NMS workstation and has LINK and ACT

indicators.

MGMT-ETH LINK

indicator (green) (on

Ethernet network

interfaces)

 Steady on: The link is normal.

 Off: The link is Down.

MGMT-ETH ACT

indicator (amber) (on

Ethernet interfaces)

 Blinking: Data is being transmitted.

 Off: No data is being transmitted.

Console interface

It connects to the console for on-site configuration of the

system.

AUX interface

It connects to the Modem for remote maintenance through

dialing.

Others

USB interface

It is not used and reserved.

CLK/TOD0

They are reserved to input or output clock signals.

CLK/TOD1

CLK/1PPS

CLK/Serial

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Interface Attributes

Table 1-38 lists the 1000MBase-X-SFP interface attributes.

Table 1-38 1000MBase-X-SFP interface attributes

Attribute

Description

Connector type

SFP

Operation mode

1000M fiber

Standard compliance

IEEE 802.3-2002

Cable specification

Single-mode or multi-mode fibers

Table 1-39 lists the attributes of the 10Base-T/100Base-TX/1000Base-T-RJ45 interfaces.

Table 1-39 10Base-T/100Base-TX/1000Base-T-RJ45 interface attributes

Attribute

Description

Connector type

RJ45

Operation mode

10M/100M/1000M auto-sensing interfaces, supporting

full-duplex mode

Standard compliance

IEEE 802.3-2002

Cable specification

Category 5 unshielded twisted pair (UTP) cables recommended

when the interface rate is 10 Mbit/s or 100 Mbit/s; super

category 5 Shielded Twisted Pair (STP) cables recommended

when the interface rate is 1000 Mbit/s

Table 1-40 lists the console interface attributes.

Table 1-40 Console interface attributes

Attribute

Description

Connector type

RJ45

Operation mode

Duplex Universal Asynchronous Receiver/Transmitter

(UART)

Electrical attribute

RS-232

Baud rate

9600 bit/s (default value), which can be changed as required

Data equipment type

Data Circuit-terminating Equipment (DCE)

Cable specification

8-core shielded cable

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Table 1-41 lists the AUX interface attributes.

Table 1-41 AUX interface attributes

Attribute

Description

Connector Type

RJ45

Operation mode

Duplex UART

Electrical attribute

RS-232

Baud rate

9600 bit/s (default value), which can be changed as required

Data equipment type

Data Terminal Equipment (DTE)

Cable specification

8-core shielded cable

Technical Specifications

Table 1-42 shows the technical specifications of the EKEX16-FWCD00MPUB00.

Table 1-42 Technical specifications of the EKEX16-FWCD00MPUB00

Item

Description

Silkscreen of the board

name

MPUB

Dimensions (W x D x H)

398.5 mm x 554 mm x 40.5 mm

Power consumption

(typical value)

85 W

Heat dissipation

290.02 BTU/hour

Board weight

4.2 kg

1.4.2.2 E8KE-X8-SRUA-200

E8KE-X8-SRUA-200 is the USG9560 SRU. It is hot-swappable. E8KE-X8-SRUA-200

integrates not only a master control unit but also a switch fabric unit for data switching.

Panel

Figure 1-53 shows the appearance of the E8KE-X8-SRUA-200.

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Figure 1-53 Appearance of the E8KE-X8-SRUA-200

Name

Description

Buttons and indicators on the panel

OFL button

To remove a board, you must press and hold the button for six

seconds until the OFL indicator turns on.

NOTE

This button takes effect only on the slave SRU.

OFL indicator (red)

Steady on: You can remove the board.

RUN indicator (green)

 Blinks every two seconds (0.5 Hz): The system is running

normally.

 Blinks twice each second (2 Hz): The system is in the alarm

state.

ALM indicator (red)

 Steady on: The system is in the alarm state.

 Off: The system is running normally.

ACT active/standby

indicator (green)

 Steady on: The SRU is in the active state.

 Off: The SRU is in the standby state.

RESET button

The button is used for resetting the SRU. If you press the

RESET button, you can reset the SRU.

CF card slot, button, and indicator

CF SLOT2

SRUs of the USG9560 have two CF cards numbered CF card 1

and CF card 2.

CF card 1 lies on the circuit board of the SRU and is used to

store system files and configuration files. CF card 2 lies on the

panel of the SRU and is used to store logs and alarms.

CF ACT indicator

(green)

 On: The CF is in position.

 Blinking: Data is being read or written.

 Off: The CF is not in position or can be removed.

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Name

Description

CF OFL button

If you press the CF OFL button, all operations on the CF card

will be ended and the CF card will be powered off.

Interfaces and indicators

CTL-ETH-SFP interface

(1000MBase-X)

It is reserved for the use after capacity expansion.

SFP LINK/ACT

indicator (green)

 Steady on: The link is normal.

 Blinking: Data is being transmitted.

MGMT-ETH interface

(10M/100M/1000M

Base-TX auto-sensing)

It connects to the NMS workstation and has LINK and ACT

indicators.

MGMT-ETH LINK

indicator (green) (on

Ethernet network

interfaces)

 Steady on: The link is normal.

 Off: The link is Down.

MGMT-ETH ACT

indicator (amber) (on

Ethernet interfaces)

 Blinking: Data is being transmitted.

 Off: No data is being transmitted.

Console interface

It connects to the console for on-site configuration of the

system.

AUX interface

It connects to the Modem for remote maintenance through

dialing.

Others

USB interface

It is not used and reserved.

CLK/TOD0

They are reserved to input or output clock signals.

CLK/TOD1

CLK/1PPS

CLK/Serial

Interface Attributes

Table 1-43 lists the 1000MBase-X-SFP interface attributes.

Table 1-43 1000MBase-X-SFP interface attributes

Attribute

Description

Connector type

SFP

Operation mode

1000M fiber

Standard compliance

IEEE 802.3-2002

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Attribute

Description

Cable specification

Single-mode or multi-mode fibers

Table 1-44 lists the attributes of the 10Base-T/100Base-TX/1000Base-T-RJ45 interfaces.

Table 1-44 10Base-T/100Base-TX/1000Base-T-RJ45 interface attributes

Attribute

Description

Connector type

RJ45

Operation mode

10M/100M/1000M auto-sensing interfaces, supporting

full-duplex mode

Standard compliance

IEEE 802.3-2002

Cable specification

Category 5 unshielded twisted pair (UTP) cables recommended

when the interface rate is 10 Mbit/s or 100 Mbit/s; super

category 5 Shielded Twisted Pair (STP) cables recommended

when the interface rate is 1000 Mbit/s

Table 1-45 lists the console interface attributes.

Table 1-45 Console interface attributes

Attribute

Description

Connector type

RJ45

Operation mode

Duplex Universal Asynchronous Receiver/Transmitter

(UART)

Electrical attribute

RS-232

Baud rate

9600 bit/s (default value), which can be changed as required

Data equipment type

Data Circuit-terminating Equipment (DCE)

Cable specification

8-core shielded cable

Table 1-46 lists the AUX interface attributes.

Table 1-46 AUX interface attributes

Attribute

Description

Connector Type

RJ45

Operation mode

Duplex UART

Electrical attribute

RS-232

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Attribute

Description

Baud rate

9600 bit/s (default value), which can be changed as required

Data equipment type

Data Terminal Equipment (DTE)

Cable specification

8-core shielded cable

Technical Specifications

Table 1-47 shows the technical specifications of the E8KE-X8-SRUA-200.

Table 1-47 Technical specifications of the E8KE-X8-SRUA-200

Item

Description

Silkscreen of the board

name

SRUA

Dimensions (W x D x H)

398.5 mm x 554 mm x 35 mm

Power consumption

(typical value)

149 W

Heat dissipation

508.39 BTU/hour

Board weight

4.8 kg

1.4.2.3 E8KE-X3-MPU

E8KE-X3-MPU is the USG9520 MPU. It is hot-swappable.

Panel

Figure 1-54 shows the appearance of the E8KE-X3-MPU.

Figure 1-54 Appearance of the E8KE-X3-MPU

This MPU uses a USB storage device. This USB storage device is installed on the PCB and is not

replaceable. To be compatible with the MPUs that use CF cards as storage devices, the USB storage

device is displayed as a CF card during a file operation, while is displayed as USB during an MPU

restart.

Name

Description

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Name

Description

Buttons and indicators on the panel

OFL button

To remove a board, you must press and hold the button for six

seconds until the OFL indicator turns on.

NOTE

This button takes effect only on the slave MPU.

OFL indicator (red)

Steady on: You can remove the board.

RUN indicator (green)

 Blinks every two seconds (0.5 Hz): The system is running

normally.

 Blinks twice each second (2 Hz): The system is in the alarm

state.

ALM indicator (red)

 Steady on: The system is in the alarm state.

 Off: The system is running normally.

ACT active/standby

indicator (green)

 Steady on: The MPU is in the active state.

 Off: The MPU is in the standby state.

RESET button

The button is used for resetting the MPU. If you press the

RESET button, you can reset the MPU.

Interfaces and indicators

MGMT-ETH interface

(10M/100M/1000M

Base-TX auto-sensing)

It connects to the NMS workstation and has LINK and ACT

indicators.

MGMT-ETH LINK

indicator (green) (on

Ethernet network

interfaces)

 Steady on: The link is normal.

 Off: The link is Down.

MGMT-ETH ACT

indicator (amber) (on

Ethernet interfaces)

 Blinking: Data is being transmitted.

 Off: No data is being transmitted.

Console interface

It connects to the console for on-site configuration of the

system.

AUX interface

It connects to the Modem for remote maintenance through

dialing.

Others

CLK

They are reserved to input or output clock signals.

TOD

Interface Attributes

Table 1-48 lists the attributes of the 10Base-T/100Base-TX/1000Base-T-RJ45 interfaces.

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Table 1-48 10Base-T/100Base-TX/1000Base-T-RJ45 interface attributes

Attribute

Description

Connector type

RJ45

Operation mode

10M/100M/1000M auto-sensing interfaces, supporting

full-duplex mode

Standard compliance

IEEE 802.3-2002

Cable specification

Category 5 unshielded twisted pair (UTP) cables recommended

when the interface rate is 10 Mbit/s or 100 Mbit/s; super

category 5 Shielded Twisted Pair (STP) cables recommended

when the interface rate is 1000 Mbit/s

Table 1-49 lists the console interface attributes.

Table 1-49 Console interface attributes

Attribute

Description

Connector type

RJ45

Operation mode

Duplex Universal Asynchronous Receiver/Transmitter

(UART)

Electrical attribute

RS-232

Baud rate

9600 bit/s (default value), which can be changed as required

Data equipment type

Data Circuit-terminating Equipment (DCE)

Cable specification

8-core shielded cable

Table 1-50 lists the AUX interface attributes.

Table 1-50 AUX interface attributes

Attribute

Description

Connector Type

RJ45

Operation mode

Duplex UART

Electrical attribute

RS-232

Baud rate

9600 bit/s (default value), which can be changed as required

Data equipment type

Data Terminal Equipment (DTE)

Cable specification

8-core shielded cable

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Technical Specifications

Table 1-51 shows the technical specifications of the E8KE-X3-MPU.

Table 1-51 Technical specifications of the E8KE-X3-MPU

Item

Description

Silkscreen of the board

name

MPU

E8KE-X3-MPU

Dimensions (W x D x H)

198.5 mm x 551 mm x 40 mm

Power consumption

(typical value)

32 W

Heat dissipation

103.82 BTU/hour

Board weight

1.7 kg

1.4.2.4 MPUD

MPUD is the USG9520 MPU. It is hot-swappable.

MPUD Panel

Figure 1-55 shows the appearance of the panel.

The CF card is not hot swappable.

Figure 1-55 Appearance of the panel

1. Ejector

lever

2. BITS0 (not in

use currently)

3. BITS1 (not in use currently)

4. ETH0

5. CF OFL

button

6. CF indicator

7. CF card slot (the other CF card

slot is on the circuitry board)

8. Reset

button

9. OFL

button

10. OFL indicator

11. ACT indicator

12. ALM

indicator

13. RUN

14. Console

15. AUX interface

-

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indicator

Table 1-52 describes the buttons and indicators on the MPUD panel.

Table 1-52 Buttons and indicators on the MPUD panel

Indicator/Button

Description

OFL button

To remove a board, you must press and hold the button for six

seconds until the OFL indicator turns on.

NOTE

This button takes effect only on the slave MPUD.

OFL indicator (red)

If the indicator is on, you can remove the board.

RUN indicator (green)

If the indicator blinks once every two seconds (0.5 Hz), the

system is in the normal state. If the indicator blinks twice each

second (2 Hz), the system is in the alarm state.

ALM indicator (red)

If the indicator is steady on, the system is in the alarm state.

If the indicator is steady off, the system is in the normal state.

ACT active/standby

indicator (green)

If the indicator is on, the MPUD is in the active state.

If the indicator is off, the MPUD is in the standby state.

RESET button

The button is used for resetting the MPUD. Press the RESET

button, and you can reset the MPUD.

CF ACT indicator

(green)

If the indicator is on, the CF is in position.

If the indicator is blinking, data is being read or written.

If the indicator is off, the CF is not in position or can be

removed.

LINK indicator (green)

(on the Ethernet

interface)

If the indicator is steady on, the link is normal.

If the indicator is off, the link is Down.

ACT indicator (amber)

(on Ethernet interfaces)

If the indicator is blinking, data is being transmitted.

If the indicator is off, no data is being transmitted.

Table 1-53 describes the interfaces on the MPUD and their uses.

Table 1-53 Interfaces on the MPUD and their uses

Interface Name

Connector

Type

Description

Eth0 (10M/100M/1000M

Base-TX auto-sensing)

RJ45

It connects to the NMS workstation and has

LINK and ACT indicators.

Console interface

RJ45

It connects to the console for on-site

configuration of the system.

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Interface Name

Connector

Type

Description

AUX interface

RJ45

It connects to the Modem for remote

maintenance through dialing.

CF card interface

TYPE II

standard

(compatible

with TYPE I

standard)

It is used to hold a CF card to store data

files as a massive storage device.

Interface Attributes

Table 1-54 lists the attributes of the 10Base-T/100Base-TX/1000Base-T-RJ45 interfaces.

Table 1-54 10Base-T/100Base-TX/1000Base-T-RJ45 interface attributes

Attribute

Description

Connector type

RJ45

Operation mode

10M/100M/1000M auto-sensing interfaces, supporting

full-duplex mode

Standard compliance

IEEE 802.3-2002

Cable specification

Category 5 unshielded twisted pair (UTP) cables recommended

when the interface rate is 10 Mbit/s or 100 Mbit/s; super

category 5 Shielded Twisted Pair (STP) cables recommended

when the interface rate is 1000 Mbit/s

Table 1-55 lists the console interface attributes.

Table 1-55 Console interface attributes

Attribute

Description

Connector type

RJ45

Operation mode

Duplex Universal Asynchronous Receiver/Transmitter

(UART)

Electrical attribute

RS-232

Baud rate

9600 bit/s (default value), which can be changed as required

Data equipment type

Data Circuit-terminating Equipment (DCE)

Cable specification

8-core shielded cable

Table 1-56 lists the AUX interface attributes.

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Table 1-56 AUX interface attributes

Attribute

Description

Connector type

RJ45

Operation mode

Duplex UART

Electrical attribute

RS-232

Baud rate

9600 bit/s (default value), which can be changed as required

Data equipment type

Data Terminal Equipments (DTE)

Cable specification

8-core shielded cable

Technical Specifications

Table 1-57 shows the technical specifications of the MPUD.

Table 1-57 Technical specifications of the MPUD

Item

Description

Silkscreen of the board

name

MPUD

Dimensions (W x D x H)

198.5 mm x 551 mm x 40 mm

Power consumption

(typical value)

41 W

Board weight

2 kg

1.4.3 SFUs

An SFU is responsible for data switching between boards. The USG9520 does not support the

SFU.

1.4.3.1 E8KE-X16-SFUC-200SP

E8KE-X16-SFUC-200SP is the USG9580 SFU. It uses the non-blocking switch fabric. It is

hot-swappable and responsible for data switching of the entire system.

Panel

Figure 1-56 shows the appearance of the E8KE-X16-SFUC-200SP.

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Figure 1-56 Appearance of the E8KE-X16-SFUC-200SP

Name

Description

OFL button

To remove a board, you must press and hold the button for six

seconds until the OFL indicator turns on.

OFL indicator (red)

Steady on: You can remove the board.

RUN indicator (green)

 Blinks every two seconds (0.5 Hz): The system is running

normally.

 Blinks twice each second (2 Hz): The system is in the alarm

state.

ACT (green)

 Steady on: The SFU is working normally.

 Off: The SFU is faulty.

Interface Attributes

The E8KE-X16-SFUC-200SP does not provide interfaces externally.

Technical Specifications

Table 1-58 shows the technical specifications of the E8KE-X16-SFUC-200SP.

Table 1-58 Technical specifications of the E8KE-X16-SFUC-200SP

Item

Description

Silkscreen of the board

name

SFUI-200-B

Dimensions (W x D x H)

410 mm x 553.5 mm x 40.5 mm

Power consumption

(typical value)

90 W

Heat dissipation

307.08 BTU/hour

Board weight

4.26 kg

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1.4.3.2 E8KE-X8-SFUC-200

E8KE-X8-SFUC-200 is the USG9560 SFU. It uses the non-blocking switch fabric. It is

hot-swappable and responsible for data switching of the entire system.

Panel

Figure 1-57 shows the appearance of the E8KE-X8-SFUC-200.

Figure 1-57 Appearance of the E8KE-X8-SFUC-200

Name

Description

OFL button

To remove a board, you must press and hold the button for six

seconds until the OFL indicator turns on.

OFL indicator (red)

Steady on: You can remove the board.

RUN indicator (green)

 Blinks every two seconds (0.5 Hz): The system is running

normally.

 Blinks twice each second (2 Hz): The system is in the alarm

state.

ACT (green)

 Steady on: The SFU is working normally.

 Off: The SFU is faulty.

Interface Attributes

The E8KE-X8-SFUC-200 does not provide interfaces externally.

Technical Specifications

Table 1-59 shows the technical specifications of the E8KE-X8-SFUC-200.

Table 1-59 Technical specifications of the E8KE-X8-SFUC-200

Item

Description

Silkscreen of the board

name

SFUI-200-C

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Item

Description

Dimensions (W x D x H)

400 mm x 553.5 mm x 35 mm

Power consumption

(typical value)

77 W

Heat dissipation

262.72 BTU/hour

Board weight

3.82 kg

1.4.4 SPUs and SPCs

An SPU is a unit responsible for security service processing.

1.4.4.1 X3 SPU (SPU-X3-B)

The SPU-X3-B applies to the USG9520 platform and is a mother board. By default, this board

does not have any service processing capability and must be used together with subcards. This

board has two slots, and each slot can house a firewall SPC or application security SPC.

The SPU-X3-B is inserted into the LPU/SPU slot of the USG9520.

The board is hot swappable.

Panel

Figure 1-58 shows the appearance of the SPU-X3-B.

Figure 1-58 Appearance of the SPU-X3-B

Name

Description

OFL button

To remove a board, you must press and hold the button for six

seconds until the OFL indicator turns on.

OFL indicator (red)

Steady on: You can remove the board.

RUN indicator (green)

 Blinks every two seconds (0.5 Hz): The board is running

normally.

 Blinks four each second (4 Hz): The board is in the alarm

state or starting and not registered.

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Interface Attributes

The SPU-X3-B does not provide interfaces externally.

Technical Specifications

Table 1-60 shows the technical specifications of the SPU-X3-B.

Table 1-60 Technical specifications of the SPU-X3-B

Item

Description

Silkscreen of the board

name

SPUC

SPU-X3-B

Dimensions (W x D x H)

400 mm x 520 mm x 41 mm

Power consumption

(typical value)

116 W

Heat dissipation

395.79 BTU/hour

Board weight

5.23 kg

Maximum input voltage

range (DC)

-72 V to -38 V

CPU

1.2 GHz

1.4.4.2 X3 SPU (SPU-X3-B2)

The SPU-X3-B2 applies to the USG9520 platform and is a mother board. By default, this

board does not have any service processing capability and must be used together with

subcards. This board has one available slot, and the slot can house a firewall SPC or

application security SPC.

The SPU-X3-B2 is inserted into the LPU/SPU slot of the USG9520.

The board is hot swappable.

Panel

Figure 1-59 shows the appearance of the SPU-X3-B2.

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Figure 1-59 Appearance of the SPU-X3-B2

Name

Description

OFL button

To remove a board, you must press and hold the button for six

seconds until the OFL indicator turns on.

OFL indicator (red)

Steady on: You can remove the board.

RUN indicator (green)

 Blinks every two seconds (0.5 Hz): The board is running

normally.

 Blinks four each second (4 Hz): The board is in the alarm

state or starting and not registered.

Interface Attributes

The SPU-X3-B2 does not provide interfaces externally.

Technical Specifications

Table 1-61 shows the technical specifications of the SPU-X3-B2.

Table 1-61 Technical specifications of the SPU-X3-B2

Item

Description

Silkscreen of the board

name

SPUE

SPU-X3-B2

Dimensions (W x D x H)

400 mm x 520 mm x 41 mm

Power consumption

(typical value)

80 W

Heat dissipation

204.71 BTU/hour

Board weight

5.18 kg

Maximum input voltage

range (DC)

-72 V to -38 V

CPU

1.6 GHz

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1.4.4.3 X8&X16 SPU (SPU-X8X16-B)

The SPU-X8X16-B applies to the USG9560 and USG9580 platforms and is a mother board.

By default, this board does not have any service processing capability and must be used

together with subcards. Each slot can house a firewall SPC or application security SPC.

The SPU-X8X16-B is inserted into the LPU/SPU slot of the USG9560 and USG9580.

The board is hot swappable.

Panel

Figure 1-60 shows the appearance of the SPU-X8X16-B.

Figure 1-60 Appearance of the SPU-X8X16-B

Name

Description

OFL button

To remove a board, you must press and hold the button for six

seconds until the OFL indicator turns on.

OFL indicator (red)

Steady on: You can remove the board.

RUN indicator (green)

 Blinks every two seconds (0.5 Hz): The board is running

normally.

 Blinks four each second (4 Hz): The board is in the alarm

state or starting and not registered.

Interface Attributes

The SPU-X8X16-B does not provide interfaces externally.

Technical Specifications

Table 1-62 shows the technical specifications of the SPU-X8X16-B.

Table 1-62 Technical specifications of the SPU-X8X16-B

Item

Description

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Item

Description

Silkscreen of the board

name

SPUD

SPU-X8X16-B

Dimensions (W x D x H)

400 mm x 520 mm x 41 mm

Power consumption

(typical value)

125 W

Heat dissipation

426.5 BTU/hour

Board weight

5.34 kg

Maximum input voltage

range (DC)

-72 V to -38 V

CPU

1.2 GHz

1.4.4.4 Firewall Service Processing Unit (SPU-X3-20-O-E8KE, for USG9520)

The SPU-X3-20-O-E8KE is inserted into the LPU/SPU slot of the USG9520, provides an

expansion slot, and is hot swappable.

Panel

Figure 1-61 shows the appearance of the SPU-X3-20-O-E8KE.

Figure 1-61 Appearance of the SPU-X3-20-O-E8KE

Name

Description

SPU

OFL button

To remove an SPU, you must press and hold the OFL button

for six seconds until the OFL indicator turns on.

OFL indicator (red)

Steady on: You can remove the SPU.

RUN indicator (green)

 Blinks every two seconds (0.5 Hz): The SPU is running

normally.

 Blinks four times every second (4 Hz): The SPU is in the

alarm state or starting but not registered.

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Name

Description

SPC

! NOT SWAP

The SPC and SPU in one slot share one sales code. Either the

SPC or SPU cannot be separately replaced.

OFL button

To remove an SPC, you must press and hold the OFL button

for six seconds until the OFL indicator turns red for one second

and then turns off.

OFL indicator

 If the indicator is green and blinks once every second (1

Hz), the SPC is running normally.

 If the indicator is green and blinks four times every second

(4 Hz), the SPC is in the alarm state or starting but not

registered.

 If the indicator turns red for one second and then turns off,

you can remove the SPC securely.

Interface Attributes

The SPU-X3-20-O-E8KE does not provide interfaces externally.

Technical Specifications

Table 1-63 shows the technical specifications of the SPU-X3-20-O-E8KE.

Table 1-63 Technical specifications of the SPU-X3-20-O-E8KE

Item

Description

Silkscreen of the board

name

SPUC

SPU-X3-20-O-E8KE

Dimensions (W x D x H)

400 mm x 520 mm x 41 mm

Power consumption

(typical value)

255 W

Heat dissipation

870.06 BTU/hour

Board weight

6.85 kg

Maximum input voltage

range (DC)

-72 V to -38 V

CPU number

2

CPU

1.2 GHz

Memory

DDR3 16 GB/CPU

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1.4.4.5 Firewall Service Processing Unit (SPUA-20-O-M, for USG9520)

The SPUA-20-O-M is inserted into the LPU/SPU slot of the USG9520, provides no

expansion slot, and is hot swappable.

Panel

Figure 1-62 shows the appearance of the SPUA-20-O-M.

Figure 1-62 Appearance of the SPUA-20-O-M

Name

Description

SPU

OFL button

To remove an SPU, you must press and hold the OFL button

for six seconds until the OFL indicator turns on.

OFL indicator (red)

Steady on: You can remove the SPU.

RUN indicator (green)

 Blinks every two seconds (0.5 Hz): The SPU is running

normally.

 Blinks four times every second (4 Hz): The SPU is in the

alarm state or starting but not registered.

SPC

! NOT SWAP

The SPC and SPU in one slot share one sales code. Either the

SPC or SPU cannot be separately replaced.

OFL button

To remove an SPC, you must press and hold the OFL button

for six seconds until the OFL indicator turns red for one second

and then turns off.

OFL indicator

 If the indicator is green and blinks once every second (1

Hz), the SPC is running normally.

 If the indicator is green and blinks four times every second

(4 Hz), the SPC is in the alarm state or starting but not

registered.

 If the indicator turns red for one second and then turns off,

you can remove the SPC securely.

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Interface Attributes

The SPUA-20-O-M does not provide interfaces externally.

Technical Specifications

Table 1-64 shows the technical specifications of the SPUA-20-O-M.

Table 1-64 Technical specifications of the SPUA-20-O-M

Item

Description

Silkscreen of the board

name

SPUE

SPUA-20-O-M

Dimensions (W x D x H)

400 mm x 520 mm x 41 mm

Power consumption

(typical value)

180 W

Heat dissipation

661.89 BTU/hour

Board weight

6.48 kg

Maximum input voltage

range (DC)

-72 V to -38 V

CPU number

1

CPU

1.6 GHz

Memory

DDR4 32GB

1.4.4.6 Firewall Service Processing Unit (SPUB-20-O-M, for USG9520)

The SPUB-20-O-M is inserted into the LPU/SPU slot of the USG9520, provides no expansion

slot, and is hot swappable.

Panel

Figure 1-63 shows the appearance of the SPUB-20-O-M.

Figure 1-63 Appearance of the SPUB-20-O-M

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Name

Description

SPU

OFL button

To remove an SPU, you must press and hold the OFL button

for six seconds until the OFL indicator turns on.

OFL indicator (red)

Steady on: You can remove the SPU.

RUN indicator (green)

 Blinks every two seconds (0.5 Hz): The SPU is running

normally.

 Blinks four times every second (4 Hz): The SPU is in the

alarm state or starting but not registered.

SPC

! NOT SWAP

The SPC and SPU in one slot share one sales code. Either the

SPC or SPU cannot be separately replaced.

OFL button

To remove an SPC, you must press and hold the OFL button

for six seconds until the OFL indicator turns red for one second

and then turns off.

OFL indicator

 If the indicator is green and blinks once every second (1

Hz), the SPC is running normally.

 If the indicator is green and blinks four times every second

(4 Hz), the SPC is in the alarm state or starting but not

registered.

 If the indicator turns red for one second and then turns off,

you can remove the SPC securely.

Interface Attributes

The SPUB-20-O-M does not provide interfaces externally.

Technical Specifications

Table 1-65 shows the technical specifications of the SPUB-20-O-M.

Table 1-65 Technical specifications of the SPUB-20-O-M

Item

Description

Silkscreen of the board

name

SPUE

SPUB-20-O-M

Dimensions (W x D x H)

400 mm x 520 mm x 41 mm

Power consumption

(typical value)

280 W

Heat dissipation

1003.08 BTU/hour

Board weight

6.6 kg

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Item

Description

Maximum input voltage

range (DC)

-72 V to -38 V

CPU number

2

CPU

1.6 GHz

Memory

DDR4 32GB/CPU

1.4.4.7 Firewall Service Processing Unit (SPU-X8X16-20-O-E8KE, for

USG9560/USG9580)

The SPU-X8X16-20-O-E8KE is inserted into the LPU/SPU slot of the USG9560 and

USG9580, provides an expansion slot, and is hot swappable.

Panel

Figure 1-64 shows the appearance of the SPU-X8X16-20-O-E8KE.

Figure 1-64 Appearance of the SPU-X8X16-20-O-E8KE

Name

Description

SPU

OFL button

To remove an SPU, you must press and hold the OFL button

for six seconds until the OFL indicator turns on.

OFL indicator (red)

Steady on: You can remove the SPU.

RUN indicator (green)

 Blinks every two seconds (0.5 Hz): The SPU is running

normally.

 Blinks four times every second (4 Hz): The SPU is in the

alarm state or starting but not registered.

SPC

! NOT SWAP

The SPC and SPU in one slot share one sales code. Either the

SPC or SPU cannot be separately replaced.

OFL button

To remove an SPC, you must press and hold the OFL button

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Name

Description

for six seconds until the OFL indicator turns red for one second

and then turns off.

OFL indicator

 If the indicator is green and blinks once every second (1

Hz), the SPC is running normally.

 If the indicator is green and blinks four times every second

(4 Hz), the SPC is in the alarm state or starting but not

registered.

 If the indicator turns red for one second and then turns off,

you can remove the SPC securely.

Interface Attributes

The SPU-X8X16-20-O-E8KE does not provide interfaces externally.

Technical Specifications

Table 1-66 shows the technical specifications of the SPU-X8X16-20-O-E8KE.

Table 1-66 Technical specifications of the SPU-X8X16-20-O-E8KE

Item

Description

Silkscreen of the board

name

SPUD

SPU-X8X16-20-O-E8KE

Dimensions (W x D x H)

400 mm x 520 mm x 41 mm

Power consumption

(typical value)

284 W

Heat dissipation

969 BTU/hour

Board weight

6.96 kg

Maximum input voltage

range (DC)

-72 V to -38 V

CPU number

2

CPU

1.2 GHz

Memory

DDR3 16 GB/CPU

1.4.4.8 Firewall Service Processing Unit (SPUA-20-O-H, for

USG9560/USG9580)

The SPUA-20-O-H is inserted into the LPU/SPU slot of the USG9560 and USG9580,

provides an expansion slot, and is hot swappable.

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Panel

Figure 1-65 shows the appearance of the SPUA-20-O-H.

Figure 1-65 Appearance of the SPUA-20-O-H

Name

Description

SPU

OFL button

To remove an SPU, you must press and hold the OFL button

for six seconds until the OFL indicator turns on.

OFL indicator (red)

Steady on: You can remove the SPU.

RUN indicator (green)

 Blinks every two seconds (0.5 Hz): The SPU is running

normally.

 Blinks four times every second (4 Hz): The SPU is in the

alarm state or starting but not registered.

SPC

! NOT SWAP

The SPC and SPU in one slot share one sales code. Either the

SPC or SPU cannot be separately replaced.

OFL button

To remove an SPC, you must press and hold the OFL button

for six seconds until the OFL indicator turns red for one second

and then turns off.

OFL indicator

 If the indicator is green and blinks once every second (1

Hz), the SPC is running normally.

 If the indicator is green and blinks four times every second

(4 Hz), the SPC is in the alarm state or starting but not

registered.

 If the indicator turns red for one second and then turns off,

you can remove the SPC securely.

Interface Attributes

The SPUA-20-O-H does not provide interfaces externally.

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Technical Specifications

Table 1-67 shows the technical specifications of the SPUA-20-O-H.

Table 1-67 Technical specifications of the SPUA-20-O-H

Item

Description

Silkscreen of the board

name

SPUD

SPUA-20-O-H

Dimensions (W x D x H)

400 mm x 520 mm x 41 mm

Power consumption

(typical value)

215 W

Heat dissipation

852.96 BTU/hour

Board weight

6.64 kg

Maximum input voltage

range (DC)

-72 V to -38 V

CPU number

1

CPU

1.6 GHz

Memory

DDR4 32GB

1.4.4.9 Firewall Service Processing Unit (SPUB-20-O-H, for

USG9560/USG9580)

The SPUB-20-O-H is inserted into the LPU/SPU slot of the USG9560 and USG9580,

provides an expansion slot, and is hot swappable.

Panel

Figure 1-66 shows the appearance of the SPUB-20-O-H.

Figure 1-66 Appearance of the SPUB-20-O-H

Name

Description

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Name

Description

SPU

OFL button

To remove an SPU, you must press and hold the OFL button

for six seconds until the OFL indicator turns on.

OFL indicator (red)

Steady on: You can remove the SPU.

RUN indicator (green)

 Blinks every two seconds (0.5 Hz): The SPU is running

normally.

 Blinks four times every second (4 Hz): The SPU is in the

alarm state or starting but not registered.

SPC

! NOT SWAP

The SPC and SPU in one slot share one sales code. Either the

SPC or SPU cannot be separately replaced.

OFL button

To remove an SPC, you must press and hold the OFL button

for six seconds until the OFL indicator turns red for one second

and then turns off.

OFL indicator

 If the indicator is green and blinks once every second (1

Hz), the SPC is running normally.

 If the indicator is green and blinks four times every second

(4 Hz), the SPC is in the alarm state or starting but not

registered.

 If the indicator turns red for one second and then turns off,

you can remove the SPC securely.

Interface Attributes

The SPUB-20-O-H does not provide interfaces externally.

Technical Specifications

Table 1-68 shows the technical specifications of the SPUB-20-O-H.

Table 1-68 Technical specifications of the SPUB-20-O-H

Item

Description

Silkscreen of the board

name

SPUD

SPUB-20-O-H

Dimensions (W x D x H)

400 mm x 520 mm x 41 mm

Power consumption

(typical value)

320 W

Heat dissipation

1194.14 BTU/hour

Board weight

6.76 kg

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Item

Description

Maximum input voltage

range (DC)

-72 V to -38 V

CPU number

2

CPU

1.6 GHz

Memory

DDR4 32 GB/CPU

1.4.4.10 Firewall Performance Expansion Card (SPC-20-O-E8KE)

The SPC-20-O-E8KE is a dual-CPU service sub-card of the firewall service board, can be

inserted into a slot of the SPU, and is hot swappable.

Panel

Figure 1-67 shows the appearance of the SPC-20-O-E8KE.

Figure 1-67 Appearance of the SPC-20-O-E8KE

Name

Description

OFL button

To remove a board, you must press and hold the OFL button

for six seconds until the OFL indicator turns red for one second

and then turns off.

OFL indicator

 If the indicator is green and blinks once every second (1

Hz), the board is running normally.

 If the indicator is green and blinks four times every second

(4 Hz), the board is in the alarm state or starting but not

registered.

 If the indicator turns red for one second and then turns off,

you can remove the board securely.

Interface Attributes

The SPC-20-O-E8KE does not provide interfaces externally.

Technical Specifications

Table 1-69 lists the technical specifications of the SPC-20-O-E8KE.

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Table 1-69 Technical specifications of the SPC-20-O-E8KE

Item

Description

Silkscreen of the board

name

SPCB02

SPC-20-O-E8KE

Dimensions (W x D x H)

175 mm x 280 mm x 36 mm

Power consumption

(typical value)

159 W

Heat dissipation

542.51 BTU/hour

Board weight

1.62 kg

CPU number

2

CPU

1.2 GHz

Memory

DDR3 16 GB/CPU

1.4.4.11 Firewall Performance Expansion Card (SPCA-20-O-H&M)

The SPCA-20-O-H&M is a single-CPU service sub-card of the firewall service board, can be

inserted into a slot of the SPU, and is hot swappable.

Panel

Figure 1-68 shows the appearance of the SPCA-20-O-H&M.

Figure 1-68 Appearance of the SPCA-20-O-H&M

Name

Description

OFL button

To remove a board, you must press and hold the OFL button

for six seconds until the OFL indicator turns red for one second

and then turns off.

OFL indicator

 If the indicator is green and blinks once every second (1

Hz), the board is running normally.

 If the indicator is green and blinks four times every second

(4 Hz), the board is in the alarm state or starting but not

registered.

 If the indicator turns red for one second and then turns off,

you can remove the board securely.

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Interface Attributes

The SPCA-20-O-H&M does not provide interfaces externally.

Technical Specifications

Table 1-70 lists the technical specifications of the SPCA-20-O-H&M.

Table 1-70 Technical specifications of the SPCA-20-O-H&M

Item

Description

Silkscreen of the board

name

SPCF01

SPCA-20-O-H&M

Dimensions (W x D x H)

175 mm x 280 mm x 36 mm

Power consumption

(typical value)

90 W

Heat dissipation

477.66 BTU/hour

Board weight

1.30 kg

CPU number

1

CPU

1.6 GHz

Memory

DDR4 32 GB

1.4.4.12 Firewall Performance Expansion Card (SPCB-20-O-H&M)

The SPCB-20-O-H&M is a dual-CPU service sub-card of the firewall service board, can be

inserted into a slot of the SPU, and is hot swappable.

Panel

Figure 1-69 shows the appearance of the SPCB-20-O-H&M.

Figure 1-69 Appearance of the SPCB-20-O-H&M

Name

Description

OFL button

To remove a board, you must press and hold the OFL button

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Name

Description

for six seconds until the OFL indicator turns red for one second

and then turns off.

OFL indicator

 If the indicator is green and blinks once every second (1

Hz), the board is running normally.

 If the indicator is green and blinks four times every second

(4 Hz), the board is in the alarm state or starting but not

registered.

 If the indicator turns red for one second and then turns off,

you can remove the board securely.

Interface Attributes

The SPCB-20-O-H&M does not provide interfaces externally.

Technical Specifications

Table 1-71 lists the technical specifications of the SPCB-20-O-H&M.

Table 1-71 Technical specifications of the SPCB-20-O-H&M

Item

Description

Silkscreen of the board

name

SPCH01

SPCB-20-O-H&M

Dimensions (W x D x H)

175 mm x 280 mm x 36 mm

Power consumption

(typical value)

180 W

Heat dissipation

818.84 BTU/hour

Board weight

1.42 kg

CPU number

2

CPU

1.6 GHz

Memory

DDR4 32 GB/CPU

1.4.4.13 Application Security Service Processing Card (SPC-APPSEC-FW)

The SPC-APPSEC-FW is a dual-CPU subcard for processing application security services

and has an IAE to provide content security. This subcard takes up a slot on the mother board.

You can insert the SPC-APPSEC-FW independently in a slot on the mother board or use it

together with a firewall SPC on the mother board. This board is hot swappable.

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Panel

Figure 1-70 shows the appearance of the SPC-APPSEC-FW.

Figure 1-70 Appearance of the SPC-APPSEC-FW

Name

Description

OFL button

To remove a board, you must press and hold the OFL button

for six seconds until the OFL indicator turns red for one second

and then turns off.

OFL indicator

 If the indicator is green and blinks once every second (1

Hz), the board is running normally.

 If the indicator is green and blinks four times every second

(4 Hz), the board is in the alarm state or starting but not

registered.

 If the indicator turns red for one second and then turns off,

you can remove the board securely.

Interface Attributes

The SPC-APPSEC-FW does not provide interfaces externally.

Technical Specifications

Table 1-72 lists the technical specifications of the SPC-APPSEC-FW.

Table 1-72 Technical specifications of the SPC-20-O-E8KE

Item

Description

Silkscreen of the board

name

SPC-APPSEC-FW

Dimensions (W x D x H)

175 mm x 280 mm x 36 mm

Power consumption

(typical value)

159 W

Heat dissipation

542.51 BTU/hour

Board weight

1.62 kg

CPU number

2

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Item

Description

CPU

1.2 GHz

Memory

DDR3 16 GB/CPU

1.4.4.14 Application Security Service Processing Card (SPC-IPS-20)

The SPC-IPS-20 is a dual-CPU subcard for processing application security services and has

an IAE to provide content security. This subcard takes up a slot on the mother board. You can

insert the SPC-IPS-20 independently in a slot on the mother board or use it together with a

firewall SPC on the mother board. This board is hot swappable.

When the product version is V300R001, the SPC-IPS-20 only processes the IPS services.

Panel

Figure 1-71 shows the appearance of the SPC-IPS-20.

Figure 1-71 Appearance of the SPC-IPS-20

Name

Description

OFL button

To remove a board, you must press and hold the OFL button

for six seconds until the OFL indicator turns red for one second

and then turns off.

OFL indicator

 If the indicator is green and blinks once every second (1

Hz), the board is running normally.

 If the indicator is green and blinks four times every second

(4 Hz), the board is in the alarm state or starting but not

registered.

 If the indicator turns red for one second and then turns off,

you can remove the board securely.

Interface Attributes

The SPC-IPS-20 does not provide interfaces externally.

Technical Specifications

Table 1-73 lists the technical specifications of the SPC-IPS-20.

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Table 1-73 Technical specifications of the SPC-IPS-20

Item

Description

Silkscreen of the board

name

IPSC01

SPC-IPS-20

Dimensions (W x D x H)

175 mm x 280 mm x 36 mm

Power consumption

(typical value)

159 W

Board weight

1.8 kg

CPU number

2

CPU

1.2 GHz

Memory

DDR3 16 GB/CPU

1.4.5 LPUF-240 and FPICs

The flexible LPU comprises the mother board (LPUF-240) and multiple flexible cards

(sub-cards), improving networking flexibility. The flexible LPU supports 240G full LR

forwarding, which reduces costs and provides personalized solutions for users.

1.4.5.1 LPUF-240

The LPUF-240 is hot swappable and provides two 1/2-width slots, each of which holds one

FPIC. It supports the following functions: 1. Forwards packets at the line speed of 240 Gbit/s.

2. Enhances networking flexibility and provides low-cost and customized solutions. 3.

Supports mixed insertion between different FPICs.

The LPUF-240 backplane does not support the hot swap of FPICs.

The LPUF-240 cannot be used on the USG9520 platform.

Panel

Figure 1-72 shows the appearance of the LPUF-240.

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Figure 1-72 Appearance of the LPUF-240

Name

Description

OFL button

To remove a board, you must press and hold the button for five

seconds until the OFL indicator turns on.

OFL indicator (red)

Steady on: You can remove the board.

RUN indicator (green)

 Blinks every two seconds (0.5 Hz): The system is running

normally.

 Blinks twice each second (2 Hz): The system is in the alarm

state.

Interface Attributes

The LPUF-240 does not provide interfaces externally.

Technical Specifications

Table 1-74 shows the technical specifications of the LPUF-240.

Table 1-74 Technical specifications of the LPUF-240

Item

Description

Silkscreen of the board

name

LPUF-240

FW-LPUF-240

Dimensions (W x D x H)

399.2 mm x 555.2 mm x 40.1 mm

Power consumption

(typical value)

353 W

Heat dissipation

1145.28 BTU/hour

Board weight

9 kg

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1.4.5.2 20-Port 10/100/1000Base-RJ45 FPIC (FW-20X1G-RJ45)

The FW-20X1G-RJ45 occupies one 1/2-width flexible card slot, applies to LPUF-240s and

LPUF-120s, but does not support hot swap.

Panel

Figure 1-73 shows the appearance of the FW-20X1G-RJ45.

Figure 1-73 Panel appearance of the 20-port 10/100/1000Base-RJ45 FPIC

Component

Description

STATUS (green)

 Blinks every two seconds (0.5 Hz): The system is running

normally.

 Blinks twice each second (2 Hz): The system is in the alarm

state.

LINK (green)/ACT

(yellow)

 Steady on: The link is connected.

 Blinking: There is data being transmitted or received.

 Off: The link is disconnected.

Interface Attributes

Table 1-75 lists the attributes of interfaces on FW-20X1G-RJ45.

Table 1-75 FW-20X1G-RJ45 interface attributes

Attribute

Description

Connector type

RJ45

Working mode

10M/100M/1000M adaptive, supporting full duplex

Cable specifications

When the working mode is 10M or 100M, it is recommended

that Category 5 unshielded twisted pairs be used. When the

working mode is 1000M, it is recommended that super

Category 5 unshielded twisted pairs be used.

Frame format

Ethernet_II, Ethernet_SAP, and Ethernet_SNAP

Network protocol

IP

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Technical Specifications

Table 1-76 shows the technical specifications of the FW-20X1G-RJ45.

Table 1-76 Technical specifications of the FW-20X1G-RJ45

Item

Description

Silk-screen board name

FW-20X1G-RJ45

Dimensions (W x D x H)

178 mm x 225 mm x 38 mm

Power consumption

(typical value)

31 W

Heat dissipation

105.77 BTU/hour

Board weight

0.8 kg

1.4.5.3 24-Port 100/1000 Base-X-SFP FPIC (E8KE-X-101-24XGE-SFP)

The E8KE-X-101-24XGE-SFP occupies one 1/2-width flexible card slot, applies to

LPUF-240s, LPUF-120s, and LPUF-101s, but does not support hot swap.

The 24-port 100/1000Base-X-SFP flexible card supports the following features:

 GE optical module, supporting GE optical interface features.

 FE optical module, supporting FE optical interface features.

 Electrical SFP module, supporting 1000M electrical interface feature.

 Mixed insertion among the above modules.

Only the interfaces indexed in odd numbers support the electrical interface module.

Panel

Figure 1-74 shows the appearance of the E8KE-X-101-24XGE-SFP.

Figure 1-74 Appearance of the E8KE-X-101-24XGE-SFP

Name

Description

STATUS (green)

 Blinks every two seconds (0.5 Hz): The system is running

normally.

 Blinks twice each second (2 Hz): The system is in the alarm

state.

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Name

Description

Indicator below the

interface (green)

 Steady on: The link is connected.

 Blinking: There is data being transmitted or received.

 Off: The link is disconnected.

Interface Attributes

Table 1-77 lists the attributes of interfaces on E8KE-X-101-24XGE-SFP.

Table 1-77 E8KE-X-101-24XGE-SFP interface attributes

Attribute

Description

Connector type

LC/PC

Optical interface attribute

Compliant with the selected SFP optical module. For the

optional attributes of the optical module, see

 1.5.1 1 Gbit/s Electrical Transceiver

 1.5.2 1.25 Gbit/s SFP/eSFP Optical Module

Working mode

Full duplex

Standard compliance

IEEE 802.3-2002

Frame format

Ethernet_II, Ethernet_SAP, Ethernet_SNAP, and 802.3

Network protocol

IP

Technical Specifications

Table 1-78 shows the technical specifications of the E8KE-X-101-24XGE-SFP.

Table 1-78 Technical specifications of the E8KE-X-101-24XGE-SFP

Item

Description

Silkscreen of the board

name

E8KE-X-101-24XGE-SFP

Dimensions (W x D x H)

178 mm x 225 mm x 38 mm

Power consumption

(typical value)

37 W

Heat dissipation

126.28 BTU/hour

Board weight

0.9 kg

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1.4.5.4 5-Port 10GBase LAN/WAN-SFP+ FPIC A

(E8KE-X-101-5X10GE-SFP+)

The E8KE-X-101-5X10GE-SFP+ occupies one 1/2-width flexible card slot, applies to

LPUF-240s, LPUF-120s, and LPUF-101s, works in LAN or WAN mode, uses SFP+ optical

modules, but does not support hot swap.

Panel

Figure 1-75 shows the appearance of the E8KE-X-101-5X10GE-SFP+.

Figure 1-75 Appearance of the E8KE-X-101-5X10GE-SFP+

Name

Description

STATUS (green)

 Blinks every two seconds (0.5 Hz): The system is running

normally.

 Blinks twice each second (2 Hz): The system is in the alarm

state.

L/A (green)

 Steady on: The link is connected.

 Blinking: There is data being transmitted or received.

 Off: The link is disconnected.

Interface Attributes

Table 1-79 lists the attributes of interfaces on E8KE-X-101-5X10GE-SFP+.

Table 1-79 E8KE-X-101-5X10GE-SFP+ interface attributes

Attribute

Description

Connector type

LC/PC

Optical interface attribute

Compliant with the selected SFP+ optical module. For the

optional attributes of the optical module, see 1.5.4 10 Gbit/s

SFP+ Optical Module.

Working mode

Full-duplex

Frame format

Ethernet_II, Ethernet_SAP, and Ethernet_SNAP

Network protocol

IP

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Technical Specifications

Table 1-80 shows the technical specifications of the E8KE-X-101-5X10GE-SFP+.

Table 1-80 Technical specifications of the E8KE-X-101-5X10GE-SFP+

Attribute

Description

Silkscreen of the board

name

E8KE-X-101-5X10GE-SFP+

Dimensions (W x D x H)

203.3 mm x 178.65 mm x 37.2 mm

Power consumption

(typical value)

29 W

Heat dissipation

98.95 BTU/hour

Board weight

0.9 kg

1.4.5.5 6*10GE SFP+ Daughter Card (FW-6X10GE-SFP+)

The FW-6X10GE-SFP+ occupies one 1/2-width flexible card slot, applies to LPUF-240s and

LPUF-120s, works in LAN or WAN mode, uses SFP+ optical modules, but does not support

hot swap.

Panel

Figure 1-76 shows the appearance of the FW-6X10GE-SFP+.

Figure 1-76 Appearance of the FW-6X10GE-SFP+

Name

Description

STA (green)

 Blinks every two seconds (0.5 Hz): The system is running

normally.

 Blinks twice each second (2 Hz): The system is in the alarm

state.

Indicator below the

interface (green)

 Steady on: The link is connected.

 Blinking: There is data being transmitted or received.

 Off: The link is disconnected.

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Interface Attributes

Table 1-81 lists the attributes of interfaces on FW-6X10GE-SFP+.

Table 1-81 FW-6X10GE-SFP+ interface attributes

Attribute

Description

Connector type

LC/PC

Optical interface attribute

Compliant with the selected SFP+ optical module. For the

optional attributes of the optical module, see 1.5.4 10 Gbit/s

SFP+ Optical Module.

Working mode

Full-duplex

Frame format

Ethernet_II, Ethernet_SAP, and Ethernet_SNAP

Network protocol

IP

Technical Specifications

Table 1-82 shows the technical specifications of the FW-6X10GE-SFP+.

Table 1-82 Technical specifications of the FW-6X10GE-SFP+

Item

Description

Silkscreen of the board

name

FW-6X10GE-SFP+

Dimensions (W x D x H)

178 mm x 180 mm x 38 mm

Power consumption

(typical value)

34 W

Heat dissipation

110.31 BTU/hour

Board weight

0.65 kg

1.4.5.6 12*10GE SFP+ Daughter Card (FW-12X10GE-SFP+)

The FW-12X10GE-SFP+ occupies one 1/2-width flexible card slot, applies to LPUF-240s and

LPUF-120s, works in LAN or WAN mode, uses SFP+ optical modules, but does not support

hot swap.

Panel

Figure 1-77 shows the appearance of the FW-12X10GE-SFP+.

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Figure 1-77 Appearance of the FW-12X10GE-SFP+

Name

Description

STA (green)

 Blinks every two seconds (0.5 Hz): The system is running

normally.

 Blinks twice each second (2 Hz): The system is in the alarm

state.

Indicator below the

interface (green)

 Steady on: The link is connected.

 Blinking: There is data being transmitted or received.

 Off: The link is disconnected.

Interface Attributes

Table 1-83 lists the attributes of interfaces on FW-12X10GE-SFP+.

Table 1-83 FW-12X10GE-SFP+ interface attributes

Attribute

Description

Connector type

LC/PC

Optical interface attribute

Compliant with the selected SFP+ optical module. For the

optional attributes of the optical module, see 1.5.4 10 Gbit/s

SFP+ Optical Module.

Working mode

Full-duplex

Frame format

Ethernet_II, Ethernet_SAP, and Ethernet_SNAP

Network protocol

IP

Technical Specifications

Table 1-84 shows the technical specifications of the FW-12X10GE-SFP+.

Table 1-84 Technical specifications of the FW-12X10GE-SFP+

Item

Description

Silkscreen of the board

name

FW-12X10GE-SFP+

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Item

Description

Dimensions (W x D x H)

193 mm x 178.65 mm x 37.2 mm

Power consumption

(typical value)

52 W

Heat dissipation

168.7 BTU/hour

Board weight

0.75 kg

1.4.5.7 3-Port 40GBase QSFP+ FPIC (FW-3X40G-QSFP+)

The FW-3X40G-QSFP+ occupies one 1/2-width flexible card slot, applies to LPUF-240s and

LPUF-120s, works in LAN mode, uses QSFP+ optical modules, but does not support hot

swap.

Panel

Figure 1-78 shows the appearance of the FW-3X40G-QSFP+.

Figure 1-78 Appearance of the FW-3X40G-QSFP+

Name

Description

STATUS (green)

 Blinks every two seconds (0.5 Hz): The system is running

normally.

 Blinks twice each second (2 Hz): The system is in the alarm

state.

L/A (green)

 Steady on: The link is connected.

 Blinking: There is data being transmitted or received.

 Off: The link is disconnected.

Interface Attributes

Table 1-85 lists the attributes of interfaces on FW-3X40G-QSFP+.

Table 1-85 FW-3X40G-QSFP+ interface attributes

Attribute

Description

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Attribute

Description

Connector type

LC/PC

Optical interface

attribute

Compliant with the selected SFP+ optical module. For the optional

attributes of the optical module, see 1.5.6 40 Gbit/s QSFP+ Optical

Module.

Working mode

Full-duplex

Standard

compliance

IEEE 802.3-2002

Frame format

Ethernet_II, Ethernet_SAP, and Ethernet_SNAP

Network protocol

IP

Technical Specifications

Table 1-86 shows the technical specifications of the FW-3X40G-QSFP+.

Table 1-86 Technical specifications of the FW-3X40G-QSFP+

Item

Description

Silkscreen of

the board

name

FW-3X40G-QSFP+

Dimensions

(W x D x H)

178 mm x 225 mm x 38 mm

Power

consumption

(typical value)

50 W

Heat

dissipation

170.59 BTU/hour

Board weight

0.685 kg

1.4.5.8 1-Port 40GBase LAN-CFP FPIC A (E8KE-X-101-1X40GE-CFP)

The E8KE-X-101-1X40GE-CFP occupies one 1/2-width flexible card slot, applies to

LPUF-240s, LPUF-120s and LPUF-101s, works in LAN mode, uses CFP optical modules, but

does not support hot swap.

Panel

Figure 1-79 shows the appearance of the E8KE-X-101-1X40GE-CFP.

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Figure 1-79 Appearance of the E8KE-X-101-1X40GE-CFP

Name

Description

STATUS (green)

 Blinks every two seconds (0.5 Hz): The system is running

normally.

 Blinks twice each second (2 Hz): The system is in the alarm

state.

L/A (green)

 Steady on: The link is connected.

 Blinking: There is data being transmitted or received.

 Off: The link is disconnected.

Interface Attributes

Table 1-87 lists the attributes of interfaces on E8KE-X-101-1X40GE-CFP.

Table 1-87 E8KE-X-101-1X40GE-CFP interface attributes

Attribute

Description

Connector type

LC/PC

Optical interface attribute

Compliant with the selected CFP optical module. For the

optional attributes of the optical module, see 1.5.5 40 Gbit/s

CFP Optical Modules.

Working mode

Full duplex

Frame format

Ethernet_II, Ethernet_SAP, and Ethernet_SNAP

Network protocol

IP

Technical Specifications

Table 1-88 shows the technical specifications of the E8KE-X-101-1X40GE-CFP.

Table 1-88 Technical specifications of the E8KE-X-101-1X40GE-CFP

Item

Description

Silkscreen of the board

name

E8KE-X-101-1X40GE-CFP

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Item

Description

Dimensions (W x D x H)

178 mm x 225 mm x 38 mm

Power consumption

(typical value)

28 W

Heat dissipation

95.54 BTU/hour

Board weight

0.9 kg

1.4.5.9 1*100GE CFP Daughter Card (FW-1X100GE-CFP)

The FW-1X100GE-CFP occupies one 1/2-width flexible card slot, applies to LPUF-240s,

LPUF-120s and LPUF-101s, works in LAN mode, uses CFP optical modules, but does not

support hot swap.

Panel

Figure 1-80 shows the appearance of the FW-1X100GE-CFP.

Figure 1-80 Appearance of the FW-1X100GE-CFP

Name

Description

STATUS (green)

 Blinks every two seconds (0.5 Hz): The system is running

normally.

 Blinks twice each second (2 Hz): The system is in the alarm

state.

L/A (green)

 Steady on: The link is connected.

 Blinking: There is data being transmitted or received.

 Off: The link is disconnected.

Interface Attributes

Table 1-89 lists the attributes of interfaces on FW-1X100GE-CFP.

Table 1-89 FW-1X100GE-CFP interface attributes

Attribute

Description

Connector type

LC/PC

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Attribute

Description

Optical interface attribute

Compliant with the selected CFP optical module. For the

optional attributes of the optical module, see 1.5.7 100 Gbit/s

CFP Optical Modules.

Working mode

Full duplex

Frame format

Ethernet_II, Ethernet_SAP, and Ethernet_SNAP

Network protocol

IP

Technical Specifications

Table 1-90 shows the technical specifications of the FW-1X100GE-CFP.

Table 1-90 Technical specifications of the FW-1X100GE-CFP

Item

Description

Silkscreen of the board

name

FW-1X100GE-CFP

Dimensions (W x D x H)

178 mm x 130 mm x 35 mm

Power consumption

(typical value)

51 W

Heat dissipation

165.3 BTU/hour

Board weight

1.3 kg

1.4.6 LPUF-120 and FPICs

The flexible LPU comprises the mother board (LPUF-120) and multiple flexible cards

(sub-cards), improving networking flexibility. The flexible LPU supports 120G full LR

forwarding, which reduces costs and provides personalized solutions for users.

1.4.6.1 LPUF-120

The LPUF-120 is hot swappable and provides two 1/2-width slots, each of which holds one

FPIC. It supports the following functions: 1. Forwards packets at the line speed of 120 Gbit/s.

2. Enhances networking flexibility and provides low-cost and customized solutions. 3.

Supports mixed insertion between different FPICs.

The LPUF-120 backplane does not support the hot swap of FPICs.

The sum of LPUF-120 subcard performance cannot exceed 120G.

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Panel

Figure 1-81 shows the appearance of the LPUF-120.

Figure 1-81 Appearance of the LPUF-120

Name

Description

OFL button

To remove a board, you must press and hold the button for five

seconds until the OFL indicator turns on.

OFL indicator (red)

Steady on: You can remove the board.

RUN indicator (green)

 Blinks every two seconds (0.5 Hz): The system is running

normally.

 Blinks twice each second (2 Hz): The system is in the alarm

state.

Interface Attributes

The LPUF-120 does not provide interfaces externally.

Technical Specifications

Table 1-91 shows the technical specifications of the LPUF-120.

Table 1-91 Technical specifications of the LPUF-120

Item

Description

Silkscreen of the board

name

LPUF-120

FW-LPUF-120

Dimensions (W x D x H)

400 mm x 530 mm x 41 mm

Power consumption

(typical value)

195 W

Heat dissipation

632.1 BTU/hour

Board weight

7.15 kg

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1.4.6.2 20-Port 10/100/1000Base-RJ45 FPIC (FW-20X1G-RJ45)

The FW-20X1G-RJ45 occupies one 1/2-width flexible card slot, applies to LPUF-240s and

LPUF-120s, but does not support hot swap.

Panel

Figure 1-82 shows the appearance of the FW-20X1G-RJ45.

Figure 1-82 Panel appearance of the 20-port 10/100/1000Base-RJ45 FPIC

Component

Description

STATUS (green)

 Blinks every two seconds (0.5 Hz): The system is running

normally.

 Blinks twice each second (2 Hz): The system is in the alarm

state.

LINK (green)/ACT

(yellow)

 Steady on: The link is connected.

 Blinking: There is data being transmitted or received.

 Off: The link is disconnected.

Interface Attributes

Table 1-92 lists the attributes of interfaces on FW-20X1G-RJ45.

Table 1-92 FW-20X1G-RJ45 interface attributes

Attribute

Description

Connector type

RJ45

Working mode

10M/100M/1000M adaptive, supporting full duplex

Cable specifications

When the working mode is 10M or 100M, it is recommended

that Category 5 unshielded twisted pairs be used. When the

working mode is 1000M, it is recommended that super

Category 5 unshielded twisted pairs be used.

Frame format

Ethernet_II, Ethernet_SAP, and Ethernet_SNAP

Network protocol

IP

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Technical Specifications

Table 1-93 shows the technical specifications of the FW-20X1G-RJ45.

Table 1-93 Technical specifications of the FW-20X1G-RJ45

Item

Description

Silk-screen board name

FW-20X1G-RJ45

Dimensions (W x D x H)

178 mm x 225 mm x 38 mm

Power consumption

(typical value)

31 W

Heat dissipation

105.77 BTU/hour

Board weight

0.8 kg

1.4.6.3 24-Port 100/1000 Base-X-SFP FPIC (E8KE-X-101-24XGE-SFP)

The E8KE-X-101-24XGE-SFP occupies one 1/2-width flexible card slot, applies to

LPUF-240s, LPUF-120s, and LPUF-101s, but does not support hot swap.

The 24-port 100/1000Base-X-SFP flexible card supports the following features:

 GE optical module, supporting GE optical interface features.

 FE optical module, supporting FE optical interface features.

 Electrical SFP module, supporting 1000M electrical interface feature.

 Mixed insertion among the above modules.

Only the interfaces indexed in odd numbers support the electrical interface module.

Panel

Figure 1-83 shows the appearance of the E8KE-X-101-24XGE-SFP.

Figure 1-83 Appearance of the E8KE-X-101-24XGE-SFP

Name

Description

STATUS (green)

 Blinks every two seconds (0.5 Hz): The system is running

normally.

 Blinks twice each second (2 Hz): The system is in the alarm

state.

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Name

Description

Indicator below the

interface (green)

 Steady on: The link is connected.

 Blinking: There is data being transmitted or received.

 Off: The link is disconnected.

Interface Attributes

Table 1-94 lists the attributes of interfaces on E8KE-X-101-24XGE-SFP.

Table 1-94 E8KE-X-101-24XGE-SFP interface attributes

Attribute

Description

Connector type

LC/PC

Optical interface attribute

Compliant with the selected SFP optical module. For the

optional attributes of the optical module, see

 1.5.1 1 Gbit/s Electrical Transceiver

 1.5.2 1.25 Gbit/s SFP/eSFP Optical Module

Working mode

Full duplex

Standard compliance

IEEE 802.3-2002

Frame format

Ethernet_II, Ethernet_SAP, Ethernet_SNAP, and 802.3

Network protocol

IP

Technical Specifications

Table 1-95 shows the technical specifications of the E8KE-X-101-24XGE-SFP.

Table 1-95 Technical specifications of the E8KE-X-101-24XGE-SFP

Item

Description

Silkscreen of the board

name

E8KE-X-101-24XGE-SFP

Dimensions (W x D x H)

178 mm x 225 mm x 38 mm

Power consumption

(typical value)

37 W

Heat dissipation

126.28 BTU/hour

Board weight

0.9 kg

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1.4.6.4 5-Port 10GBase LAN/WAN-SFP+ FPIC A

(E8KE-X-101-5X10GE-SFP+)

The E8KE-X-101-5X10GE-SFP+ occupies one 1/2-width flexible card slot, applies to

LPUF-240s, LPUF-120s, and LPUF-101s, works in LAN or WAN mode, uses SFP+ optical

modules, but does not support hot swap.

Panel

Figure 1-84 shows the appearance of the E8KE-X-101-5X10GE-SFP+.

Figure 1-84 Appearance of the E8KE-X-101-5X10GE-SFP+

Name

Description

STATUS (green)

 Blinks every two seconds (0.5 Hz): The system is running

normally.

 Blinks twice each second (2 Hz): The system is in the alarm

state.

L/A (green)

 Steady on: The link is connected.

 Blinking: There is data being transmitted or received.

 Off: The link is disconnected.

Interface Attributes

Table 1-96 lists the attributes of interfaces on E8KE-X-101-5X10GE-SFP+.

Table 1-96 E8KE-X-101-5X10GE-SFP+ interface attributes

Attribute

Description

Connector type

LC/PC

Optical interface attribute

Compliant with the selected SFP+ optical module. For the

optional attributes of the optical module, see 1.5.4 10 Gbit/s

SFP+ Optical Module.

Working mode

Full-duplex

Frame format

Ethernet_II, Ethernet_SAP, and Ethernet_SNAP

Network protocol

IP

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Technical Specifications

Table 1-97 shows the technical specifications of the E8KE-X-101-5X10GE-SFP+.

Table 1-97 Technical specifications of the E8KE-X-101-5X10GE-SFP+

Attribute

Description

Silkscreen of the board

name

E8KE-X-101-5X10GE-SFP+

Dimensions (W x D x H)

203.3 mm x 178.65 mm x 37.2 mm

Power consumption

(typical value)

29 W

Heat dissipation

98.95 BTU/hour

Board weight

0.9 kg

1.4.6.5 6*10GE SFP+ Daughter Card (FW-6X10GE-SFP+)

The FW-6X10GE-SFP+ occupies one 1/2-width flexible card slot, applies to LPUF-240s and

LPUF-120s, works in LAN or WAN mode, uses SFP+ optical modules, but does not support

hot swap.

Panel

Figure 1-85 shows the appearance of the FW-6X10GE-SFP+.

Figure 1-85 Appearance of the FW-6X10GE-SFP+

Name

Description

STA (green)

 Blinks every two seconds (0.5 Hz): The system is running

normally.

 Blinks twice each second (2 Hz): The system is in the alarm

state.

Indicator below the

interface (green)

 Steady on: The link is connected.

 Blinking: There is data being transmitted or received.

 Off: The link is disconnected.

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Interface Attributes

Table 1-98 lists the attributes of interfaces on FW-6X10GE-SFP+.

Table 1-98 FW-6X10GE-SFP+ interface attributes

Attribute

Description

Connector type

LC/PC

Optical interface attribute

Compliant with the selected SFP+ optical module. For the

optional attributes of the optical module, see 1.5.4 10 Gbit/s

SFP+ Optical Module.

Working mode

Full-duplex

Frame format

Ethernet_II, Ethernet_SAP, and Ethernet_SNAP

Network protocol

IP

Technical Specifications

Table 1-99 shows the technical specifications of the FW-6X10GE-SFP+.

Table 1-99 Technical specifications of the FW-6X10GE-SFP+

Item

Description

Silkscreen of the board

name

FW-6X10GE-SFP+

Dimensions (W x D x H)

178 mm x 180 mm x 38 mm

Power consumption

(typical value)

34 W

Heat dissipation

110.31 BTU/hour

Board weight

0.65 kg

1.4.6.6 12*10GE SFP+ Daughter Card (FW-12X10GE-SFP+)

The FW-12X10GE-SFP+ occupies one 1/2-width flexible card slot, applies to LPUF-240s and

LPUF-120s, works in LAN or WAN mode, uses SFP+ optical modules, but does not support

hot swap.

Panel

Figure 1-86 shows the appearance of the FW-12X10GE-SFP+.

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Figure 1-86 Appearance of the FW-12X10GE-SFP+

Name

Description

STA (green)

 Blinks every two seconds (0.5 Hz): The system is running

normally.

 Blinks twice each second (2 Hz): The system is in the alarm

state.

Indicator below the

interface (green)

 Steady on: The link is connected.

 Blinking: There is data being transmitted or received.

 Off: The link is disconnected.

Interface Attributes

Table 1-100 lists the attributes of interfaces on FW-12X10GE-SFP+.

Table 1-100 FW-12X10GE-SFP+ interface attributes

Attribute

Description

Connector type

LC/PC

Optical interface attribute

Compliant with the selected SFP+ optical module. For the

optional attributes of the optical module, see 1.5.4 10 Gbit/s

SFP+ Optical Module.

Working mode

Full-duplex

Frame format

Ethernet_II, Ethernet_SAP, and Ethernet_SNAP

Network protocol

IP

Technical Specifications

Table 1-101 shows the technical specifications of the FW-12X10GE-SFP+.

Table 1-101 Technical specifications of the FW-12X10GE-SFP+

Item

Description

Silkscreen of the board

name

FW-12X10GE-SFP+

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Item

Description

Dimensions (W x D x H)

193 mm x 178.65 mm x 37.2 mm

Power consumption

(typical value)

52 W

Heat dissipation

168.7 BTU/hour

Board weight

0.75 kg

1.4.6.7 3-Port 40GBase QSFP+ FPIC (FW-3X40G-QSFP+)

The FW-3X40G-QSFP+ occupies one 1/2-width flexible card slot, applies to LPUF-240s and

LPUF-120s, works in LAN mode, uses QSFP+ optical modules, but does not support hot

swap.

Panel

Figure 1-87 shows the appearance of the FW-3X40G-QSFP+.

Figure 1-87 Appearance of the FW-3X40G-QSFP+

Name

Description

STATUS (green)

 Blinks every two seconds (0.5 Hz): The system is running

normally.

 Blinks twice each second (2 Hz): The system is in the alarm

state.

L/A (green)

 Steady on: The link is connected.

 Blinking: There is data being transmitted or received.

 Off: The link is disconnected.

Interface Attributes

Table 1-102 lists the attributes of interfaces on FW-3X40G-QSFP+.

Table 1-102 FW-3X40G-QSFP+ interface attributes

Attribute

Description

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Attribute

Description

Connector type

LC/PC

Optical interface

attribute

Compliant with the selected SFP+ optical module. For the optional

attributes of the optical module, see 1.5.6 40 Gbit/s QSFP+ Optical

Module.

Working mode

Full-duplex

Standard

compliance

IEEE 802.3-2002

Frame format

Ethernet_II, Ethernet_SAP, and Ethernet_SNAP

Network protocol

IP

Technical Specifications

Table 1-103 shows the technical specifications of the FW-3X40G-QSFP+.

Table 1-103 Technical specifications of the FW-3X40G-QSFP+

Item

Description

Silkscreen of

the board

name

FW-3X40G-QSFP+

Dimensions

(W x D x H)

178 mm x 225 mm x 38 mm

Power

consumption

(typical value)

50 W

Heat

dissipation

170.59 BTU/hour

Board weight

0.685 kg

1.4.6.8 1-Port 40GBase LAN-CFP FPIC A (E8KE-X-101-1X40GE-CFP)

The E8KE-X-101-1X40GE-CFP occupies one 1/2-width flexible card slot, applies to

LPUF-240s, LPUF-120s and LPUF-101s, works in LAN mode, uses CFP optical modules, but

does not support hot swap.

Panel

Figure 1-88 shows the appearance of the E8KE-X-101-1X40GE-CFP.

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Figure 1-88 Appearance of the E8KE-X-101-1X40GE-CFP

Name

Description

STATUS (green)

 Blinks every two seconds (0.5 Hz): The system is running

normally.

 Blinks twice each second (2 Hz): The system is in the alarm

state.

L/A (green)

 Steady on: The link is connected.

 Blinking: There is data being transmitted or received.

 Off: The link is disconnected.

Interface Attributes

Table 1-104 lists the attributes of interfaces on E8KE-X-101-1X40GE-CFP.

Table 1-104 E8KE-X-101-1X40GE-CFP interface attributes

Attribute

Description

Connector type

LC/PC

Optical interface attribute

Compliant with the selected CFP optical module. For the

optional attributes of the optical module, see 1.5.5 40 Gbit/s

CFP Optical Modules.

Working mode

Full duplex

Frame format

Ethernet_II, Ethernet_SAP, and Ethernet_SNAP

Network protocol

IP

Technical Specifications

Table 1-105 shows the technical specifications of the E8KE-X-101-1X40GE-CFP.

Table 1-105 Technical specifications of the E8KE-X-101-1X40GE-CFP

Item

Description

Silkscreen of the board

name

E8KE-X-101-1X40GE-CFP

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Item

Description

Dimensions (W x D x H)

178 mm x 225 mm x 38 mm

Power consumption

(typical value)

28 W

Heat dissipation

95.54 BTU/hour

Board weight

0.9 kg

1.4.6.9 1*100GE CFP Daughter Card (FW-1X100GE-CFP)

The FW-1X100GE-CFP occupies one 1/2-width flexible card slot, applies to LPUF-240s,

LPUF-120s and LPUF-101s, works in LAN mode, uses CFP optical modules, but does not

support hot swap.

Panel

Figure 1-89 shows the appearance of the FW-1X100GE-CFP.

Figure 1-89 Appearance of the FW-1X100GE-CFP

Name

Description

STATUS (green)

 Blinks every two seconds (0.5 Hz): The system is running

normally.

 Blinks twice each second (2 Hz): The system is in the alarm

state.

L/A (green)

 Steady on: The link is connected.

 Blinking: There is data being transmitted or received.

 Off: The link is disconnected.

Interface Attributes

Table 1-106 lists the attributes of interfaces on FW-1X100GE-CFP.

Table 1-106 FW-1X100GE-CFP interface attributes

Attribute

Description

Connector type

LC/PC

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Attribute

Description

Optical interface attribute

Compliant with the selected CFP optical module. For the

optional attributes of the optical module, see 1.5.7 100 Gbit/s

CFP Optical Modules.

Working mode

Full duplex

Frame format

Ethernet_II, Ethernet_SAP, and Ethernet_SNAP

Network protocol

IP

Technical Specifications

Table 1-107 shows the technical specifications of the FW-1X100GE-CFP.

Table 1-107 Technical specifications of the FW-1X100GE-CFP

Item

Description

Silkscreen of the board

name

FW-1X100GE-CFP

Dimensions (W x D x H)

178 mm x 130 mm x 35 mm

Power consumption

(typical value)

51 W

Heat dissipation

165.3 BTU/hour

Board weight

1.3 kg

1.4.7 LPUF-101 and FPICs

The flexible LPU comprises the mother board (LPUF-101) and multiple flexible cards

(sub-cards), improving networking flexibility. The flexible LPU supports 100G full LR

forwarding, which reduces costs and provides personalized solutions for users.

1.4.7.1 LPUF-101

The LPUF-101 is hot swappable and provides four 1/4-width slots or two 1/2-width slots,

each of which holds one FPIC. It supports the following functions: 1. Forwards packets at the

line speed of 100 Gbit/s. 2. Enhances networking flexibility and provides low-cost and

customized solutions. 3. Supports mixed insertion of FPICs with different width. By default,

each LPUF-101 is delivered with two 1/2-width slots. To install 1/4-width flexible plug-in

cards, guide rails delivered with cards need to be installed.

The LPUF-101 backplane does not support the hot swap of FPICs.

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Panel

Figure 1-90 shows the appearance of the LPUF-101.

Figure 1-90 Appearance of the LPUF-101

Name

Description

OFL button

To remove a board, you must press and hold the button for five

seconds until the OFL indicator turns on.

OFL indicator (red)

Steady on: You can remove the board.

RUN indicator (green)

 Blinks every two seconds (0.5 Hz): The system is running

normally.

 Blinks twice each second (2 Hz): The system is in the alarm

state.

Interface Attributes

Th LPUF-101 does not provide interfaces externally.

Technical Specifications

Table 1-108 shows the technical specifications of the LPUF-101.

Table 1-108 Technical specifications of the LPUF-101

Item

Description

Silkscreen of the board

name

LPUF-101

E8KE-X-LPUF-101

Dimensions (W x D x H)

399.2 mm x 532.6 mm x 40.1 mm

Power consumption

(typical value)

260 W

Heat dissipation

887.12 BTU/hour

Board weight

6.8 kg

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1.4.7.2 24-Port 100/1000 Base-X-SFP FPIC (E8KE-X-101-24XGE-SFP)

The E8KE-X-101-24XGE-SFP occupies one 1/2-width flexible card slot, applies to

LPUF-240s, LPUF-120s and LPUF-101s, but does not support hot swap.

The 24-port 100/1000Base-X-SFP flexible card supports the following features:

 GE optical module, supporting GE optical interface features.

 FE optical module, supporting FE optical interface features.

 Electrical SFP module, supporting 1000M electrical interface feature.

 Mixed insertion among the above modules.

Only the interfaces indexed in odd numbers support the electrical interface module.

Panel

Figure 1-91 shows the appearance of the E8KE-X-101-24XGE-SFP.

Figure 1-91 Appearance of the E8KE-X-101-24XGE-SFP

Name

Description

STATUS (green)

 Blinks every two seconds (0.5 Hz): The system is running

normally.

 Blinks twice each second (2 Hz): The system is in the alarm

state.

Indicator below the

interface (green)

 Steady on: The link is connected.

 Blinking: There is data being transmitted or received.

 Off: The link is disconnected.

Interface Attributes

Table 1-109 lists the attributes of interfaces on E8KE-X-101-24XGE-SFP.

Table 1-109 E8KE-X-101-24XGE-SFP interface attributes

Attribute

Description

Connector type

LC/PC

Optical interface attribute

Compliant with the selected SFP optical module. For the

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Attribute

Description

optional attributes of the optical module, see

 1.5.1 1 Gbit/s Electrical Transceiver

 1.5.2 1.25 Gbit/s SFP/eSFP Optical Module

Working mode

Full duplex

Standard compliance

IEEE 802.3-2002

Frame format

Ethernet_II, Ethernet_SAP, Ethernet_SNAP, and 802.3

Network protocol

IP

Technical Specifications

Table 1-110 shows the technical specifications of the E8KE-X-101-24XGE-SFP.

Table 1-110 Technical specifications of the E8KE-X-101-24XGE-SFP

Item

Description

Silkscreen of the board

name

E8KE-X-101-24XGE-SFP

Dimensions (W x D x H)

178 mm x 225 mm x 38 mm

Power consumption

(typical value)

37 W

Heat dissipation

126.28 BTU/hour

Board weight

0.9 kg

1.4.7.3 4-Port 10G Base LAN -SFP+ FPIC (E8KE-X-101-4X10GE-SFP+)

The E8KE-X-101-4X10GE-SFP+ occupies one 1/4-width flexible card slot, applies to

LPUF-101s, but does not support hot swap.

The E8KE-X-101-4X10GE-SFP+ is a convergence sub-card. Each port can converge to 20G on average.

Panel

Figure 1-92 shows the appearance of the E8KE-X-101-4X10GE-SFP+.

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Figure 1-92 Appearance of the E8KE-X-101-4X10GE-SFP+

Name

Description

STATUS (green)

 Blinks every two seconds (0.5 Hz): The system is running

normally.

 Blinks twice each second (2 Hz): The system is in the alarm

state.

L/A (green)

 Steady on: The link is connected.

 Blinking: There is data being transmitted or received.

 Off: The link is disconnected.

Interface Attributes

Table 1-111 lists the attributes of interfaces on the E8KE-X-101-4X10GE-SFP+.

Table 1-111 E8KE-X-101-4X10GE-SFP+ interface attributes

Attribute

Description

Connector type

LC/PC

Optical interface attribute

Compliant with the selected SFP+ optical module. For the

optional attributes of the optical module, see 1.5.4 10 Gbit/s

SFP+ Optical Module.

Frame format

Ethernet_II, Ethernet_SAP, and Ethernet_SNAP

Network protocol

IP

Technical Specifications

Table 1-112 shows the technical specifications of the E8KE-X-101-4X10GE-SFP+.

Table 1-112 Technical specifications of the E8KE-X-101-4X10GE-SFP+

Parameter

Description

Silkscreen of the board

name

E8KE-X-101-4X10GE-SFP+

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Parameter

Description

Dimensions (W x D x H)

89.1 mm x 203.3 mm x 37.2 mm

Power consumption

(typical value)

20 W

Heat dissipation

68.26 BTU/hour

Board weight

0.4 kg

1.4.7.4 5-Port 10GBase LAN/WAN-SFP+ FPIC A

(E8KE-X-101-5X10GE-SFP+)

The E8KE-X-101-5X10GE-SFP+ occupies one 1/2-width flexible card slot, applies to

LPUF-240s, LPUF-120s, and LPUF-101s, works in LAN or WAN mode, uses SFP+ optical

modules, but does not support hot swap.

Panel

Figure 1-93 shows the appearance of the E8KE-X-101-5X10GE-SFP+.

Figure 1-93 Appearance of the E8KE-X-101-5X10GE-SFP+

Name

Description

STATUS (green)

 Blinks every two seconds (0.5 Hz): The system is running

normally.

 Blinks twice each second (2 Hz): The system is in the alarm

state.

L/A (green)

 Steady on: The link is connected.

 Blinking: There is data being transmitted or received.

 Off: The link is disconnected.

Interface Attributes

Table 1-113 lists the attributes of interfaces on E8KE-X-101-5X10GE-SFP+.

Table 1-113 E8KE-X-101-5X10GE-SFP+ interface attributes

Attribute

Description

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Attribute

Description

Connector type

LC/PC

Optical interface attribute

Compliant with the selected SFP+ optical module. For the

optional attributes of the optical module, see 1.5.4 10 Gbit/s

SFP+ Optical Module.

Working mode

Full-duplex

Frame format

Ethernet_II, Ethernet_SAP, and Ethernet_SNAP

Network protocol

IP

Technical Specifications

Table 1-114 shows the technical specifications of the E8KE-X-101-5X10GE-SFP+.

Table 1-114 Technical specifications of the E8KE-X-101-5X10GE-SFP+

Attribute

Description

Silkscreen of the board

name

E8KE-X-101-5X10GE-SFP+

Dimensions (W x D x H)

203.3 mm x 178.65 mm x 37.2 mm

Power consumption

(typical value)

29 W

Heat dissipation

98.95 BTU/hour

Board weight

0.9 kg

1.4.7.5 1-Port 40GBase LAN-CFP FPIC A (E8KE-X-101-1X40GE-CFP)

The E8KE-X-101-1X40GE-CFP occupies one 1/2-width flexible card slot, applies to

LPUF-240s, LPUF-120s, and LPUF-101s, works in LAN mode, uses CFP optical modules,

but does not support hot swap.

Panel

Figure 1-94 shows the appearance of the E8KE-X-101-1X40GE-CFP.

Figure 1-94 Appearance of the E8KE-X-101-1X40GE-CFP

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Name

Description

STATUS (green)

 Blinks every two seconds (0.5 Hz): The system is running

normally.

 Blinks twice each second (2 Hz): The system is in the alarm

state.

L/A (green)

 Steady on: The link is connected.

 Blinking: There is data being transmitted or received.

 Off: The link is disconnected.

Interface Attributes

Table 1-115 lists the attributes of interfaces on E8KE-X-101-1X40GE-CFP.

Table 1-115 E8KE-X-101-1X40GE-CFP interface attributes

Attribute

Description

Connector type

LC/PC

Optical interface attribute

Compliant with the selected CFP optical module. For the

optional attributes of the optical module, see 1.5.5 40 Gbit/s

CFP Optical Modules.

Working mode

Full duplex

Frame format

Ethernet_II, Ethernet_SAP, and Ethernet_SNAP

Network protocol

IP

Technical Specifications

Table 1-116 shows the technical specifications of the E8KE-X-101-1X40GE-CFP.

Table 1-116 Technical specifications of the E8KE-X-101-1X40GE-CFP

Item

Description

Silkscreen of the board

name

E8KE-X-101-1X40GE-CFP

Dimensions (W x D x H)

178 mm x 225 mm x 38 mm

Power consumption

(typical value)

28 W

Heat dissipation

95.54 BTU/hour

Board weight

0.9 kg

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1.4.8 LPUF-40-A and FPIC

This chapter describes the structure and specifications of the Flexible Card Line Processing

Unit (LPUF-40-A, 2 sub-slots) and FPIC.

1.4.8.1 LPUF-40-A

The LPUF-40-A is hot swappable and provides two 1/2-width slots, each of which holds one

FPIC. It supports the following functions: 1. Forwards packets at the line speed of 40 Gbit/s. 2.

Enhances networking flexibility and provides low-cost and customized solutions. 3. Supports

mixed insertion between different FPICs.

The LPUF-40-A backplane does not support the hot swap of FPICs.

The sum of the LPUF-40-A subcard performance cannot exceed 40G. Each slot supports a

maximum of 20-Gbit/s bandwidth.

Panel

Figure 1-95 shows the appearance of the LPUF-40-A.

Figure 1-95 Appearance of the LPUF-40-A

Name

Description

OFL button

To remove a board, you must press and hold the button for five

seconds until the OFL indicator turns on.

OFL indicator (red)

Steady on: You can remove the board.

RUN indicator (green)

 Blinks every two seconds (0.5 Hz): The system is running

normally.

 Blinks twice each second (2 Hz): The system is in the alarm

state.

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Interface Attributes

Th LPUF-40-A does not provide interfaces externally.

Technical Specifications

Table 1-117 shows the technical specifications of the LPUF-40-A.

Table 1-117 Technical specifications of the LPUF-40-A

Item

Description

Silkscreen of the board

name

LPUF-40-A

E8KE-X-LPUF-40-A

Dimensions (W x D x H)

400 mm x 520 mm x 41 mm

Power consumption

(typical value)

280 W

Heat dissipation

955.36 BTU/hour

Board weight

6.6 kg

1.4.8.2 20-Port 100/1000Base-X-SFP Flexible Card (P40-20xGE/FE-SFP)

The P40-20xGE/FE-SFP occupies one 1/2-width flexible card slot, applies to LPUF-40-A, but

does not support hot swap.

The P40-20xGE/FE-SFP supports the following features:

 GE optical module, supporting GE optical interface features.

 FE optical module, supporting FE optical interface features.

 Electrical SFP module, supporting features of the 10M/100M/1000M auto-sensing

electrical interfaces.

 Mixed insertion among the above modules.

Panel

Figure 1-96 shows the appearance of the P40-20xGE/FE-SFP.

Figure 1-96 Appearance of the P40-20xGE/FE-SFP

Name

Description

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Name

Description

STATUS (green)

 Blinks every two seconds (0.5 Hz): The system is running

normally.

 Blinks twice each second (2 Hz): The system is in the alarm

state.

Indicator below the

interface (green)

 Steady on: The link is connected.

 Blinking: There is data being transmitted or received.

 Off: The link is disconnected.

Interface Attributes

Table 1-118 lists the attributes of interfaces on the P40-20xGE/FE-SFP.

Table 1-118 P40-20xGE/FE-SFP interface attributes

Attributes

Description

Connector type

LC/PC

Optical interface

attributes

Compliant with the selected SFP optical module. For the

optional attributes of the optical module, see

 1.5.1 1 Gbit/s Electrical Transceiver

 1.5.2 1.25 Gbit/s SFP/eSFP Optical Module

Working mode

Full-duplex

Frame format

Ethernet_II, Ethernet_SAP, and Ethernet_SNAP

Network protocol

IP

Technical Specifications

Table 1-119 lists the technical specifications of the P40-20xGE/FE-SFP.

Table 1-119 Technical specifications of the P40-20xGE/FE-SFP

Item

Specifications

Silkscreen of the board

name

P40-20xGE/FE-SFP

Dimensions (W x D x H)

180 mm x 145 mm x 40 mm

Power consumption

(typical value)

37 W

Heat dissipation

126.24 BTU/hour

Board weight

0.5 kg

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1.4.8.3 2-Port 10GBase LAN/WAN-XFP Flexible Card (P40-2x10GBase

LAN/WAN-XFP)

The P40-2x10GBase LAN/WAN-XFP occupies one 1/2-width flexible card slot, applies to

LPUF-40-A, works in LAN or WAN mode, uses XFP optical modules, but does not support

hot swap.

Panel

Figure 1-97 shows the appearance of the P40-2x10GBase LAN/WAN-XFP.

Figure 1-97 Appearance of the P40-2x10GBase LAN/WAN-XFP

Name

Description

STATUS (green)

 Blinks every two seconds (0.5 Hz): The system is running

normally.

 Blinks twice each second (2 Hz): The system is in the alarm

state.

LINK/ACT (green)

 Steady on: The link is connected.

 Blinking: There is data being transmitted or received.

 Off: The link is disconnected.

Interface Attributes

Table 1-120 lists the attributes of interfaces on the P40-2x10GBase LAN/WAN-XFP.

If you configure 10 GE interface to work in WAN mode, use single-mode optical fibers to

connect devices.

Table 1-120 P40-2x10GBase LAN/WAN-XFP interface attributes

Attributes

Description

Connector type

LC/PC

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Attributes

Description

Optical interface

attributes

Compliant with the selected XFP optical module. For the

optional attributes of the optical module, see 1.5.3 10 Gbit/s

XFP Optical Module.

Working mode

Full-duplex

Frame format

Ethernet_II, Ethernet_SAP, and Ethernet_SNAP

Network protocol

IP

Technical Specifications

Table 1-121 lists the technical specifications of the P40-2x10GBase LAN/WAN-XFP.

Table 1-121 Technical specifications of the P40-2x10GBase LAN/WAN-XFP

Item

Specifications

Silkscreen of the board

name

P40-2x10GBase LAN/WAN-XFP

Dimensions (W x D x H)

180 mm x 145 mm x 40 mm

Power consumption

(typical value)

12 W

Heat dissipation

40.94 BTU/hour

Board weight

0.6 kg

1.4.8.4 4-port 10GBase LAN/WAN-XFP FPIC (P40-4x10GBase

LAN/WAN-XFP)

The P40-4x10GBase LAN/WAN-XFP occupies one 1/2-width flexible card slot, applies to

LPUF-40-A, works in LAN or WAN mode, uses XFP optical modules, but does not support

hot swap.

The P40-4x10GBase LAN/WAN-XFP is convergence. The left-most two ports can be converged to 10

Gbit/s in average. The right-most two ports can be converged to 10 Gbit/s in average.

Panel

Figure 1-98 shows the appearance of the P40-4x10GBase LAN/WAN-XFP.

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Figure 1-98 Appearance of the P40-4x10GBase LAN/WAN-XFP

Name

Description

STATUS (green)

 Blinks every two seconds (0.5 Hz): The system is running

normally.

 Blinks twice each second (2 Hz): The system is in the alarm

state.

LA (green)

 Steady on: The link is connected.

 Blinking: There is data being transmitted or received.

 Off: The link is disconnected.

Interface Attributes

Table 1-122 lists the attributes of interfaces on the P40-4x10GBase LAN/WAN-XFP.

If you configure 10 GE interface to work in WAN mode, use single-mode optical fibers to

connect devices.

Table 1-122 P40-4x10GBase LAN/WAN-XFP interface attributes

Attributes

Description

Connector type

LC/PC

Optical interface

attributes

Compliant with the selected XFP optical module. For the

optional attributes of the optical module, see 1.5.3 10 Gbit/s

XFP Optical Module.

Frame format

Ethernet_II, Ethernet_SAP, and Ethernet_SNAP

Network protocol

IP

Technical Specifications

Table 1-123 lists the technical specifications of the P40-4x10GBase LAN/WAN-XFP.

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Table 1-123 Technical specifications of the P40-4x10GBase LAN/WAN-XFP

Item

Specifications

Silkscreen of the board

name

P40-4x10GBase LAN/WAN-XFP

Dimensions (W x D x H)

180 mm x 145 mm x 40 mm

Power consumption

(typical value)

12 W

Heat dissipation

39 BTU/hour

Board weight

0.5 kg

1.4.9 LPUF-21 and FPIC

This chapter describes the structure and specifications of the Flexible Card Line Processing

Unit (LPUF-21, 2 sub-slots) and FPIC.

1.4.9.1 LPUF-21

The LPUF-21 is hot swappable and provides two 1/2-width slots, each of which holds one

FPIC. It supports the following functions: 1. Forwards packets at the line speed of 20 Gbit/s. 2.

Enhances networking flexibility and provides low-cost and customized solutions. 3. Supports

mixed insertion between different FPICs.

The LPUF-21 backplane does not support the hot swap of FPICs.

Panel

Figure 1-99 shows the appearance of the LPUF-21.

Figure 1-99 Appearance of the LPUF-21

Name

Description

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Name

Description

OFL button

To remove a board, you must press and hold the button for five

seconds until the OFL indicator turns on.

OFL indicator (red)

Steady on: You can remove the board.

RUN indicator (green)

 Blinks every two seconds (0.5 Hz): The system is running

normally.

 Blinks twice each second (2 Hz): The system is in the alarm

state.

Interface Attributes

Th LPUF-21 does not provide interfaces externally.

Technical Specifications

Table 1-124 shows the technical specifications of the LPUF-21.

Table 1-124 Technical specifications of the LPUF-21

Item

Description

Silkscreen of the board

name

LPUF-21

E8KE-X-LPUF-21

Dimensions (W x D x H)

400 mm x 520 mm x 41 mm

Power consumption

(typical value)

170 W

Heat dissipation value

580.04 BTU/hour

Board weight

5.0 kg

1.4.9.2 12-port 10Base-T/100Base-TX/1000Base-T-RJ45 FPIC

(12x10/100/1000Base-TX-RJ45)

The 12x10/100/1000Base-TX-RJ45 occupies one 1/2-width flexible card slot, applies to

LPUF-21, but does not support hot swap.

Panel

Figure 1-100 shows the appearance of the 12x10/100/1000Base-TX-RJ45.

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Figure 1-100 Appearance of the 12x10/100/1000Base-TX-RJ45

Name

Description

STATUS (green)

 Blinks every two seconds (0.5 Hz): The system is running

normally.

 Blinks twice each second (2 Hz): The system is in the alarm

state.

LINK (green)/ACT

(yellow)

 Steady on: The link is connected.

 Blinking: There is data being transmitted or received.

 Off: The link is disconnected.

Interface Attributes

Table 1-125 lists the attributes of interfaces on the 12x10/100/1000Base-TX-RJ45.

Table 1-125 12x10/100/1000Base-TX-RJ45 tnterface attributes

Attribute

Description

Connector type

RJ45

Working mode

10M/100M/1000M adaptive, supporting full duplex

Cable specifications

When the working mode is 10M or 100M, it is recommended

that Category 5 unshielded twisted pairs be used. When the

working mode is 1000M, it is recommended that super

Category 5 unshielded twisted pairs be used.

Compliance

IEEE802.3-2002

Frame format

Ethernet_II, Ethernet_SAP, and Ethernet_SNAP

Network protocol

IP

Technical Specifications

Table 1-126 shows the technical specifications of the 12x10/100/1000Base-TX-RJ45.

Table 1-126 Technical specifications of the 12x10/100/1000Base-TX-RJ45

Item

Description

Silk-screen board name

12x10/100/1000Base-TX-RJ45

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Item

Description

Dimensions (W x D x H)

180 mm x 145 mm x 40 mm

Power consumption

(typical value)

10 W

Heat dissipation value

34.12 BTU/hour

Board weight

0.50 kg

1.4.9.3 12-port 100Base-FX/1000Base-X-SFP FPIC (12x100/1000Base-SFP)

The 12x100/1000Base-SFP occupies one 1/2-width flexible card slot, applies to LPUF-21, but

does not support hot swap.

The 12x100/1000Base-SFP supports the following features:

 GE optical module, supporting GE optical interface features.

 FE optical module, supporting FE optical interface features.

 Electrical SFP module, supporting features of the 10M/100M/1000M auto-sensing

electrical interfaces.

 Mixed insertion among the above modules.

Panel

Figure 1-101 shows the appearance of the 12x100/1000Base-SFP.

Figure 1-101 Appearance of the 12x100/1000Base-SFP

Name

Description

STATUS (green)

 Blinks every two seconds (0.5 Hz): The system is running

normally.

 Blinks twice each second (2 Hz): The system is in the alarm

state.

L/A (green)

 Steady on: The link is connected.

 Blinking: There is data being transmitted or received.

 Off: The link is disconnected.

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Interface Attributes

Table 1-127 lists the attributes of interfaces on the 12x100/1000Base-SFP.

Table 1-127 12x100/1000Base-SFP interface attributes

Attribute

Description

Connector type

LC/PC

Interface attributes

Compliant with the selected SFP optical module. For the

optional attributes of the optical module, see

 1.5.1 1 Gbit/s Electrical Transceiver

 1.5.2 1.25 Gbit/s SFP/eSFP Optical Module

Working mode

Full-duplex

Compliance

IEEE 802.3-2002

Frame format

Ethernet_II, Ethernet_SAP, and Ethernet_SNAP

Network protocol

IP

Technical Specifications

Table 1-128 shows the technical specifications of 12x100/1000Base-SFP.

Table 1-128 Technical specifications of 12x100/1000Base-SFP

Item

Description

Silk-screen board name

12x100/1000Base-SFP

Dimensions (W x D x H)

180 mm x 145mm x 40 mm

Power consumption

(typical value)

13 W

Heat dissipation value

44.36 BTU/hour

Board weight

0.50 kg

1.4.9.4 1-port OC-192c/STM-64c POS-XFP FPIC (1 x OC-192c/STM-64c

POS-XFP)

The 1 x OC-192c/STM-64c POS-XFP occupies one 1/2-width flexible card slot, applies to

LPUF-21, uses 10G XFP optical modules, provides one 10 GE POS interface, but does not

support hot swap.

Panel

Figure 1-102 shows the appearance of the 1 x OC-192c/STM-64c POS-XFP.

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Figure 1-102 Appearance of the 1 x OC-192c/STM-64c POS-XFP

Name

Description

STATUS (green)

 Blinks every two seconds (0.5 Hz): The system is running

normally.

 Blinks twice each second (2 Hz): The system is in the alarm

state.

LINK/ACT (green)

 Steady on: The link is connected.

 Blinking: There is data being transmitted or received.

 Off: The link is disconnected.

Interface Attributes

Table 1-129 lists the attributes of interfaces on the 1 x OC-192c/STM-64c POS-XFP.

Table 1-129 1 x OC-192c/STM-64c POS-XFP interface attributes

Attribute

Description

Connector type

LC/PC

Optical interface

attributes

Compliant with the selected XFP optical module. For the

optional attributes of the optical module, see 1.5.3 10 Gbit/s

XFP Optical Module.

Working mode

Full duplex

Compliance

STM-64c SDH/OC-192c SONET and RFC 2615 (1619)/1662

Link protocol

PPP and HDLC

Network protocol

IP

Technical Specifications

Table 1-130 shows the technical specifications of the 1-port OC-192c/STM-64c POS-XFP

FPIC.

Table 1-130 Technical specifications of the 1-port OC-192c/STM-64c POS-XFP FPIC

Item

Description

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Item

Description

Silk-screen board name

1 x OC-192c/STM-64c POS-XFP

Dimensions (W x D x H)

180 mm x 145 mm x 40 mm

Power consumption

(typical value)

16 W

Heat dissipation value

54.59 BTU/hour

Board weight

0.50 kg

1.4.9.5 1-port 10GBase LAN/WAN-XFP FPIC (1 x 10GBase LAN/WAN)

The 1 x 10GBase LAN/WAN occupies one 1/2-width flexible card slot, applies to LPUF-21,

works in LAN or WAN mode, uses XFP optical modules, but does not support hot swap.

Panel

Figure 1-103 shows the appearance of the 1 x 10GBase LAN/WAN.

Figure 1-103 Appearance of the 1 x 10GBase LAN/WAN

Name

Description

STATUS (green)

 Blinks every two seconds (0.5 Hz): The system is running

normally.

 Blinks twice each second (2 Hz): The system is in the alarm

state.

L/A (green)

 Steady on: The link is connected.

 Blinking: There is data being transmitted or received.

 Off: The link is disconnected.

Interface Attributes

Table 1-131 lists the attributes of interfaces on the 1 x 10GBase LAN/WAN.

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If you configure 10 GE interface to work in WAN mode, use single-mode optical fibers to

connect devices.

Table 1-131 1 x 10GBase LAN/WAN interface attributes

Attribute

Description

Connector type

LC/PC

Optical interface

attributes

Compliant with the selected XFP optical module. For the

optional attributes of the optical module, see 1.5.3 10 Gbit/s

XFP Optical Module.

Compliance

IEEE 802.3ae

Frame format

Ethernet_II, Ethernet_SAP, and Ethernet_SNAP

Network protocol

IP

Technical Specifications

Table 1-132 shows the technical specifications of 1 x 10GBase LAN/WAN.

Table 1-132 Technical specifications of the 1 x 10GBase LAN/WAN

Item

Description

Silk-screen board name

1 x 10GBase LAN/WAN

Dimensions (W x D x H)

180 mm x 145 mm x 40 mm

Power consumption

(typical value)

16 W

Heat dissipation value

54.59 BTU/hour

Board weight

0.5 kg

1.4.9.6 4-Port 10GBase WAN/LAN-XFP FPIC (4x10GBase LAN/WAN)

The 4x10GBase LAN/WAN occupies two 1/2-width flexible card slots, applies to LPUF-21,

works in LAN or WAN mode, uses XFP optical modules, but does not support hot swap.

The 4x10GBase LAN/WAN is convergence. The left-most two ports can be converged to 10 Gbit/s in

average. The right-most two ports can be converged to 10 Gbit/s in average.

Panel

Figure 1-104 shows the appearance of the 4x10GBase LAN/WAN.

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Figure 1-104 Appearance of the 4x10GBase LAN/WAN

Name

Description

STATUS (green)

 Blinks every two seconds (0.5 Hz): The system is running

normally.

 Blinks twice each second (2 Hz): The system is in the alarm

state.

LINK/ACT (green)

 Steady on: The link is connected.

 Blinking: There is data being transmitted or received.

 Off: The link is disconnected.

Interface Attributes

Table 1-133 lists the attributes of interfaces on the 4x10GBase LAN/WAN.

Table 1-133 4x10GBase LAN/WAN interface attributes

Attributes

Description

Connector type

LC/PC

Optical interface

attributes

Compliant with the selected XFP optical module. For the

optional attributes of the optical module, see 1.5.3 10 Gbit/s

XFP Optical Module.

Working mode

Full-duplex

Frame format

Ethernet_II, Ethernet_SAP, and Ethernet_SNAP

Network protocol

IP

Technical Specifications

Table 1-134 lists the technical specifications of the 4x10GBase LAN/WAN.

Table 1-134 Technical specifications of the 4x10GBase LAN/WAN

Item

Specifications

Silkscreen of the board

name

4x10GBase LAN/WAN

Dimensions (W x D x H)

340 mm x 180 mm x 40 mm

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Item

Specifications

Power consumption

(typical value)

31 W

Heat dissipation

105.77 BTU/hour

Board weight

1.2 kg

1.4.10 1-Port 100GBase-CFP Integrated Line Processing Unit

(LPUI-101)

The LPUI-101 is hot swappable and supports packet forwarding at the line speed of 100

Gbit/s on a single interface. The port can be only configured to work in LAN mode and uses

CFP optical module.

Panel

Figure 1-105 shows the appearance of the LPUI-101.

Figure 1-105 Appearance of the LPUI-101

Name

Description

OFL button

To remove a board, you must press and hold the button for five

seconds until the OFL indicator turns on.

OFL indicator (red)

Steady on: You can remove the board.

RUN indicator (green)

 Blinks every two seconds (0.5 Hz): The system is running

normally.

 Blinks twice each second (2 Hz): The system is in the alarm

state.

LINK/ACT (green)

 Steady on: The link is connected.

 Blinking: There is data being transmitted or received.

 Off: The link is disconnected.

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Interface Attributes

Table 1-135 lists the attributes of interfaces on LPUI-101.

Table 1-135 LPUI-101 Interface attributes

Attribute

Description

Connector type

LC/PC

Optical interface attribute

Compliant with the selected CFP optical module. For the

optional attributes of the optical module, see 1.5.7 100 Gbit/s

CFP Optical Modules.

Working mode

Full duplex

Standard compliance

IEEE 802.3-2002

Frame format

Ethernet_II, Ethernet_SAP, and Ethernet_SNAP

Network protocol

IP

Technical Specifications

Table 1-136 shows the technical specifications of the LPUI-101.

Table 1-136 Technical specifications of the LPUI-101

Item

Description

Silkscreen of the board

name

LPUI-101

1x100GBase LAN-CFP

E8KE-X-101-1X100GE-CFP

Dimensions (W x D x H)

399.2 mm x 532.6 mm x 40.1 mm

Power consumption

(typical value)

339 W

Heat dissipation

1157 BTU/hour

Board weight

8.28 kg

1.5 Optical/Electrical Module

This section describes supported optical/electrical modules.

1.5.1 1 Gbit/s Electrical Transceiver

The 1 Gbit/s electrical transceiver can be applied to the GE electrical interfaces.

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Figure 1-106 1 Gbit/s Electrical Transceiver

Table 1-137 lists the currently available 1 Gbit/s electrical transceivers.

Table 1-137 1 Gbit/s electrical transceivers

Product

Model

BOM

Number

Interface

Standard

Transmis

sion

Distance

Transmis

sion

medium

Auto-neg

otiation

Remarks

SFP/RJ45-

GE-100m

02314171

1000BAS

E-T

100 m

(328.08 ft)

RJ-45

Supported

To meet

NEBS

standards,

shielded

cables

must be

available

for this

type of

optical

module

used at

sites in

North

America.

Table 1-138 lists the basic features of 1 Gbit/s electrical transceivers and the compliant

standards.

Table 1-138 Basic features of 1 Gbit/s electrical transceivers and the compliant standards

Item

Description

Interface standard

IEEE Std 802.3z, IEEE Std 802.3ab

SFP MSA

Temperature

0-75°C (32°F - 167°F)

Digital diagnosis

N/A

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Item

Description

Environment standard

RoHS(exempted)

Security standard

FCC class B, IEC 61000-4-3

ESD

> 500 V (Human body model)

Table 1-139 lists the specifications of 1 Gbit/s electrical transceivers.

Table 1-139 Specifications of 1 Gbit/s electrical transceivers

Item

Description

Remarks

Interface standard

1000BASE-T

-

Transmission rate

10-1000 Mbit/s

Complying with IEEE802.3

Interface type

RJ-45

-

Transmission distance

100m (328.08 ft)

Category 5 UTP, BER <

10-12, (SFP/RJ45-GE-100)

1.5.2 1.25 Gbit/s SFP/eSFP Optical Module

The 1.25 Gbit/s SFP/eSFP optical modules of different levels can be applied to the GE

interface. The wavelength of the common 1.25 Gbit/s SFP/eSFP optical modules can be 850

nm, 1310 nm, or 1550 nm and the transmission distance ranges from 0.5 km (0.31 mi) to 80

km (49.71 mi).

Figure 1-107 1.25 Gbit/s SFP/eSFP Optical Module

Table 1-140 lists the currently available 1.25 Gbit/s SFP/eSFP optical modules.

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Table 1-140 1.25 Gbit/s SFP/eSFP optical modules

Product

Model

BOM

Number

Interface

Standard

Transmis

sion

Distance

(km) (mi)

Transmis

sion

medium

Wavelen

gth (nm)

Remarks

eSFP-GE-

MM850-5

00m

02315204

1000BAS

E-SX

0.5 (0.31)

Multi-mod

e

850

Preferred

eSFP-GE-

SM1310-1

0Km

02315200

1000BAS

E-LX

10 (6.21)

Single-mo

de

1310

Preferred

eSFP-GE-

SM1310-4

0Km

02317346

1000BAS

E-LX

40 (24.86)

Single-mo

de

1310

Preferred

When

performin

g a

self-loop

test, use

an optical

attenuator

eSFP-GE-

SM1550-8

0Km

02317348

1000BAS

E-ZX

80 (49.71)

Single-mo

de

1550

Preferred

When

performin

g a

self-loop

test, use

an optical

attenuator

Table 1-141 lists the basic features of 1.25 Gbit/s SFP/eSFP optical modules and the

compliant standards.

Table 1-141 Basic features of 1.25 Gbit/s SFP/eSFP optical modules and the compliant standards

Item

Description

Interface standard

IEEE802.3, SFP MSA

Bit Error Ratio (BER)

< 1 x 10E -12

Temperature

0°C -70°C (32°F -158°F)

Digital diagnosis

SFF-8472(exclude SFP optical modules)

Environment standard

RoHS (exempted)

Security standard

FCC class B, IEC 60825-1 Class 1

ESD

> 500 V (Human body model)

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Table 1-142 lists the specifications of the eSFP-GE-MM850-500 optical module.

Table 1-142 Specifications of the eSFP-GE-MM850-500 optical module

Item

Description

Interface standard

1000BASE-SX

Transmission rate

1.25 Gbit/s

Interface type

LC/PC

Transmission distance

500m (310.7 ft.) (50/125 um MMF)

200m (124.28 ft.) (62.5/125 um MMF)

Optical transmitter

Optical source type

VCSEL

Center wavelength

850 nm

Operating wavelength range

830 nm-860 nm

Spectral characteristics

Maximum root mean square (RMS)

Spectral Width

0.85 nm

Maximum spectral width (-20 dB)

N/A

Minimum side mode suppression ratio

(SMSR)

N/A

Average transmit optical power

Maximum transmit optical power

-3dBm

Minimum transmit optical power

-9dBm

Minimum extinction ratio

9.0dB

Optical receiver

Operating wavelength range

770nm-860nm

Maximum receiver sensitivity

-17dBm

Overload power

0dBm

Maximum optical channel cost

N/A

Maximum reflection factor

N/A

Table 1-143 lists the specifications of the eSFP-GE-SM1310-10K optical module.

Table 1-143 Specifications of the eSFP-GE-SM1310-10K optical module

Parameter

Description

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Parameter

Description

Interface standard

1000BASE-LX

Transmission rate

1.25 Gbit/s

Interface type

LC

Transmission distance

10 km(6.21 mi)

Optical transmitter

Optical source type

FP

Center wavelength

1310 nm

Operating wavelength range

1270-1355 nm

Spectral characteristics

Maximum root mean square (RMS)

Spectral Width

4 nm

Maximum spectral width (-20 dB)

N/A

Minimum side mode suppression ratio

(SMSR)

N/A

Average transmit optical power

Maximum transmit optical power

-3 dBm

Minimum transmit optical power

-9 dBm

Minimum extinction ratio

9.5 dB

Optical receiver

Operating wavelength range

1260-1580 nm

Minimum receiver sensitivity

-20 dBm

Overload power

-3 dBm

Maximum optical channel cost

N/A

Maximum reflection factor

N/A

Table 1-144 lists the specifications of the SFP-STM1-MM1310-40K optical module.

Table 1-144 Specifications of the SFP-STM1-MM1310-40K optical module

Parameter

Description

Interface standard

1000BASE-ZX

Transmission rate

1.25 Gbit/s

Interface type

LC/PC

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Parameter

Description

Transmission distance

40 km (25 mi)

Optical transmitter

Optical source type

DFB

Center wavelength

1310 nm

Operating wavelength range

1275 nm-1335 nm

Spectral characteristics

Maximum root mean square (RMS)

Spectral Width

N/A

Maximum spectral width (-20 dB)

1.0 nm

Minimum side mode suppression ratio

(SMSR)

30 dB

Average transmit optical power

Maximum transmit optical power

0 (34060298)dBm

Minimum transmit optical power

-5 (34060298)dBm

Minimum extinction ratio

9dB

Optical receiver

Operating wavelength range

1260 nm-1580 nm

Receiver sensitivity

-23 dBm

Overload power

-3 dBm

Maximum optical channel cost

N/A

Maximum reflection factor

N/A

Table 1-145 lists the specifications of the eSFP-GE-SM1550-80K optical module.

Table 1-145 Specifications of the eSFP-GE-SM1550-80K optical module

Parameter

Description

Interface standard

1000BASE-ZX

Transmission rate

1.25 Gbit/s

Interface type

LC/PC

Transmission distance

80 km (50 mi)

Optical transmitter

Optical source type

DFB

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Parameter

Description

Center wavelength

1550 nm

Operating wavelength range

1540 nm-1570 nm

Spectral characteristics

Maximum root mean square (RMS)

Spectral Width

N/A

Maximum spectral width (-20 dB)

1.0 nm

Minimum side mode suppression ratio

(SMSR)

30 dB

Average transmit optical power

Maximum transmit optical power

3 dBm

Minimum transmit optical power

-2 dBm

Minimum extinction ratio

9 dB

Optical receiver

Operating wavelength range

1270 nm-1570 nm

Minimum receiver sensitivity

-22 dBm

Overload power

-3 dBm

Maximum optical channel cost

N/A

Maximum reflection factor

N/A

1.5.3 10 Gbit/s XFP Optical Module

The 10 Gbit/s XFP optical modules of different levels can be applied to the OC-192/STM-64

POS interface and 10 GE interface. The wavelength of these 10 Gbit/s XFP optical modules

can be 850 nm, 1310 nm, or 1550 nm and the transmission distance ranges from 0.3 km (0.19

mi.) to 80 km (49.71 mi.).

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Figure 1-108 10 Gbit/s XFP Optical Module

Table 1-146 lists the currently available 10 Gbit/s XFP optical modules.

Table 1-146 10 Gbit/s XFP optical modules

Product

Model

BOM

Number

Interface

Standard

Transmis

sion

Distance

(km)

Transmis

sion

medium

Wavelen

gth (nm)

Remarks

XFP-10G-

MM850-3

00m

02315176

10GBASE

-SR/SW

0.3 (0.19

mi.)

Multi-mod

e

850

-

XFP-10G-

SM1310-1

0Km

02315208

10GBASE

-LR/LW

STM-64/

OC-192

10 (6.21

mi.)

Single-mo

de

1310

-

XFP-10G-

SM1550-4

0Km

02315209

10GBASE

-ER/EW

STM-64/

OC-192

40 (24.86

mi.)

Single-mo

de

1550

When

performin

g a

self-loop

test, use

an optical

attenuator

XFP-10G-

SM1550-8

0Km

02315143

10GBASE

-ZR/ZW

STM-64/

OC-192

80 (49.71

mi.)

Single-mo

de

1550

When

performin

g a

self-loop

test, use

an optical

attenuator

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Table 1-147 lists the basic features of 10 Gbit/s XFP optical modules and the compliant

standards.

Table 1-147 Basic features of 10 Gbit/s XFP optical modules and the compliant standards

Item

Description

Interface standard

IEEE802.3ae 10GE, SONET OC-192/SDH

STM-64, XFP MSA

XFP-10G-MM850-300 do not support

SONET OC-192/SDH STM-64

Bit Error Ratio (BER)

< 1 x 10E -12

Temperature

0-70°C (32°F to 158°F)

Digital diagnosis

XFP MSA INF8077i

Environment standard

RoHS (exempted)

Security standard

FCC class B, IEC 60825-1 Class 1 laser eye

safe

ESD

> 500 V (Human body model)

Table 1-148 lists the specifications of the XFP-10G-MM850-300 optical module.

Table 1-148 Specifications of the XFP-10G-MM850-300 optical module

Item

Description

Interface standard

10GBASE-SR/SW

Transmission rate

10.3125 Gbit/s (10GBASE-SR/SW)

9.95328 Gbit/s (10GBASE-SW)

Interface type

LC

Transmission distance

300m (984.24 ft) (50/125um MMF, OM3)

33m (108.27 ft) (62.5/125um MMF, OM1)

Optical transmitter

Optical source type

VCSEL

Center wavelength

850 nm

Operating wavelength range

840-860 nm

Spectral characteristics

Maximum root mean square (RMS)

Spectral Width

0.45 nm

Maximum spectral width (-20 dB)

N/A

Minimum side mode suppression ratio

N/A

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Item

Description

(SMSR)

Average transmit optical power

Maximum transmit optical power

-1.3 dBm

Minimum transmit optical power

-7.3 dBm

Minimum extinction ratio

3.0 dB

Optical receiver

Operating wavelength range

840-860 nm

Receiver sensitivity

-9.9 dBm

Overload power

-1 dBm

Maximum optical channel cost

N/A

Maximum reflection factor

-12 dB

Table 1-149 lists the specifications of the XFP-10G-SM1310-10K optical module.

Table 1-149 Specifications of the XFP-10G-SM1310-10K optical module

Item

Description

Interface standard

10GBASE-LR/LW, STM-64/OC-192

Transmission rate

9.95328 Gbit/s

(STM-64/OC-192/10GBASE-LW)

10.3125 Gbit/s (10GBASE-LR/LW)

Interface type

LC

Transmission distance

10km (6.21 mi.)

Optical transmitter

Optical source type

DFB

Center wavelength

1310 nm

Operating wavelength range

1290-1330 nm

Spectral characteristics

Maximum root mean square (RMS)

Spectral Width

N/A

Maximum spectral width (-20 dB)

1.0 nm

Minimum side mode suppression ratio

(SMSR)

30 dB

Average transmit optical power

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Item

Description

Maximum transmit optical power

-1 dBm

Minimum transmit optical power

-6 dBm

Minimum extinction ratio

6 dB

Optical receiver

Operating wavelength range

1270-1565 nm

Receiver sensitivity

-14.4 dBm

Overload power

0.5 dBm

Maximum optical channel cost

1 dB

Maximum reflection factor

-14 dB

Table 1-150 lists the specifications of the XFP-10G-SM1550-40K optical module.

Table 1-150 Specifications of the XFP-10G-SM1550-40K optical module

Item

Description

Interface standard

10GBASE-ER/EW, STM-64/OC-192

Transmission rate

9.95328 Gbit/s (STM-64/OC-192/EW)

10.3125 Gbit/s (10GBASE-ER)

Interface type

LC

Transmission distance

40km (24.86 mi.)

Optical transmitter

Optical source type

EML

Center wavelength

1550 nm

Operating wavelength range

1530-1565 nm

Spectral characteristics

Maximum root mean square (RMS)

Spectral Width

N/A

Maximum spectral width (-20 dB)

1.0 nm

Minimum side mode suppression ratio

(SMSR)

30 dB

Average transmit optical power

Maximum transmit optical power

2 dBm

Minimum transmit optical power

-1 dBm

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Item

Description

Minimum extinction ratio

8.2 dB

Optical receiver

Operating wavelength range

1270-1565 nm

Receiver sensitivity

-15.8 dBm

Overload power

-1 dBm

Maximum optical channel cost

2 dB

Maximum reflection factor

-26 dB

Table 1-151 lists the specifications of the XFP-10G-SM1550-80K optical module.

Table 1-151 Specifications of the XFP-10G-SM1550-80K optical module

Item

Description

Interface standard

10GBASE-ZR/ZW, STM-64/OC-192

Transmission rate

9.95328 Gbit/s (STM-64/OC-192/ZW)

10.3125 Gbit/s (10GBASE-ZR)

Interface type

LC/PC

Transmission distance

80 km (49.71 mi.)

Optical transmitter

Optical source type

EML

Center wavelength

1550 nm

Operating wavelength range

1530-1565 nm

Spectral characteristics

Maximum root mean square (RMS)

Spectral Width

N/A

Maximum spectral width (-20 dB)

1.0 nm

Minimum side mode suppression ratio

(SMSR)

30 dB

Average transmit optical power

Maximum transmit optical power

4 dBm

Minimum transmit optical power

0 dBm

Minimum extinction ratio

9 dB

Optical receiver

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Item

Description

Operating wavelength range

1270-1600 nm

Receiver sensitivity

-24 dBm

Overload power

-7 dBm

Maximum optical channel cost

2 dB

Maximum reflection factor

-27 dB

1.5.4 10 Gbit/s SFP+ Optical Module

The 10 Gbit/s SFP+ optical modules can only be used on 10 GE interfaces. The wavelength of

these 10 Gbit/s SFP+ optical modules can be 850 nm, 1310 nm, or 1550 nm. The transmission

distance ranges from 0.3 km (0.19 mi.) to 80 km (49.71 mi.).

Figure 1-109 10 Gbit/s SFP+ Optical Module

Table 1-152 lists the currently available 10 Gbit/s SFP+ optical modules.

Table 1-152 10 Gbit/s SFP+ optical modules

Product

Model

BOM

Number

Interface

Standard

Transmis

sion

Distance

(km)

Mode

Wavelen

gth (nm)

Remarks

SFP+-10

G-MM85

0-300m

02318169

10GBASE

-SR

0.3 (0.19

mi.)

Multi-mod

e

850

-

SFP+-10

G-SM131

0-10Km

02318170

10GBASE

-LR

10 (6.21

mi.)

Single-mo

de

1310

-

SFP+-10

G-SM155

02310CN

10GBASE

40 (24.86

Single-mo

1550

The

optical

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Product

Model

BOM

Number

Interface

Standard

Transmis

sion

Distance

(km)

Mode

Wavelen

gth (nm)

Remarks

0-40Km

F

-ER

mi.)

de

modules

produced

by

FINISAR

are of the

cooled

type, and

the

initializati

on time

does not

exceed

90s. When

performin

g a

self-loop

test, use an

optical

attenuator.

SFP+-10

G-SM155

0-80Km

34060672

02310SN

N

10GBASE

-ZR

80 (49.71

mi.)

Single-mo

de

1550

When

performin

g a

self-loop

test, use an

optical

attenuator

Table 1-153 lists the basic features of 10 Gbit/s SFP+ optical modules and the compliant

standards.

Table 1-153 Basic features of 10 Gbit/s SFP+ optical modules and the compliant standards

Item

Description

Interface standard

IEEE802.3ae 10GE, SFP+ MSA,SFF-8472

SONET OC-192/SDH STM-64 is not

supported.

Bit Error Ratio (BER)

<1x10E-12

Temperature

0°C to 70°C (32°F to 158°F)

Digital diagnosis

SFF-8472

Environment standard

RoHS-6 (lead free)

Security standard

IEC 60825-1 Class 1 laser eye safe

ESD

>500 V (Human body model)

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Table 1-154 lists the specifications of the SFP+-10G-MM850-300 optical modules.

Table 1-154 Specifications of the SFP+-10G-MM850-300 optical modules

Item

Description

Interface standard

10GBASE-SR

Transmission rate

10.3125 Gbit/s (10GBASE-SR)

Interface type

LC

Transmission distance

300 m (984.24 ft) (50/125um MMF, OM3)

33 m (108.27 ft) (62.5/125um MMF, OM1)

Optical transmitter

Optical source type

VCSEL

Center wavelength

850 nm

Operating wavelength range

840-860 nm

Spectral characteristics

Maximum root mean square (RMS)

spectral width

0.45 nm

Maximum spectral width (-20 dB)

N/A

Minimum side mode suppression ratio

(SMSR)

N/A

Average transmit optical power

Maximum transmit optical power

-1 dBm

Minimum transmit optical power

-7.3 dBm

Minimum extinction ratio

3.0 dB

Optical receiver

Operating wavelength range

840-860 nm

Receiver sensitivity

-9.9 dBm

Overload power

-1 dBm

Maximum optical channel cost

N/A

Maximum reflection factor

-12 dB

Table 1-155 lists the specifications of the SFP+-10G-SM1310-10Km optical modules.

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Table 1-155 Specifications of the SFP+-10G-SM1310-10Km optical modules

Item

Description

Interface standard

10GBASE-LR

Transmission rate

10.3125 Gbit/s (10GBASE-LR)

Interface type

LC

Transmission distance

10 km (6.21 mi.)

Optical transmitter

Optical source type

DFB

Center wavelength

1310 nm

Operating wavelength range

1260-1355 nm

Spectral characteristics

Maximum root mean square (RMS)

spectral width

N/A

Maximum spectral width (-20dB)

N/A

Minimum side mode suppression ratio

(SMSR)

30 dB

Average transmit optical power

Maximum transmit optical power

0.5 dBm

Minimum transmit optical power

-8.2 dBm

Minimum extinction ratio

3.5 dB

Optical receiver

Operating wavelength range

1260-1355 nm

Receiver sensitivity

-14.4 dBm

Overload power

0.5 dBm

Maximum optical channel cost

N/A

Maximum reflection factor

-12 dB

Table 1-156 lists the specifications of the SFP+-10G-SM1550-40Km optical modules.

Table 1-156 Specifications of the SFP+-10G-SM1550-40Km optical modules

Item

Description

Interface standard

10GBASE-ER

Transmission rate

10.3125 Gbit/s (10GBASE-ER)

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Item

Description

Interface type

LC

Transmission distance

40 km (24.86 mi.)

Optical transmitter

Optical source type

EML

Center wavelength

1550 nm

Operating wavelength range

1530-1565 nm

Spectral characteristics

Maximum root mean square (RMS)

spectral width

N/A

Maximum spectral width (-20dB)

1nm

Minimum side mode suppression ratio

(SMSR)

30 dB

Average transmit optical power

Maximum transmit optical power

4 dBm

Minimum transmit optical power

-4.7 dBm

Minimum extinction ratio

3 dB

Optical receiver

Operating wavelength range

1530-1565 nm

Receiver sensitivity

-15.8 dBm

Overload power

0.5 dBm

Maximum optical channel cost

N/A

Maximum reflection factor

-26 dB

Table 1-157 lists the specifications of the SFP+-10G-SM1550-80Km optical modules.

Table 1-157 Specifications of the SFP+-10G-SM1550-80Km optical modules

Item

Description

Interface standard

10GBASE-ER

Transmission rate

10.3125 (10GBASE-ER)

9.953 (10GBASE-WAN)

Interface type

LC

Transmission distance

80 km (49.72 mi.)

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Item

Description

Optical transmitter

Optical source type

EML

Center wavelength

1550 nm

Operating wavelength range

1530-1565 nm

Spectral characteristics

Maximum root mean square (RMS)

spectral width

N/A

Maximum spectral width (-20dB)

1 nm

Minimum side mode suppression ratio

(SMSR)

30 dB

Average transmit optical power

Maximum transmit optical power

4 dBm

Minimum transmit optical power

0 dBm

Minimum extinction ratio

9 dB

Optical receiver

Operating wavelength range

1530-1565 nm

Receiver sensitivity

-24 dBm

Overload power

-7 dBm

Maximum optical channel cost

N/A

Maximum reflection factor

-27 dB

1.5.5 40 Gbit/s CFP Optical Modules

The 40 Gbit/s CFP Optical Modules can only be used on 40 GE interfaces. They provide

multiple wavelength ranges. The transmission distance is 10 km (6.21 mi).

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Figure 1-110 40 Gbit/s CFP Optical Modules

Table 1-158 lists the available 40 Gbit/s CFP optical modules.

Table 1-158 40 Gbit/s CFP optical modules

Model

BOM

Number

Interface

Standard

Transmis

sion

Distance

(km) (mi)

Transmis

sion

medium

Wavelen

gth (nm)

Remarks

CFP-40G-

SM-10k

02310TM

D

40GBASE

-LR4

10(6.21)

Single

mode

1271

1291

1311

1331

-

Table 1-159 lists the attributes and standards of 40 Gbit/s CFP optical modules.

Table 1-159 Attributes and standards of 40 Gbit/s CFP optical modules

Attribute and standard

Description

Interface standard

40GBASE-LR4, ITU-T G.959.1 4I1-9D1F

Bit error rate (BER)

< 1 x 10E -12

Operating temperature

0-70°C (32°F to 158°F)

Digital diagnosis

Environment standard

RoHS (exempted)

Safety standard

FCC class B, IEC 60825-1 Class 1 laser eye

safe

ESD

>500V (Human Body Model (HBM))

Table 1-160 lists the CFP-40G-SM1310-10k optical module specifications.

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Table 1-160 CFP-40G-SM1310-10k optical module specifications

Item

Description

Interface standard

40GBASE-LR4

Transmission rate

41.25 Gbit/s

Interface type

LC

Transmission distance

10 km (6.21 mi)

Optical transmitter

Optical source type

Semi-cooled EA-DFB

Center wavelength

1271 nm

1291 nm

1311 nm

1331 nm

Working wavelength

1264.5-1277.5 nm

1284.5-1297.5 nm

1304.5-1317.5 nm

1324.5-1337.5 nm

Spectrum attributes

Maximum root-mean-square (RMS)

spectral width

N/A

Maximum spectrum width (-20 dB)

N/A

Minimum Side Mode Suppression Ratio

(SMSR)

30 dB

Average transmit optical power

Maximum transmit optical power

3.5 dBm

Minimum transmit optical power

-4 dBm

Minimum extinction ratio

4.0 dB

Optical receiver

Working wavelength

1264.5-1277.5 nm

1284.5-1297.5 nm

1304.5-1317.5 nm

1324.5-1337.5 nm

Minimum receiver sensitivity

-13.7 dBm

Overload optical power

3.5 dBm

Minimum optical channel overhead

1.5 dB

Maximum reflection coefficient

-26 dB

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1.5.6 40 Gbit/s QSFP+ Optical Module

The 40 Gbit/s QSFP+ optical modules can only be used on 40 GE interfaces. The wavelength

of these 40 Gbit/s QSFP+ optical modules can be 850 nm, or 1310 nm-center multiple

wavelength ranges. The transmission distance is 0.15 km (0.09 mi.), 0.3 km (0.18 mi.), or 10

km (6.21 mi.).

Figure 1-111 40 Gbit/s QSFP+ Optical Module

Table 1-161 lists the currently available 40 Gbit/s QSFP+ optical modules.

Table 1-161 40 Gbit/s QSFP+ optical modules

Product

Model

BOM

Number

Interface

Standard

Transmis

sion

Distance

(km)

Mode

Wavelen

gth (nm)

Remarks

QSFP+-4

0G-SM-1

0km

02310MH

S

40GBASE

-LR4

10 (6.21

mi.)

Single-mo

de

1271

1291

1311

1331

-

QSFP+-4

0G-MM-

0.15km

02310MH

R

40GBASE

-SR4

0.15 (0.09

mi.)

Multi-mod

e

850

-

QSFP+-4

0G-MM-

0.3km

02310RM

B

40GBase-

eSR4

0.3 (0.18

mi.)

Multi-mod

e

850

-

Table 1-162 lists the basic features of 40 Gbit/s QSFP+ optical modules and the compliant

standards.

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Table 1-162 Basic features of 40 Gbit/s QSFP+ optical modules and the compliant standards

Item

Description

Interface standard

IEEE 802.3ba

Bit Error Ratio (BER)

<1x10E-12

Temperature

0°C to 70°C (32°F to 158°F)

Digital diagnosis

QSFP MSA

Environment standard

RoHS-6 (lead free)

Security standard

-

ESD

>500 V (Human body model)

Table 1-163 lists the specifications of the QSFP+-40G-SM-10km optical modules.

Table 1-163 Specifications of the QSFP+-40G-SM-10km optical modules

Item

Description

Interface standard

40GBASE-LR4

Transmission rate

41.25 Gbit/s

Interface type

LC

Transmission distance

10 km (6.21 mi.)

Optical transmitter

Optical source type

DFB

Center wavelength

1310 nm

Operating wavelength range

1264.5 nm-1277.5 nm

1284.5 nm-1297.5 nm

1304.5 nm-1317.5 nm

1324.5 nm-1337.5 nm

Spectral characteristics

Maximum root mean square (RMS)

spectral width

N/A

Maximum spectral width (-20 dB)

N/A

Minimum side mode suppression ratio

(SMSR)

N/A

Average transmit optical power

Maximum transmit optical power

2.3 dBm

Minimum transmit optical power

–7 dBm

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Item

Description

Minimum extinction ratio

3.5 dB

Optical receiver

Operating wavelength range

1264.5 nm-1277.5 nm

1284.5 nm-1297.5 nm

1304.5 nm-1317.5 nm

1324.5 nm-1337.5 nm

Receiver sensitivity

–11.5 dBm

Overload power

2.3 dBm

Maximum optical channel cost

1.9 dB

Maximum reflection factor

N/A

Table 1-164 lists the specifications of the QSFP+-40G-MM-0.15km optical modules.

Table 1-164 Specifications of the QSFP+-40G-MM-0.15km optical modules

Item

Description

Interface standard

40GBASE-SR4

Transmission rate

41.25Gbit/s

Interface type

MPO

Transmission distance

0.15 km (0.09 mi.)

Optical transmitter

Optical source type

VCSEL

Center wavelength

850 nm

Operating wavelength range

840 nm-860 nm

Spectral characteristics

Maximum root mean square (RMS)

spectral width

N/A

Maximum spectral width (-20dB)

N/A

Minimum side mode suppression ratio

(SMSR)

N/A

Average transmit optical power

Maximum transmit optical power

-1 dBm

Minimum transmit optical power

-7.6 dBm

Minimum extinction ratio

3 dB

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Item

Description

Optical receiver

Operating wavelength range

840 nm-860 nm

Receiver sensitivity

-9.5 dBm

Overload power

2.4 dBm

Maximum optical channel cost

N/A

Maximum reflection factor

N/A

Table 1-164 lists the specifications of the QSFP+-40G-MM-0.3km optical modules.

Table 1-165 Specifications of the QSFP+-40G-MM-0.3km optical modules

Item

Description

Interface standard

40GBase-eSR4

Transmission rate

41.25 Gbit/s

Interface type

MPO

Transmission distance

0.3 km (0.18 mi.)

Optical transmitter

Optical source type

VCSEL

Center wavelength

850 nm

Operating wavelength range

840 nm-860 nm

Spectral characteristics

Maximum root mean square (RMS)

spectral width

N/A

Maximum spectral width (-20dB)

N/A

Minimum side mode suppression ratio

(SMSR)

N/A

Average transmit optical power

Maximum transmit optical power

-1 dBm

Minimum transmit optical power

-7.6 dBm

Minimum extinction ratio

3 dB

Optical receiver

Operating wavelength range

840 nm-860 nm

Receiver sensitivity

-9.9 dBm

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Item

Description

Overload power

2.4 dBm

Maximum optical channel cost

N/A

Maximum reflection factor

N/A

1.5.7 100 Gbit/s CFP Optical Modules

The 100 Gbit/s CFP Optical Modules can only be used on 100 GE interfaces. They provide

multiple wavelength ranges. The transmission distance ranges from 0.1 km (0.06 mi.) to 10

km (6.21 mi.).

Figure 1-112 100 Gbit/s CFP Optical Modules

Table 1-166 lists the available 100 Gbit/s CFP optical modules.

Table 1-166 100 Gbit/s CFP optical modules

Model

BOM

Number

Interface

Standard

Transmissi

on

Distance

(km) (mi)

Transmissi

on medium

Wavelengt

h (nm)

CFP-100G-S

M-10km

(4x25G)

02310YTD

100GBASE-

LR4

10(6.21)

Single mode

1295

1300

1304

1309

CFP-100G-

MM-0.1Km(

10x10G)

02310YNE

100GBASE-

SR10

0.1(0.06)

Multi-mode

850

Table 1-167 lists the attributes and standards of 100 Gbit/s CFP optical modules.

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Table 1-167 Attributes and standards of 100 Gbit/s CFP optical modules

Item

Description

Interface standard

100GBASE-LR4

100GBASE-SR10

Bit error rate (BER)

< 1 x 10E -12

Operating temperature

0-70°C (32°F to 158°F)

Digital diagnosis

-

Environment standard

RoHS (exempted)

Safety standard

FCC class B, IEC 60825-1 Class 1 laser eye

safe

ESD

>500V

Table 1-168 lists the CFP-100G-SM-10km (4x25G) optical module specifications.

Table 1-168 CFP-100G-SM-10km (4x25G) optical module specifications

Item

Description

Interface standard

100GBASE-LR4

Transmission rate

103.125 Gbit/s

Interface type

LC/PC

Transmission distance

10 km (6.21 mi)

Optical transmitter

Optical source type

EML

Center wavelength

1295 nm

1300 nm

1304 nm

1309 nm

Working wavelength

1294.53-1296.59 nm

1299.02-1301.09 nm

1303.54-1305.63 nm

1308.09-1310.19 nm

Spectrum attributes

Maximum root-mean-square (RMS)

spectral width

N/A

Maximum spectrum width (-20 dB)

N/A

Minimum Side Mode Suppression Ratio

30 dB

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Item

Description

(SMSR)

Average transmit optical power

Maximum transmit optical power

4.5 dBm

Minimum transmit optical power

-4.3 dBm

Minimum extinction ratio

4.0 dB

Optical receiver

Working wavelength

1294.53-1296.59 nm

1299.02-1301.09 nm

1303.54-1305.63 nm

1308.09-1310.19 nm

Receiver sensitivity

-10.6 dBm

Overload optical power

4.5 dBm

Minimum optical channel overhead

1.5 dB

Maximum reflection coefficient

-26 dB

Table 1-169 lists theCFP-100G-MM-0.1Km(10x10G) optical module specifications.

Table 1-169 CFP-100G-MM-0.1Km(10x10G) optical module specifications

Item

Description

Interface standard

100GBASE-SR10

Transmission rate

103.125 Gbit/s

Interface type

MPO

Transmission distance

0.1 km

Optical transmitter

Optical source type

DFB

Center wavelength

850 nm

Working wavelength

840-860 nm

Spectrum attributes

Maximum root-mean-square (RMS)

spectral width

-

Maximum spectrum width (-20 dB)

-

Minimum Side Mode Suppression Ratio

(SMSR)

-

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Item

Description

Average transmit optical power

Maximum transmit optical power

-2.4 dBm

Minimum transmit optical power

-7.6 dBm

Minimum extinction ratio

3 dB

Optical receiver

Working wavelength

840-860 nm

Receiver sensitivity

-9.5 dBm

Overload optical power

2.5 dBm

Minimum optical channel overhead

3.5 dB

Maximum reflection coefficient

-

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2 Hardware Installation

2.1 Installation Preparation

Before installing the USG9500, learn installation preparations and requirements, prepare

technical files, tools, and instruments, and unpack and check the device.

2.1.1 Preparing Technical Documents

Technical documents are a vital prerequisite for installing a cabinet successfully. They are also

the important information to be referred to during the installation.

Before installation, read the technical documents listed in Table 2-1 carefully to master the

information on the project.

Table 2-1 Technical documents related to hardware installation

Document

Category

Document Name

Description

Installation

guide

Equipment Room Design

Construction Diagram

Cable Route Diagram

Prepared by the customer.

The user or Huawei site survey engineer

should provide the duplicates before

delivery.

Machine room site survey

report

Produced by Huawei site survey engineer

after site survey.

Engineering design,

including network

functions, networking

diagrams and network

addresses planning

Compiled by Huawei Engineering

Design Department according to the

equipment configuration of the sites.

Delivered at the installation site along

with the equipment.

Product manual

Attached disk

Quick Installation Guide

They are provided by Huawei and

shipped together with the equipment.

Installers can refer to these manuals to

install and maintain the equipment.

Contract

Configuration Table

Provided by Huawei during delivery.

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Document

Category

Document Name

Description

Packing List

2.1.2 Preparing Tools and Meters

The owner of installation needs to arrange the tools and meters for hardware installation.

Table 2-2 lists the required tools and meters for USG9500 installation.

Table 2-2 Required instruments and meters

Category

Instrument/Meter

Measuring and

lineation instruments

 Ruler: used to measure length.

 Marker: used to indicate specific lengths with drawn lines.

Fastening tools

 Flat-head screwdriver: used to fasten small screws and bolts.

 Phillips screwdriver: used to fasten small screws and bolts.

Drilling tools

 Hammer drill: used to drill mounting holes during

wall-mounting.

 Vacuum cleaner: used to remove dust and debris produced

while drilling holes.

 Hammer: used to drive the hollow wall anchors into mounting

holes.

Pliers

 Needle-nose pliers: used to hold small fittings and twist fine

wires in a narrow workplace.

 Diagonal cutting pliers: used to cut insulated sleeves and tie

wraps.

Auxiliary tools

 Knife: used to peel the insulated sleeve from the cable.

 Ladder: used to access overhead cabling.

Special tools

 Wire stripper: used to peel the insulated sleeve of the

communication cable.

 RJ-45 crimping tool: used to crimp RJ-45 cables for telephony

and Ethernet applications.

 Crimping tool: used to crimp the metal sleeve at the ends of

coaxial cables.

 ESD gloves: used to protect the device from being damaged by

static electricity.

 ESD wrist strip: used to protect the device from being damaged

by static electricity.

 Protective gloves: used to shield hands from being injury by

sharp objects.

Meters

 Network cable tester: used to test whether a network cable is

connected and check the connection sequence in a network

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Category

Instrument/Meter

cable.

 Optical power meter: used to test the optical power.

 Optical attenuator: used to measure optical attenuation.

 Multimeter: used to test insulation within the cabinet, cable

connections, and electric performance specifications of the

device, such as the voltage, current, and resistance.

 Ground resistance tester: used to measure the ground

resistance.

 Configuration terminal (A common PC is also applicable).

2.1.3 Checking the Installation Environment

Before you install a USG9500, verify that the installation environment meets requirements to

ensure the normal running and extended life time of the USG9500.

Table 2-3 lists installation environment check items.

Table 2-3 Installation environment checklist

Check Item

Requirement

Compliance

Site for the Equipment

Room

Complies with requirements

in A.3.1 Requirements for

Selecting a Site for an

Equipment Room.

□ Y □ N □ N/A

Construction for the

equipment room

Complies with requirements

in A.3.3 Construction

Requirements for the

Equipment Room.

□ Y □ N □ N/A

Temperature

Complies with requirements

in A.3.4 Requirements for

Temperature, Humidity, and

Altitude.

□ Y □ N □ N/A

Relative humidity

□ Y □ N □ N/A

Altitude

□ Y □ N □ N/A

Neatness

Complies with requirements

in A.3.5 Requirements for

Neatness.

□ Y □ N □ N/A

Corrosive Gases

Complies with requirements

in A.3.6 Requirements for

Corrosive Gases.

□ Y □ N □ N/A

Electrostatic discharging

Complies with requirements

in A.3.7 Requirements for

ESD Prevention.

□ Y □ N □ N/A

Electromagnetic shielding

Complies with requirements

in A.3.8 Electromagnetism

Requirements for the

□ Y □ N □ N/A

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Check Item

Requirement

Compliance

Equipment Room.

Surge protection

Complies with requirements

in A.3.9 Requirements for

Lightning Proof Grounding.

□ Y □ N □ N/A

Power supply facility

Complies with requirements

in A.3.10 Requirements for

Power Supply.

□ Y □ N □ N/A

2.1.4 Unpacking and Checking the Products

The section describes procedures and precautions for unpacking and checking the device prior

to installation.

2.1.4.1 Checking the Package Container

Before unpacking and checking the products, check whether the package container is intact.

Procedure

Step 1 Unload the products.

When unloading the products, place the package containers in order. Make sure that the

product labels on the package containers are in the same direction. This facilitates the

checking.

Step 2 After unloading the products, check whether the total number of the products are the same as

the number indicated on the Packing List. Check whether the destination of delivery is the

same as the actual site for installation.

Condition

Action

The total number of products are the same

as the number indicated on the Packing List,

and the products are delivered to the correct

destination.

Perform step 4.

The total number of products are different

from the number indicated on the Packing

List, or the products are delivered to the

wrong destination.

Perform step 3.

Step 3 The engineering supervisor must send the Cargo Inspection Feedback Form that is confirmed

and signed by the customer to the order management engineer in the local Huawei

representative office within three days. At the same time, stop unpacking the products.

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Step 4 Check whether the exterior of the package container is intact. Check whether the package

container is placed correctly during transportation.

Condition

Action

The external package is intact.

Unpack and check the products.

The exterior of the package container is

seriously damaged or shows signs of water

penetration.

Perform step 5.

Step 5 Stop unpacking the products, trace the cause, report the problem to the order management

engineer of the local Huawei representative office, and wait for further assistance.

To protect the device and trace the cause, transfer the unpacked device indoors to ensure

proper storage. Take photographs of the storage site, the device that is rusted or corroded, the

related package container, and the package materials. Collect the photos and file them.

Preserve the package container and package materials that are unpacked.

----End

2.1.4.2 Unpacking the Wooden Case

In general, wooden cases are used to pack heavy goods such as racks, cabinets and batteries.

The package for a cabinet consists of wooden panels, steel edges, tongues, and foam plates. If

possible, move the wooden case into or near the equipment room, and then unpack the cabinet

to avoid damaging the cabinet during transportation.

Prerequisites

 When carrying the cabinet, always hold the stronger part of the cabinet, such as the

support or the rack. Do not exert force on the parts that are relatively weak, such as the

cable support or the cable fixing beam. Otherwise, the cabinet may get damaged or

accidents may occur. Remove the backing blocks from the rack only after the cabinet is

carried to the installation site. The same is to avoid damaging signal cables and boards

when carrying the cabinet.

 The wooden case must be positioned correctly. Do not place the wooden case upside down.

Otherwise, the device can get damaged severely.

Procedure

Step 1 Wear protective gloves.

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Step 2 Place the wooden case in an even manner on the ground, and make sure that the side with the

pallet faces downwards.

Step 3 Insert one end of the spanner into the hole of the tongue on the cover of the wooden case. Lift

the spanner to straighten the tongue, as shown in Figure 2-1. You can also use a screwdriver

or a claw hammer to straighten the tongue.

Figure 2-1 Straightening the tongue

1 Steel edge

2 Wooden panel

3 Tongue

4 Spanner

The edges of tongues are sharp and may injure your hand.

Step 4 After straightening all the tongues on the cover, remove the cover as shown in Figure 2-2.

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Figure 2-2 Removing the cover

Step 5 Straighten all the tongues that join the side wooden panels and remove the wooden panels, as

shown in Figure 2-3.

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Figure 2-3 Removing the side wooden panels

Step 6 Stand the cabinet. Remove the pallet, foam plates, and package bag.

Three to five persons are required to stand the cabinet. When standing the cabinet, prevent the

cabinet from tipping over, as this may cause injury to the personnel who are handling it.

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Step 7 Check the cabinet according to the following requirements:

 Check the appearance of the cabinet. Ensure that the exterior (especially the bottom) of

the cabinet is intact, free from water penetration, distortion, and rust.

 Check the cabinet door. Ensure that the cabinet door can be opened and closed normally.

 Check the surface of the cabinet. Ensure that the surface of the cabinet is clean, neat and

completely painted.

 Check the labels on the cabinet. Ensure that the labels on the cabinet are correct, legible

and complete.

----End

2.1.4.3 Unpacking the Carton

In general, cartons are used to pack cables, boards, and terminal devices.

Procedure

Step 1 Read the carton label carefully to know the types and quantities of the boards in the carton.

Step 2 Use diagonal pliers to cut the packing straps.

Step 3 Use a paper knife to cut the tapes along the seams of the carton cover. Do not insert the paper

knife to extra depths; otherwise, the contents inside the carton may get damaged.

Step 4 Open the carton and take out the foam plates.

Step 5 Check the label of the box that contains the board, and see whether the board quantity is

consistent with the quantity indicated on the carton label. Then, take out the boxes.

Step 6 Wear an ESD wrist strap and ground it correctly. Unpack the ESD bag that contains the board.

Check whether the board has any obvious damages.

Step 7 Check the types and quantity of the boards in the carton according to the Packing List. The

Packing List must be confirmed and signed on site by the customer.

Figure 2-4 shows the procedure for unpacking the carton.

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Figure 2-4 Unpacking the carton

1 Pressure-sensitive adhesive tape

2 Packing strap

3 Carton label

4 Carton

5 Foam plate

6 Label of the board box

7 Board box

8 ESD bag

9 Board

Do not throw away a carton that still contains boards. It is recommended that one person

unpacks one carton. After unpacking a carton, check it carefully and make sure that it is

empty before unpacking the next carton.

----End

2.1.4.4 Checking the Boards

This section describes the criteria for checking boards.

Clean the chassis and cabinet before installing the boards. Wear an antistatic wrist strap and

remove the board from the antistatic package. Check whether the board name is consistent

with the identifier on the package box, and whether any device is damaged or any component

is missing.

Check pins on the backplane of the chassis. The pins should be kept straight, orderly, and

clean. For the pins bent in the board slots on the backplane, repair them.

The boards are sensitive to Electrostatic Discharge (ESD). When handling boards, observe the

following rules:

 Check whether the device is securely grounded against requirements.

 Wear an antistatic wrist strap during the installation.

 Ensure good contact of the metal tab of the wrist strap with your bare skin. Insert the

other end of the wrist strap into the grounding point on the device.

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 Ensure that the wrist strap works in the normal state. Its resistance value must be

between 0.75 megohm and 10 megohm. If the service life (usually two years) of the

wrist strap expires or the resistance value fails to meet requirements, replace it with

another one.

 Avoid touching the board with your clothes, because the touch generates static electricity

that is beyond the protection scope of the wrist strap.

 Wear antistatic gloves and place the board on an antistatic pad when replacing the chip of

the board. Use antistatic tweezers or extraction tools to replace chips. Do not tough chips,

circuits, or pins with your bare hands.

 Keep the board and other ESD sensitive parts to be installed in antistatic bags. Place the

removed boards and components on an antistatic pad or other antistatic materials. Do not

use non-antistatic materials such as white foams, common plastic bags, or paper bags to

pack boards or let them touch boards.

 Wear an antistatic wrist strap when operating the ports of boards because they are also

ESD-sensitive. Discharge the static electricity of cables and protective sleeves before

connecting them to the ports.

 It is recommended that you reserve some materials that can hold boards such as vacuum

formed boxes and antistatic bags in the equipment room for later use.

2.2 Installing USG9580

This section describes how to install the USG9580.

2.2.1 Preparing the Site

Prior to device installation, deploy the cabinet and device according to the following

requirements to ensure that the device can operate properly.

Power Supply System

 If you use DC power, ensure that the outputs of the DC power distribution box fall

within the range of -72 V DC to -38 V DC. Two power modules are needed, and each

power module must be connected to two different power sources for redundancy.

 If you use AC power, ensure that the outputs of the AC power distribution box fall within

the range of 90V AC to 264 V AC. Two power modules are needed, and each power

module must be connected to two different power sources for redundancy. Meanwhile,

two AC power chassis must be installed on the device.

Cabinet Requirements

You are advised to use Huawei standard NE68E cabinet. The self-purchased cabinet must

meet A.6 Requirements on Customers' Cabinets Purchased from Other Vendors.

Cabinet Clearance Requirements

The N68E-22 cabinet is used as an example. As shown in Figure 2-5, cabinet clearance must

meet the following requirements:

 Aisles in the equipment room ≥ 1000 mm; aisles between cabinet rows ≥ 1000 mm

 Spacing between cabinet sides and wall ≥800 mm

 Spacing between cabinet row and wall ≥ 1000 mm

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Figure 2-5 Diagram for cabinet deployment

Device Clearance Requirements

The USG9580 chassis is 32 U high and requires front and back maintenance mode. Device

clearance must meet the following requirements:

 Airflow clearance

− Maintain a minimum of 750 mm spacing between the device and the equipment

room wall and between two neighboring devices to prevent hot air recirculation.

− Maintain a minimum spacing of 2 U between devices installed in the same cabinet,

between the top-most device and the cabinet top, and between the bottom-most

device and the cabinet bottom.

 Maintenance clearance

Maintain a minimum of 700 mm spacing between devices and between a device and

wall.

The height of three holes on the mounting rails is 1 U, which is equivalent to 44.45 mm.

2.2.2 Installing the Chassis into the Cabinet

The USG9580 can be mounted into a 19-inch standard cabinet through guide rails.

Context

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 The USG9580 is heavy and requires four people to lift and move.

 Use the handles on the chassis sides when moving the device. Do not use the handles of

modules to avoid damages to the device.

 Do not step on the air filter at the bottom of the cabinet.

Procedure

Step 1 Install floating nuts and guide rails

1. Determine where to install floating nuts and mark the positions using a marker, as shown

in Figure 2-6.

2. Fix the floating nuts at the positions.

3. Use M6 screws to fix the guide rails at the positions.

Figure 2-6 Installing floating nuts and guide rails

Step 2 Install mounting ears on the USG9580.

Use a Phillips screwdriver to fix the mounting ears to both sides of the chassis with M4

screws, as shown in Figure 2-7.

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Figure 2-7 Installing mounting ears

Step 3 Mount the USG9580 in the cabinet.

1. Lift the USG9580, move it to the cabinet, place it onto the guide rails, and push it into

the cabinet.

2. Use M6 screws to fix the mounting ears of the USG9580 to the mounting rack, as shown

in Figure 2-8.

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Figure 2-8 Mounting the USG9580 in the cabinet

Step 4 Mount the AC power chassises in the cabinet. (Mandatory in case of AC power supply)

When the equipment room uses the AC power supply, one USG9580 requires two AC power

chassises, as shown in Figure 2-9.

Figure 2-9 Mounting the AC power chassises in the cabinet

----End

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Follow-up Procedure

Perform the following checks after the installation:

 Ensure that the USG9580 is placed securely inside the cabinet.

 Ensure that the exhaust of the USG9580 is not blocked by other objects.

2.2.3 Installing the PGND Cable

Connecting the PGND cable of the USG9580 correctly is a key measure of surge protection

and resistance to interference. Before using the USG9580, correctly connect the PGND cable.

Prerequisites

Before installing the PGND cable of the device, ensure that the PGND cable of the cabinet is

correctly connected and the ground resistance is zero ohm.

Context

If the chassis is near the ground bar in the equipment room, connect the PGND cable of the

chassis directly to the ground bar. If the chassis is distant from the ground bar, connect the

PGND cable to the ground point on the cabinet.

In this section, connecting the PGND cable to the ground point on the cabinet is used as an

example.

Procedure

Step 1 Install the chassis ground cable, as shown in Figure 2-10.

Step 2 Install the ground cable of the AC power chassis (mandatory for AC power supply), as shown

in Figure 2-10.

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Figure 2-10 Connecting the PGND cable

----End

Follow-up Procedure

Verify the following after the cabling is complete:

 The PGND cable is securely connected to the ground terminal.

 The electrical resistance between the ground terminal and ground point is less than 10

ohm on a multimeter.

2.2.4 Installing Boards and Subcards

This section describes how to install boards and subcards to avoid any damage.

Context

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 Ensure that no water is on the device or board before you insert the board into the device.

 Before installing boards, wear the ESD wrist strap and that the strap is well grounded to

prevent any electrostatic discharge of the human body from damaging the sensitive

components.

The boards in the lower chassis need to be inversely installed. The installation method is the

same as that of the boards in the upper chassis.

Procedure

Step 1 Select the slots based on the slot distribution.

You can determine whether it is a correct slot for a board by checking whether the color on

both ends of the board panel is the same as the color on the slot.

Figure 2-11 Slot layout

Step 2 Install a board.

1. Determine the slot for the board to be installed based on hardware planning and remove

the filler panel from the slot.

2. Extend the ejector levels of the board, insert the board fully into slot, and rotate the

ejector level to the front of the board so that the board is fully inserted in the slot.

3. Use a Phillips screwdriver to tighten the captive screws to the board.

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Figure 2-12 Installing a board

Step 3 Install a subcard.

Before you install a subcard, remove redundant guide rails from the board and store them properly for

future use.

1. Remove the filler panel from the board.

2. Smoothly insert the subcard into the board along the guide rail.

3. Use a Phillips screwdriver to tighten the captive screws to the board.

Figure 2-13 Installing a subcard

----End

Follow-up Procedure

Check the following items after the installation is complete:

 Check whether the boards and subcards are installed in position and the captive screws

are fastened.

 Filler panels are inserted in vacant slots. You must insert filler panels in the vacant slots

on the USG9580 to prevent dust and ensure heat dissipation.

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2.2.5 Installing Chassis Components

Air filters are used to protect devices against dust, and cable racks are used to route optical

fibers and cables.

Procedure

 Install air filters to the upper and lower air intake frames.

The air intake vent has two air filters on the upper and lower ends of the front panel of the chassis

respectively.Point the pin on the air filter to the hole that prevents reverse installation. Otherwise, the air

filter cannot be installed.

Figure 2-14 Install air filters to the upper and lower air intake frames

 Install the front cable rack.

The front cable rack is classified into upper and lower cable racks. The logo of the upper cable rack is

"HUAWEI", the logo of the lower cable rack is "USG9500 Series"

a. Align the studs of the cable rack with the holes on the front panel of the device and

insert the rack.

b. (For the upper rack) Push the rack upward to click it into place.

c. (For the lower rack) Push the rack downward to click it into place.

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d. Use M4 x 10 screws to fix the cable rack.

Figure 2-15 Install the front cable rack

 Install the rear cable rack.

There are four rear cable racks on the rear panel of the chassis.

a. Align the studs of the cable rack with the holes on the rear panel of the device and

insert the rack.

b. Push the rack to the left or right to click it into place.

c. Tighten the captive screws.

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Figure 2-16 Install the rear cable rack

----End

2.2.6 Installing Power Cables-DC Power Distribution

In standard configuration, the USG9580 has eight PEM modules. Each PEM module requires

an NEG DC power cable and an RTN DC power cable. This section describes how to connect

power cables to the two DC supply modules.

Context

Never install power cables when the power is on.

Before installing the power cables, ensure that the device is adequately grounded.

 Inside the cable should be an entire piece of copper core. Any connection of the core is

not allowed.

 Cables of DC power distribution.

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Cable

Image

NEG cable

RTN cable

 The terminals on DC cables.

Terminal

Image

OT bare crimping

terminal (M8)

JG2 double-hole

bare crimping

terminal (M6)

 For details, see 2.5.1.1 Guide to the DC Power Distribution.

Procedure

Step 1 Make temporary marks on both ends of each power cable using a marker.

Step 2 Connect the M6 JG2 terminals of the DC power cable to the PEM modules on USG9580.

Connect the M8 OT terminals of the DC power cable to the output terminals on the power

supply device.

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Step 3 Use tie wraps to bind the cables every 100 mm upwards from the bottom end, and fix the

cables to the cabling rack.

Step 4 Affix permanent labels 20 mm from both ends of each power cable.

Figure 2-17 Affix permanent labels

----End

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Follow-up Procedure

Note that the power cable has polarity. After the device is powered on, if the PEM indicator

blinks red, check whether the anode and cathode of the power cable for the PEM are

connected without error. If they are connected mistakenly, switch off the previous-stage power

immediately and connect the power cable w ithout error.

1. After installing power cables, install the plastic cover to each power module.

2. The power cables are fixed securely and in reliable and good contact with the terminals.

3. In the corner, the cables should be smooth.

4. Labels for the power cables must be filled in and attached to the cables as required. All

labels are neat and face the same direction for easy viewing.

5. The power cable, grounding cable and the signal cable should be bound separately. The

distance between them must be more than 3 cm.

2.2.7 Installing Power Cables-AC Power Distribution

When the USG9580 uses AC power supply, two external AC power chassises are added to the

DC power supply system to constitute an AC power supply system. Four AC power cables are

used to connect each AC power chassis to the AC PDF.

Context

Never install power cables when the power is on.

Before installing the power cables, ensure that the device is adequately grounded.

With the 110 V AC power supply, the USG9580 must use 110 V dual-live-wire AC input to

meet the maximum system power consumption with the full configuration. This is because

AC power modules are half-load output with 110 V AC input, which cannot meet the system

power consumption.

 Inside the cable should be an entire piece of copper core. Any connection of the core is

not allowed.

 Cables of AC power distribution.

Cable

Image

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Cable

Image

DC cables

from the

device to

the AC

power

chassis

NEG cable

RTN cable

Terminals

on DC

cables from

the device

to the AC

power

chassis

JG2 double-hole

bare crimping

terminal (M6)

AC cables from the AC power

chassis to the AC power supply

device

 For details, see 2.5.1.2 Guide to the AC Power Distribution.

Procedure

Step 1 Make temporary marks on both ends of each power cable using a marker.

Step 2 Connect one end of the AC power cables to the input terminals of the AC power chassis.

Connect the other end of the AC power cables to the AC power supply device.

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Step 3 Connect one end of the DC power cables to the PEM modules on USG9580. Connect the

other end of the DC power cables to the output terminals of the AC power chassis.

Step 4 Use tie wraps to bind the cables every 100 mm upwards from the bottom end, and fix the

cables to the cable rack.

Step 5 Affix permanent labels 20 mm from both ends of each power cable.

Figure 2-18 Affix permanent labels

----End

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Follow-up Procedure

Note that the power cable has polarity. After the device is powered on, if the PEM indicator

blinks red, check whether the anode and cathode of the power cable for the PEM are

connected without error. If they are connected mistakenly, switch off the previous-stage power

immediately and connect the power cable without error.

1. After installing power cables, install the plastic cover to each power module.

2. The power cables are fixed securely and in reliable and good contact with the terminals.

3. In the corner, the cables should be smooth.

4. Labels for the power cables must be filled in and attached to the cables as required. All

labels are neat and face the same direction for easy viewing.

5. The power cable, grounding cable and the signal cable should be bound separately. The

distance between them must be more than 3 cm.

2.2.8 Connecting Network Cables

This section describes how to install electrical transceivers on the ports and connect them to

the ports of the peer device using network cables according to the network plan.

Context

Before connecting the network cable, perform the following operations:

 Check construction conditions.

The peer device has been installed in the equipment room, and the port to which the

network cable is to be connected has been determined.

 Check the cabling route.

The engineering document should specify the cabling route from the cabinet to the peer

device in the equipment room, and the length of the cable is calculated based on the

cabling path.

 Label the cable.

The cable must be labeled before being connected to the devices.

network cables fall into crossover and straight through cables. Currently, Ethernet ports on

most devices can dynamically adapt to both types of cables. Use proper cables for devices that

do not support dynamic adaptation.

By electromagnetic compatibility, network cables can be classified into ordinary and shielded

cables. The shielded cables are preferred due to their better electromagnetic compatibility.

Before connecting a cable, note the label on the port and make sure that the cable is inserted

into the correct port. Otherwise, the port module or the device might be damaged.

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Before bundling network cables, use a network cable tester to test cable connectivity. Bind the

network cables to form a rectangle inside the cabinet. Each bundle contains a maximum of 20

network cables. The tie wraps must be tidy and in the same direction.

The clearance between the power cable, PGND cable, and signal cable must be more than 30

mm.

Procedure

Step 1 If multiple network cables need to be connected, attach temporary labels to both ends of each

cable for identification.

Step 2 Remove the dust-proof caps from a board interface and insert the electrical module into the

interface.

The electrical module can be inserted only in the interface with an odd number on the 24-port

100/1000Base-X-SFP flexible interface card.

Step 3 Connect one end of a network cable to the electrical transceiver of the USG9580 and the other

end to the Ethernet port of the peer device based on the network plan.

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Figure 2-19 Connecting a network cable

Step 4 Lay out the network cable along a cabinet and route the cable through the cable hole for the

signal cables at the top (overhead cabling) or bottom (underfloor cabling) of the cabinet.

Step 5 Remove the temporary labels and attach labels (20 mm away from the connectors) at both

ends of the network cable.

----End

Follow-up Procedure

Verify the following after the installation:

 The labels at both ends of the cable are correct, clear, neat, and facing the same direction.

 The cables and connectors are free of any damage or breakage and are connected

properly and reliably.

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2.2.9 Connecting Optical Fibers

This section describes how to install optical transceivers on the ports and connect them to the

ports of the peer device using optical fibers according to the network plan.

Installing Fiber Spools

You are advised to wind excess optical fibers around fiber spools for convenient cable routing and

device maintenance.

Determine the locations of the fiber spools based on the device arrangement in the cabinet. The fiber

spools cannot be too close to device operation area to avoid hampering board insertion or removal or

cabling, and the fiber spools cannot be too far away from the device to facilitate fiber spool operation.

Figure 2-20 Installing fiber spools

Installing Optical Transceivers and Connecting Optical Fibers

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Do not look into the optical interface of the optical module or the optical fiber connector

without eye protection.

Wear an ESD wrist strap or ESD gloves before installing optical modules.

Before connecting optical fiber cables, read the following precautions:

 Do not overbend optical fibers, and the radius should not be shorter than 40 mm.

 Do not bundle the optical fibers too tight. Otherwise, the transmission performance of

the optical fibers and the communication between devices might be adversely affected.

Step 1 Before connecting an optical fiber, attach temporary labels to both ends of the optical fiber for

identification.

Step 2 Remove the dust cap from an optical interface and insert an optical module in the optical

interface.

Step 3 Remove the dust cap from the optical transceiver.

Set aside the dust cap properly for future use. After optical fiber are disconnected for maintenance, use

the dust cap to prevent the optical transceiver from dust.

Step 4 Remove protective caps from optical fiber connectors, insert optical fibers into the optical

transceiver, and connect the fiber to the peer device.

Ensure that the Tx and Rx ports are correctly connected.

Ensure that the TX and RX ports on one end of the optical fiber cable are connected to the RX

and TX ports (respectively) on the other end.

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Figure 2-21 Figure 1 Installing optical transceivers and connecting optical fibers

Step 5 Repeat Step 1 to Step 4 to install all optical transceivers and connect all optical fibers.

Step 6 Coil up the redundant optical fibers around a fiber management tray.

Step 7 Bind optical fibers every 200 mm with binding tapes and use tie wraps to fix the bundle of the

optical fibers to the cabling rack.

Step 8 Affix permanent labels 20 mm from both ends of the optical fiber.

----End

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Follow-up Procedure

After you power on the USG9500, check the connection by observing the optical port

indicator. If the indicator is on or blinks, the link is connected or data is being transmitted. If

the indicator is off, the link is disconnected. Possible causes for the disconnection are as

follows:

 The optical fiber is improperly inserted. Pull out the optical fiber and re-insert it.

 The RX and TX optical ports are inserted reversely. Pull out the optical fibers, change

their position, and re-insert them.

 The optical module is damaged or the optical fiber is broken. Replace the optical module

or the optical fiber.

2.2.10 Checking After Installation

After you install the device in a cabinet, you need to verify the cables and NE40E have been

installed correctly before powering up the device.

Cabinet Installation Checklist

No.

Item

1

Verify that the cabinet is placed according to the engineering

design document.

2

Verify that the deviation of the cabinet is less than 3 mm

horizontally and not more than 3 mm vertically.

3

Verify that all the bolts are firmly fastened, especially those for

electrical connections. Flat washers and spring washers are

used, and spring washers are placed on top of flat washers.

4

Verify that the cabinet is neat and clean.

5

Verify that the doors can be opened and closed smoothly.

6

Verify that all labels, tags, and nameplates are correct, legible,

and complete.

Installation Environment Checklist

No.

Item

1

Verify that no fingerprints or other smears exist on the

equipment.

2

Verify that no excessive electrical tapes or cable ties exist on

the cables.

3

Verify that no tapes, cable ties, wastepaper, or packaging bags

are left around the equipment.

4

Verify that all the items around the equipment are neat, clean,

and intact.

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Cable Installation Checklist

No.

Item

1

Verify that all the self-made ground cables are copper-based

with proper wire diameters. There is no switch, fuse, or

disconnection on the cable.

2

Verify that ground cables, AC input power cables, cables in the

cabinet are connected correctly according to the wiring diagram

of the power system, and the screws are tightened. Ensure that

the output and input cables are not short-circuited.

3

Verify that the redundant part of the power cable or ground

cable is stripped off rather than being coiled.

4

Verify that the lugs at both ends of each power cable or ground

cable are crimped securely.

5

Verify that bare wires and lug handles at the wiring terminals

are wrapped tightly by using insulation tapes or heat shrink

tubes.

6

Verify that the flat washer and spring washer are mounted

securely to all the wiring terminals.

7

Verify that the connectors of all cables are securely linked,

especially those at the bottom of the cabinet.

8

Verify that the cables are properly bound. Cable ties are

installed at equal spacing and in the same direction

9

Verify that the power cable and ground cable are routed

separately from other cables.

10

Verify that the cable layout facilitates maintenance and

expansion in the future.

11

Verify that the labels at both ends of each cable are legible.

12

Verify that the excess of cable ties is trimmed off without

remaining rough edges.

2.2.11 Powering On the USG9580-DC Power Distribution

Check whether the USG9580 is operating properly in the DC power supply environment.

Power on the USG9580 according to the following requirements to ensure device security.

Context

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Before power-on check, switch all circuit breakers to the OFF position.

Before you power on the USG9580, ensure that:

 The power cable and PGND cable are properly connected.

 The power switch in the equipment room is easy to locate so that you can power off

devices in the case of accidents.

Procedure

Step 1 Turn on the circuit breakers of external DC power supplies A and B.

Step 2 Measure the input voltage of the device with a multimeter and ensure that the voltage falls

within the range of -72 V DC to -38 V DC.

Step 3 Turn on the DC power switch of the device.

Step 4 Wait for three minutes and then check the status of the indicators.

Figure 2-22 shows the indicator status of main parts when the device is operating properly.

Table 2-4 describes all indicators.

If all power modules do not have eight inputs, the STATUS indicator of the fan module is steady red.

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Figure 2-22 Indicator status when the USG9580 is operating properly

----End

Result

Table 2-4 Device indicators

Item

Indicator

Color

Status Description

PEM

RUN

Green

If the indicator is steady green, the

PEM has normal output.

ALM

Red

Alarm indicator. If the indicator is

steady red,

 Lightning protection circuit of the

PEM is faulty.

 No power is input.

FAN

STATUS

Green

If the indicator blinks once every two

seconds (0.5 Hz), the FAN is working

properly.

Red

If the indicator blinks once every two

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Item

Indicator

Color

Status Description

seconds (0.5 Hz), the fan module or

PEM is faulty (including the case that

not all PEMs are powered on).

MPU/SRU

RUN

Green

From the MPU/SRU being powered on

until it is registered, the indicator status

changes in the sequence of off-blinks

once every 250 ms (4 Hz)-off-steady

on-blinks once every two seconds (0.5

Hz).

After the MPU/SRU is registered, the

MPU/SRU is working properly if the

indicator blinks at 0.5 Hz.

NOTE

Possible causes for the indicator being off

are:

 The BootROM is damaged.

 The MPU cannot be powered on.

Possible causes for the indicator blinking

quickly are:

 The CF card is faulty.

 The other control chips on the

MPU/SRU are faulty, causing the

MPU/SRU not to be able to initialize.

ALM

Red

If the indicator is steady off, the

MPU/SRU is in the normal state. If the

indicator is steady red, an alarm is

generated.

SFU

RUN

Green

From the SFU being powered on until it

is registered, the indicator status

changes in the sequence of off-blinks

once every 250 ms (4 Hz)-off-steady

on-blinks once every two seconds (0.5

Hz).

After the SFU is registered, the SFU is

working properly if the indicator blinks

at 0.5 Hz.

ACT

Green

If the indicator is steady green, the SFU

is working properly; if the indicator is

off, the SFU is faulty.

2.2.12 Powering On the USG9580-AC Power Distribution

Check whether the USG9580 is operating properly in the DC power supply environment.

Power on the USG9580 according to the following requirements to ensure device security.

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Context

Before power-on check, switch all circuit breakers to the OFF position.

Before you power on the USG9580, ensure that:

 The power cable and PGND cable are properly connected.

 The power switch in the equipment room is easy to locate so that you can power off

devices in the case of accidents.

Procedure

Step 1 Turn on the external AC power supplies A and B.

Step 2 Measure the input voltage of the AC power chassis with a multimeter and ensure that the

voltage falls within the range of 90 V AC to 264 V AC.

Step 3 Turn on the circuit breakers of external AC power supplies A and B and check the status of

the indicators on the AC power chassis.

Step 4 Measure the input voltage of the device with a multimeter and ensure that the voltage falls

within the range of -72 V DC to -38 V DC.

Step 5 Measure the input voltage of the device with a multimeter and ensure that the voltage falls

within the range of -72 V DC to -38 V DC.

Step 6 Wait for three minutes and then check the status of the indicators.

Figure 2-23 and Figure 2-24 show the indicator status of main parts when the device is

operating properly. Table 2-6 describes all indicators.

Figure 2-23 Indicator status when the AC power chassis is working properly

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Figure 2-24 Indicator status when the USG9580 is operating properly

----End

Result

Table 2-5 Indicators on the AC power chassis

Item

Color

Status Description

Cause of the Abnormality

Operation

indicator

Green

If the indicator is

steady green, the AC

power chassis is

running properly. If

the indicator is off, an

exception occurs.

No main AC power is input, the

AC input voltage is higher or

lower than the normal range, or

the AC power chassis has no

output.

Protection

indicator

Yellow

If the indicator is off,

the AC power chassis

is running properly. If

the indicator is on, an

exception occurs.

A temperature alarm is

generated (if the temperature

exceeds 65°C, the AC power

chassis will be powered off), or

the AC power chassis is in the

dormant state (the indicator is

on and no alarm is generated).

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Item

Color

Status Description

Cause of the Abnormality

Fault

indicator

Red

If the indicator is off,

the AC power chassis

is running properly. If

the indicator is on, an

exception occurs.

The AC power chassis is

powered off due to over-voltage

or over-temperature, or fans are

faulty, or the AC power chassis

has no output due to its internal

faults.

DC output

voltage

-

The normal voltage

ranges from -43.2 V

DC to -57 V DC

-

Table 2-6 Device indicators

Item

Indicator

Color

Status Description

PEM

RUN

Green

If the indicator is steady green, the

PEM has normal output.

ALM

Red

Alarm indicator. If the indicator is

steady red,

 Lightning protection circuit of the

PEM is faulty.

 No power is input.

FAN

STATUS

Green

If the indicator blinks once every two

seconds (0.5 Hz), the FAN is working

properly.

Red

If the indicator blinks once every two

seconds (0.5 Hz), the fan module or

PEM is faulty (including the case that

not all PEMs are powered on).

MPU/SRU

RUN

Green

From the MPU/SRU being powered on

until it is registered, the indicator status

changes in the sequence of off-blinks

once every 250 ms (4 Hz)-off-steady

on-blinks once every two seconds (0.5

Hz).

After the MPU/SRU is registered, the

MPU/SRU is working properly if the

indicator blinks at 0.5 Hz.

NOTE

Possible causes for the indicator being off

are:

 The BootROM is damaged.

 The MPU cannot be powered on.

Possible causes for the indicator blinking

quickly are:

 The CF card is faulty.

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Item

Indicator

Color

Status Description

 The other control chips on the

MPU/SRU are faulty, causing the

MPU/SRU not to be able to initialize.

ALM

Red

If the indicator is steady off, the

MPU/SRU is in the normal state. If the

indicator is steady red, an alarm is

generated.

SFU

RUN

Green

From the SFU being powered on until it

is registered, the indicator status

changes in the sequence of off-blinks

once every 250 ms (4 Hz)-off-steady

on-blinks once every two seconds (0.5

Hz).

After the SFU is registered, the SFU is

working properly if the indicator blinks

at 0.5 Hz.

ACT

Green

If the indicator is steady green, the SFU

is working properly; if the indicator is

off, the SFU is faulty.

2.3 Installing USG9560

This section describes how to install the USG9560.

2.3.1 Preparing the Site

Prior to device installation, deploy the cabinet and device according to the following

requirements to ensure that the device can operate properly.

Power Supply System

 If you use DC power, ensure that the outputs of the DC power distribution box fall

within the range of -72 V DC to -38 V DC. Two power modules are needed, and each

power module must be connected to two different power sources for redundancy.

 If you use AC power, ensure that the outputs of the AC power distribution box fall within

the range of 90V AC to 264 V AC. Two power modules are needed, and each power

module must be connected to two different power sources for redundancy. Meanwhile,

one AC power chassis must be installed on the device.

Cabinet Requirements

You are advised to use Huawei standard NE68E cabinet. The self-purchased cabinet must

meet A.6 Requirements on Customers' Cabinets Purchased from Other Vendors.

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Cabinet Clearance Requirements

The N68E-22 cabinet is used as an example. As shown in Figure 2-25, cabinet clearance must

meet the following requirements:

 Aisles in the equipment room ≥ 1000 mm; aisles between cabinet rows ≥ 1000 mm

 Spacing between cabinet sides and wall ≥800 mm

 Spacing between cabinet row and wall ≥ 1000 mm

Figure 2-25 Diagram for cabinet deployment

Device Clearance Requirements

The USG9560 chassis is 14 U high and requires front and back maintenance mode. Device

clearance must meet the following requirements:

 Airflow clearance

− Maintain a minimum of 750 mm spacing between the device and the equipment

room wall and between two neighboring devices to prevent hot air recirculation.

− Maintain a minimum spacing of 2 U between devices installed in the same cabinet,

between the top-most device and the cabinet top, and between the bottom-most

device and the cabinet bottom.

 Maintenance clearance

Maintain a minimum of 700 mm spacing between devices and between a device and

wall.

The height of three holes on the mounting rails is 1 U, which is equivalent to 44.45 mm.

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2.3.2 Installing the Chassis into the Cabinet

The USG9560 can be mounted into a 19-inch standard cabinet through guide rails.

Context

 The USG9560 is heavy and requires four people to lift and move.

 Use the handles on the chassis sides when moving the device. Do not use the handles of

modules to avoid damages to the device.

 Do not step on the air filter at the bottom of the cabinet.

Procedure

Step 1 Install floating nuts and guide rails

1. Determine where to install floating nuts and mark the positions using a marker, as shown

in Figure 2-26.

2. Fix the floating nuts at the positions.

3. Use M6 screws to fix the guide rails at the positions.

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Figure 2-26 Installing floating nuts and guide rails

Step 2 Install mounting ears on the USG9560.

Use a Phillips screwdriver to fix the mounting ears to both sides of the chassis with M4

screws, as shown in Figure 2-27.

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Figure 2-27 Installing Mounting Ears

Step 3 Mount the USG9560 in the cabinet.

1. Lift the USG9560, move it to the cabinet, place it onto the guide rails, and push it into

the cabinet.

2. Use M6 screws to fix the mounting ears of the USG9560 to the mounting rack, as shown

in Figure 2-28.

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Figure 2-28 Mounting the USG9560 in the cabinet

Step 4 Mount the AC power chassises in the cabinet. (Mandatory in case of AC power supply)

When the equipment room uses the AC power supply, one USG9560 requires one AC power

chassis, as shown in Figure 2-29.

Figure 2-29 Mounting the AC power chassis in the cabine

----End

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Follow-up Procedure

Perform the following checks after the installation:

 Ensure that the USG9560 is placed securely inside the cabinet.

 Ensure that the exhaust of the USG9560 is not blocked by other objects.

2.3.3 Installing the PGND Cable

Connecting the PGND cable of the USG9560 correctly is a key measure of surge protection

and resistance to interference. Before using the USG9560, correctly connect the PGND cable.

Prerequisites

Before installing the PGND cable of the device, ensure that the PGND cable of the cabinet is

correctly connected and the ground resistance is zero ohm.

Context

If the chassis is near the ground bar in the equipment room, connect the PGND cable of the

chassis directly to the ground bar. If the chassis is distant from the ground bar, connect the

PGND cable to the ground point on the cabinet.

In this section, connecting the PGND cable to the ground point on the cabinet is used as an

example.

Procedure

Step 1 Install the chassis ground cable, as shown in Figure 2-30.

Step 2 Install the ground cable of the AC power chassis (mandatory for AC power supply), as shown

in Figure 2-30.

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Figure 2-30 Connecting the PGND cable

----End

Follow-up Procedure

Verify the following after the cabling is complete:

 The PGND cable is securely connected to the ground terminal.

 The electrical resistance between the ground terminal and ground point is less than 10

ohm on a multimeter.

2.3.4 Installing Boards and Subcards

This section describes how to install boards and subcards to avoid any damage.

Context

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 Ensure that no water is on the device or board before you insert the board into the device.

 Before installing boards, wear the ESD wrist strap and that the strap is well grounded to

prevent any electrostatic discharge of the human body from damaging the sensitive

components.

Procedure

Step 1 Select the slots based on the slot distribution.

You can determine whether it is a correct slot for a board by checking whether the color on

both ends of the board panel is the same as the color on the slot.

Figure 2-31 Slot layout

Step 2 Install a board.

1. Determine the slot for the board to be installed based on hardware planning and remove

the filler panel from the slot.

2. Extend the ejector levels of the board, insert the board fully into slot, and rotate the

ejector level to the front of the board so that the board is fully inserted in the slot.

3. Use a Phillips screwdriver to tighten the captive screws to the board.

Figure 2-32 Installing a board

Step 3 Install a subcard.

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Before you install a subcard, remove redundant guide rails from the board and store them properly for

future use.

1. Remove the filler panel from the board.

2. Smoothly insert the subcard into the board along the guide rail.

3. Use a Phillips screwdriver to tighten the captive screws to the board.

Figure 2-33 Installing a subcard

----End

Follow-up Procedure

Check the following items after the installation is complete:

 Check whether the boards and subcards are installed in position and the captive screws

are fastened.

 Filler panels are inserted in vacant slots. You must insert filler panels in the vacant slots

on the USG9560 to prevent dust and ensure heat dissipation.

2.3.5 Installing Chassis Components

Air filters are used to protect devices against dust, and cable racks are used to route optical

fibers and cables.

Procedure

 Install air filters to the air intake frame.

Point the pin on the air filter to the hole that prevents reverse installation. Otherwise, the air filter cannot

be installed.

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Figure 2-34 Install air filters to the air intake frame

 Install the cable rack.

a. Install the front cable rack.

b. Slide the rack to the right to click it into place.

c. Use two M4 x 10 screws to fix the cable rack.

Figure 2-35 Install the cable rack

----End

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2.3.6 Installing Power Cables-DC Power Distribution

In standard configuration, the USG9560 has four PEM modules. Each PEM module requires

an NEG DC power cable and an RTN DC power cable. This section describes how to connect

power cables to the two DC supply modules.

Context

Never install power cables when the power is on.

Before installing the power cables, ensure that the device is adequately grounded.

 Inside the cable should be an entire piece of copper core. Any connection of the core is

not allowed.

 Cables of DC power distribution.

Cable

Image

NEG cable

RTN cable

 The terminals on DC cables.

Terminal

Image

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Terminal

Image

OT bare crimping

terminal

JG2 double-hole

bare crimping

terminal

 For details, see 2.5.2.1 Guide to the DC Power Distribution.

Procedure

Step 1 Make temporary marks on both ends of each power cable using a marker.

Step 2 Connect the M6 JG2 terminals of the DC power cable to the PEM modules on USG9560.

Connect the M8 OT terminals of the DC power cable to the output terminals on the power

supply device.

Step 3 Use tie wraps to bind the cables every 100 mm upwards from the bottom end, and fix the

cables to the cabling rack.

Step 4 Affix permanent labels 20 mm from both ends of each power cable.

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Figure 2-36 Affix permanent labels

----End

Follow-up Procedure

Note that the power cable has polarity. After the device is powered on, if the PEM indicator

blinks red, check whether the anode and cathode of the power cable for the PEM are

connected without error. If they are connected mistakenly, switch off the previous-stage power

immediately and connect the power cable without error.

1. After installing power cables, install the plastic cover to each power module.

2. The power cables are fixed securely and in reliable and good contact with the terminals.

3. In the corner, the cables should be smooth.

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4. Labels for the power cables must be filled in and attached to the cables as required. All

labels are neat and face the same direction for easy viewing.

5. The power cable, grounding cable and the signal cable should be bound separately. The

distance between them must be more than 3 cm.

2.3.7 Installing Power Cables-AC Power Distribution

When the USG9560 uses AC power supply, one external AC power chassis is added to the DC

power supply system to constitute an AC power supply system. Four AC power cables are

used to connect each AC power chassis to the AC PDF.

Context

Never install power cables when the power is on.

Before installing the power cables, ensure that the device is adequately grounded.

 With the 110 V AC power supply, the USG9560 must use 110 V dual-live-wire AC input

to meet the maximum system power consumption with the full configuration. This is

because AC power modules are half-load output with 110 V AC input, which cannot meet

the system power consumption.

 As USG9560 do not support AC power chassis management, the DB9 interface on the rear

of an AC power chassis does not need to connect to the monitoring cable in the installation

auxiliary material package.

 Inside the cable should be an entire piece of copper core. Any connection of the core is

not allowed.

 Cables of AC power distribution.

Cable

Image

DC cables

from the

device to

the AC

power

chassis

NEG cable

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Cable

Image

RTN cable

Terminals

on DC

cables from

the device

to the AC

power

chassis

JG2 double-hole

bare crimping

terminal (M6)

AC cables from the AC power

chassis to the AC power supply

device

 For details, see 2.5.2.2 Guide to the AC Power Distribution.

Procedure

Step 1 Make temporary marks on both ends of each power cable using a marker.

Step 2 Connect one end of the AC power cables to the input terminals of the AC power chassis.

Connect the other end of the AC power cables to the AC power supply device.

Step 3 Connect one end of the DC power cables to the PEM modules on USG9560. Connect the

other end of the DC power cables to the output terminals of the AC power chassis.

Step 4 Use tie wraps to bind the cables every 100 mm upwards from the bottom end, and fix the

cables to the cable rack.

Step 5 Affix permanent labels 20 mm from both ends of each power cable.

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Figure 2-37 Affix permanent labels

----End

Follow-up Procedure

Note that the power cable has polarity. After the device is powered on, if the PEM indicator

blinks red, check whether the anode and cathode of the power cable for the PEM are

connected without error. If they are connected mistakenly, switch off the previous-stage power

immediately and connect the power cable without error.

1. After installing power cables, install the plastic cover to each power module.

2. The power cables are fixed securely and in reliable and good contact with the terminals.

3. In the corner, the cables should be smooth.

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4. Labels for the power cables must be filled in and attached to the cables as required. All

labels are neat and face the same direction for easy viewing.

5. The power cable, grounding cable and the signal cable should be bound separately. The

distance between them must be more than 3 cm.

2.3.8 Connecting Network Cables